CN220023392U - Power supply module - Google Patents

Abstract

The utility model relates to the technical field of design and manufacture of power modules, in particular to a power module which comprises a shell, a heat dissipation assembly and a circuit board assembly, wherein the heat dissipation assembly comprises a liquid cooling plate, and the liquid cooling plate is detachably connected to the shell. The circuit board assembly comprises a first board layer and a second board layer, wherein the second board layer is arranged on one side, far away from the liquid cooling board, of the first board layer, and the first board layer and the second board layer are arranged at intervals in the thickness direction. The first sheet layer sets up in the liquid cooling board surface, and the second sheet layer sets up in first sheet layer keep away from liquid cooling board one side, and first sheet layer and second sheet layer carry out the interval setting in thickness direction to make first sheet layer and second sheet layer overall structure occupy the projected area on the liquid cooling board littleer, optimize circuit board assembly's arrangement space, reduce power module and occupy in width direction and length direction ascending space, be convenient for circuit board assembly's heat dissipation and installation simultaneously, with the loaded down with trivial details problem of improvement power module installation.

Description

Power supply module

Technical Field

The present disclosure relates to power modules, and particularly to a power module.

Background

The special film plating power supply module is a module power supply which can be used for film plating of photovoltaic battery pieces, glass film plating and the like, and along with the progress of film plating technology and film plating quality, the power density of the special film plating power supply module is continuously improved, the heat productivity is continuously increased, and the requirements for the special film plating power supply module are also continuously expanded. In order to cope with the continuously improved power level, power density and the like, the power supply module in the related art is often designed with complex structural arrangement, is large in size and has complex manufacturing process steps. When the whole machine is installed, as the devices and the PCB of each part are more, the installation process is complicated, and the production efficiency is seriously affected.

Disclosure of Invention

In view of the foregoing, it is desirable to provide a power module that can effectively improve the problem of complicated installation of the power module and improve the reliability of the power module.

The embodiment of the utility model provides a power module which comprises a shell, a heat dissipation assembly and a circuit board assembly. The heat dissipation assembly is located the accommodation space, the heat dissipation assembly includes the liquid cooling board, liquid cooling board detachably connect in the casing. The circuit board assembly comprises a first board layer and a second board layer, wherein the first board layer is arranged on the surface of the liquid cooling board, and the second board layer is arranged on one side, away from the liquid cooling board, of the first board layer.

In the above-mentioned embodiment, first sheet layer sets up in the liquid cooling board surface, and the second sheet layer sets up in first sheet layer and keeps away from liquid cooling board one side, and first sheet layer and second sheet layer carry out the interval setting in thickness direction to make first sheet layer and second sheet layer overall structure occupy the projected area littleer on the liquid cooling board, optimize circuit board assembly's arrangement space, reduce power module and occupy in width direction and length direction ascending space, be convenient for circuit board assembly's heat dissipation and installation simultaneously, with the loaded down with trivial details problem of improvement power module installation.

In at least one embodiment, the housing comprises a pallet assembly, a seal plate assembly and a cover shell, wherein the seal plate assembly is used for installing an input air-break and an output interface, the liquid cooling plate is detachably connected to the pallet assembly, and the seal plate assembly is detachably connected with the pallet assembly; the housing is detachably connected to the supporting plate assembly and the sealing plate assembly, and the accommodating space is formed in the housing, the sealing plate assembly and the area enclosed by the supporting plate assembly.

In the above-mentioned embodiment, liquid cooling board detachably connects in the layer board subassembly, and housing, shrouding subassembly and layer board subassembly all are mutual detachably connected, on the one hand, liquid cooling board, housing, shrouding subassembly and layer board subassembly can be alone complete the material of prepareeing and can carry out the modularization and change to improve this power module's maintenance convenience. On the other hand, the liquid cooling plate, the housing, the sealing plate assembly and the supporting plate assembly are mutually independent, and can be assembled integrally after all modules are assembled independently, so that the assembly efficiency of the whole machine is improved, and the problem of complicated installation of the power supply module is further solved.

In at least one embodiment, the first board layer includes a PFC power amplification board, a first output filter board, a second output filter board, and a DC power amplification board, the first output filter board is disposed between the PFC power amplification board and the second output filter board, the DC power amplification board is disposed on a side of the first output filter board and a side of the second output filter board along a first direction, and the DC power amplification board is disposed on a side, close to the first output filter board, of the PFC power amplification board along a second direction, and the first direction is perpendicular to the second direction.

In the above embodiment, the first output filter board is disposed between the PFC power amplifier board and the second output filter board, and the first output filter board and the second output filter board are disposed adjacently, so that the routing of the first output filter board and the second output filter board can be more compact. Meanwhile, the DC power amplification board is arranged on one side, close to the first output filter board, of the PFC power amplification board along the second direction, and is arranged on the side surfaces of the first output filter board and the second output filter board along the first direction, and the first direction is perpendicular to the second direction, so that the DC power amplification board is adjacent to the PFC power amplification board, the first output filter board and the second output filter board at the same time, and therefore the wiring length between the DC power amplification board and other adjacent circuit boards is reduced, and the wiring of the power supply module is compact and reasonable. And because the first plate layer is arranged on the surface of the liquid cooling plate, heat accumulated by the PFC power amplification plate, the first output filter plate, the second output filter plate and the DC power amplification plate can be absorbed by the liquid cooling plate, so that the heat dissipation performance of the power supply module is improved.

In at least one embodiment, the second board layer includes a power panel, an input fuse board, a first communication board and a second communication board, the power panel and the input fuse board are both fixed on a side of the PFC power amplifier board away from the liquid cooling board, and the second communication board is fixed on a side of the second output filter board away from the liquid cooling board.

In the above embodiment, the power panel, the input fuse board and the second communication board are all arranged on one side of the first board layer away from the liquid cooling board, the heating value of the power panel, the input fuse board and the second communication board is smaller than that of the PFC power amplification board, the first output filter board, the second output filter board and the DC power amplification board, the power panel, the input fuse board and the second communication board do not occupy the volume of the liquid cooling board in length and width directions independently, the arrangement space of the circuit board assembly is optimized, and the volume of the power module is reduced.

In at least one embodiment, the first communication plate is fixed on a side surface of the sealing plate assembly, and the first communication plate is located on a side, away from the liquid cooling plate, of the first output filter plate.

In the above embodiment, the first communication board is located at a side of the first output filter board away from the liquid cooling board, so that the first communication board does not occupy the volume of the liquid cooling board in the length and width directions alone. The first communication board can follow the shrouding assembly and leave from the surface of the second output filter board together at the in-process of dismantling the shrouding assembly to the wiring of the first communication board of being convenient for.

In at least one embodiment, a liquid cooling runner is provided in the liquid cooling plate, the liquid cooling runner has a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet are disposed on the same side of the liquid cooling plate and are located near the side surface of the sealing plate assembly.

In the above embodiment, the liquid inlet and the liquid outlet of the liquid cooling runner are arranged on the same side of the liquid cooling plate and are positioned on the side surface close to the sealing plate assembly, so that the liquid inlet and the liquid outlet are positioned on the same side of the input opening and the output interface, thereby being convenient for installing the liquid inlet pipeline and the liquid outlet pipeline and improving the assembly convenience of the power module.

In at least one embodiment, the heat dissipation assembly further comprises a heat dissipation fan and a fan mounting plate, wherein the fan mounting plate is arranged on the supporting plate assembly, the heat dissipation fan is mounted on the fan mounting plate, and an air inlet gap is formed between the fan mounting plate and the supporting plate assembly; and a cooling space is formed between the first plate layer and the second plate layer, the heat dissipation fan is provided with an air outlet, and the air outlet is opposite to the cooling space.

In the above-mentioned embodiment, have the air inlet clearance between fan mounting panel and the layer board subassembly, the cooling fan is followed the air inlet clearance and is inhaled cold wind, is formed with cooling space between first sheet layer and the second sheet layer, just to cooling space through the air outlet with the cooling fan, and the cooling fan blows to cooling space, uses the cooling fan to improve the heat dispersion of first sheet layer and second sheet layer simultaneously on the one hand, on the other hand, and the cooling fan sets up in the fan mounting panel to the assembly of cooling fan of being convenient for.

In at least one embodiment, two heat dissipation fans are provided, and the two heat dissipation fans are arranged in parallel along the second direction.

In the above embodiment, the two heat dissipation fans are parallel to the bottom surface of the pallet assembly along the second direction, so as to improve the air flow between the first board layer and the second board layer, and further improve the heat dissipation effect of the power module.

In at least one embodiment, the liquid cooling plate comprises a heat dissipation plate body and heat dissipation fins, the heat dissipation fins are arranged on the side surface, far away from the circuit board assembly, of the heat dissipation plate body, and the extending direction of the heat dissipation fins is parallel to the first direction.

In the above embodiment, the heat dissipation fins are disposed on a side of the heat dissipation plate body away from the circuit board assembly, and the extending direction of the heat dissipation fins is parallel to the first direction, so that the heat dissipation fins conduct heat generated by the first board layer away from the other side of the heat dissipation plate body. Because the liquid cooling is contact heat conduction, to first sheet layer, dispel the heat through liquid cooling and forced air cooling simultaneously, can further improve the radiating efficiency of first sheet layer.

In at least one embodiment, the blade assembly includes a fixed blade and a panel removably connected to the fixed blade, the fan mounting plate being disposed on the panel.

In the above embodiment, the pallet assembly includes the fixed pallet and the panel detachably connected with the fixed pallet, so as to simplify the processing and assembling of the pallet assembly and reduce the processing cost of the pallet assembly.

Drawings

Fig. 1 is a schematic diagram illustrating an overall structure of a power module according to an embodiment of the utility model.

Fig. 2 is an exploded view of a power module according to an embodiment of the utility model.

Fig. 3 is a schematic view of the overall structure of the pallet assembly according to an embodiment of the present utility model, showing the outer side of the panel.

Fig. 4 is a schematic view of the overall structure of the seal plate assembly according to an embodiment of the present utility model, which shows the outer side surface of the rear plate body.

Fig. 5 is a schematic diagram of a liquid cooling plate according to an embodiment of the utility model.

Fig. 6 is a schematic view of the overall structure of the pallet assembly according to an embodiment of the present utility model, showing the inner side of the panel.

Fig. 7 is a schematic diagram showing the overall structure of the power module with the cover removed according to an embodiment of the utility model.

FIG. 8 is a schematic diagram of an arrangement of a first board layer according to an embodiment of the utility model.

Fig. 9 is a schematic view of the overall structure of the seal plate assembly according to an embodiment of the present utility model, which shows the inner side surface of the rear plate body.

Description of the main reference signs

100. Power supply module

10. Pallet assembly

11. Fixed supporting plate

12. Panel board

13. Handle grip

20. Sealing plate assembly

21. Rear plate body

22. Input air switch

23. Input copper bar

24. Communication interface

25. Output interface

30. Housing shell

31. Top plate

32. Left side plate

33. Right side plate

40. Heat dissipation assembly

41. Liquid cooling plate

411. Heat radiation plate body

4111. Liquid inlet

4112. Liquid outlet

412. Heat radiation fin

42. Heat radiation fan

F air outlet

43. Fan mounting plate

44. Air inlet gap

50. Circuit board assembly

51. First plate layer

511 PFC power amplifier board

512. First output filter plate

513. Second output filter plate

514 DC power amplification board

51C power conversion magnetic piece

C1 First magnetic member

C2 Second magnetic member

C3 Third magnetic member

C4 Fourth magnetic member

C5 Fifth magnetic member

C6 Sixth magnetic member

C7 Seventh magnetic element

C8 Eighth magnetic member

C9 Ninth magnetic member

C10 Tenth magnetic part

C11 Eleventh magnetic member

C12 Twelfth magnetic element

52. Second plate layer

521. Power panel

522. Input fuse board

523. First communication board

524. Second communication board

X first direction

Y second direction

Z third direction

The utility model will be further described in the following detailed description in conjunction with the above-described figures.

Detailed Description

The following description of the technical solutions according to the embodiments of the present utility model will be given with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, but not all embodiments.

It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed" on another element, it can be directly on the other element or intervening elements may also be present.

Unless specifically stated or limited otherwise, the terms "mounted," "connected," "secured," and the like should be construed broadly, as they may be connected directly or indirectly through intervening media. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances. The terms "upper," "lower," "bottom," "top," "left," "right," "front," "rear," and the like as used herein refer to the orientation of a worker toward and facilitating operation of a power module when the power module is in normal use in some embodiments of the utility model. Some embodiments of the present utility model are described in detail below with reference to the accompanying drawings. The features of the embodiments and examples described below may be combined with each other without conflict.

The embodiment of the utility model provides a power module, which is designed in a modularized manner, on one hand, each module can be independently and completely prepared and can be replaced in a modularized manner, so that the processing cost and the maintenance cost of the power module are reduced. On the other hand, after each module is assembled independently, the modules are assembled integrally, so that the assembly efficiency of the whole machine is improved, and the problem of complicated installation of the power supply module is solved. The heat sink comprises a shell, a heat dissipation assembly and a circuit board assembly. The shell comprises a supporting plate assembly, a sealing plate assembly and a cover shell, wherein the sealing plate assembly is detachably connected with the supporting plate assembly, the cover shell is detachably connected with the supporting plate assembly and the sealing plate assembly, and the cover shell, the sealing plate assembly and the supporting plate assembly enclose to form a containing space. The heat dissipation assembly is located the accommodation space, the heat dissipation assembly includes the liquid cooling board, liquid cooling board detachably connect in the layer board subassembly. The liquid cooling plate, the housing, the sealing plate assembly and the supporting plate assembly are mutually independent, and the liquid cooling plate, the housing, the sealing plate assembly and the supporting plate assembly can be independently and completely prepared and can be replaced in a modularized mode, so that the maintenance convenience of the power supply module is improved. The circuit board assembly comprises a first board layer and a second board layer, wherein the first board layer is arranged on the surface of the liquid cooling plate, the second board layer is arranged on one side, away from the liquid cooling plate, of the first board layer, the first board layer and the second board layer are arranged at intervals in the thickness direction, so that the projection area occupied by the first board layer and the second board layer on the liquid cooling plate is smaller, and the arrangement space of the circuit board assembly is optimized.

Referring to fig. 1 and 2, an embodiment of the present utility model provides a power module 100, which includes a housing, a heat dissipation assembly 40, and a circuit board assembly 50. The housing comprises a supporting plate assembly 10, a sealing plate assembly 20 and a housing 30, wherein the supporting plate assembly 10, the sealing plate assembly 20 and the housing 30 are detachably connected and enclose to form a containing space, and the heat dissipation assembly 40 and the circuit board assembly 50 are located in the containing space.

In some embodiments, the body portions of the pallet assembly 10, the seal plate assembly 20, and the housing 30 are formed by sheet metal machining, thereby reducing the machining costs of the pallet assembly 10, the seal plate assembly 20, and the housing 30.

Referring to fig. 2 and 3, in some embodiments, the pallet assembly 10 includes a fixed pallet 11 and a faceplate 12. The panel 12 is located at a side of the upper surface of the fixing pallet 11 in the first direction X and is fixed by bolts to form an "L" -shaped mounting structure. And the fixed supporting plate 11 and the panel 12 are processed by a sheet metal mode, so that the whole processing and assembly of the supporting plate assembly 10 are simplified, and the processing cost of the supporting plate assembly 10 is reduced. The fixing pallet 11 is lengthwise along a first direction X, and the fixing pallet 11 is widthwise along a second direction Y, the first direction X being perpendicular to the second direction Y.

In some embodiments, the pallet assembly 10 further includes a handle 13, where the handle 13 is fixed to a side of the panel 12 away from the fixed pallet 11 by bolts, so that the power module 100 can be conveniently transported as a whole by the handle 13, thereby improving transportation convenience.

In some embodiments, the number of the handles 13 is two, and the two handles 13 are symmetrically disposed along the central axis of the panel 12, so as to facilitate two-hand carrying of the power module 100.

Referring to fig. 2 and 4, the sealing plate assembly 20 is disposed on the other side of the upper surface of the fixed supporting plate 11 along the opposite direction of the first direction X, and the sealing plate assembly 20 is disposed opposite to the faceplate 12. The seal plate assembly 20 comprises a rear plate body 21, an input blank 22, an input copper bar 23, a communication interface 24 and an output interface 25. The input air switch 22, the input copper bar 23, the communication interface 24, and the output interface 25 are all mounted on the rear plate 21. The back plate body 21 is formed by processing a metal plate, the input blank 22 is used for being connected with alternating current, the input copper bar 23 is electrically connected with the input blank 22 and the circuit board assembly 50, and the output interface 25 is electrically connected with the circuit board assembly 50 so as to convert the input alternating current into direct current and output the direct current from the output interface 25. The communication interface 24 is electrically connected to the circuit board assembly 50, and the communication interface 24 is electrically connected to the expansion module, so that the power module 100 can exchange data with the expansion module. The data exchanged between the power module 100 and the expansion module may be data such as current, voltage, and temperature of the power module 100.

Referring to fig. 2, the cover 30 is disposed directly above the fixing support plate 11, and the cover 30 includes a top plate 31, a left side plate 32, and a right side plate 33, wherein the left side plate 32 is detachably connected to the panel 12 and the rear plate 21 by bolts, and similarly, the right side plate 33 is detachably connected to the panel 12 and the rear plate 21 by bolts. Accordingly, the top plate 31, the fixing pallet 11, the left side plate 32, the right side plate 33, the panel 12, and the rear plate 21 constitute six outer surfaces of the power module 100, respectively, and enclose a housing space.

In some embodiments, the top plate 31, the left side plate 32, and the right side plate 33 are integrally formed by bending metal plates.

Referring to fig. 2 and 5, in some embodiments, the heat dissipation assembly 40 includes a liquid cooling plate 41, and the liquid cooling plate 41 has a length direction along a first direction X and a width direction along a second direction Y. The liquid cooling plate 41 is detachably connected to the upper surface of the fixing support plate 11, the liquid cooling plate 41 includes a heat dissipating plate body 411 and heat dissipating fins 412, the heat dissipating fins 412 are disposed on the bottom surface of the heat dissipating plate body 411, and the extending direction of the heat dissipating fins 412 is parallel to the first direction X. The circuit board assembly 50 is mounted on the upper surface of the heat dissipating plate 411, so that the heat generated by the circuit board assembly 50 is absorbed and conducted through the heat dissipating plate 411 and the heat dissipating fins 412.

In some embodiments, a liquid cooling channel (not shown in the drawings) is disposed in the heat dissipation plate 411, the liquid cooling channel has a liquid inlet 4111 and a liquid outlet 4112, and the liquid inlet 4111 and the liquid outlet 4112 are respectively connected with a liquid inlet and a liquid outlet, so that the liquid cooling channel system is convenient to communicate, and liquid cooling is performed on the heat dissipation plate 411.

In some embodiments, the liquid inlet 4111 and the liquid outlet 4112 are disposed on the same side of the heat dissipation plate 411 in parallel to the first direction X, so that the liquid inlet and the liquid outlet are convenient to communicate with the liquid cooling pipeline system, and installation convenience is improved.

In some embodiments, the upper surface of the heat dissipating plate 411 is provided with a plurality of power tubes, and the power tubes are located below the first plate layer 51. The power tube is a power tube with 90-degree corner packaged by TO247, the main body of the power tube is attached TO the heat dissipation plate 411, pins of the power tube are bent upwards by 90 degrees and are directly and electrically connected with each PCB of the first plate layer 51 through soldering tin, and therefore the reliability of connection between each power tube and the PCB of the first plate layer 51 is greatly improved while good heat dissipation of the power tube is guaranteed. In the related technical means, the power tubes are packaged by SOT227 and are used for power transmission through the locking studs. Compared with a power tube welded by soldering tin, the SOT227 power tube is installed in a locking mode, the power tube can bear locking stress, and after the power tube is used for a long time, a locking stud is easy to loosen, so that the reliability of the power tube is affected.

Referring to fig. 2 and 6, in some embodiments, the heat dissipation assembly 40 further includes a heat dissipation fan 42 and a fan mounting plate 43, wherein the fan mounting plate 43 is detachably connected to the inner side of the panel 12 to form an air intake gap 44 between the panel 12 and the fan mounting plate 43. In one aspect, when the heat dissipation fan 42 is operating, the air inlet gap 44 may be uniformly pressurized so that the heat dissipation fan 42 draws cold air from the air inlet gap 44 and blows the cold air toward the circuit board assembly 50. On the other hand, the panel 12 may protect the blower 42, reducing the risk of foreign objects contacting the blower 42.

In some embodiments, two heat dissipation fans 42 are provided, and the two heat dissipation fans 42 are disposed in parallel along the second direction Y, so as to increase the air flow, and further improve the heat dissipation effect of the power module 100.

Referring to fig. 6 and 7, in some embodiments, the circuit board assembly 50 includes a first board layer 51 and a second board layer 52, the second board layer 52 is disposed above the first board layer 51 along a third direction Z, and the power module 100 is shown as a thickness direction in the third direction Z. The first sheet layer 51 and the second sheet layer 52 are disposed at intervals in the thickness direction. A cooling space is formed between the first plate layer 51 and the second plate layer 52, and the heat dissipation fan 42 has an air outlet F facing the cooling space. The heat radiation fan 42 sucks cold air from the air intake gap 44 and blows the cold air to the cooling space, and the heat radiation capability of the first plate layer 51 and the second plate layer 52 is simultaneously improved by using the heat radiation fan 42. In assembly, the first ply 51 may be assembled such that the heat dissipating fan 42 is above the first ply 51, and then the second ply 52 is assembled such that the second ply 52 is above the heat dissipating fan 42. The heat dissipation blower 42 may be directly secured to neither the first plate layer 51 nor the second plate layer 52, thereby facilitating assembly of the heat dissipation blower 42.

Referring to fig. 5 to 7, in some embodiments, the heat dissipation fins 412 are disposed on the bottom surface of the heat dissipation plate 411, and the heat dissipation fins 412 extend along a direction parallel to the first direction X. The cooling fan 42 blows air in the cooling space and flows through the cooling fins 412, and then passes through the bottom surface of the fan mounting plate 43 to reach the air intake gap 44, thereby realizing cooling air circulation. The heat dissipation fins 412 conduct out the heat generated by the first plate layer 51 at the other side of the heat dissipation plate body 411, and because the liquid cooling is contact type heat conduction, the heat dissipation efficiency of the first plate layer 51 can be further improved by simultaneously dissipating the heat by the liquid cooling and the air cooling for the first plate layer 51.

Referring to fig. 7 and 8, in some embodiments, the first board layer 51 includes a PFC (Power FactorCorrection) power amplifier board 511, a first output filter board 512, a second output filter board 513, and a DC power amplifier board 514, where the first output filter board 512 is disposed between the PFC power amplifier board 511 and the second output filter board 513, and the first output filter board 512 and the second output filter board 513 are disposed adjacently, so that the routing of the first output filter board 512 and the second output filter board 513 can be more compact. The DC power amplification plate 514 is disposed at the side of the first output filter plate 512 and the second output filter plate 513 at the same time along the first direction X, and the DC power amplification plate 514 is disposed at the side of the PFC power amplification plate 511 close to the first output filter plate 512 along the second direction Y. So that the DC power amplification plate 514 is adjacent to the PFC power amplification plate 511, the first output filter plate 512 and the second output filter plate 513 at the same time, thereby reducing the length of the routing between the DC power amplification plate 514 and other adjacent circuit boards, and making the routing of the power module 100 compact and reasonable. Moreover, since the first plate layer 51 is disposed on the surface of the heat dissipating plate 411, the heat accumulated by the PFC power amplifying plate 511, the first output filter plate 512, the second output filter plate 513, and the DC power amplifying plate 514 can be absorbed by the liquid cooling plate 41, thereby improving the heat dissipating performance of the power module 100.

In some implementations, the upper surface of the first plate layer 51 is provided with a plurality of power conversion magnets 51C. In the related art, the power conversion magnetic element 51C of the power module 100 is usually encapsulated with a heat-conducting gel and then attached to a water-cooling radiator to dissipate heat of the power conversion magnetic element 51C. Meanwhile, the input and output of the power conversion magnetic component 51C are respectively locked on the corresponding PCB through the led power wires to realize power transmission, and the problems of complex wiring and difficult layout exist. In the technical scheme of the utility model, the power conversion magnetic piece 51C is designed to reduce copper loss of the power conversion magnetic piece 51C, so that the power conversion magnetic piece 51C can be welded on each PCB board of the first board layer 51 through wave soldering process like other resistance, capacitance and other elements, thereby reducing the overall power loop area of the power module 100, reducing the mounting complexity of the power module 100 and improving the reliability of the power module 100.

Specifically, referring to fig. 8, the upper surface of the pfc power amplification board 511 sequentially includes a first magnetic component C1, a second magnetic component C2 and a third magnetic component C3, the upper surface of the DC power amplification board 514 sequentially includes a fourth magnetic component C4, a fifth magnetic component C5, a sixth magnetic component C6, a seventh magnetic component C7 and an eighth magnetic component C8, the upper surface of the first output filter board 512 sequentially includes a ninth magnetic component C9 and a tenth magnetic component C10, and the upper surface of the first output filter board 512 sequentially includes an eleventh magnetic component C11 and a twelfth magnetic component C12.

Referring to fig. 5, 7 and 9, in some embodiments, the second board layer 52 includes a power board 521, an input fuse board 522, a first communication board 523 and a second communication board 524, where the power board 521 and the input fuse board 522 are both fixed on a side of the PFC power board 511 away from the liquid cooling board 41, and the second communication board 524 is fixed on a side of the second output filter board 513 away from the liquid cooling board 41. Since the heating value of the power board 521, the input fuse board 522 and the second communication board 524 is smaller than the heating value of the PFC power amplifier board 511, the first output filter board 512, the second output filter board 513 and the DC power amplifier board 514, the second board layer 52 is disposed above the first board layer 51, so that the power board 521, the input fuse board 522 and the second communication board 524 do not occupy the volume of the liquid cooling board 41 in the length and width directions alone, thereby optimizing the arrangement space of the circuit board assembly 50 and reducing the volume of the power module 100.

In some embodiments, the first communication board 523 is fixed to a side of the sealing board assembly 20, and the first communication board 523 is located on a side of the first output filter board 512 away from the liquid cooling board 41, so that the first communication board 523 does not occupy the volume of the liquid cooling board 41 in the length and width directions alone. The first communication board 523 can be separated from the surface of the second output filter board 513 along with the sealing board assembly 20 in the process of disassembling the sealing board assembly 20, so that the routing of the first communication board 523 is facilitated.

In operation of the power module 100, ac power is supplied to the power module 100 through the input air switch 22 and is connected to the input fuse board 522 through the input copper bar 23 electrically connected to the input air switch 22. The input fuse plate 522 is an overcurrent protection electric appliance, and the input fuse plate 522 mainly comprises two parts of melt and a melting pipe, additional filler and the like. When the fuse protector is used, the input fuse plate 522 is connected in series in a protected circuit, and when the current of the protected circuit exceeds a specified value and a certain time passes, the heat generated by the melt fuses the melt, so that the circuit is disconnected, and the protection effect is achieved. The input fuse board 522 is electrically connected to the power board 521 through a flat cable, and the power board 521 is a functional circuit for converting an input power voltage (such as an ac power of 220V) into various levels of operating voltages (such as a dc power of 12V and 15V) required for an electronic circuit in an electronic device. After the conversion of the operating voltage by the first plate layer 51, the direct current is output from the output interface 25. Meanwhile, the communication interface 24 is electrically connected to the first communication board 523 and the second communication board 524, so as to output related data such as current, voltage and temperature inside the circuit board assembly 50.

In the structural layout of the power module 100, functional parts are reasonably distributed to the first board layer 51 and the second board layer 52 by reasonable design. In the related art, the power transmission wires led out from the functional parts inside the power module 100 and the led out control signal transmission wires are crossed and routed, so that the signal transmission interference problem exists. In the technical solution of the present utility model, the power transmission inside the whole power module 100 is connected through metal copper bars, and each functional portion where the power transmission exists is divided into the first board layer 51. The control signal transmission inside the power module 100 is routed through the outgoing power line at the spatial plane layer where the second board layer 52 inside the power module 100 is located. The structural layout ensures that the components of the power module 100 meet the heat dissipation requirement, and meanwhile, through the division of the functional areas, the mixing of the space of the power transmission path and the control signal transmission path inside the power module 100 is avoided, the anti-interference capability of the control signal of the power module 100 is improved, and the reliability of the power module 100 is improved.

In the heat dissipation process of the power module 100, on one hand, the heat dissipation fan 42 sucks cold air from the air intake gap 44 and blows the cold air to the cooling space between the first plate layer 51 and the second plate layer 52, and air in the cooling space is blown and flows through the heat dissipation fins 412, and then reaches the air intake gap 44 through the bottom surface of the fan mounting plate 43, so as to realize cooling air circulation. On the other hand, the liquid cooling pipeline system is respectively communicated with the liquid inlet 4111 and the liquid outlet 4112 of the liquid cooling flow channel through the liquid inlet and the liquid outlet, and the liquid cooling circulation is realized in the heat dissipation plate 411, and since the first plate layer 51 is arranged on the surface of the heat dissipation plate 411, the heat accumulated by the PFC power amplification plate 511, the first output filter plate 512, the second output filter plate 513 and the DC power amplification plate 514 can be absorbed by the liquid cooling plate 41, so that the heat dissipation performance of the power module 100 is improved.

In addition, other variations within the technical concept of the present utility model can be made by those skilled in the art, and of course, such variations as are included in the scope of the present utility model disclosed herein.

Claims (10)

1. A power module, comprising:

the shell is provided with an accommodating space;

the heat dissipation assembly is positioned in the accommodating space and comprises a liquid cooling plate which is detachably connected with the shell;

the circuit board assembly comprises a first plate layer and a second plate layer, wherein the first plate layer is arranged on the surface of the liquid cooling plate, and the second plate layer is arranged on one side, away from the liquid cooling plate, of the first plate layer.

2. The power module of claim 1, wherein the housing comprises a tray assembly, a seal plate assembly, and a cover, the seal plate assembly for mounting the input air-break and the output interface, the liquid cooling plate being removably connected to the tray assembly, the seal plate assembly being removably connected to the tray assembly; the housing is detachably connected to the supporting plate assembly and the sealing plate assembly, and the accommodating space is formed in the housing, the sealing plate assembly and the area enclosed by the supporting plate assembly.

3. The power module of claim 2, wherein the first plate layer comprises a PFC power amplifier plate, a first output filter plate, a second output filter plate, and a DC power amplifier plate, the first output filter plate is disposed between the PFC power amplifier plate and the second output filter plate, the DC power amplifier plate is disposed on sides of the first output filter plate and the second output filter plate simultaneously along a first direction, and the DC power amplifier plate is disposed on a side of the PFC power amplifier plate adjacent to the first output filter plate along a second direction, the first direction being perpendicular to the second direction.

4. The power module of claim 3, wherein the second board layer comprises a power board, an input fuse board, a first communication board and a second communication board, wherein the power board and the input fuse board are both fixed on a side of the PFC power amplifier board away from the liquid cooling board, and the second communication board is fixed on a side of the second output filter board away from the liquid cooling board.

5. The power module of claim 4, wherein the first communication plate is fixed to a side of the seal plate assembly, and the first communication plate is located on a side of the first output filter plate away from the liquid cooling plate.

6. The power module of claim 2, wherein a liquid cooling flow channel is disposed in the liquid cooling plate, the liquid cooling flow channel having a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet being disposed on a same side of the liquid cooling plate and on a side surface adjacent to the seal plate assembly.

7. The power module of claim 3, wherein the heat dissipation assembly further comprises a heat dissipation fan and a fan mounting plate, the fan mounting plate being disposed on the pallet assembly, the heat dissipation fan being mounted on the fan mounting plate with an air intake gap therebetween; and a cooling space is formed between the first plate layer and the second plate layer, the heat dissipation fan is provided with an air outlet, and the air outlet is opposite to the cooling space.

8. The power module of claim 7, wherein two heat dissipation fans are provided, the two heat dissipation fans being disposed in parallel along the second direction.

9. The power module of claim 7, wherein the liquid cooling plate comprises a heat dissipating plate body and heat dissipating fins, the heat dissipating fins are disposed on a side of the heat dissipating plate body away from the circuit board assembly, and an extending direction of the heat dissipating fins is parallel to the first direction.

10. The power module of claim 8, wherein the blade assembly includes a stationary blade and a faceplate removably connected to the stationary blade, the fan mounting plate being disposed on the faceplate.