CN215964515U

CN215964515U - Die type electronic chip production wafer film coating equipment

Info

Publication number: CN215964515U
Application number: CN202122049672.XU
Authority: CN
Inventors: 冯达
Original assignee: Shanghai Aishensi Technology Co ltd
Current assignee: Shanghai Aishensi Technology Co ltd
Priority date: 2021-08-29
Filing date: 2021-08-29
Publication date: 2022-03-08
Anticipated expiration: 2031-08-29

Abstract

The utility model relates to the technical field of electronic chips, in particular to a die type electronic chip production wafer film coating device which comprises a film coating body, wherein the film coating body comprises symmetrically arranged support columns, fixed rods are communicated between the support columns, a film coating disc is arranged at one end of each fixed rod and is of a circular structure with an upward opening, a connecting plate is sleeved on the surface of each fixed rod, a fixed shaft is arranged in one end of each connecting plate, a rotating disc is arranged at the top of each fixed shaft, a coating plate is arranged at the bottom of each fixed shaft, one end of each coating plate and the central shaft of each film coating disc are positioned on the same horizontal line, and the size of each coating plate is the same as the radius of each film coating disc. The photoresist coating on the surface of the wafer can be scraped in a circular motion manner through the coating plate, so that the coating can be paved on the surface of the wafer at one time, the effect is better compared with the current mechanical rotation filling coating, the whole straw is simple, and the cost is saved; meanwhile, the device can also be suitable for secondary fine treatment of the surface of the wafer after mechanical rotation filling.

Description

Die type electronic chip production wafer film coating equipment

Technical Field

The utility model relates to the technical field of electronic chips, in particular to a die type electronic chip production wafer film coating device.

Background

For electronic chips, the raw material is the wafer. When the wafer is required to be formed into a chip, a plurality of processes are required, for example: the method comprises the steps of wafer cleaning, wafer coating, wafer photoetching development, impurity doping and the like, wherein the wafer is coated, so that a photoresist film layer is filled on the surface of the wafer by using more general manpower at present, the photoresist filling in the process is more labor-consuming, and then a small part of technicians can adopt mechanical rotary filling, and the lower wafer is rotatably filled by using the photoresist positioned on a rotating tool, so that the process has the effect of saving manpower, but the mechanical rotary filling for a long time is needed, the one-time uniform filling effect cannot be achieved, and the time cannot be saved for subsequent exposure and baking; meanwhile, during rotary filling, the photoresist filled on the surface of the wafer may have more measurements, and the overall uniform effect cannot be achieved.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a die type electronic chip production wafer coating device to solve the problems in the background technology.

In order to achieve the purpose, the utility model provides die type electronic chip production wafer film coating equipment which comprises a film coating body, wherein the film coating body comprises support columns which are symmetrically arranged, fixed rods are communicated among the support columns, a film coating disc is installed at one end of each fixed rod, the film coating disc is of a round structure with an upward opening, a connecting plate is sleeved on the surface of each fixed rod, a fixed shaft is installed in one end of each connecting plate, a rotating disc is installed at the top of the fixed shaft, a film coating plate is arranged at the bottom of the fixed shaft, one end of each film coating plate and the central shaft of the film coating disc are located on the same horizontal line, and the size of each film coating plate is the same as the radius of the film coating disc.

As a further improvement of the technical scheme, a plug penetrating through the interior is arranged at the surface side end of the coating disc.

As a further improvement of the technical scheme, the coating disc is internally and threadedly connected with a bottom screw rod, and a rotating handle is installed at the bottom of the bottom screw rod.

As a further improvement of the technical scheme, a positioning block is installed on the surface of the fixing rod, a jacking screw rod is connected to the surface of the positioning block in a threaded mode, and the top of the jacking screw rod is in adaptive contact with the connecting plate.

As a further improvement of the technical scheme, a fixed block is installed at one end of one of the support columns, a wiping plate is arranged on the surface of one end of the fixed block, a moving rod is arranged on the side face of the wiping plate, a moving cavity is formed in the side wall of the fixed block, and the moving rod is connected with the moving cavity in a sliding mode.

As a further improvement of the technical scheme, a sticking block matched with the wiping plate is arranged in the surface of the wiping plate.

As a further improvement of the technical scheme, an inwards concave annular cavity is formed in the surface of the fixed rod, an inner block which is attached to the annular cavity in an adaptive mode is arranged in a round opening of the positioning block, and the positioning block is movably sleeved with the fixed rod. Compared with the prior art, the utility model has the beneficial effects that:

in the die type electronic chip production wafer coating equipment, the photoresist coating on the surface of the wafer can be scraped in a circular motion manner through the coating plate, so that the coating can be paved on the surface of the wafer at one time, the effect of mechanical rotary filling is better compared with the current effect, the whole straw is simple, and the cost is saved; meanwhile, the device can also be suitable for secondary fine treatment of the surface of the wafer after mechanical rotation filling.

Drawings

FIG. 1 is a schematic view of the overall structure of embodiment 1 of the present invention;

FIG. 2 is an exploded view of the structure of a coating film body according to example 1 of the present invention;

FIG. 3 is a sectional view of a positioning block structure in embodiment 1 of the present invention;

fig. 4 is an exploded view of a fixing block structure in embodiment 1 of the present invention.

The various reference numbers in the figures mean:

100. coating a film body;

110. a support pillar; 111. fixing the rod; 1110. an annular cavity; 112. coating a film disc; 113. a connecting plate; 114. a fixed shaft; 115. coating plates; 116. a bottom screw; 1160. rotating the handle; 117. positioning blocks; 1171. jacking a screw rod; 1172. an inner block; 118. a fixed block; 1181. wiping the board; 1182. a travel bar; 1183. the chamber is moved.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.

Example 1

Referring to fig. 1-4, the embodiment provides a die-type electronic chip production wafer coating apparatus, including a coating body 100, the coating body 100 includes support pillars 110 symmetrically disposed, a fixing rod 111 is communicated between the support pillars 110, a coating disc 112 is installed at one end of the fixing rod 111, the coating disc 112 is a circular structure with an upward opening, a connecting plate 113 is sleeved on the surface of the fixing rod 111, a fixing shaft 114 is installed in one end of the connecting plate 113, a rotating disc is installed at the top of the fixing shaft 114, a coating plate 115 is installed at the bottom of the fixing shaft 114, one end of the coating plate 115 is in the same horizontal line with the central axis of the coating disc 112, and the size of the coating plate 115 is the same as the radius of the coating disc 112.

In this embodiment, the bottom of the coating plate 115 is in a conical structure, that is, the turntable is manually rotated by manpower, that is, the fixed shaft 114 is driven, and then the coating plate 115 moves along the surface circumference of the fixed shaft 114, because the axis of one end of the connecting plate 113 and the axis of the coating disc 112 are in the same horizontal line, that is, the wafer is firstly placed inside the coating disc 112, and then the adapted photoresist coating is placed on the surface of the wafer, that is, the photoresist coating is linear, that is, one end is located at the edge of the wafer, and the other end is located at the central axis of the wafer, at this time, the coating plate 115 can circumferentially and uniformly scrape the coating by the rotation of the fixed shaft 114, and the photoresist is flatly laid on the surface of the wafer, that is, the photoresist forms a layer of coating material after a certain time, wherein the coating disc 112 is in a circular structure, and is just in fit with the size of the current wafer, so as to achieve a one-time uniform coating, meanwhile, when the connecting plate 113 slides up and down along the surface of the fixing rod 111, the coating plate 115 can be gradually far away from or close to the surface of the coating disc 112, when the coating plate 115 is far away, on one hand, when the size and thickness of the wafer are large, namely, the height in the coating disc 112 is high, trimming is performed through adjustment and matching adjustment on the coating plate 115, so that adaptive scraping and tiling are facilitated, on the other hand, after the coating plate 115 is far away from the coating disc 112, namely, after coating is finished, the wafer is convenient to move out, when the coating plate 115 is close, when the size and thickness of the wafer is small, namely, the height in the coating disc 112 is lower, trimming is performed through downward adjustment and matching adjustment of the coating plate 115, so that adaptive scraping and tiling are facilitated, namely, double adaptive trimming is achieved through upward and downward adjustment, and a fine process is formed by filling and coating the wafer; secondly, the device is also suitable for the current wafer adopting mechanical rotation coating, the wafer can be placed in the coating disc 112 after the rotation coating is finished, the coating does not need to be placed at the moment, namely the coating is contacted through the rotation of the coating plate 115, so that the photoresist coating is further finely processed on the surface of the wafer, the coating material is filled more uniformly, and the current mechanical rotation filling effect is synchronously enhanced; this device can carry out circular motion's scraping to the photoresist coating on wafer surface through scribbling flitch 115 for the coating can once only be tiled in the surface of wafer, and the effect of filling is better for present mechanical rotation, and this device still can be applicable to simultaneously and rotate the back of filling, carries out secondary fine treatment to the wafer surface.

In order to improve the practical effect of the whole device, the internal structure of the coating disc 112 is reasonably designed, the side end of the surface of the coating disc 112 is provided with a plug penetrating through the interior, wherein before the step of coating the wafer, the wafer is required to be cleaned, when the wafer is not cleaned or is not clean enough, firstly, water flow is placed in the coating disc 112, the wafer is placed in the interior, the adaptive height of the connecting plate 113 is adjusted, namely the coating plate 115 is in adaptive contact with the wafer, the rotary disc is rotated, the coating plate 115 scrapes and cleans the water flow on the surface of the wafer, so that convenient cleaning is achieved, manpower is saved, manual cleaning is achieved, after the wafer is removed through plugging, the water flow flows to the outside along the water outlet sealed by plugging, namely cleaning is completed, the next step of coating can be started, and further, the practicability of the whole device is increased.

In order to improve the convenience and the rapidness of moving out of the film coating disc 112 after cleaning or film coating by a police officer, the internal structure of the film coating disc 112 is reasonably designed, the internal thread of the film coating disc 112 is connected with a bottom screw 116, a rotating handle 1160 is installed at the bottom of the bottom screw 116, after cleaning or filling of a wafer is finished, the wafer is rotated through the rotating handle 1160 of the bottom screw 116, namely the bottom screw 116 pushes the wafer outwards, the wafer is convenient to move out through the operation after being matched and attached with the film coating disc 112 because the wafer is circular, and meanwhile, the bottom of the cleaned wafer contains moisture, namely the wafer is more conveniently taken out and wiped to be dry through pushing out of the bottom screw 116; secondly, the bottom screw 116 is in sealing fit contact with the film coating disc 112 when returning again, and the top of the bottom screw 116 is horizontal to the inner wall of the film coating disc 112.

Stability after adjusting for the connecting plate 113 that improves, surface mounting locating piece 117 of dead lever 111, the surperficial threaded connection of locating piece 117 has jacking screw 1171, jacking screw 1171's top and connecting plate 113 adaptation contact, upwards rotate through jacking screw 1171, on the one hand reach the connecting plate 113 and can practice thrift the manpower and upwards promote, on the other hand can be to adjusting the position of back connecting plate 113 steady support more, prevent along dead lever 111 landing.

In order to solve the problem that the coating material plate 115 adheres a rubber material on the rear surface of the coating material, a fixed block 118 is mounted at one end of one of the support columns 110, a wiping plate 1181 is arranged on the surface of one end of the fixed block 118, a moving rod 1182 is arranged on the side surface of the wiping plate 1181, a moving cavity 1183 is formed in the side wall of the fixed block 118, and the moving rod 1182 is slidably connected with the moving cavity 1183. The wiping plate 1181 is structurally matched with the coating plate 115, that is, after coating is finished, the connecting plate 113 is rotated to the other side end, that is, the coating plate 115 is located on the surface of the wiping plate 1181, at this time, the moving rod 1182 is pushed by manpower to slide along the inside of the moving cavity 1183, that is, the wiping plate 1181 can wipe off the coating plate 115 with a conical structure, so that after the coating plate 115 scrapes the coating, a certain amount of coating may adhere to the surface, and the coating on the surface of the coating plate 115 can be removed through the process.

Furthermore, a patch matched with the wiping plate 1181 is arranged in the surface of the wiping plate 1181. The patch is made of cotton material, and when the wiping plate 1181 moves, the patch can be more attached to the side end of the surface of the coating plate 115 to rub and remove the material.

In order to improve the practical effect of the positioning block 117 and the jacking screw 1171, the internal structure of the utility model is reasonably designed, the surface of the fixed rod 111 is provided with an inwards concave annular cavity 1110, the round opening of the positioning block 117 is internally provided with an inner block 1172 which is matched and attached with the annular cavity 1110, and the positioning block 117 is movably sleeved with the fixed rod 111. That is, the positioning block 117 can rotate along the surface of the fixing rod 111 through the connection between the ring cavity 1110 and the inner block 1172, but the height position is not changed, that is, when the position of the connecting plate 113 is shifted to one side of the fixing block 118, the positioning block 117 and the jacking screw 1171 are adjusted accordingly, that is, the jacking screw 1171 can support the connecting plate 113 in real time, so that the position of the coating plate 115 is stably positioned.

The foregoing shows and describes the general principles, essential features, and advantages of the utility model. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. A die type electronic chip production wafer film coating equipment comprises a film coating body (100), and is characterized in that: the coating body (100) is including support column (110) that the symmetry set up, the intercommunication has dead lever (111) between support column (110), coating dish (112) are installed to dead lever (111) one end, coating dish (112) are the ascending circular structure of opening, connecting plate (113) have been cup jointed on the surface of dead lever (111), fixed axle (114) are installed in the one end of connecting plate (113), the carousel is installed at the top of fixed axle (114), the bottom of fixed axle (114) is equipped with coating board (115), the one end of coating board (115) with the center pin of coating dish (112) is in same water flat line, coating board (115) obtain the size with the radius of coating dish (112) is the same.

2. The die-type electronic chip production wafer coating apparatus as claimed in claim 1, wherein: the surface side end of the coating disc (112) is provided with a plug penetrating the interior.

3. The die-type electronic chip production wafer coating apparatus as claimed in claim 1, wherein: the inner part of the coating disc (112) is connected with a bottom screw rod (116) in a threaded manner, and a rotating handle (1160) is installed at the bottom of the bottom screw rod (116).

4. The die-type electronic chip production wafer coating apparatus as claimed in claim 1, wherein: the surface mounting locating piece (117) of dead lever (111), the surperficial threaded connection of locating piece (117) has jacking screw rod (1171), the top of jacking screw rod (1171) with connecting plate (113) adaptation contact.

5. The die-type electronic chip production wafer coating apparatus as claimed in claim 1, wherein: a fixed block (118) is installed at one end of one of the supporting columns (110), a wiping plate (1181) is arranged on the surface of one end of the fixed block (118), a moving rod (1182) is arranged on the side face of the wiping plate (1181), a moving cavity (1183) is formed in the side wall of the fixed block (118), and the moving rod (1182) is in sliding connection with the moving cavity (1183).

6. The die-type electronic chip production wafer coating apparatus of claim 5, wherein: the surface of the wiping plate (1181) is internally provided with a sticking block matched with the wiping plate.

7. The die-type electronic chip production wafer coating apparatus as claimed in claim 4, wherein: the surface of the fixing rod (111) is provided with an inwards concave annular cavity (1110), an inner block (1172) which is matched and attached to the annular cavity (1110) is arranged in a round opening of the positioning block (117), and the positioning block (117) is movably sleeved with the fixing rod (111).