CN215935152U - Multilayer printed circuit board - Google Patents
Multilayer printed circuit board Download PDFInfo
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- CN215935152U CN215935152U CN202121587834.9U CN202121587834U CN215935152U CN 215935152 U CN215935152 U CN 215935152U CN 202121587834 U CN202121587834 U CN 202121587834U CN 215935152 U CN215935152 U CN 215935152U
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- printed circuit
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Abstract
The utility model discloses a multilayer printed circuit board, which comprises a circuit upper board, a welding layer, a board layer unit and a connecting unit, wherein the circuit upper board is provided with a plurality of welding holes; the laminated unit contains the welding dish, the wiring layer, the back up coat, insulating layer and anti-corrosion layer, the welding dish is installed to the upper end of welding layer, the lower extreme of welding layer bonds with the upper end of wiring layer, install conductive copper foil in the wiring layer, conductive copper foil is connected with the welding dish electricity, the lower extreme of wiring layer bonds the upper end of back up coat, the lower extreme of back up coat bonds with the upper end of insulating layer, the lower extreme of insulating layer bonds and has anti-corrosion layer, this multilayer printed circuit board, insulating effect is better, and it is convenient to take and put, more can satisfy more complicated circuit connection condition.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a multilayer printed circuit board.
Background
When the single-layer circuit board is used, leads are sometimes needed, which is troublesome, and the insulation effect of the common circuit board is poor.
A multilayer printed circuit board, wherein the multilayer printed circuit board proposed by prior art application No. 201922177740.3, comprises a frame assembly including a left frame and a right frame; the left frame and the right frame are positioned on the left side and the right side of the circuit board assembly, and the circuit board assembly comprises a substrate, two first circuit layers, two first insulating layers and two second circuit layers; the clamping block is fixed on the outer walls of the two supporting tubes, the upper surface and the lower surface of the substrate are respectively fixed with an L-shaped limiting block, and the limiting blocks are connected with the clamping block in a clamping manner; the outer wall of the supporting tube is provided with a first through hole and a second through hole, the first through hole and the first circuit layer are on the same horizontal plane, and the second through hole and the second circuit layer are on the same horizontal plane.
The insulation effect is poor, the number of electronic elements is large, and the requirement for connection is not good when the connection is complex.
SUMMERY OF THE UTILITY MODEL
The technical problem to be solved by the utility model is to overcome the existing defects, and provide a multilayer printed circuit board which has better insulation effect and convenient taking and placing, can meet more complicated circuit connection conditions, and can effectively solve the problems in the background art.
In order to achieve the purpose, the utility model provides the following technical scheme: a multilayer printed circuit board includes a circuit upper board, a solder layer, a board layer unit, and a connection unit;
a slab unit: the anti-corrosion welding device comprises a welding disc, a wiring layer, a reinforcing layer, an insulating layer and an anti-corrosion layer, wherein the welding disc is arranged at the upper end of the welding layer, the lower end of the welding layer is adhered to the upper end of the wiring layer, a conductive copper foil is arranged in the wiring layer and electrically connected with the welding disc, the lower end of the wiring layer is adhered to the upper end of the reinforcing layer, the lower end of the reinforcing layer is adhered to the upper end of the insulating layer, and the anti-corrosion layer is adhered to the lower end of the insulating layer; the welding discs can be fixed through the welding layer, the circuit device can be connected more conveniently through the conductive copper foil in the wiring layer, the circuit board can be prevented from deforming through the reinforcing layer, and the service life of the circuit board can be prolonged through the insulating layer and the anti-corrosion layer.
A connection unit: is arranged at four corners of the circuit upper board.
Furthermore, the connection unit includes the spliced pole, the four corners of circuit upper panel is connected in the four corners on welding layer through four spliced poles respectively. The board layer unit can be well connected with the circuit upper board through the four connecting columns.
Furthermore, the connecting unit also comprises a hexagonal screwing disc, and the upper end of the connecting column penetrates through the upper circuit board to be connected with the hexagonal screwing disc. The connection of the column connection plate layer unit and the circuit upper plate is facilitated by the hexagonal screwing plate.
Furthermore, the connecting unit also comprises an insulating stud, and the lower end of the connecting column penetrates through the welding layer to be in threaded connection with the insulating stud. The circuit board can be well insulated through the insulating studs and is not contacted with a placing surface.
Furthermore, the connecting unit further comprises an insulating cylinder which is sleeved on the connecting column. The insulation cylinder can prevent the connecting column from being electrified to influence the human body or hinder the work.
The power transmission device further comprises a power transmission copper column, the lower end of the power transmission copper column is electrically connected with the conductive copper foil, and the upper end of the power transmission copper column is electrically connected with the circuit upper plate. The components on the circuit upper plate can work better through the power transmission copper columns.
Compared with the prior art, the utility model has the beneficial effects that: the multilayer printed circuit board has the following advantages:
1. the multilayer printed circuit board is provided with a board layer unit, the circuit device can be connected more conveniently by utilizing the conductive copper foil and the welding disc in the wiring layer, and the service life of the circuit board can be longer through the insulating layer and the anti-corrosion layer.
2. The multilayer printed circuit board is provided with a connecting unit, a connecting column is in threaded connection with an insulating stud by screwing a hexagonal screwing disc, and the upper board of the circuit and the board layer unit can keep a distance by using an insulating cylinder and work respectively.
3. The multilayer printed circuit board can enable components on the upper board of the circuit to work better through the power transmission copper columns, and further enable the circuit board to adapt to more complex circuit connection conditions.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic view of the enlarged structure of a portion a in fig. 1 according to the present invention.
In the figure: the structure comprises a circuit 1 upper plate, a circuit 2 welding layer, a circuit 3 plate layer unit, a circuit 31 welding disc, a circuit 32 wiring layer, a circuit 33 reinforcing layer, a circuit 34 insulating layer, a circuit 35 anti-corrosion layer, a circuit 4 connecting unit, a circuit 41 connecting column, a circuit 42 hexagonal screwing disc, a circuit 43 insulating stud, a circuit 44 insulating cylinder and a circuit 5 power transmission copper column.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, the present embodiment provides a technical solution: a multilayer printed circuit board includes a circuit upper board 1, a solder layer 2, a board layer unit 3, and a connection unit 4;
ply unit 3: the anti-corrosion wire comprises a welding pad 31, a wiring layer 32, a reinforcing layer 33, an insulating layer 34 and an anti-corrosion layer 35, wherein the welding pad 31 is arranged at the upper end of the welding layer 2, the lower end of the welding layer 2 is adhered to the upper end of the wiring layer 32, a conductive copper foil is arranged in the wiring layer 32 and is electrically connected with the welding pad 31, the lower end of the wiring layer 32 is adhered to the upper end of the reinforcing layer 33, the lower end of the reinforcing layer 33 is adhered to the upper end of the insulating layer 34, and the anti-corrosion layer 35 is adhered to the lower end of the insulating layer 34; the soldering land 31 can be fixed by the soldering layer 2, the circuit device can be connected more conveniently by the conductive copper foil in the wiring layer 32, the circuit board can be prevented from being deformed by the reinforcing layer 33, and the service life of the circuit board can be made longer by the insulating layer 34 and the anti-corrosion layer 35.
The connection unit 4: are mounted at the four corners of the circuit upper board 1.
The connection unit 4 includes connection posts 41, and four corners of the circuit upper board 1 are connected to four corners of the solder layer 2 through the four connection posts 41, respectively. The board layer unit 3 can be well connected to the circuit upper board 1 through the four connection posts 41.
The connecting unit 4 further comprises a hexagonal screwing plate 42, and the upper end of the connecting column 41 penetrates through the upper circuit board 1 to be connected with the hexagonal screwing plate 42. Connecting posts 41 facilitate connection of the slab unit 3 to the circuit upper board 1 by means of hexagonal twist plates 42.
The connecting unit 4 further comprises an insulating stud 43, and the lower end of the connecting column 41 penetrates through the welding layer 2 to be in threaded connection with the insulating stud 43. The circuit board can be insulated well by the insulating studs 43 without contacting the mounting surface.
The connection unit 4 further comprises an insulation cylinder 44, and the insulation cylinder 44 is sleeved on the connection column 41. The insulation tube 44 prevents the connection post 41 from being charged to affect the human body or hinder the work.
The power transmission copper column structure further comprises a power transmission copper column 5, the lower end of the power transmission copper column 5 is electrically connected with the conductive copper foil, and the upper end of the power transmission copper column 5 is electrically connected with the circuit upper board 1. The components on the upper board 1 of the circuit can work better through the power transmission copper columns 5.
The working principle of the multilayer printed circuit board provided by the utility model is as follows: through welding electronic components on bonding pad 31, can make circuit device electricity connect through the electrically conductive copper foil in wiring layer 32, back up layer 33 can prevent this circuit board deformation, can make the life of this circuit board longer through insulating layer 34 and anti-corrosion layer 35, can make circuit upper board 1 and the fine electricity of sheet layer unit 3 be connected through transmission of electricity copper post 5, realize stable work separately, twist six sides and twist set 42 and make spliced pole 41 and insulating double-screw bolt 43 threaded connection, utilize insulating cylinder 44, can make circuit upper board 1 and sheet layer unit 3 keep the distance, and is more stable.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (6)
1. A multilayer printed circuit board characterized by: the circuit board comprises an upper circuit board (1), a welding layer (2), a board layer unit (3) and a connecting unit (4);
ply unit (3): the anti-corrosion welding wire comprises a welding disc (31), a wiring layer (32), a reinforcing layer (33), an insulating layer (34) and an anti-corrosion layer (35), wherein the welding disc (31) is installed at the upper end of the welding layer (2), the lower end of the welding layer (2) is bonded with the upper end of the wiring layer (32), a conductive copper foil is installed in the wiring layer (32) and electrically connected with the welding disc (31), the lower end of the wiring layer (32) is bonded with the upper end of the reinforcing layer (33), the lower end of the reinforcing layer (33) is bonded with the upper end of the insulating layer (34), and the anti-corrosion layer (35) is bonded at the lower end of the insulating layer (34);
connection unit (4): is arranged at four corners of the circuit upper board (1).
2. A multilayer printed circuit board according to claim 1, wherein: the connecting unit (4) comprises connecting columns (41), and four corners of the circuit upper board (1) are connected to four corners of the welding layer (2) through the four connecting columns (41) respectively.
3. A multilayer printed circuit board according to claim 2, wherein: the connecting unit (4) further comprises a hexagonal screwing plate (42), and the upper end of the connecting column (41) penetrates through the upper circuit board (1) to be connected with the hexagonal screwing plate (42).
4. A multilayer printed circuit board according to claim 2, wherein: the connecting unit (4) further comprises an insulating stud (43), and the lower end of the connecting column (41) penetrates through the welding layer (2) to be in threaded connection with the insulating stud (43).
5. A multilayer printed circuit board according to claim 2, wherein: the connecting unit (4) further comprises an insulating cylinder (44), and the insulating cylinder (44) is sleeved on the connecting column (41).
6. A multilayer printed circuit board according to claim 1, wherein: the power transmission device is characterized by further comprising a power transmission copper column (5), the lower end of the power transmission copper column (5) is electrically connected with the conductive copper foil, and the upper end of the power transmission copper column (5) is electrically connected with the circuit upper plate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121587834.9U CN215935152U (en) | 2021-07-13 | 2021-07-13 | Multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121587834.9U CN215935152U (en) | 2021-07-13 | 2021-07-13 | Multilayer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215935152U true CN215935152U (en) | 2022-03-01 |
Family
ID=80399308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121587834.9U Active CN215935152U (en) | 2021-07-13 | 2021-07-13 | Multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215935152U (en) |
-
2021
- 2021-07-13 CN CN202121587834.9U patent/CN215935152U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A multilayer printed circuit board Effective date of registration: 20220826 Granted publication date: 20220301 Pledgee: Postal Savings Bank of China Limited Meizhou Chengqu sub branch Pledgor: MEIZHOU HUADA CIRCUIT BOARD Co.,Ltd. Registration number: Y2022980013706 |