CN215892291U - Heat dissipation module and lamp - Google Patents

Abstract

The utility model relates to the field of lamps and discloses a heat dissipation module and a lamp, wherein the heat dissipation module comprises a substrate, a plurality of heat dissipation fins and a plurality of lamp beads, a plurality of abdicating grooves are formed in the substrate at intervals, each heat dissipation fin comprises a fin main body and a clamping plate, the clamping plate is fixed on one side edge of the fin main body, one end, far away from the clamping plate, of the fin main body penetrates through the abdicating groove from the front surface of the substrate, the clamping plate abuts against the edge of the abdicating groove, the clamping plate is fixedly connected with the substrate, and the lamp beads are fixedly connected with the substrate.

Description

Heat dissipation module and lamp

Technical Field

The utility model relates to the field of lamps, in particular to a heat dissipation module and a lamp.

Background

The basic structure of the LED lamp is an electroluminescent semiconductor material chip, the LED energy-saving lamp is taken as a novel lighting source, and the LED energy-saving lamp is characterized by energy conservation, health, environmental protection and long service life, is favored by people and is greatly supported by the country, and is widely applied to various fields of daily household appliances such as mobile phones, table lamps and household appliances, mechanical production and the like, but the existing LED lamp has long energy conservation and long service life, but the heat dissipation function is still unsatisfactory, the heat generated by the high-power LED lamp is difficult to dissipate, the existing module heat dissipation technology is generally to arrange heat dissipation fins on a lamp panel of the LED, and the arrangement of the heat dissipation fins comprises two methods; the first method is to make the heat dissipation fins and the lamp shell of the lamp into an integral structure, and the method needs a special mold for injection molding and is troublesome to manufacture; the second method is to weld or adhere the heat dissipation fins on the back of the lamp panel, but in this method, the heat dissipation fins are not fixed firmly, and the actual contact area between the heat dissipation fins and the lamp panel is small, and the heat dissipation efficiency is low.

SUMMERY OF THE UTILITY MODEL

Therefore, a heat dissipation module is needed to be provided to solve the problems of the existing heat dissipation lamp that the heat dissipation fins are not firmly fixed and the heat dissipation efficiency is low.

In order to achieve the purpose, the utility model provides a heat dissipation module which comprises a substrate, a plurality of heat dissipation fins and a plurality of lamp beads, wherein a plurality of abdicating grooves are formed in the substrate at intervals, each heat dissipation fin comprises a fin main body and a clamping plate, the clamping plate is fixed on one side edge of the fin main body, one end, far away from the clamping plate, of each fin main body penetrates through the abdicating groove from the front face of the substrate, a heat dissipation channel is formed between every two adjacent fin main bodies, the clamping plate abuts against the edge of the abdicating groove, the clamping plate is fixedly connected with the front face of the substrate, and the lamp beads are fixedly connected with the substrate.

Furthermore, one side of the clamping plate, which is connected with the substrate, is plated with a nickel layer, and the nickel layer is tightly attached to the front side of the substrate. The nickel layer is plated, so that the heat transfer efficiency between the clamping plate and the substrate is improved, and the heat dissipation efficiency of the heat dissipation fins is improved.

Further, the clamping plate is a plane plate, and the clamping plate and the fin main body form an L-shaped or T-shaped structure. The tail end clamping plate of the L-shaped or T-shaped structure can be clamped with the substrate, and the fin main body is effectively fixed.

Furthermore, the clamping plate and the lamp beads are welded on the substrate by adopting reflow soldering.

Furthermore, a plurality of hollow holes are formed in the fin main body. The hollow holes are beneficial to the flowing of heat dissipation airflow between the fin main bodies, so that the heat on the fin main bodies is accelerated to be transferred to the air, and the heat dissipation efficiency is improved.

Furthermore, a plurality of hollow holes on the fin main body are arranged in an equidistant array.

Furthermore, the hollow holes are long-strip-shaped, and the long-strip-shaped hollow holes are horizontally or vertically arranged.

Further, the hollow holes on the adjacent fin bodies are aligned or arranged in a staggered mode. The hollow holes arranged in a staggered manner enable the heat dissipation airflow to have a certain flow path between the fin main bodies, and heat dissipation is facilitated.

Further, the lamp bead is arranged between two adjacent radiating fins.

A lamp comprises the heat dissipation module and a lamp shell, wherein the heat dissipation module is installed in the lamp shell, a space is reserved between a base plate and the side face of the lamp shell to form a ventilation opening, heat dissipation holes are formed in the top face and the side face of the lamp shell, and the heat dissipation holes in the side face of the lamp shell correspond to the heat dissipation channel positions of the heat dissipation module.

The technical scheme has the following beneficial effects:

in the utility model, the substrate and the radiating fins are of a split structure, the radiating fins can be arranged on the substrate according to requirements, the requirement of adapting to various radiating environments is facilitated, meanwhile, the clamping plate is clamped with the front surface of the substrate after the fin main body passes through the abdicating groove, so that the radiating fins are more firmly fixed, in addition, the contact surface of the clamping plate and the front surface of the substrate is facilitated to increase the contact surface of the radiating fins and the substrate, and the radiating efficiency is facilitated to be improved.

Drawings

Fig. 1 is a structure diagram of the heat dissipation module according to embodiment 1.

Fig. 2 is an assembly diagram of the heat dissipation module according to embodiment 1.

Fig. 3 is a heat sink with an L-shaped structure according to embodiment 1.

Fig. 4 shows a heat sink fin of the T-shaped structure according to embodiment 2.

Fig. 5 is a schematic view of the heat sink fin with hollow holes according to embodiment 3.

Fig. 6 is a structural diagram of the heat dissipation module according to embodiment 3.

Fig. 7 is a structural diagram of the lamp according to embodiment 6.

Fig. 8 is a cross-sectional structural view of the lamp according to embodiment 6.

Description of reference numerals:

1. a substrate; 11. a yielding groove; 2. heat dissipation fins; 21. clamping a plate; 22. a fin body; 23. a nickel layer; 24. hollowing out holes; 3. a lamp bead; 4. a heat dissipation channel; 5. a lamp housing; 51. a vent; 52. and (4) heat dissipation holes.

Detailed Description

To explain technical contents, structural features, and objects and effects of the technical solutions in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.

Example 1

Please refer to fig. 1-3, a heat dissipation module includes a substrate 1, a plurality of heat dissipation fins 2 and a plurality of lamp beads 3, the substrate 1 includes a front surface and a back surface opposite to each other, a plurality of equally spaced yielding slots 11 are arranged on the substrate 1 at intervals, the yielding slots 11 penetrate through the front surface and the back surface, the heat dissipation fins 2 include fin bodies 22 and snap boards 21, the snap boards 21 are fixed on one side edge of the fin bodies 22, one end of the fin bodies 22 far away from the snap boards 21 penetrates the yielding slots 11 from the front surface of the substrate 1, heat dissipation channels 4 are formed between the adjacent fin bodies 22, the snap boards 21 abut against the edges of the yielding slots 11, the snap boards 21 are welded with the front surface of the substrate 1, the lamp beads 3 are arranged between the adjacent two heat dissipation fins 2, and the lamp beads 3 are welded with the front surface of the substrate 1. The clamping plate 21 and the lamp beads 3 are welded on the substrate 1 through reflow soldering. The width of the relief groove 11 is adapted to the thickness of the fin body 22, so that the relief groove 11 can just block the fin body 22. The substrate 1 is an aluminum substrate 1, and the lamp beads 3 are LED lamp beads 3.

One side of the clamping plate 21 connected with the substrate 1 is plated with a nickel layer 23, and the nickel layer 23 is tightly attached to the front side of the substrate 1. The nickel plating layer 23 helps to improve the heat transfer efficiency between the card 21 and the substrate 1, thereby improving the heat dissipation efficiency of the heat sink fins 2. Specifically, the thickness of the nickel layer 23 is less than 1mm, and the thickness of the nickel layer 23 in this embodiment is 0.1 mm.

The clamping plate 21 is a flat plate, the clamping plate 21 and the fin main body 22 form an L-shaped structure, specifically, the bottom edge of the clamping plate 21 is fixedly connected with one side edge of the clamping plate 21, and the radiating fins 2 of the L-shaped structure face the same direction on the clamping plate 21. The end snap-gauge 21 of the L-shaped structure can be engaged with the substrate 1 to effectively fix the fin body 22. A plurality of rows of lamp beads 3 are arranged between two adjacent clamping plates 21. In this embodiment, be provided with one row of lamp pearl 3 between two adjacent cardboard 21.

Example 2

Referring to fig. 4, a difference of the heat dissipation module from embodiment 1 is that the locking plate 21 and the fin main body 22 form a T-shaped structure, and specifically, the bottom edge of the locking plate 21 is fixedly connected to the central position of one side surface of the locking plate 21.

Example 3

Referring to fig. 5-6, a heat dissipation module is different from embodiment 1 in that a plurality of hollow holes 24 are formed in the fin body 22 and are arranged in an array at equal intervals, and the hollow holes are aligned. The hollowed-out holes 24 facilitate the flow of the heat dissipation air flow between the fin bodies 22, so as to accelerate the heat transfer from the fin bodies 22 to the air, thereby improving the heat dissipation efficiency.

In this embodiment, the hollow holes 24 are long strips, and the long strip-shaped hollow holes 24 are vertically arranged. The lengths of the apertures 24 exceed the vertical height 1/2 of the fin body 22 and the apertures 24 are arranged in rows. The openings in adjacent fin bodies 22 are aligned.

Example 4

A heat dissipation module, which is different from embodiment 1 in that the hollow holes of two adjacent heat dissipation fins are arranged in a staggered manner. The hollow holes arranged in a staggered manner enable the heat dissipation airflow to have a certain flow path between the fin main bodies, and heat dissipation is facilitated.

Example 5

The utility model provides a heat dissipation module, differs with embodiment 1 in that the fretwork hole is rectangular shape, and the fretwork hole level of rectangular shape sets up. The length of the hollow holes exceeds 1/2 of the horizontal width of the fin body, and the hollow holes are arranged in a single row.

Example 6

Referring to fig. 7-8, a lamp includes the heat dissipation module of any one of embodiments 1-5 and a lamp housing 5, the heat dissipation module is installed in the lamp housing 5, a space is formed between the substrate 1 and a side surface of the lamp housing 5 to form a ventilation opening 51, heat dissipation holes 52 are formed on a top surface and a side surface of the lamp housing 5, and the heat dissipation holes 52 on the side surface of the lamp housing 5 correspond to the positions of the heat dissipation channels 4 of the heat dissipation module.

When the utility model is installed and used:

pass the groove of stepping down 11 with fin main part 22, the nickel layer 23 of cardboard 21 closely laminates with base plate 1's front, cardboard 21 welds with base plate 1, 3 welding of lamp pearl are in base plate 1's front, during the use, the heat energy that lamp pearl 3 produced passes through the bottom to both sides transmission, the heat passes through nickel layer 23 and transmits to cardboard 21 after that, transmit to fin main part 22 after that, transmit in the air at last, accomplish the heat dissipation, being provided with of cardboard 21 nickel layer 23 does benefit to the heat transfer efficiency who improves between cardboard 21 and the nickel layer 23, fretwork hole 24 on fin main part 22, make the air between fin main part 22 can flow each other, thereby improve the radiating efficiency.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrases "comprising … …" or "comprising … …" does not exclude the presence of additional elements in a process, method, article, or terminal that comprises the element. Further, herein, "greater than," "less than," "more than," and the like are understood to exclude the present numbers; the terms "above", "below", "within" and the like are to be understood as including the number.

Although the embodiments have been described, once the basic inventive concept is obtained, other variations and modifications of these embodiments can be made by those skilled in the art, so that the above embodiments are only examples of the present invention, and not intended to limit the scope of the present invention, and all equivalent structures or equivalent processes using the contents of the present specification and drawings, or any other related technical fields, which are directly or indirectly applied thereto, are included in the scope of the present invention.

Claims (10)

1. The utility model provides a heat dissipation module, its characterized in that, includes base plate, a plurality of heat radiation fins and a plurality of lamp pearl, the interval sets up a plurality of grooves of stepping down on the base plate, heat radiation fins includes fin main part and cardboard, a side at the fin main part is fixed to the cardboard, the one end that the cardboard was kept away from to the fin main part is passed the groove of stepping down by the front of base plate, forms heat dissipation channel between the adjacent fin main part, the cardboard butt is at the edge in the groove of stepping down, the positive fixed connection of cardboard and base plate, the lamp pearl is with the positive fixed connection of base plate.

2. The heat dissipating module of claim 1, wherein the side of the card that is attached to the substrate is plated with a nickel layer that is in intimate contact with the front side of the substrate.

3. The heat dissipation module of claim 1, wherein the clip is a planar plate, and the clip and the fin body form an L-shaped or T-shaped structure.

4. The heat dissipation module of claim 1, wherein the card board and the bead are soldered to the substrate by reflow soldering.

5. The heat dissipation module of claim 1, wherein the fin body defines a plurality of apertures.

6. The heat dissipation module of claim 5, wherein the plurality of apertures are disposed in an equidistant array.

7. The heat dissipation module of claim 6, wherein the hollow holes are elongated, and the elongated hollow holes are horizontally or vertically disposed.

8. The heat dissipation module of claim 6, wherein the openings in adjacent fin bodies are aligned or offset.

9. The heat dissipation module of claim 1, wherein the bead is disposed between two adjacent heat dissipation fins.

10. A lamp comprising the heat dissipation module of any of claims 1-9 and a lamp housing, wherein the heat dissipation module is mounted in the lamp housing, the substrate is spaced apart from the side surface of the lamp housing to form a ventilation opening, heat dissipation holes are formed in the top surface and the side surface of the lamp housing, and the heat dissipation holes in the side surface of the lamp housing correspond to the positions of the heat dissipation channels of the heat dissipation module.

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