CN215834499U - Copper wire cleaver for semiconductor packaging bonding wire - Google Patents

Abstract

The utility model provides a copper wire chopper for semiconductor packaging bonding wires, which comprises a cutter body, a conical core hole and a tip, wherein the conical core hole penetrates through the cutter body and the tip from top to bottom, the conical core hole is used for allowing the bonding wires to pass through, the cutter body and the tip are rotating bodies taking the central axis of the conical core hole as a symmetry axis, and the tip is positioned on the top surface of the front end of the cutter body; the front end lateral surface of the tip is an arc-shaped surface, the opening of the front end of the cone core hole is expanded in a horn shape from back to front, a first chamfer and a second chamfer of the cone core hole are formed due to the increase of the expansion rate, a first inner tangent angle diameter and a second inner tangent angle diameter which correspond to the first chamfer and the second chamfer respectively are formed on the tip, the second chamfer is larger than the first chamfer, and the second inner tangent angle diameter is larger than the first inner tangent angle diameter. By reasonably selecting the numerical values of key technical parameters such as the diameter of the tip, the radius of the outer radius, the angle of the working face and the like, the utility model greatly improves the performance of the copper wire riving knife and enables the copper wire riving knife to meet the production requirement of high-end chips.

Description

Copper wire cleaver for semiconductor packaging bonding wire

Technical Field

The utility model belongs to the technical field of semiconductors, and particularly relates to a copper wire cleaver for a semiconductor packaging bonding wire.

Background

The copper wire chopper for semiconductor packaging bonding wires (hereinafter referred to as copper wire chopper) is one of the key components in semiconductor manufacturing equipment, is usually made of ceramic materials or ceramic composite materials, and comprises a cutter body, a conical core hole (also referred to as a vertical hole) and a sharp nozzle (cutter nozzle) positioned at the top of the front end of the cutter body, wherein the cutter body and the sharp nozzle are rotating bodies taking the central axis of the conical core hole as a symmetry axis. The effect of awl core hole lets the bonding wire pass, and at the front end opening part in awl core hole, the diameter in awl core hole enlarges gradually, and the front end opening part in awl core hole promptly is tubaeform, and the effect of this kind of shape design is the copper ball that uses when being convenient for the block bonding wire. The tangent lines at the two sides of the longitudinal section at the front end of the sharp mouth are also arc-shaped, namely, a certain angle is formed between the tangent lines and the working surface.

At present, the copper wire cleaver used in the domestic semiconductor packaging industry is mainly imported products, and although the proportion of the domestic copper wire cleaver is improved in recent years, the import substitution is difficult to realize completely in a short time. It is worth noting that the imported copper wire chopper in China is not the most advanced product in western countries due to technical blockade in western countries. It should be noted that although the technical principle, technical effect and basic technical solution of the more advanced copper wire cleaver are described in the related technical documents of the western countries, some key technical parameters and technical details are simply not mentioned, and it is difficult to achieve the claimed technical effect by simply manufacturing the copper wire cleaver according to the technical solutions disclosed in the technical documents.

In the past, because the chip pressure welding window has a simple structure and a single routing specification, the common copper wire cleaver can meet the quality requirement of products. However, in recent years, with the rapid update and update of electronic products, the integrated circuit chip is more and more miniaturized, the pin structure (PAD structure) inside the chip is also increasingly complex, and particularly, with the changes of the process conditions or product parameters such as the thickness of an aluminum layer, the size of a bonding window, a circuit or a device below a welding spot aluminum layer, the possibility of wire touching arcs/copper touching balls, insufficient secondary welding size of a multi-wire product, a copper wire ball planting process and the like, the copper wire cleaver is difficult to meet normal production requirements, many abnormal phenomena occur in the production process, such as the unsmooth wire paying in the wire bonding process, the abnormal length of the fish tail of the secondary welding, the abnormal range of the energy transmission of the cleaver, the spherical shape of the welding spot on the chip is unstable, the push-pull force inspection data is more discrete, the wire is not put on, the alarm rate is higher, the product qualification rate is low, the engineering debugging workload is large, and the staff has low machine-viewing yield, and serious negative effects are caused to the product quality and the production efficiency of production enterprises.

Disclosure of Invention

The object of the present invention is to overcome the drawbacks of the prior art described above, and is achieved by the following technical solution:

a copper wire chopper for semiconductor packaging bonding wires comprises a cutter body, a conical core hole and a tip, wherein the conical core hole penetrates through the cutter body and the tip from top to bottom, the conical core hole is used for allowing bonding wires to penetrate through, the cutter body and the tip are rotating bodies taking the central axis of the conical core hole as a symmetry axis, and the tip is positioned on the top surface of the front end of the cutter body; the front end lateral surface of the tip is an arc-shaped surface, the opening of the front end of the cone core hole is expanded in a horn shape from back to front, a first chamfer and a second chamfer of the cone core hole are formed due to the increase of the expansion rate, a first inner tangent angle diameter and a second inner tangent angle diameter which correspond to the first chamfer and the second chamfer respectively are formed on the tip, the second chamfer is larger than the first chamfer, and the second inner tangent angle diameter is larger than the first inner tangent angle diameter.

The above technical solution is a basic technical solution adopted by the present invention to overcome the defects of the prior art. In short, the utility model adopts the technical means of double CD and double CA on the selection problems of two key technical parameters of chamfer angle CA (Chamfer angle) of the cone core hole and the inner tangent angle diameter CD (Chamfer diameter) of the tip. Due to the structural design, the chip packaging structure can be better suitable for chips with different specifications. The reason why the double CD, double CA is formed is that the enlargement rate of the conical core hole is not constant but once changed (increased).

On the basis of the technical scheme, the utility model can adopt the following additional technical means to limit the technical scheme so as to better or more specifically solve the technical problem to be solved by the utility model:

the diameter of the front end of the tip is 130 microns, the radius of the outer radius is 30 microns, and the angle of the working face is 8 degrees.

Further, the first chamfer angle is 70 degrees, and the second chamfer angle is 120 degrees; the first internal tangent diameter is 40 μm and the second internal tangent diameter is 46 μm.

Further, inside the tip 3, the diameter H of the conical core hole is 31 μm.

Furthermore, the middle part and the rear part of the cutter body are cylindrical, the front part of the cutter body is conical, the main cone angle MT A of the cutter body is 20 degrees, and the tip is positioned on the cone top of the front part of the cutter body.

Further, the total length TL of the cutter body and the tip is 11100 μm, and the diameter TD of the cutter body is 1598 μm.

The utility model has the following beneficial effects:

through reasonable selection of parameter values of key technical characteristics such as the diameter of a nozzle tip, the diameter of an external radius, the angle of a working surface, the diameter of an internal tangent angle, the chamfer angle of a conical core hole, the aperture of the conical core hole and the like, particularly by adopting a technical means of double CD and double CA, the utility model can meet the requirement of smooth paying off (from the improvement of the diameter of the conical core hole) of different wire specifications in the wire welding process; the spacing of the control-weld PADs, and the range of chopper energy transmission (resulting from the improvement in tip diameter) can be adjusted; the fishtail length of the second weld can be controlled (due to the improvement of the diameter of the tip); the spherical diameter of a welding point can be effectively controlled (the diameter of an internal tangent angle of a tip is improved); the action range of energy transmission (due to the improvement of the chamfer of the conical core hole) can be effectively controlled; the section curvature of the two-welding fishtail can be controlled (the improvement of the external radius from the tip of the mouth); the thickness of the fillet (resulting from the improvement in the face angle of the tip) can be controlled. In conclusion, the utility model effectively overcomes the defects of the prior art and can meet the production requirements of high-end integrated circuit chips.

Drawings

FIG. 1 is a schematic structural diagram of one embodiment of the present invention;

fig. 2 is an enlarged view of a portion (tip) of one embodiment of the present invention.

In the figure:

1-a cutter body; 2-taper core hole; 3-the tip of the mouth;

TL-total length of cutter body and tip; TD-diameter of the cutter body;

MTA-Main Cone Angle; CD1 — first internal corner diameter;

CD2 — second inside corner diameter; CA1 — first chamfer;

CA2 — second chamfer; OR-outside radius of radius

T is the diameter of the front end of the tip; h is the diameter of the conical core hole;

FA-face Angle.

Detailed Description

In order to facilitate a better understanding of the technical solutions of the present invention for those skilled in the art, an embodiment of the present invention is described below with reference to the accompanying drawings:

as shown in fig. 1, a copper wire chopper for semiconductor packaging bonding wires comprises a cutter body 1, a conical core hole 2 and a tip 3, wherein the conical core hole 2 penetrates through the cutter body 1 and the tip 3 from top to bottom, a bonding wire (not shown in the figure) is arranged in the conical core hole 2, and the cutter body 1 and the tip 3 are rotating bodies taking a central axis of the conical core hole 2 as a symmetry axis; in the embodiment, the middle part and the rear part of the cutter body 1 are cylindrical, the front part of the cutter body 1 is conical, and the tip 3 is positioned on the conical top of the front part of the cutter body 1; the total length TL of the cutter body 1 and the tip 3 is 11100 μm, the diameter TD of the cutter body 1 (excluding the tapered front portion) is 1598 μm, and the Main cone Angle MT a (Main Taper Angle) of the front portion of the cutter body 1 is 20 degrees.

As shown in fig. 2, the outer side surface of the front end of the tip 3 is an arc surface, so that a certain angle, namely a working surface angle FA, is formed between the outer side surface and the working surface; the arc line formed by the arc-shaped surface tangent to the longitudinal section of the tip 3 forms a part of the outer radius, the part of the conical core hole 2 in the tip 3 is generally cylindrical, the diameter of the conical core hole is H, however, at the front end opening of the tip 3, namely, at the front end of the conical core hole 2, the conical core hole 2 expands in a trumpet shape from back to front (from top to bottom in fig. 2), a first chamfer CA1 and a second chamfer CA2 of the conical core hole 2 are formed successively, and the second chamfer CA2 is larger than the first chamfer CA1, which shows that the expansion rate of the conical core hole 2 is improved. Corresponding to the first chamfer CA1 is a first inner chamfer diameter CD1 of the tip 3, corresponding to the second chamfer CA2 is a second inner chamfer diameter CD2 of the tip, and the second inner chamfer diameter CD2 is greater than the first inner chamfer diameter CD 1.

In the present embodiment, the diameter T (excluding the diameter reduction portion due to the arc design) of the front end of the tip 3 is 130 μm, the outer radius or (outer radius) of the tip 3 is 30 μm, the working face angle fa (face angle) of the tip 3 is 8 degrees, the first inner chamfer diameter CD1 of the tip 3 is 40 μm, the second inner chamfer diameter CD2 of the tip 3 is 46 μm, the first chamfer CA1 of the cone core hole 2 is 70 degrees, the second chamfer CA2 of the cone core hole 2 is 120 degrees, and the diameter H (excluding the diameter reduction portion after the trumpet-shaped opening) of the cone core hole 2 within the tip 3 is 31 μm.

In a word, by reasonably selecting the numerical values of key technical parameters such as the diameter of the nozzle tip, the radius of the external rounding, the angle of the working surface, the diameter of the internal tangent angle, the chamfer angle of the conical core hole, the diameter of the conical core hole and the like, the performance of the copper wire cleaver is greatly improved, and the production requirement of a high-end chip can be met.

Claims (6)

1. A copper wire chopper for semiconductor packaging bonding wires comprises a cutter body, a conical core hole and a tip, wherein the conical core hole penetrates through the cutter body and the tip from top to bottom, the conical core hole is used for allowing bonding wires to penetrate through, the cutter body and the tip are rotating bodies taking the central axis of the conical core hole as a symmetry axis, and the tip is positioned on the top surface of the front end of the cutter body; the front end lateral surface of mouth point is the arcwall face, and the front end opening part in awl core hole is tubaeform and enlarges its characterized in that: due to the increase of the expansion rate of the conical core hole, a first chamfer and a second chamfer of the conical core hole are formed, and a first internal tangent angle diameter and a second internal tangent angle diameter of the tip of the nozzle, which correspond to the first chamfer and the second chamfer respectively, are formed, wherein the second chamfer is larger than the first chamfer, and the second internal tangent angle diameter is larger than the first internal tangent angle diameter.

2. The copper wire cleaver for semiconductor package bonding wires as defined in claim 1, wherein: the diameter of the front end of the tip is 130 microns, the radius of the outer radius is 30 microns, and the angle of the working face is 8 degrees.

3. The copper wire cleaver for semiconductor package bonding wires as defined in claim 1, wherein: the first chamfer angle is 70 degrees, and the second chamfer angle is 120 degrees; the first internal tangent diameter is 40 μm and the second internal tangent diameter is 46 μm.

4. The copper wire cleaver for semiconductor package bonding wires as defined in claim 1, wherein: within the tip, the diameter of the conical core hole is 31 μm.

5. The copper wire cleaver for semiconductor package bonding wires as defined in claim 1, wherein: the middle part and the rear part of the cutter body are cylindrical, the front part of the cutter body is conical, the main cone angle of the cutter body is 20 degrees, and the tip is positioned on the cone top of the front part of the cutter body.

6. The copper wire chopper for semiconductor package bonding wire of any one of claims 1 to 5, wherein: the total length of the knife body and the tip is 11100 mu m, and the diameter of the knife body is 1598 mu m.

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