CN215871982U - Circuit board assembly and electronic device - Google Patents

Abstract

The application discloses a circuit board assembly and electronic equipment, which belong to the technical field of circuit boards, wherein the circuit board assembly comprises a circuit board and a circuit board base; a first circuit board; the first circuit board and the second circuit board are provided with a heat dissipation interval; the supporting piece is supported between the first circuit board and the second circuit board. The heat dissipation fan is rotatably arranged between the first circuit board and the second circuit board.

Description

Circuit board assembly and electronic device

Technical Field

The application relates to the technical field of circuit boards, in particular to a circuit board assembly and electronic equipment.

Background

With the development of the patch technology, the sandwich circuit board design is widely influenced. Although the sandwich circuit board design reduces the area of the circuit board, the electronic components are stacked and distributed, which is equivalent to the closer spatial distribution of the electrical components. After the circuit board is powered on to operate, heat generated by the operation of the electrical components can be easily concentrated and is not easy to dissipate, so that the heat dissipation effect of the whole electronic equipment is poor, and the circuit board and the whole electronic equipment can be seriously damaged.

SUMMERY OF THE UTILITY MODEL

The application aims at providing a circuit board assembly and electronic equipment, and the technical problem that in the related art, the heat dissipation effect of a stacked circuit board assembly is poor is solved at least.

In a first aspect, an embodiment of the present application provides a circuit board assembly, including; a first circuit board; the first circuit board and the second circuit board are provided with a heat dissipation interval; the supporting piece is supported between the first circuit board and the second circuit board. The heat dissipation fan is rotatably arranged between the first circuit board and the second circuit board.

In the embodiment of the application, the heat dissipation interval between the first circuit board and the second circuit board is a non-closed structure and is provided with an air inlet and an air outlet. In the use process, the rotation of the heat radiation fan can enable the air inside and outside the heat radiation interval to flow to form airflow. Therefore, the temperature of the heat dissipation interval can be reduced when the outside low-temperature air flow enters the heat dissipation interval, and the heat can be taken out when the high-temperature air flow flows out of the heat dissipation interval in the heat dissipation interval, so that the temperature of the heat dissipation interval is further reduced.

Therefore, this application through continuous air inlet and air-out, can effectively reduce heat dissipation spaced temperature, and then heat first circuit board, second circuit board and the electrical components's of setting on first circuit board and second circuit board heat loss, and then guaranteed circuit board assembly's radiating effect, avoid circuit board assembly to damage because of high temperature, promote circuit board assembly's life.

In a second aspect, an embodiment of the present application provides an electronic device, including: a circuit board assembly as in the embodiment of the first aspect of the present application.

In embodiments of the present application, the electronic device has all the benefits of the circuit board assembly described above, and will not be discussed in detail here.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is one of schematic diagrams of a circuit board assembly according to one embodiment of the present application;

FIG. 2 is a second schematic diagram of a circuit board assembly according to one embodiment of the present application;

FIG. 3 is a third schematic diagram of a circuit board assembly according to one embodiment of the present application;

fig. 4 is a schematic structural diagram of a heat dissipation fan in a circuit board assembly according to an embodiment of the present application;

FIG. 5 is a schematic view of a fan blade of the heat dissipation fan shown in FIG. 4;

FIG. 6 is a front view of the fan blade of the heat dissipation fan shown in FIG. 5;

FIG. 7 is a side view (with the rotating shaft hidden) of the fan blade of the heat dissipation fan shown in FIG. 5;

fig. 8 is a schematic structural diagram of a roller in the heat dissipation fan shown in fig. 4.

Reference numerals in fig. 1 to 8:

102 a first circuit board, 104 a second circuit board, 106 a support member, 108 a heat dissipation fan, 110 a heat dissipation interval, 112 an electrical element, 114 a mounting area, 116 an air passing opening, 118 a first end, 120 a second end, 122 a third end, 124 a fourth end, 126 a mounting opening, 128 fan blades, 130 rollers, 132 a rotating shaft, 134 a copper hole and 136 a welding disc.

Detailed Description

The technical solutions in the embodiments of the present application will be described clearly below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments that can be derived by one of ordinary skill in the art from the embodiments given herein are intended to be within the scope of the present disclosure.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

Fig. 1 to 8 provided in the embodiments of the present application are described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof. The bold arrows in fig. 2 indicate the direction of the air flow.

As shown in fig. 1, fig. 2 and fig. 3, an embodiment of the first aspect of the present application provides a circuit board assembly, which includes a first circuit board 102, a second circuit board 104, a support 106 and a heat dissipation fan 108. The first circuit board 102 and the second circuit board 104 are arranged at intervals, and a certain distance is reserved between the first circuit board 102 and the second circuit board 104; the support 106 is supported between the first circuit board 102 and the second circuit board 104. Thus, the first circuit board 102 and the second circuit board 104 are provided with the heat dissipation space 110. In addition, both the first circuit board 102 and the second circuit board 104 can be used for mounting the electrical components 112, so that the whole circuit board assembly has at least four mounting surfaces, more electrical components 112 can be arranged, and the area of a single circuit board is greatly reduced.

In addition, as shown in fig. 1, fig. 2 and fig. 3, the heat dissipation fan 108 is rotatably disposed between the first circuit board 102 and the second circuit board 104, and can be used for air intake and air outtake of the heat dissipation space 110 between the first circuit board 102 and the second circuit board 104, so as to drive the heat inside the heat dissipation space 110 through the airflow, thereby dissipating heat for the first circuit board 102, the second circuit board 104 and the electrical components 112 disposed on the first circuit board 102 and the second circuit board 104.

Specifically, as shown in fig. 1, 2 and 3, the heat dissipation space 110 between the first circuit board 102 and the second circuit board 104 is a non-closed structure and has an air inlet and an air outlet. During use, the rotation of the heat dissipation fan 108 causes air flow between the inside and outside of the heat dissipation compartment 110, forming an air flow. Thus, the temperature of the heat dissipation space 110 is reduced when the external low-temperature air flows enter the heat dissipation space 110, and the heat is also taken out by the high-temperature air flows in the heat dissipation space 110 flowing out of the heat dissipation space 110, so as to further reduce the temperature of the heat dissipation space 110.

Therefore, this application through continuous air inlet and air-out, can effectively reduce heat dissipation interval 110's temperature, and then heat first circuit board 102, second circuit board 104 and set up the heat loss of electrical components 112 on first circuit board 102 and second circuit board 104, and then guaranteed circuit board assembly's radiating effect, avoid circuit board assembly to damage because of high temperature, promote circuit board assembly's life.

In addition, the circuit board assembly provided by the application has a simple structure, and the efficient heat dissipation of the circuit board assembly can be realized only through the heat dissipation fan 108, so that the structures of the first circuit board 102 and the second circuit board 104 are not needed, and the original circuit performance of the circuit board assembly is not influenced.

Specifically, as shown in fig. 1 and 3, the supporting member 106 may be a raised plate. The two ends of the raised plate are provided with bonding pads 136, and the two ends of the raised plate can be connected with a circuit through the copper holes 134.

It should be noted that the circuit board assembly proposed in the present application is only exemplified by the first circuit board 102 and the second circuit board 104, the number of the circuit boards is not limited to two, and a third circuit board (the support member 106 and the above-mentioned heat dissipation space 110 are also arranged between the third circuit board and the second circuit board 104), a fourth circuit board (the support member 106 and the above-mentioned heat dissipation space 110 are also arranged between the fourth circuit board and the third circuit board) and the like may also be arranged in the present application, and are not exemplified here.

As a possible implementation, as shown in fig. 2 and 3, at least one of the first circuit board 102 and the second circuit board 104 is provided with an electrical component 112. Specifically, the electrical component 112 may be freely disposed on the first circuit board 102 and/or the second circuit board 104. Moreover, since the heat dissipation fan 108 generates flowing air flow, the air flow contacts the first circuit board 102 and the second circuit board 104, and the temperature of the electrical component 112 is taken away directly or indirectly, so as to cool the electrical component 112, thereby ensuring the service life of the electrical component 112.

Specifically, the electrical component 112 may be mounted on the first circuit board 102 or the second circuit board 104 by soldering.

As a possible embodiment, as shown in fig. 2 and 3, the electrical component 112 is disposed inside the heat dissipation space 110, and may be disposed outside the heat dissipation space 110. When the electrical component 112 is disposed inside the heat dissipation space 110, the airflow generated by the heat dissipation fan 108 directly carries away the heat generated by the electrical component 112, and thus is the electrical component 112 located inside the heat dissipation space 110. When the electrical component 112 is disposed outside the heat dissipation space 110, on one hand, heat generated by the electrical component 112 is directly lost to the surrounding space, on the other hand, heat generated by the electrical component 112 is transferred to the first circuit board 102 or the second circuit board 104, and the airflow generated by the heat dissipation fan 108 takes away heat of the first circuit board 102 and the second circuit board 104, thereby indirectly dissipating heat of the electrical component 112.

As one possible implementation, as shown in FIG. 2, the heat dissipation compartment 110 includes a plurality of interconnected mounting areas 114. Wherein each mounting region 114 is adapted to mount the electrical components 112 in an orderly arrangement of the electrical components 112 within the heat dissipation compartment 110. Furthermore, at least a portion of the support 106 is disposed inside the heat dissipation space 110 and between two adjacent mounting areas 114. And an air inlet 116 is arranged on the supporting member 106 between two adjacent mounting areas 114, so as to ensure that two adjacent mounting areas 114 are communicated.

Thus, as shown in fig. 2, the airflow generated by the heat dissipation fan 108 may traverse different mounting areas 114 during use of the circuit board assembly. More importantly, it is ensured that two adjacent mounting regions 114 are communicated, that is, the mounting region 114 located at the middle portion can be communicated with the outside of the heat dissipation space 110 through the other mounting regions 114, thereby ensuring the heat dissipation of the mounting region 114 located at the middle portion.

Furthermore, as shown in fig. 2, different electrical components 112 are mounted in different mounting areas 114, so that mutual influence between different electrical components 112 can be avoided. For example, electrical components 112 (e.g., speakers, sound units, etc.) for implementing audio for the electrical device are disposed within one of the mounting areas 114. In addition, some electrical components 112 release more heat (such as a battery) when operating, and some electrical components 112 release less heat (such as a light sensing chip) when operating; the electrical components 112 with different heat release amounts are arranged in different mounting areas 114, so that the influence of the use temperature among different electrical components 112 can be effectively avoided.

As a possible implementation manner, as shown in fig. 2, the heat dissipation fan 108 is disposed at least at a first end 118 and a second end 120 of the heat dissipation space 110, and the first end 118 and the second end 120 are opposite to each other along the first direction. In addition, the heat dissipation fan 108 at the first end 118 is used for air intake of the heat dissipation space 110, and the heat dissipation fan 108 at the second end 120 is used for air outtake of the heat dissipation space 110.

Thus, as shown in fig. 2, during the use of the circuit board assembly, the heat dissipation fan 108 at the first end 118 and the heat dissipation fan 108 at the second end 120 can work simultaneously, so as to simultaneously send low-temperature air flow into the heat dissipation space 110 and simultaneously exhaust high-temperature air flow in the heat dissipation space 110, thereby further improving the heat dissipation effect of the circuit board assembly. In addition, the heat dissipation fan 108 at the first end 118 and the heat dissipation fan 108 at the second end 120 are used in cooperation, so that the consistency of the airflow path can be ensured, and the heat dissipation effect on the circuit board assembly is further improved.

As a possible implementation manner, as shown in fig. 2, the heat dissipation fan 108 is disposed at least at a third end 122 and a fourth end 124 of the heat dissipation space 110, the third end 122 and the fourth end 124 are opposite to each other along the second direction, and the first direction is different from the second direction. In addition, the heat dissipation fan 108 at the third end 122 is used for air intake of the heat dissipation space 110, and the heat dissipation fan 108 at the fourth end 124 is used for air outtake of the heat dissipation space 110. Specifically, the first direction is perpendicular to the second direction.

Thus, as shown in fig. 2, during the use of the circuit board assembly, the heat dissipation fan 108 at the third end 122 and the heat dissipation fan 108 at the fourth end 124 can work simultaneously, so as to simultaneously send low-temperature air flow into the heat dissipation space 110 and simultaneously discharge high-temperature air flow in the heat dissipation space 110, thereby further improving the heat dissipation effect of the circuit board assembly. In addition, the heat dissipation fan 108 at the third end 122 and the heat dissipation fan 108 at the fourth end 124 are used in cooperation, so that the consistency of the airflow path can be ensured, and the heat dissipation effect on the circuit board assembly is further improved.

As a possible implementation, the same end of the heat dissipation space 110 may be provided with a heat dissipation fan 108, provided that the heat dissipation requirement is satisfied. Therefore, the structure of the whole circuit board assembly can be effectively simplified, and the cost of the circuit board assembly is reduced.

As a possible implementation manner, at least two heat dissipation fans 108 may be disposed at the same end of the heat dissipation space 110, on the premise of satisfying the heat dissipation requirement. Thus, at least two heat dissipation fans 108 can work simultaneously to enhance the strength of the airflow, thereby further improving the heat dissipation effect of the circuit board assembly.

As a possible embodiment, as shown in fig. 1, 2 and 3, at least a portion of the supporting member 106 is disposed at the edge of the heat dissipation space 110. And, the supporting member 106 located at the edge of the heat dissipation space 110 is provided with a mounting opening 126, and the mounting opening 126 is communicated with the heat dissipation space 110 and can be used as an air inlet and an air outlet.

Further, the heat dissipation fan 108 is rotatably disposed at the mounting opening 126. In this way, the heat dissipation fan 108 disposed at the mounting opening 126 rotates to introduce the cold air outside the heat dissipation space 110 into the heat dissipation space 110 through the mounting opening 126, and also to introduce the hot air inside the heat dissipation space 110 out of the heat dissipation space 110 through the mounting opening 126, thereby achieving effective heat dissipation of the circuit board assembly.

As a possible embodiment, as shown in fig. 4, 5, 6 and 7, the heat dissipation fan 108 includes a fan blade 128 and a roller 130. The roller 130 is rotatably disposed at two axial ends of the fan 128, and the roller 130 is connected to the rotating shaft 132 of the fan 128 to drive the rotating shaft 132 to rotate. Specifically, during the use of the circuit board assembly, the temperature inside the heat dissipation space 110 is higher, the temperature outside the heat dissipation space 110 is lower, and the heat dissipation fan 108 is rotatably disposed at the edge of the heat dissipation space 110. Specifically, as shown in fig. 7, a roller 130 is provided with a ball or the like.

Thus, under the action of the temperature difference between the inside and the outside of the heat dissipation space 110, part of the heat dissipation fan 108 can rotate and lead the outside cold air out of the heat dissipation space 110; correspondingly, part of the heat dissipation fan 108 can rotate and lead out hot air in the heat dissipation interval 110 to the outside of the heat dissipation interval 110, so that efficient heat dissipation of the heat dissipation interval 110 and the whole circuit board assembly is realized.

As a possible implementation, the heat dissipation fan 108 further includes a driving member (not shown). The driving member is connected to the roller 130 and can directly drive the roller 130 to drive the fan to rotate.

Specifically, the driver is provided with an electric connection terminal (not shown in the figure) and a control terminal (not shown in the figure), and the first circuit board 102 or the second circuit board 104 is provided with a power supply part and a control circuit. The electric connection terminal of the driving member is connected with the power supply member, and the control terminal of the driving member is connected with the control circuit. Therefore, the driving part can be directly supplied with power through the power supply part, and the driving part is controlled to work through the control circuit. Specifically, the driving member may employ a micro motor.

As a possible embodiment, the blades 128 of the heat dissipation fan 108 may be axial flow blades, centrifugal blades, side flow blades, or diagonal flow blades. And the placement direction of the heat dissipation fan 108 can be designed according to the type of the fan blades 128, as will be understood by those skilled in the art.

As a possible embodiment, the circuit board assembly itself is small in structure, as shown in fig. 4. Therefore, the diameter L1 of the cooling fan 108 used in the present application is greater than or equal to 2mm and less than or equal to 5mm, and the axial dimension L2 of the cooling fan 108 is greater than or equal to 2mm and less than or equal to 10 mm. Therefore, on the basis of ensuring the original structural size of the circuit board assembly, the heat dissipation fan 108 can be additionally arranged, the heat dissipation fan 108 is ensured not to cause the structural change of the circuit board assembly to be large, and the miniaturization design of the circuit board assembly is ensured.

Specifically, as shown in fig. 4, the diameter L1 of the heat dissipation fan 108 may be 2mm, 3mm, 4mm, 5mm, or the like. Specifically, the axial dimension L2 of the radiator fan 108 may be 2mm, 3mm, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm, 10mm, or the like. The above design is understood by those skilled in the art.

An embodiment of the second aspect of the present application provides an electronic device (not shown in the drawings), including: a circuit board assembly as in the embodiment of the first aspect of the present application. Accordingly, the electronic device has all the advantages of the circuit board assembly described above, and will not be discussed in detail herein.

Specifically, the electronic device proposed by the present application may be: mobile phones, tablet computers, game machines or appliances, etc.

In the related art, a sandwich circuit board is used to reduce the planar size of the circuit board (the sandwich circuit board is formed by arranging upper and lower circuit boards at intervals and welding the upper and lower circuit boards through a middle layer elevating plate, and electronic components can be arranged in the sandwich space of the upper and lower circuit boards). However, the sandwich circuit board design reduces the area of the circuit board, but makes the space layout of the electrical components more compact. After the circuit board is powered on to operate, heat generated by the operation of the electrical components can be easily concentrated and is not easy to dissipate, so that the heat dissipation effect of the whole electronic equipment is poor, and the circuit board and the whole electronic equipment can be seriously damaged.

Therefore, as shown in fig. 1, fig. 2 and fig. 3, the present application provides a new circuit board assembly, which can solve the technical problem of poor heat dissipation effect of the sandwich circuit board in the related art, and optimize the overall heat dissipation effect of the circuit board assembly, thereby optimizing the heat dissipation effect of the electronic device.

As shown in fig. 1, 2 and 3, in the present application, the heat dissipation space 110 between the first circuit board 102 and the second circuit board 104 is non-enclosed, and the support 106 located at the edge of the heat dissipation space 110 is provided with a mounting opening 126, the mounting opening 126 is mounted with the heat dissipation fan 108, and the rotation of the heat dissipation fan 108 works to make the air inside and outside the heat dissipation space 110 flow to form an air flow.

That is, as shown in fig. 2, when the heat dissipation fan 108 rotates, the air with a low temperature outside the heat dissipation space 110 is transmitted to the inside of the heat dissipation space 110 at one end of the heat dissipation space 110, and the air with a high temperature inside the heat dissipation space 110 is transmitted from the other end of the heat dissipation space 110, so that the air flows and transmits inside and outside to form an air flow, and the high temperature air inside the heat dissipation space 110 is taken away. Meanwhile, the flowing air can take away heat generated by the electrical component 112 in the heat dissipation interval 110 during working, so that the transmission of the surface heat and temperature of the electrical component 112 is accelerated, and the heat dissipation effect of the circuit board assembly is optimized.

As shown in fig. 1, 2 and 3, in the present application, the heat dissipation fan 108 is designed at the mounting opening 126 of the supporting member 106, so that the design of the enclosed heat dissipation space 110 in the sandwich circuit board interlayer in the related art is changed into an open design in which the inside and outside air flows, and in the operation of the heat dissipation fan 108, the air with low outside temperature is transmitted and flows to take out the air with high inside temperature in the heat dissipation space 110, so as to form the air flow to take away the heat, thereby realizing the optimized heat dissipation. In addition, the support 106 process design retains the original associated electrical performance path design; in addition, a plurality of heat dissipation fans 108 are designed, and the closed design of the heat dissipation space 110 is changed into an open design. In addition, the rotation of the heat dissipation fan 108 causes the air to flow, so that the air inside and outside the heat dissipation compartment 110 is transmitted and flows, the high-temperature air inside the heat dissipation compartment 110 is taken away, and the surface heat transfer of the electrical component 112 in the heat dissipation compartment 110 is accelerated, thereby achieving the optimized heat dissipation effect.

As shown in fig. 1, 2 and 3, the circuit board assembly proposed by the present application includes at least two circuit boards (a first circuit board 102 and a second circuit board 104), which are mainly printed circuit boards of electrical components 112, the at least two circuit boards being stacked and soldered by a support member 106; the supporting member 106 (a raised plate may be used), the supporting member 106 is connected to different circuit boards, pads 136 are disposed at two ends of the supporting member 106, and two ends of the supporting member 106 may be electrically connected through the copper holes 134; the heat dissipation fan 108, the heat dissipation fan 108 mainly rotates to drive the air to flow; as shown in fig. 4, the diameter L1 of the heat dissipating fan 108 is greater than or equal to 2mm and less than or equal to 5 mm; the axial dimension L2 of the radiator fan 108 is greater than or equal to 2mm and less than or equal to 10 mm.

Specifically, as shown in fig. 2, during use, the heat dissipation fan 108 generates an air flow, and the air flow is transmitted in the same direction, such as toward the second end 120 or toward the fourth end 124, so as to ensure that the air in the heat dissipation space 110 can flow in and out.

Specifically, the support 106 may be assembled during manufacturing, and then a furnace mounting process may be performed. This requires the heat dissipation fan 108 to be made of high temperature resistant material, so as to ensure that the patch will not be damaged and work normally after passing through the furnace for welding. Alternatively, the heat dissipation fan 108 may be assembled to the mounting opening 126 of the supporting member 106 after the supporting member 106 is furnace-welded to the first circuit board 102 and the second circuit board 104.

Specifically, as shown in fig. 4, 5, 6, 7 and 8, the heat dissipation fan 108 may be a pure mechanical fan blade 128, or may be designed as a micro motor fan. When the heat dissipation fan 108 is a pure mechanical fan blade 128, the heat dissipation fan 108 includes a fan blade 128 and a roller 130, and is driven by the difference between the internal and external temperatures of the heat dissipation space 110. When the heat dissipation fan 108 is a micro motor fan, the heat dissipation fan 108 further includes a micro motor having an electrical connection terminal and a control terminal, and the control terminal can trigger the fan to rotate after the power is turned on. The electrical connection terminal is electrically connected to the power supply component of the first circuit board 102 or the second circuit board 104, and the control terminal is electrically connected to the control circuit of the first circuit board 102 or the second circuit board 104.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (10)

1. A circuit board assembly, comprising;

a first circuit board;

a second circuit board having a heat dissipation space therebetween;

a support member supported between the first circuit board and the second circuit board;

and the heat dissipation fan is rotatably arranged between the first circuit board and the second circuit board.

2. The circuit board assembly of claim 1,

at least one of the first circuit board and the second circuit board is provided with an electrical element;

the heat dissipation fan is used for dissipating heat of the electrical component.

3. The circuit board assembly of claim 2,

the electrical element is arranged in the heat dissipation interval; and/or

The electrical component is arranged outside the heat dissipation interval.

4. The circuit board assembly of claim 2,

the heat dissipation interval comprises a plurality of communicated installation areas, the supporting piece is arranged between every two adjacent installation areas, an air passing opening is formed in the supporting piece between every two adjacent installation areas, and the installation areas are used for installing the electrical appliance elements.

5. Circuit board assembly according to one of the claims 1 to 4,

the heat dissipation fan is at least arranged at a first end and a second end of the heat dissipation interval, and the first end and the second end are opposite to each other along a first direction;

the heat dissipation fan located at the first end is used for air inlet of the heat dissipation interval, and the heat dissipation fan located at the second end is used for air outlet of the heat dissipation interval.

6. The circuit board assembly of claim 5,

the heat dissipation fan is at least arranged at a third end and a fourth end of the heat dissipation interval, and the third end and the fourth end are opposite to each other along a second direction;

the heat dissipation fan positioned at the third end is used for air inlet of the heat dissipation interval, and the heat dissipation fan positioned at the fourth end is used for air outlet of the heat dissipation interval;

wherein the first direction is different from the second direction.

7. The circuit board assembly of claim 6,

the same end of the heat dissipation interval is provided with the heat dissipation fan; or

The same end of the heat dissipation interval is provided with at least two heat dissipation fans.

8. Circuit board assembly according to one of the claims 1 to 4,

the supporting piece is at least arranged at the edge of the heat dissipation interval, and a mounting opening is arranged on the supporting piece at the edge of the heat dissipation interval and communicated with the heat dissipation interval;

the heat radiation fan is arranged in the mounting opening.

9. Circuit board assembly according to one of the claims 1 to 4,

the heat dissipation fan comprises fan blades and a roller;

the idler wheels are rotatably arranged at two axial ends of the fan blades and are connected with the rotating shafts of the fan blades.

10. An electronic device, comprising:

a circuit board assembly according to any one of claims 1 to 9.

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