CN215955267U

CN215955267U - Pulsating heat pipe heat dissipation device for server-level double-chip cooling

Info

Publication number: CN215955267U
Application number: CN202122420053.7U
Authority: CN
Inventors: 李震; 曹建国; 陈亮; 陈晓轩
Original assignee: Hebei Tsinghua Development Institute
Current assignee: Hebei Tsinghua Development Institute
Priority date: 2021-10-08
Filing date: 2021-10-08
Publication date: 2022-03-04
Anticipated expiration: 2031-10-08

Abstract

The utility model provides a pulsating heat pipe heat dissipation device for cooling a server-level double chip, which comprises a pulsating heat pipe and a condenser, wherein the lower end of the condenser is provided with a chip, one end of the pulsating heat pipe is connected with the condenser, the pulsating heat pipe comprises a condensation end, an evaporation end and a heat insulation section, and the condensation end and the evaporation end are connected through the heat insulation section, so that the high-efficiency heat dissipation of the server-level double chip can be ensured; the cooling and heat dissipation of two chip heat sources can be simultaneously met; meanwhile, two high-power chips are ensured to work under the same low-temperature stable condition; the high-power heat dissipation device has the advantages of good adaptability, capability of adjusting the temperature through the adjustment of the working medium and the liquid filling rate according to the working temperature requirement, good economy, low manufacturing cost, easiness in batch production and low manufacturing cost, realizes the high-efficiency heat dissipation of the server-level double high-power chip, ensures the stable operation of the data center, is more green, further promotes the informatization development and promotes the development of big data and the Internet.

Description

Pulsating heat pipe heat dissipation device for server-level double-chip cooling

Technical Field

The utility model relates to the technical field of chip cooling, in particular to a pulsating heat pipe heat dissipation device for server-level double-chip cooling.

Background

With the continuous push of the informatization revolution, the informatization datamation of each industry brings about the requirements of data operation and storage, and the requirements of data centers are continuously increased. The stable operation of the data center with low energy consumption and high efficiency cooling is very challenging. The traditional cooling mode of a precision air conditioner is adopted for cooling the existing data center, and equipment and chips in a machine room are cooled through mechanical vapor compression type air cooling. With the increasing power consumption of data centers, liquid cooling technology is adopted. Meanwhile, heat pipes are also used for data center cooling due to their high thermal conductivity and long-distance transmission characteristics. The large loop heat pipe is mainly used, and a part of flat heat pipes and a tail end cooling mode are also used. The air cooling adopts working medium air, the heat exchange coefficient of the air is lower, the distance between an air port and a heat source is also longer, the problem of uneven heat dissipation is caused due to the existence of an air cooling inlet and outlet and a flow path, the uneven heat dissipation also causes the reduction of the set temperature of the precision air conditioner, the power of the air conditioner is further increased, the power consumption is increased, the uneven phenomenon is also increased, vicious circle is formed, and finally the energy utilization rate (PUE) value of a data center is overhigh. The liquid cooling efficiency is high, and the heat transfer capacity is improved by 2-3 orders of magnitude compared with air cooling. However, liquid heat dissipation presents a hidden risk of leakage. The leakage of the liquid working medium can directly damage the normal operation of the electronic device and even influence the whole system. Meanwhile, the complexity of the system is increased by the distribution of liquid pipelines and the like, and the construction cost of the data center is increased. The heat pipe is a high-heat-conduction efficient heat dissipation cooling mode, and the operation does not need to be driven by external force, such as liquid pumping and the like, so that the operation cost is reduced. The heat pipes adopted in the existing data center mainly adopt separated heat pipes, and the heat dissipation and cooling inside the cabinets are carried out one by one through a back plate. The heat dissipation of whole rack is aimed at, but to specific a certain server, the inside chip of server, can't accurate heat dissipation, has a distance between chip and the heat pipe. Meanwhile, along with the upgrading of the server, the requirement of the multi-chip server is increased, and the heat dissipation mode of the traditional heat pipe is further optimized, so that the requirement of the operation improvement of the server is matched.

Disclosure of Invention

In order to solve the problems, the utility model provides a pulsating heat pipe heat dissipation device for server-level double-chip cooling, which is reasonable in structure and solves the problems.

The technical scheme of the utility model is as follows: the pulsating heat pipe heat dissipation device comprises a pulsating heat pipe and a condenser, wherein a chip is installed at the lower end of the condenser, one end of the pulsating heat pipe is connected with the condenser, the pulsating heat pipe comprises a condensation end, an evaporation end and a heat insulation section, and the condensation end and the evaporation end are connected through the heat insulation section.

Optionally, the condenser consists of an upper cover plate and a lower cover plate, the upper cover plate and the lower cover plate are metal cover plates, one surface of the lower cover plate is connected with the chip, the other surface of the lower cover plate is attached to the upper cover plate, a groove with the size consistent with that of the evaporation end is formed in an attachment interface, and the condenser formed by the upper cover plate and the lower cover plate is connected with the evaporation end in a packaging mode.

Optionally, a gap between the condenser, the chip and the evaporation end is filled with a high-thermal-conductivity material, and the high-thermal-conductivity material is high-thermal-conductivity silicone grease.

Optionally, one end of the condensation end is a bent end.

Optionally, one end of the evaporation end is a bent end and is divided into two parts.

Optionally, the tail ends of the evaporation end and the condensation end are flattened capillaries.

Optionally, the heat-insulating segments are bent to form a stepped structure with upper and lower height differences.

Optionally, the capillary tube is a metal tube with a smooth or rough inner wall, and is made of copper, aluminum metal or metal alloy.

Optionally, the working temperature range of the chip is adjusted through the type and the vacuum degree of a working medium, and the working medium is a single solution of water and ethanol or a mixed solution of nano-particle fluid.

Compared with the prior art, the utility model has the beneficial effects that: the high-efficiency heat dissipation of the server-level double chips can be ensured; the cooling and heat dissipation of two chip heat sources can be simultaneously met; meanwhile, two high-power chips are ensured to work under the same low-temperature stable condition; the high-power heat dissipation device has the advantages of good adaptability, capability of adjusting the temperature through the adjustment of the working medium and the liquid filling rate according to the working temperature requirement, good economy, low manufacturing cost, easiness in batch production and low manufacturing cost, realizes the high-efficiency heat dissipation of the server-level double high-power chip, ensures the stable operation of the data center, is more green, further promotes the informatization development and promotes the development of big data and the Internet.

Drawings

The utility model is further illustrated below with reference to the figures:

FIG. 1 is a block diagram of the present invention;

FIG. 2 is a block diagram of the present invention;

FIG. 3 is a block diagram of the present invention;

FIG. 4 is a block diagram of the present invention;

shown in fig. 1, 2, 3, 4: 1. pulsating heat pipe, 2, chip, 3, condenser, 11, condensation end, 12, evaporation end, 13 and heat insulation section.

Detailed Description

The present invention will be described in further detail with reference to the drawings, which are only for explaining the present invention and are schematic illustrations of the embodiments of the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, e.g., as being fixed or detachable or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1, fig. 2, fig. 3, and fig. 4, a pulsating heat pipe heat dissipation device for server-level dual-chip cooling includes a condensation end, an evaporation end, a heat insulation section, a pulsating heat pipe, and a condenser, where the pulsating heat pipe includes a condensation end, an evaporation end, and a heat insulation section, the condenser is composed of an upper cover plate and a lower cover plate, both the upper cover plate and the lower cover plate are metal cover plates, one surface of the lower cover plate is connected with a chip, and the other surface is attached to the upper cover plate, and a groove with the same size as the evaporation end of the pulsating heat pipe is formed on an attachment interface, and the condenser composed of the upper and lower cover plates is connected to the evaporation end of the pulsating heat pipe in a packaging manner. The gaps among the condenser, the chip and the evaporation end of the pulsating heat pipe are filled with high-heat-conductivity materials, and the high-heat-conductivity materials are high-heat-conductivity silicone grease. One end of the condensation end is a bending end. One end of the evaporation end is a bent end and is divided into two parts. The tail ends of the evaporation end and the condensation end are flattened capillary tubes; the heat insulation sections are bent to form a ladder structure with different heights; the capillary tube is a metal tube with a smooth or rough inner wall, and is made of metal or metal alloy such as copper, aluminum and the like. The geometric dimension of the pulsating heat pipe is determined according to the packaging size, the heat flux density and the working temperature requirement of a specific server chip.

The pulsating heat pipe is a novel heat transfer device, an internal working medium absorbs heat at an evaporation end to form an air plug, heat is released at a condensation end to form a liquid plug, heat transfer is realized through sensible heat and latent heat of phase change of the working medium and oscillation between the air plug and the liquid plug, and the heat transfer effect of the pulsating heat pipe is better than that of a traditional heat pipe.

Examples

When the heat dissipation device is used, the heat dissipation device consists of a condenser and a pulsating heat pipe, wherein the pulsating heat pipe is formed by bending a metal capillary tube, is bent into one part at a condensation end and is bent into two parts at an evaporation end and is used for heat dissipation of two chips, and the middle heat insulation section is bent to form a stepped structure with different heights. The tail ends of the evaporation end and the condensation end of the pulsating heat pipe adopt flattened capillaries, so that the connection with a condenser is optimized, and the contact thermal resistance is reduced. The metal capillary is a metal tube with smooth or rough inner wall, and is made of metal such as copper, aluminum and the like or metal alloy. The working medium of the pulsating heat pipe is selected according to the working temperature range of the server chip, and the working temperature range can be adjusted through the type and the vacuum degree of the working medium. The working medium is water and ethanol single solution or nanoparticle fluid mixed solution. The geometric dimension of the pulsating heat pipe is determined according to the packaging size, the heat flux density and the working temperature requirement of a specific server chip. The condenser is determined according to the chip size and the pulsating heat pipe size on a specific dual-chip server. The condenser mainly comprises an upper metal cover plate and a lower metal cover plate, one surface of the lower cover plate is connected with the chip, the other surface of the lower cover plate is attached to the upper cover plate, a groove with the size consistent with that of the evaporation end of the pulsating heat pipe is formed in an attaching interface, and the condenser formed by the upper cover plate and the lower cover plate is packaged with the evaporation end of the pulsating heat pipe. The gaps among the condenser, the chip and the evaporation end of the pulsating heat pipe are filled with high-heat-conductivity materials, such as high-heat-conductivity silicone grease. The heat dissipation of two chip heat sources can be simultaneously satisfied by a pulsating heat pipe heat dissipation device and an evaporation end consisting of two parts. The two evaporation end parts of one pulsating heat pipe can improve the temperature uniformity of the two chips and ensure that the two high-power chips work under the same low-temperature stable condition.

The utility model has reasonable structure, adopts the pulsating heat pipe to carry out chip-level cooling of the data center, and has the following outstanding advantages compared with the traditional heat pipe:

(1) the heat transfer efficiency is extremely high, the maximum heat transfer efficiency of the pulsating heat pipe can reach more than 85 percent, and the high-efficiency heat dissipation of the server-level double chips can be ensured;

(2) the simultaneous double-chip heat dissipation is realized, and the cooling and heat dissipation of two chip heat sources can be simultaneously realized by adopting an evaporation end consisting of two parts through a pulsating heat pipe heat dissipation device; the temperature uniformity of the two chips can be improved at the two evaporation end parts of one pulsating heat pipe, and the two high-power chips are ensured to work under the same low-temperature stable condition;

(3) good adaptability, bending and flattening operations are carried out according to working conditions, namely shape adaptability; in addition, the temperature can be adjusted through adjusting the working medium and the liquid filling rate according to the working temperature requirement;

(4) the pulsating heat pipe is a smooth pipe, is easy to produce in batches, has low manufacturing cost, can run under self-driving, reduces the operation and maintenance cost of a data center, and is more green; the efficient heat dissipation of the server-level double high-power chips is achieved, stable operation of the data center is guaranteed, the data center operates stably and is more green, informatization development is further promoted, and development of big data and the Internet is promoted.

The above description is illustrative of the present invention and is not to be construed as limiting thereof, as numerous modifications and variations therein will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims

1. The utility model provides a pulsation heat pipe heat abstractor for server level double chip cooling which characterized in that: the heat pipe comprises a pulsating heat pipe (1) and a condenser (3), wherein a chip (2) is installed at the lower end of the condenser (3), one end of the pulsating heat pipe (1) is connected with the condenser (3), the pulsating heat pipe (1) comprises a condensation end (11), an evaporation end (12) and an insulation section (13), and the condensation end (11) and the evaporation end (12) are connected through the insulation section (13).

2. The pulsating heat pipe heat sink for server-level dual chip cooling of claim 1, wherein: the condenser (3) is composed of an upper cover plate and a lower cover plate, the upper cover plate and the lower cover plate are metal cover plates, one surface of the lower cover plate is connected with the chip, the other surface of the lower cover plate is attached to the upper cover plate, a groove with the size consistent with that of the evaporation end (12) is formed in an attaching interface, and the condenser (3) formed by the upper cover plate and the lower cover plate is connected with the evaporation end (12) in a packaging mode.

3. The pulsating heat pipe heat sink for server-level dual chip cooling of claim 1, wherein: gaps among the condenser (3), the chip (2) and the evaporation end (12) are filled with high-heat-conductivity materials, and the high-heat-conductivity materials are high-heat-conductivity silicone grease.

4. The pulsating heat pipe heat sink for server-level dual chip cooling of claim 1, wherein: one end of the condenser (3) is a bent end.

5. The pulsating heat pipe heat sink for server-level dual chip cooling of claim 1, wherein: one end of the evaporation end (12) is a bent end and is divided into two parts.

6. The pulsating heat pipe heat sink for server-level dual chip cooling of claim 1, wherein: the tail ends of the evaporation end (12) and the condensation end (11) are flattened capillary tubes.

7. The pulsating heat pipe heat sink for server-level dual chip cooling of claim 1, wherein: the heat insulation sections (13) are bent to form a ladder structure with different heights.

8. The pulsating heat pipe heat sink for server-level dual chip cooling of claim 6, wherein: the capillary tube is a metal tube with a smooth or rough inner wall, and is made of copper, aluminum metal or metal alloy.

9. The pulsating heat pipe heat sink for server-level dual chip cooling of claim 1, wherein: the working temperature range of the chip (2) is adjusted through the type and the vacuum degree of a working medium, and the working medium is a single solution of water and ethanol or a mixed solution of nano-particle fluid.