CN219483202U - Integrated circuit wafer film coating device - Google Patents
Integrated circuit wafer film coating device Download PDFInfo
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- CN219483202U CN219483202U CN202223272380.3U CN202223272380U CN219483202U CN 219483202 U CN219483202 U CN 219483202U CN 202223272380 U CN202223272380 U CN 202223272380U CN 219483202 U CN219483202 U CN 219483202U
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- frame
- clamping
- film coating
- circuit wafer
- waste
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Abstract
The utility model discloses an integrated circuit wafer film coating device, and relates to the technical field of circuit wafer processing. The waste rubber collecting cover comprises a frame, wherein the inner wall of the frame is sequentially and slidably connected with a clamping mechanism driven by a clamping push rod and a lifting table driven by a lifting push rod from top to bottom, the bottom ends of the clamping push rod and the lifting push rod are fixedly connected with the frame, the inner wall of the lifting table is rotationally connected with a rotating shaft driven by a servo motor, a tray is arranged at the axis position of the top surface of the rotating shaft, and the peripheral side surface of the rotating shaft is fixedly provided with a waste rubber collecting cover with an opening at the top end and driven to deform by the clamping mechanism. According to the utility model, through the arrangement of the waste rubber collecting cover and the clamping rod, the device can efficiently finish the film coating operation of the wafer, and in the film coating device, redundant film coating materials can be effectively recovered through the structure arrangement of the waste rubber collecting cover and the external clamping structure arrangement of the clamping rod.
Description
Technical Field
The utility model belongs to the technical field of circuit wafer processing, and particularly relates to an integrated circuit wafer film coating device.
Background
The utility model provides an integrated circuit wafer film coating device, which is used for manufacturing a silicon semiconductor circuit, wherein the original material of the wafer is silicon, a silicon crystal bar is ground, polished and sliced to form a silicon wafer, namely the wafer, the wafer is required to be coated in the processing process, the wafer film coating can resist oxidization and temperature resistance, various types of wafer film coating devices are already developed in the prior art, such as a patent document with the publication number of CN217588859U, the wafer is fixed by the fixing mechanism, uneven film coating is prevented, the quick forming is carried out by a drying mechanism, the yield is improved, and the excessive film coating device is easy to accumulate or adhere in a clamping mechanism of the wafer when the excessive film coating material is recovered, so that the excessive film coating material is wasted and the clamping mechanism is stained.
Disclosure of Invention
The utility model aims to provide an integrated circuit wafer film coating device, which solves the problems that when the existing film coating device is used for recycling the redundant film coating materials, the redundant film coating materials are easy to accumulate or adhere in a clamping mechanism of a wafer, and then the redundant film coating materials are wasted and the clamping mechanism is stained.
In order to solve the technical problems, the utility model is realized by the following technical scheme:
the utility model relates to an integrated circuit wafer film coating device which comprises a frame, wherein the inner wall of the frame is sequentially and slidably connected with a clamping mechanism driven by a clamping push rod and a lifting table driven by a lifting push rod from top to bottom, the bottom ends of the clamping push rod and the lifting push rod are fixedly connected with the frame, the inner wall of the lifting table is rotationally connected with a rotating shaft driven by a servo motor, a tray is arranged at the axis position of the top surface of the rotating shaft, a waste collecting rubber cover with an opening at the top end and driven to deform by the clamping mechanism is fixedly arranged at the peripheral side surface of the rotating shaft, a waste collecting assembly matched with the waste collecting rubber cover is arranged at the axis position of the rotating shaft, and a film spraying assembly and a film scraping assembly are respectively and fixedly arranged at the top of the frame.
As the preferable technical scheme of the utility model, the clamping mechanism comprises a fixed clamping ring in sliding connection with the frame and a clamping rotating frame which is arranged above the fixed clamping ring and is rotationally connected with the frame, the fixed clamping ring is driven by a clamping push rod, the top surface of the fixed clamping ring is rotationally connected with a transmission rotating ring, the inner wall of the transmission rotating ring is in sliding connection with a rotating shaft, a group of clamping tables distributed in a circumferential array are in sliding connection with the inner wall of the clamping rotating frame, connecting rods are hinged between the opposite surfaces of each clamping table and the transmission rotating ring, and clamping rods which are vertically arranged and are arranged outside the waste rubber collecting cover are fixedly arranged on the top surface of the clamping table.
As a preferable technical scheme of the utility model, a group of transmission guide grooves which are distributed in a circumferential array and are vertically arranged are fixedly arranged in the rotating shaft, and guide blocks which are in sliding fit with the transmission guide grooves are arranged on the inner wall of the transmission rotating ring and correspond to the positions of each transmission guide groove.
As the preferable technical scheme of the utility model, the waste collection assembly respectively comprises a waste outlet pipe arranged at the bottom end of the lifting table and a waste collection flow passage arranged at the axial line position of the rotating shaft, the top end of the waste outlet pipe is communicated with the waste collection flow passage in a rotating way, a waste discharge valve is fixedly arranged in the waste outlet pipe, a group of through holes which are distributed in a circumferential array and are communicated with the waste collection rubber cover are fixedly arranged at the top of the rotating shaft, and a waste guide inclined surface which inclines towards the through holes is fixedly arranged at the inner bottom of the waste collection rubber cover.
As the preferable technical scheme of the utility model, the film spraying assembly comprises a screw rod driving module which is horizontally arranged and arranged in the frame, a material carrying platform is connected to the peripheral side face of the screw rod driving module in a transmission way, the inner wall of the material carrying platform is in sliding connection with the frame, a material storage box is fixedly arranged on the top face of the material carrying platform, a pump body is fixedly arranged on the side face of the material storage box, a spray head which is vertically arranged is fixedly arranged on the bottom face of the material carrying platform, and the discharge port end of the pump body is communicated with the spray head.
As the preferable technical scheme of the utility model, the film scraping assembly comprises a film scraping frame which is connected to the inner wall of the frame in a sliding way, an adjusting push rod is arranged between the opposite surfaces of the film scraping frame and the frame, and two scraping blades which are symmetrically arranged are fixedly arranged at the bottom end of the film scraping frame.
As a preferable technical scheme of the utility model, the top surface of the tray is movably provided with the circuit wafer body.
As a preferable technical scheme of the utility model, the top surface of the waste rubber collecting cover is higher than the top surface of the tray, and the height difference between the top surface of the waste rubber collecting cover and the top surface of the tray is 0.3-0.6 times of the thickness of the circuit wafer body.
The utility model has the following beneficial effects:
according to the utility model, through the arrangement of the waste rubber cover and the clamping rod, the device can efficiently finish the film coating operation of the wafer, and in the film coating device, redundant film coating materials can be effectively recovered through the arrangement of the waste rubber cover and the external clamping structure of the clamping rod, and the recovery structure can not pollute the clamping mechanism, so that the problems that the redundant film coating materials are easy to accumulate or adhere in the clamping mechanism of the wafer when the redundant film coating materials are recovered by the traditional film coating device, and then the waste of the redundant film coating materials and the pollution of the clamping mechanism are caused are effectively solved.
Of course, it is not necessary for any one product to practice the utility model to achieve all of the advantages set forth above at the same time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an integrated circuit wafer coating apparatus;
FIG. 2 is a schematic cross-sectional view of FIG. 1;
FIG. 3 is a schematic view of a partial enlarged structure at A in FIG. 2;
fig. 4 is a schematic structural view of the tray and the scrap rubber collecting cover.
In the drawings, the list of components represented by the various numbers is as follows:
1. a frame; 2. clamping the push rod; 3. lifting the push rod; 4. a lifting table; 5. a servo motor; 6. a rotating shaft; 7. a tray; 8. a waste rubber collecting cover; 9. a fixed clamping ring; 10. clamping the rotating frame; 11. a transmission rotary ring; 12. a clamping table; 13. a connecting rod; 14. clamping a rod; 15. a waste pipe; 16. a through hole; 17. a screw rod driving module; 18. a material carrying table; 19. a spray head; 20. a film scraping frame; 21. adjusting the push rod; 22. a wiper blade; 23. a circuit wafer body.
Detailed Description
Embodiments of the present utility model are described in further detail below with reference to the accompanying drawings and examples. The following examples are illustrative of the utility model but are not intended to limit the scope of the utility model.
In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front," "rear," "head," "tail," and the like are used as an orientation or positional relationship based on that shown in the drawings, merely to facilitate description of the utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the utility model. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "connected," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
Referring to fig. 1-4, the utility model discloses an integrated circuit wafer film coating device, which comprises a frame 1, wherein the inner wall of the frame 1 is sequentially and slidably connected with a clamping mechanism driven by a clamping push rod 2 and a lifting table 4 driven by a lifting push rod 3 from top to bottom, the bottom ends of the clamping push rod 2 and the lifting push rod 3 are fixedly connected with the frame 1, and the inner wall of the lifting table 4 is rotatably connected with a rotating shaft 6 driven by a servo motor 5;
the clamping mechanism comprises a fixed clamping ring 9 which is in sliding connection with the frame 1 and a clamping rotating frame 10 which is arranged above the fixed clamping ring 9 and is in rotating connection with the frame 1, the fixed clamping ring 9 is driven by a clamping push rod 2, the top surface of the fixed clamping ring 9 is in rotating connection with a transmission rotating ring 11, and the inner wall of the transmission rotating ring 11 is in sliding connection with the rotating shaft 6;
the inside of the rotating shaft 6 is fixedly provided with a group of transmission guide grooves which are distributed in a circumferential array and are vertically arranged, the inner wall of the transmission rotating ring 11 is provided with guide blocks which are in sliding fit with the transmission guide grooves and correspond to the positions of each transmission guide groove, and the transmission rotating ring 11 can slide up and down along the axial direction of the rotating shaft 6 and can synchronously rotate with the rotating shaft 6 through the arrangement of the guide blocks and the transmission guide grooves;
the inner wall sliding connection of centre gripping spiral frame 10 has a set of centre gripping platform 12 that are circumference array distribution, all articulates between the opposite surface of every centre gripping platform 12 and transmission spiral ring 11 has connecting rod 13, and the top surface fixed mounting of centre gripping platform 12 has vertical setting and sets up the clamp stick 14 in the collection waste rubber cover 8 outside.
The top surface axis position of the rotating shaft 6 is provided with a tray 7, the top surface of the tray 7 is movably provided with a circuit wafer body 23, the peripheral side surface of the rotating shaft 6 is fixedly provided with a waste rubber collecting cover 8 with an opening at the top end and driven to deform through a clamping mechanism, the waste rubber collecting cover 8 is made of silica gel, the top surface of the waste rubber collecting cover 8 is higher than the top surface of the tray 7, the height difference between the top surface of the waste rubber collecting cover 8 and the top surface of the tray 7 is 0.3 times of the thickness of the circuit wafer body 23, and the scraping operation of the scraping blade 22 is facilitated through the height difference;
the axis of the rotating shaft 6 is provided with a waste collection component matched with the waste collection rubber cover 8;
the waste collection assembly comprises a waste outlet pipe 15 arranged at the bottom end of the lifting table 4 and a waste collection flow passage arranged at the axial position of the rotating shaft 6, wherein the top end of the waste outlet pipe 15 is communicated with the waste collection flow passage in a rotating way, a waste discharge valve is fixedly arranged in the waste outlet pipe 15, a group of through holes 16 which are distributed in a circumferential array and are communicated with the waste collection rubber cover 8 are fixedly arranged at the top of the rotating shaft 6, and waste guide inclined planes which incline towards the through holes 16 are fixedly arranged at the inner bottom of the waste collection rubber cover 8;
the top of the frame 1 is fixedly provided with a film spraying component and a film scraping component respectively.
The film spraying assembly comprises a screw rod driving module 17 which is horizontally arranged and arranged in the frame 1, a material carrying table 18 is connected to the peripheral side face of the screw rod driving module 17 in a transmission manner, the inner wall of the material carrying table 18 is in sliding connection with the frame 1, a material storage box is fixedly arranged on the top face of the material carrying table 18, a pump body is fixedly arranged on the side face of the material storage box, a spray head 19 which is vertically arranged is fixedly arranged on the bottom face of the material carrying table 18, the discharge port end of the pump body is communicated with the spray head 19, the screw rod driving module 17 is used for driving the material carrying table 18 to slowly displace along a set direction, and then the position of the spray head 19 acting on a circuit wafer body 23 is changed, and the material storage box is used for storing photoresist paint;
the screw driving module 17 includes a driving screw and a motor for driving the driving screw to rotate, respectively.
The film scraping assembly comprises a film scraping frame 20 which is connected to the inner wall of the frame 1 in a sliding manner, an adjusting push rod 21 is arranged between the film scraping frame 20 and the opposite surface of the frame 1, two scraping blades 22 which are symmetrically arranged are fixedly arranged at the bottom end of the film scraping frame 20, the height difference between the scraping blades 22 and the circuit wafer body 23 can be quickly adjusted through the arrangement of the adjusting push rod 21, and the thickness of a coating film on the circuit wafer body 23 is limited through the height difference adjustment.
One specific application of this embodiment is: before working, the circuit wafer body 23 to be coated is placed on the tray 7, the layout height of the waste rubber collecting cover 8 is adjusted according to the thickness of the circuit wafer body 23, after the layout height of the waste rubber collecting cover 8 is adjusted, the top surface of the clamping rod 14 is slightly lower than the top surface of the waste rubber collecting cover 8, then, under the action of the clamping push rod 2, the three clamping rods 14 perform positioning clamping operation of the circuit wafer body 23, after clamping, the height difference between the scraping blade 22 and the circuit wafer body 23 is adjusted according to the thickness requirement of the coating, then the thickness of the coating is limited, after adjustment, the rotating shaft 6 rotates slowly, during the rotating process of the rotating shaft 6, the screw rod driving module 17 drives the carrying platform 18 to reciprocate slowly along the set direction, during the moving process of the carrying platform 18, the spray head 19 sprays photoresist coating with set pressure and set flow, due to the arrangement of the scraping blade 22, redundant photoresist coating is collected through the waste rubber collecting cover 8, after the coating is fully shaped, the circuit wafer body 23 is taken out, and then the coating operation of the circuit wafer body 23 is completed.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (8)
1. Integrated circuit wafer film coating device, including frame (1), its characterized in that: the inner wall of frame (1) is from top to bottom sliding connection in proper order has fixture through centre gripping push rod (2) and through lift push rod (3) and driven elevating platform (4), the bottom of centre gripping push rod (2) and elevating push rod (3) all with frame (1) fixed connection, the inner wall rotation of elevating platform (4) is connected with pivot (6) through servo motor (5) and driven, tray (7) are installed in the top surface axis position of pivot (6), the week side fixed mounting of pivot (6) has top opening and through fixture and driven deformation's collection waste rubber cover (8), the axle position of pivot (6) install with collection waste rubber cover (8) complex collection useless subassembly, the top of frame (1) fixed mounting has respectively and spouts membrane subassembly and scrapes membrane subassembly.
2. The integrated circuit wafer film coating device according to claim 1, wherein the clamping mechanism comprises a fixed clamping ring (9) in sliding connection with the frame (1) and a clamping rotating frame (10) arranged above the fixed clamping ring (9) and rotationally connected with the frame (1), the fixed clamping ring (9) is driven by a clamping push rod (2), a transmission rotating ring (11) is rotationally connected to the top surface of the fixed clamping ring (9), the inner wall of the transmission rotating ring (11) is in sliding connection with the rotating shaft (6), a group of clamping tables (12) distributed in a circumferential array are in sliding connection with the inner wall of the clamping rotating frame (10), connecting rods (13) are hinged between the opposite surfaces of each clamping table (12) and the transmission rotating ring (11), and clamping rods (14) which are vertically arranged and are arranged outside the waste rubber collecting cover (8) are fixedly arranged on the top surface of the clamping tables (12).
3. The integrated circuit wafer film coating device according to claim 2, wherein a group of transmission guide grooves which are distributed in a circumferential array and are vertically arranged are fixedly arranged in the rotating shaft (6), and guide blocks which are in sliding fit with the transmission guide grooves are arranged on the inner wall of the transmission rotating ring (11) and correspond to the positions of each transmission guide groove.
4. The integrated circuit wafer film coating device according to claim 1, wherein the waste collection assembly comprises a waste discharge pipe (15) arranged at the bottom end of the lifting table (4) and a waste collection flow passage arranged at the axis of the rotating shaft (6), the top end of the waste discharge pipe (15) is communicated with the waste collection flow passage in a rotating way, a waste discharge valve is fixedly arranged in the waste discharge pipe (15), a group of through holes (16) which are distributed in a circumferential array and are communicated with the waste collection rubber cover (8) are fixedly arranged at the top of the rotating shaft (6), and waste guiding inclined surfaces which incline towards the through holes (16) are fixedly arranged at the inner bottom of the waste collection rubber cover (8).
5. The integrated circuit wafer film coating device according to claim 1, wherein the film spraying assembly comprises a screw rod driving module (17) which is horizontally arranged and is installed in the frame (1), a material carrying table (18) is connected to the peripheral side face of the screw rod driving module (17) in a transmission manner, the inner wall of the material carrying table (18) is slidably connected with the frame (1), a material storage box is fixedly installed on the top face of the material carrying table (18), a pump body is fixedly installed on the side face of the material storage box, a spray head (19) which is vertically arranged is fixedly installed on the bottom face of the material carrying table (18), and a discharge port end of the pump body is communicated with the spray head (19).
6. The integrated circuit wafer film coating device according to claim 1, wherein the film scraping assembly comprises a film scraping frame (20) which is connected to the inner wall of the frame (1) in a sliding manner, an adjusting push rod (21) is installed between the film scraping frame (20) and the opposite surface of the frame (1), and two symmetrically arranged scraping blades (22) are fixedly installed at the bottom end of the film scraping frame (20).
7. Integrated circuit wafer film coating apparatus according to any one of claims 1-6, characterized in that the top surface of the tray (7) is movably provided with a circuit wafer body (23).
8. The integrated circuit wafer film coating apparatus according to claim 7, wherein the top surface of the waste collection cover (8) is higher than the top surface of the tray (7), and the difference in height between the top surface of the waste collection cover (8) and the top surface of the tray (7) is 0.3 to 0.6 times the thickness of the circuit wafer body (23).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223272380.3U CN219483202U (en) | 2022-12-07 | 2022-12-07 | Integrated circuit wafer film coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223272380.3U CN219483202U (en) | 2022-12-07 | 2022-12-07 | Integrated circuit wafer film coating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219483202U true CN219483202U (en) | 2023-08-08 |
Family
ID=87476806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223272380.3U Active CN219483202U (en) | 2022-12-07 | 2022-12-07 | Integrated circuit wafer film coating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219483202U (en) |
-
2022
- 2022-12-07 CN CN202223272380.3U patent/CN219483202U/en active Active
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