CN216000842U

CN216000842U - Improved semi-automatic wafer scribing and cutting machine

Info

Publication number: CN216000842U
Application number: CN202122298162.6U
Authority: CN
Inventors: 赵康
Original assignee: Suzhou Cuizhu Semiconductor Co ltd
Current assignee: Suzhou Cuizhu Semiconductor Co ltd
Priority date: 2021-09-23
Filing date: 2021-09-23
Publication date: 2022-03-11
Anticipated expiration: 2031-09-23

Abstract

The utility model discloses an improved semi-automatic wafer scribing and cutting machine, which comprises a workbench, wherein a transverse plate is arranged between two groups of vertical plates, the upper surface of the transverse plate is provided with a rack, the surface of the transverse plate is connected with a mounting rack in a sliding way, the output end of a motor is provided with a gear meshed with the rack, the bottom surface inside the mounting rack is provided with a cylinder, the inside of the cylinder is provided with a roller, the lower surface of the mounting rack is provided with a sliding groove plate, a sliding block is connected in the sliding groove plate in a sliding way, the groove wall surface of the sliding groove plate is embedded with a ball head seat, the inside of the ball head seat is movably connected with a ball through the ball, the ball is propped against the surface of the sliding block, the lower surface of the sliding block is provided with a second electric cylinder, the output end of the second electric cylinder is provided with a laser cutting head, the utility model only needs to place a wafer on a placing table, and then the device is operated to realize automatic cutting to the wafer, not only reduces labor intensity, but also improves processing precision and reduces production cost.

Description

Improved semi-automatic wafer scribing and cutting machine

Technical Field

The utility model relates to a wafer cutting machine technical field specifically is a semi-automatic wafer scribing cutting machine of improvement.

Background

The wafer cutting machine is mainly used in the semiconductor industry for cutting silicon wafers and various ceramic materials into small blocks. The existing wafer cutting machine is generally cut manually, the problems of low processing precision, poor uniformity, high rejection rate and the like exist in manual cutting, the existing full-automatic wafer cutting machine is high in price, the use cost is high although the cutting precision is high, and therefore an improved semi-automatic wafer scribing and cutting machine is provided.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semi-automatic wafer scribing cutting machine of improvement to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: an improved semi-automatic wafer scribing and cutting machine comprises a workbench, wherein a placing table is embedded in the middle of the upper surface of the workbench, supporting legs which are integrally formed with the workbench are arranged on the lower surface of the workbench, and the supporting legs are provided with four groups and are positioned at four corners of the workbench;

vertical plates are arranged on the left side wall and the right side wall of the workbench, a transverse plate is arranged between the two groups of vertical plates, a rack is arranged on the upper surface of the transverse plate, an installation frame is connected to the surface of the transverse plate in a sliding mode, a motor is installed inside the installation frame, a gear meshed with the rack is arranged at the output end of the motor, a cylinder is arranged on the bottom surface inside the installation frame, idler wheels are installed inside the cylinder, springs are arranged between wheel carriers of the idler wheels and the inner wall inside the cylinder, wheel grooves are formed in the lower surface of the transverse plate, the idler wheels are connected in the wheel grooves in a rolling mode, and the two groups of idler wheels are arranged;

the lower surface of the mounting frame is provided with a chute plate, a chute in the chute plate is concave, the chute plate is positioned below the transverse plate and is perpendicular to the transverse plate, a sliding block is connected in the chute plate in a sliding manner, the surface of the sliding block is provided with a T-shaped sliding strip which is integrally formed with the sliding block, the surface of the chute plate is provided with a first electric cylinder, and a piston rod of the first electric cylinder is connected with the sliding block;

the surface of the groove wall of the sliding groove plate is embedded with a ball head seat, the inside of the ball head seat is movably connected with a ball through a ball, the ball abuts against the surface of the sliding block, a second electric cylinder is mounted on the lower surface of the sliding block, and the output end of the second electric cylinder is provided with a laser cutting head.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model can control the left and right movement of the mounting frame through the motor, further drive the laser cutting head to move left and right, the first electric cylinder can control the sliding block to move back and forth, further drive the laser cutting head to move back and forth, the second electric cylinder can control the laser cutting head to move up and down, and the second electric cylinder is matched with the motor and the first electric cylinder to form four-axis cutting movement;

the utility model discloses only need place the bench with the wafer, then operate this device and can realize automatic cutting to the wafer, the machining precision is high, reduces artificial intervention simultaneously, has not only reduced intensity of labour, improves the machining precision simultaneously, has also reduced manufacturing cost.

Drawings

FIG. 1 is a schematic sectional view of the present invention;

fig. 2 is a schematic structural view of the connection between the motor and the mounting bracket of the present invention;

FIG. 3 is a schematic structural view of the first electric cylinder connected to the sliding block;

FIG. 4 is an enlarged schematic view of the structure of FIG. 1;

fig. 5 is an enlarged schematic structural diagram of the present invention at B in fig. 4.

In the figure: 1. a work table; 2. a placing table; 3. a vertical plate; 4. a transverse plate; 5. a wheel groove; 6. a rack; 7. a motor; 8. a mounting frame; 9. a gear; 10. a cylinder; 11. a roller; 12. a spring; 13. a chute plate; 14. a slider; 15. a first electric cylinder; 16. a ball cup seat; 17. a ball bearing; 18. a ball; 19. a second electric cylinder; 20. laser cutting head.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides a technical solution: an improved semi-automatic wafer scribing and cutting machine comprises a workbench 1, wherein vertical plates 3 are arranged on the left side wall and the right side wall of the workbench 1, a transverse plate 4 is arranged between the two groups of vertical plates 3, the transverse plate 4 is positioned at the upper parts of the vertical plates 3, a rack 6 is arranged on the upper surface of the transverse plate 4, a mounting frame 8 is connected to the surface of the transverse plate 4 in a sliding manner, and the mounting frame 8 can slide left and right along the transverse plate 4;

a motor 7 is arranged in the mounting frame 8, the shell of the motor 7 is fixedly connected in the mounting frame 8 through two groups of fixing rods, a gear 9 meshed with the rack 6 is arranged at the output end of the motor 7, a cylinder 10 is arranged on the bottom surface in the mounting frame 8, rollers 11 are arranged in the cylinder 10, the rollers 11 can reduce the friction force between the mounting frame 8 and the transverse plate 4, the sliding is smoother, and a spring 12 is arranged between a wheel carrier of the rollers 11 and the inner wall in the cylinder 10, so that the gear 9 is tightly attached to the rack 6;

a sliding groove plate 13 is arranged on the lower surface of the mounting frame 8, a sliding block 14 is connected in the sliding groove plate 13 in a sliding mode, the sliding block 14 can slide back and forth along the sliding groove plate 13, a first electric cylinder 15 is arranged on the surface of the sliding groove plate 13, a piston rod of the first electric cylinder 15 is connected with the sliding block 14, and the first electric cylinder 15 is located at the rear end of the sliding groove plate 13;

the groove wall surface of the sliding groove plate 13 is embedded with a ball seat 16, the ball seat 16 is internally and movably connected with a ball 18 through a ball 17, the ball 17 is uniformly provided with a plurality of groups, so that the friction force between the ball 18 and the ball seat 16 is reduced, the ball 18 is propped against the surface of the sliding block 14, the friction force between the sliding block 14 and the sliding groove plate 13 is reduced, a second electric cylinder 19 is installed on the lower surface of the sliding block 14, and the output end of the second electric cylinder 19 is provided with a laser cutting head 20.

Specifically, 1 upper surface middle part embedding of workstation has place platform 2, places platform 2 and is used for placing the wafer, makes things convenient for laser cutting head 20 to cut, 1 lower surface of workstation is equipped with the supporting leg with 1 integrated into one piece of workstation, supports workstation 1.

Specifically, the chute plate 13 is located below the transverse plate 4 and perpendicular to the transverse plate 4, so that the laser cutting head 20 can move horizontally all around.

Specifically, diaphragm 4 lower surface is equipped with

race

5, 11 roll connections of gyro wheel are in race 5, and race 5 restricts gyro wheel 11, prevents that gyro wheel 11 from droing from diaphragm 4, gyro wheel 11 sets up two sets ofly, strengthens the gliding stability of mounting bracket 8.

Specifically, the sliding groove in the sliding groove plate 13 is concave, and the surface of the sliding block 14 is provided with a T-shaped sliding strip integrally formed with the sliding block 14, so that the sliding block 14 can slide conveniently, and the sliding block 14 is prevented from falling off from the sliding groove plate 13.

Specifically, during the use, place the wafer on placing platform 2, the circuit of cutting according to the wafer needs, starter motor 7, motor 7's output end drives gear 9 and rotates, because gear 9 and rack 6 mesh, so along with gear 9's rotation, mounting bracket 8 can remove about diaphragm 4, the piston rod of control first electric jar 15 stretches out or contracts, can drive slider 14 and slide along chute board 13, and then drive second electric jar 19 and the laser cutting head 20 back-and-forth movement on slider 14, because chute board 13 is installed on mounting bracket 8, so the removal is removed about motor 7 steerable laser cutting head 20, the telescopic link of second electric jar 19 stretches out, drive laser cutting head 20 and remove downwards, start laser cutting head 20, can cut the wafer from side to side through motor 7, can cut the wafer from side to side through first electric jar 15.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a semi-automatic wafer scribing cutting machine of improvement, includes workstation (1), its characterized in that: vertical plates (3) are arranged on the left side wall and the right side wall of the workbench (1), a transverse plate (4) is arranged between the two groups of vertical plates (3), racks (6) are arranged on the upper surface of the transverse plate (4), an installation frame (8) is connected to the surface of the transverse plate (4) in a sliding mode, a motor (7) is installed inside the installation frame (8), a gear (9) meshed with the racks (6) is arranged at the output end of the motor (7), a cylinder (10) is arranged on the bottom surface inside the installation frame (8), rollers (11) are installed inside the cylinder (10), and a spring (12) is arranged between a wheel carrier of each roller (11) and the inner wall inside the cylinder (10);

the utility model discloses a laser cutting machine, including mounting bracket (8), mounting bracket (8) lower surface is equipped with chute board (13), the landing has slider (14) in chute board (13), chute board (13) surface mounting has first electric jar (15), and the piston rod of first electric jar (15) is connected with slider (14), the cell wall surface embedding of chute board (13) has bulb seat (16), bulb seat (16) inside has ball (18) through ball (17) swing joint, ball (18) support on slider (14) surface, slider (14) lower surface mounting has second electric jar (19), the output of second electric jar (19) is equipped with laser cutting head (20).

2. An improved semi-automatic wafer dicing saw according to claim 1, characterized in that: the middle part of the upper surface of the workbench (1) is embedded with the placing table (2), and the lower surface of the workbench (1) is provided with supporting legs integrally formed with the workbench (1).

3. An improved semi-automatic wafer dicing saw according to claim 1, characterized in that: the chute plate (13) is positioned below the transverse plate (4) and is vertical to the transverse plate (4).

4. An improved semi-automatic wafer dicing saw according to claim 1, wherein: the lower surface of the transverse plate (4) is provided with wheel grooves (5), the rollers (11) are connected in the wheel grooves (5) in a rolling mode, and the rollers (11) are arranged in two groups.

5. An improved semi-automatic wafer dicing saw according to claim 1, characterized in that: the inside spout of chute board (13) is the spill, slider (14) surface is equipped with the T shape draw runner with slider (14) integrated into one piece.