CN215898273U - Airborne electronic equipment for ultralow temperature environment - Google Patents
Airborne electronic equipment for ultralow temperature environment Download PDFInfo
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- CN215898273U CN215898273U CN202121391501.9U CN202121391501U CN215898273U CN 215898273 U CN215898273 U CN 215898273U CN 202121391501 U CN202121391501 U CN 202121391501U CN 215898273 U CN215898273 U CN 215898273U
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Abstract
The utility model discloses airborne electronic equipment for an ultralow temperature environment, which comprises a mounting unit and a mounting bracket, wherein the mounting bracket is sleeved on the outer side of the mounting unit, and a plurality of pressure sensor mechanisms are arranged on the peripheral side of the mounting bracket; the mounting unit comprises a heating module, a signal processing mechanism and a power supply mechanism which are sequentially arranged from top to bottom; the upper end and the lower end of the mounting unit are respectively provided with a central processing mechanism and a heating monitoring mechanism, and the central processing mechanism and the heating monitoring mechanism are respectively arranged on the upper surface and the lower surface of the mounting bracket; the heating module adopts a PTC thermistor element for heating. The PTC thermistor element is used for heating, the resistance value is very small and the power is very high at the low temperature of-65 ℃, rapid heating is realized, and the heating requirement of the equipment at the ultralow temperature can be met. The heating module is arranged in the heating module, so that the working reliability of the electronic equipment in the ultralow temperature environment is effectively ensured, and the heating module has better practicability.
Description
Technical Field
The utility model belongs to the technical field of airborne equipment, and particularly relates to airborne electronic equipment for an ultralow temperature environment.
Background
The low-temperature working temperature of the conventional airborne equipment is-55 ℃, and along with the increasingly harsh environmental conditions of airplane operation, the environmental adaptability requirement of the airborne equipment is higher and higher, and the airborne equipment is required to normally work at the ultralow temperature of-65 ℃. Meanwhile, as the requirement for localization of airborne equipment becomes stricter and stricter, all electronic components are required to be replaced in localization, and particularly, after part of key electronic components are replaced in localization, the problem of low-temperature starting faults frequently occurs. In order to better adapt to the increasingly severe environmental requirements, it is increasingly important to find a solution for reliable operation at ultralow temperatures (-65 ℃).
Ptc (positive Temperature coefficient) refers to a positive Temperature coefficient thermistor, as a new material and element, a typical semiconductor resistor with Temperature sensitivity, and after a certain Temperature (curie Temperature) is exceeded, the resistance value of the thermistor increases in a step-like manner with the increase of Temperature. The R-T curve of a typical PTC thermistor is shown in fig. 2. The resistance-temperature characteristic, namely the temperature resistance characteristic, has good temperature compensation effect, and can solve the problem of reliable work of the airborne equipment at ultralow temperature (-65 ℃).
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide airborne electronic equipment for an ultralow temperature environment, wherein the heating module adopts a PTC thermistor element for heating, and the heating module is arranged inside the airborne electronic equipment to effectively ensure the working reliability of the electronic equipment in the ultralow temperature environment, so that the airborne electronic equipment has better practicability. The structure of the airborne electronic equipment is redesigned, the PTC thermistor is applied to low-temperature heating of the airborne electronic equipment, and according to an R-T curve, the PTC thermistor has small resistance value and large power at the low temperature of-65 ℃, so that the equipment can be quickly heated; when the chip can be normally started after being heated, the temperature of the PTC thermistor does not reach the Curie temperature, and the heating circuit is turned off, so that the power consumption of the PTC thermistor is always high in the whole process, and the heating requirement of the equipment at ultralow temperature (-65 ℃) can be met.
The utility model is mainly realized by the following technical scheme:
an airborne electronic device for an ultralow temperature environment comprises a mounting unit and a mounting bracket sleeved outside the mounting unit, wherein the mounting bracket is provided with a plurality of pressure sensor mechanisms along the peripheral side; the mounting unit comprises a heating module, a signal processing mechanism and a power supply mechanism which are sequentially arranged from top to bottom; the upper end and the lower end of the mounting unit are respectively provided with a central processing mechanism and a heating monitoring mechanism, and the central processing mechanism and the heating monitoring mechanism are respectively arranged on the upper surface and the lower surface of the mounting bracket; the heating module adopts a PTC thermistor element for heating. The pressure sensor mechanism, the heating module, the signal processing mechanism, the power supply mechanism, the central processing mechanism, the heating monitoring mechanism and the connection relationship among the pressure sensor mechanism, the heating module, the signal processing mechanism, the power supply mechanism, the central processing mechanism and the heating monitoring mechanism are respectively the prior art and are not the main improvement points of the utility model, so the description is omitted.
In order to better implement the utility model, further, the heating module, the signal processing mechanism and the power supply mechanism are arranged in a stacked mode through interconnection of connectors between boards.
In order to better implement the present invention, the upper and lower ends of the mounting unit are respectively connected to the central processing unit and the heating monitoring unit through the inter-board connectors.
In order to better implement the utility model, further, the mounting bracket is enclosed by 4 side faces, and each side face is respectively provided with a pressure sensor mechanism.
In the use process of the heating module, in order to ensure that all electronic components of the airborne electronic equipment can be uniformly heated, the structure of all electronic components is redesigned, connectors between boards are adopted for stacking and interconnecting, and the heating module is arranged close to the central processing mechanism, so that the ultralow temperature working reliability of the airborne electronic equipment is effectively ensured. The heating module, the signal processing mechanism and the power supply mechanism are respectively stacked together in an interconnected mode through the connectors between boards, the 4 pressure sensor mechanisms are stacked together in a support combination mode, and the heating module, the signal processing mechanism and the power supply mechanism are enclosed in the mounting support.
In order to better implement the present invention, further, the heating module includes a PTC thermistor element and a printed circuit board, the PTC thermistor element is mounted to the printed circuit board, and a gap between the PTC thermistor element and the printed circuit board is filled with a gel elastomer.
In order to better implement the present invention, further, the PTC thermistor components are mutant type PTC ceramic heating materials.
In order to better realize the utility model, further, the heating power of the heating module is less than or equal to 10W, and the Curie temperature point is-20 ℃.
In the using process, the heating module is firstly prepared, the PTC thermistor element is assembled on the printed circuit board, and the gel elastomer is filled in the gap between the PTC thermistor element and the printed circuit board, so that the heat conductivity is improved, and the thermal expansion of the PTC thermistor element can be smoothly carried out. The PTC thermistor element is fixed on the printed circuit board of the heating module, the resistance value of the PTC thermistor element is very small and the power is very high at-65 ℃, the PTC thermistor element starts a heating mode, the printed circuit board and the connectors between boards are heated, and meanwhile, the connectors between boards and other electronic assemblies are also heated, so that the top and the bottom of the heating module are simultaneously thermally conducted due to the connectors between boards, and the temperature rise is uniform. And further ensure that the whole electronic assembly works in a reliable working temperature range.
The utility model has the beneficial effects that:
(1) compared with the existing far infrared heating plate on the market, the PTC thermistor element has the advantages of low cost, small volume and high heating speed, and has no influence on the heat dissipation of the normal work of the whole equipment chip; the heating module is heated by the PTC thermistor element, so that the working reliability of the electronic equipment in an ultralow-temperature environment is effectively ensured by arranging the heating module inside, and the heating module has better practicability;
(2) the PTC thermistor element is assembled on the printed circuit board, and the gel elastomer is filled in the gap between the PTC thermistor element and the printed circuit board, so that the thermal conductivity is improved, the thermal expansion of the PTC thermistor element can be smoothly carried out, and the PTC thermistor has better practicability;
(3) according to the utility model, the heating mode is started through the PTC thermistor element, the printed circuit board and the connectors between boards are heated, meanwhile, as the connectors between boards, the signal processing mechanism and the power supply mechanism are also heated, the heat conduction of the central processing mechanism and the heating monitoring mechanism is realized at the top and the bottom of the heating module simultaneously due to the connectors between boards, the temperature rise is uniform, and the PTC thermistor element heating module has better practicability.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an R-T curve of a PTC thermistor.
Wherein: 1-a central processing mechanism, 2-a heating module, 3-a pressure sensor mechanism, 7-a signal processing mechanism, 8-a power supply mechanism and 9-a heating monitoring mechanism.
Detailed Description
Example 1:
an airborne electronic device for an ultralow temperature environment is shown in fig. 1 and comprises a mounting unit and a mounting bracket sleeved outside the mounting unit, wherein the mounting bracket is provided with a plurality of pressure sensor mechanisms 3 along the peripheral side; the mounting unit comprises a heating module 2, a signal processing mechanism 7 and a power supply mechanism 8 which are sequentially arranged from top to bottom; the upper end and the lower end of the mounting unit are respectively provided with a central processing mechanism 1 and a heating monitoring mechanism 8, and the central processing mechanism 1 and the heating monitoring mechanism 8 are respectively arranged on the upper surface and the lower surface of the mounting bracket; the heating module 2 adopts a PTC thermistor element for heating.
Further, the installing support is enclosed by 4 sides and closes and form, and every side is provided with pressure sensor mechanism 3 respectively.
In the use process of the heating module, in order to ensure that all electronic components of the airborne electronic equipment can be uniformly heated, the structure of all electronic components is redesigned, connectors between boards are adopted for stacking and interconnecting, and the heating module 2 is arranged close to the central processing mechanism 1, so that the ultralow temperature working reliability of the airborne electronic equipment is effectively ensured. 4 pressure sensor mechanisms 3 are stacked together in a bracket combination mode, the heating module 2, the signal processing mechanism 7 and the power supply mechanism 8 are enclosed in a mounting bracket, and the heating monitoring mechanism 8 and the central processing mechanism 1 are respectively covered on the upper surface and the lower surface of the mounting bracket through connectors between plates.
The heating module 2 is heated by adopting a PTC thermistor element, and the heating module 2 is arranged inside the heating module, so that the working reliability of the electronic equipment in an ultralow-temperature environment is effectively ensured, and the heating module has better practicability. The structure of the airborne electronic equipment is redesigned, the PTC thermistor is applied to low-temperature heating of the airborne electronic equipment, and according to an R-T curve, the PTC thermistor has small resistance value and large power at the low temperature of-65 ℃, so that the equipment can be quickly heated; when the chip can be normally started after being heated, the temperature of the PTC thermistor does not reach the Curie temperature, and the heating circuit is turned off, so that the power consumption of the PTC thermistor is always high in the whole process, and the heating requirement of the equipment at ultralow temperature (-65 ℃) can be met.
Example 2:
this embodiment is optimized based on embodiment 1, and as shown in fig. 1, the heating module 2, the signal processing mechanism 7, and the power supply mechanism 8 are stacked and interconnected by the inter-board connector.
Furthermore, the upper end and the lower end of the mounting unit are respectively connected with the central processing mechanism 1 and the heating monitoring mechanism 8 through the connectors between the boards.
In the use process of the heating module, in order to ensure that all electronic components of the airborne electronic equipment can be uniformly heated, the structure of all electronic components is redesigned, connectors between boards are adopted for stacking and interconnecting, and the heating module 2 is arranged close to the central processing mechanism 1, so that the ultralow temperature working reliability of the airborne electronic equipment is effectively ensured. The heating module 2, the signal processing mechanism 7 and the power supply mechanism 8 are respectively stacked together by adopting an inter-board connector, 4 pressure sensor mechanisms 3 are stacked together in a support combination mode, and the heating module 2, the signal processing mechanism 7 and the power supply mechanism 8 are enclosed in the mounting support, and the heating monitoring mechanism 8 and the central processing mechanism 1 are respectively covered on the upper surface and the lower surface of the mounting support through the inter-board connector.
At-65 ℃, the resistance value of the PTC thermistor element is very small, the power is very high, the PTC thermistor element starts a heating mode, the printed circuit board and the connectors between boards are heated, and meanwhile, other electronic combinations are also heated due to the connectors between boards, so that the top and the bottom of the heating module 2 realize heat conduction due to the connectors between boards, and the temperature rise is uniform. And further ensure that the whole electronic assembly works in a reliable working temperature range.
Other parts of this embodiment are the same as embodiment 1, and thus are not described again.
Example 3:
this embodiment is optimized on the basis of embodiment 1 or 2, and the heating module 2 includes a PTC thermistor element and a printed circuit board, the PTC thermistor element is mounted on the printed circuit board, and a gel elastomer is filled in a gap between the PTC thermistor element and the printed circuit board.
Further, the PTC thermistor element is a mutant type PTC ceramic heating material.
Further, the heating power of the heating module 2 is less than or equal to 10W, and the Curie temperature point is-20 ℃. The heating module 2 is rapidly heated at-65 ℃ and the heating power is rapidly reduced at-10 ℃ so that the product can normally work at the ultralow temperature of-65 ℃ and is hardly heated at the high temperature. The utility model has long-term stability in the prior art and can improve the reliability of ultralow temperature operation of airborne equipment.
As shown in FIG. 2, the PTC thermistor has good temperature compensation effect and can solve the problem of reliable operation of the airborne equipment at ultralow temperature (-65 ℃), which is the resistance-temperature characteristic of the universal PTC thermistor.
Wherein: rmin is the minimum zero power resistance;
rc is a switching resistance value corresponding to a zero power resistance value of the switching temperature;
rn is a rated temperature zero power resistor;
rmax is the maximum resistance value;
TRmin is the temperature at minimum zero power resistance;
tc is the switching temperature, i.e. the Curie temperature, the temperature at which the resistance value of the positive temperature coefficient thermistor increases stepwise;
TRmax is the temperature corresponding to the maximum resistance value.
Because the power consumption of the PTC thermistor is greatly related to the heat dissipation condition, under the condition of low-temperature heating, the power consumption of the PTC chip is very large, the power consumption of 1 PTC thermistor in the airborne equipment can reach 10W, the situation that the airborne equipment is normally operated after being kept at the ultralow temperature of-65 ℃ for 2h is recorded, the working condition of the airborne equipment is recorded by copying for 2h, the phenomenon that the work of the airborne equipment is not interrupted is found, and the problem that the work of the airborne equipment is interrupted at the ultralow temperature of-65 ℃ is successfully solved.
In the using process of the utility model, the heating module 2 is firstly prepared, the PTC thermistor element is assembled on the printed circuit board, and the gel elastomer is filled in the gap between the PTC thermistor element and the printed circuit board, so that the heat conductivity is improved, and the thermal expansion of the PTC thermistor element can be smoothly carried out. The PTC thermistor element is fixed on the printed circuit board of the heating module 2, the resistance value of the PTC thermistor element is very small and the power is very high at-65 ℃, the PTC thermistor element starts a heating mode, the printed circuit board and the connectors between boards are heated, and meanwhile, because the connectors between boards and other electronic combinations are also heated, the top and the bottom of the heating module 2 are simultaneously in heat conduction due to the connectors between boards, and the temperature rise is uniform. And further ensure that the whole electronic assembly works in a reliable working temperature range.
The rest of this embodiment is the same as embodiment 1 or 2, and therefore, the description thereof is omitted.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, and all simple modifications and equivalent variations of the above embodiments according to the technical spirit of the present invention are included in the scope of the present invention.
Claims (6)
1. An airborne electronic device for an ultralow temperature environment is characterized by comprising a mounting unit and a mounting bracket sleeved outside the mounting unit, wherein the mounting bracket is provided with a plurality of pressure sensor mechanisms (3) along the peripheral side; the mounting unit comprises a heating module (2), a signal processing mechanism (7) and a power supply mechanism (8) which are arranged from top to bottom in sequence; the upper end and the lower end of the mounting unit are respectively provided with a central processing mechanism (1) and a heating monitoring mechanism (9), and the central processing mechanism (1) and the heating monitoring mechanism (9) are respectively arranged on the upper surface and the lower surface of the mounting bracket; the heating module (2) adopts a PTC thermistor element for heating.
2. The on-board electronics device for ultra-low temperature environments of claim 1, wherein the heating module (2), the signal processing mechanism (7), and the power supply mechanism (8) are stacked and interconnected via inter-board connectors.
3. The on-board electronic device for ultra-low temperature environments of claim 2, wherein the upper and lower ends of the mounting unit are connected to the central processing unit (1) and the heating monitoring unit (9) through the connectors between boards, respectively.
4. The on-board electronics device for ultra-low temperature environments of any of claims 1-3, wherein the mounting bracket is enclosed by 4 sides, and each side is provided with a pressure sensor mechanism (3).
5. The on-board electronic device for an ultra-low temperature environment according to claim 1, wherein the heating module (2) comprises a PTC thermistor element and a printed circuit board, the PTC thermistor element is mounted on the printed circuit board, and a gap between the PTC thermistor element and the printed circuit board is filled with a gel elastomer.
6. The on-board electronic device for an ultra-low temperature environment as claimed in claim 5, wherein the PTC thermistor element is a mutant PTC ceramic heating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121391501.9U CN215898273U (en) | 2021-06-22 | 2021-06-22 | Airborne electronic equipment for ultralow temperature environment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202121391501.9U CN215898273U (en) | 2021-06-22 | 2021-06-22 | Airborne electronic equipment for ultralow temperature environment |
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| CN215898273U true CN215898273U (en) | 2022-02-22 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113631013A (en) * | 2021-06-22 | 2021-11-09 | 成都凯天电子股份有限公司 | High-reliability aviation airborne electronic system capable of working at ultralow temperature |
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2021
- 2021-06-22 CN CN202121391501.9U patent/CN215898273U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113631013A (en) * | 2021-06-22 | 2021-11-09 | 成都凯天电子股份有限公司 | High-reliability aviation airborne electronic system capable of working at ultralow temperature |
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