CN215644390U

CN215644390U - Special chopper for semiconductor packaging bonding wire

Info

Publication number: CN215644390U
Application number: CN202122026372.XU
Authority: CN
Inventors: 曾小明; 王光明; 郑水财
Original assignee: FOSHAN BLUE ROCKET ELECTRONICS CO LTD
Current assignee: FOSHAN BLUE ROCKET ELECTRONICS CO LTD
Priority date: 2021-08-26
Filing date: 2021-08-26
Publication date: 2022-01-25
Anticipated expiration: 2031-08-26

Abstract

The utility model provides a special chopper for semiconductor packaging bonding wires, which comprises a cutter body, a conical core hole and a nozzle tip, wherein the conical core hole penetrates through the cutter body and the nozzle tip from top to bottom, the conical core hole is used for allowing the bonding wires to pass through, the cutter body and the nozzle tip are rotating bodies taking the central axis of the conical core hole as a symmetry axis, and the nozzle tip is positioned on the top surface of the front end of the cutter body; the outer side face of the front end of the nozzle tip is an arc-shaped face, the opening of the front end of the conical core hole is expanded in a horn shape from back to front, so that a chamfer of the conical core hole is formed, and the degree of the chamfer is 70 degrees. By reasonably selecting the numerical value of the key technical parameter, arranging the latticed groove on the surface of the front end of the nozzle tip and particularly limiting the degree of the chamfer to 70 degrees, the utility model solves the technical problem that the copper ball is easy to deform and tilt when the welding ball is a copper ball and the pressure welding window is made of a copper material, effectively avoids the occurrence of the condition that the welding spot is deflected and fails, and greatly improves the product quality and the production efficiency.

Description

Special chopper for semiconductor packaging bonding wire

Technical Field

The utility model belongs to the technical field of semiconductor packaging, and particularly relates to a special cleaver for a semiconductor packaging bonding wire.

Background

The cleaver is one of the key components in the semiconductor packaging equipment, and is usually made of a ceramic material or a ceramic composite material, and includes a cutter body, a conical core hole (also called a vertical hole), and a tip (a cutter nozzle) located at the top of the front end of the cutter body, where the cutter body and the tip are a rotating body with the central axis of the conical core hole as the symmetry axis. The conical core hole is used for allowing a welding wire to pass through. At the front opening of the tapered core hole, the diameter of the tapered core hole gradually increases, that is, the front opening of the tapered core hole is in a horn shape, so as to form a Chamfer (Chamfer Angle, CA, also called inner tangent Angle, inner Chamfer Angle, ICA for short) of the tapered core hole, which is used for conveniently clamping a metal ball used in bonding a wire. In addition, the tangent lines on both sides of the longitudinal section at the front end of the sharp mouth are arc-shaped, so as to form a certain Angle with the working surface, namely a working surface Angle (FA).

At present, the chopper used in the domestic semiconductor packaging industry is mainly imported products, but with the improvement of the independent innovation capability of domestic enterprises, the proportion of domestic cleavers with independent intellectual property rights is gradually improved.

For example, the utility model patent application with application publication number CN 103311136 a discloses a cleaver, and the main technical parameters of the cleaver are as follows:

when the copper line diameter is 0.7mil, the chopper chamfer diameter (the internal tangent angle diameter of the mouth point) CD is 28 ~ 30um, the internal chamfer hole angle (the chamfer of the cone core hole) CA is 48 ~ 52 degrees, the end face angle (the working face angle of the mouth point) FA is 7 ~ 9 degrees, the aperture (the diameter of the cone core hole) H is 22 ~ 23um, the head diameter (the diameter of the front end of the mouth point) T is 60 ~ 63um, the main cone angle MTA is 28 ~ 32um, the internal main cone angle ITA is 28 ~ 32um, the chopper neck height BNH is 130 ~ 145um, the neck angle BNA is 9 ~ 11.

As another example, recently, the applicant has successfully developed a copper wire cleaver with a double CA and double CD (Chamfer Diameter, inside corner Diameter of the tip, CD for short) structure, and the main technical parameters are as follows:

the first chamfer CA1 of the conical core hole is 70 degrees, the second chamfer CA2 of the conical core hole is 120 degrees, the first inner chamfer diameter CD1 of the tip is 40 μm, the second inner chamfer diameter CD2 of the tip is 46 μm, the outer radius OR (outer radius) of the tip 3 is 30 μm, the working face angle FA (face angle) of the tip 3 is 8 degrees, the diameter H (excluding the diameter expansion part after the trumpet-shaped opening) of the conical core hole 2 in the tip 3 is 31 μm, and the diameter T of the front end of the tip is 130 μm.

The technical scheme can achieve respective purposes. Taking the cleaver with double CA and double CD structures invented by the applicant as an example, the cleaver can meet the requirement that different wire specifications are smoothly paid off in the wire welding process; the distance between the PADs and the energy transmission range of the riving knife can be adjusted and controlled; the length of the fishtail of the second welding can be controlled; the spherical diameter of a welding spot can be effectively controlled; the action range of energy transmission can be effectively controlled; the section camber of the secondary welding fishtail can be controlled; the thickness of the secondary welding fishtail can be controlled.

However, the above-mentioned cleavers, in fact, also include the cleavers imported from foreign countries and the cleavers produced by other manufacturers in China, and have certain technical defects, specifically, when the solder balls are copper balls and the bonding windows are made of copper materials, no matter whether the cleavers with double-CA and double-CD structures are used or other cleavers are used, the technical defect that the bonding points are prone to deformation and ball distortion, so that the bonding point is prone to failure due to bonding deflection is existed. Because the technical scheme that the solder balls are copper balls and the bonding windows are made of copper materials has important economic and technical values, a special cleaver for the solder balls and the bonding windows made of copper materials is urgently needed in the field.

Disclosure of Invention

The aim of the present invention is to overcome the above-mentioned technical drawbacks, this aim being achieved by the following technical solution:

a special chopper for semiconductor packaging bonding wires comprises a cutter body, a conical core hole and a nozzle tip, wherein the conical core hole penetrates through the cutter body and the nozzle tip from top to bottom, the conical core hole is used for allowing bonding wires to penetrate through, the cutter body and the nozzle tip are rotating bodies taking the central axis of the conical core hole as a symmetry axis, and the nozzle tip is positioned on the top surface of the front end of the cutter body; the outer side face of the front end of the nozzle tip is an arc-shaped face, the opening of the front end of the conical core hole is expanded in a horn shape from back to front, so that a chamfer CA of the conical core hole is formed, and the degree of the chamfer CA is 70 degrees.

On the basis of the above technical solutions, the present invention can adopt the following additional technical means to better or more specifically solve the technical problems to be solved by the present invention:

the diameter H of the conical core hole is 33 μm, the diameter T of the front end of the tip is 130 μm, the diameter CD of the internal tangent of the tip is 58 μm, the radius OR of the external rounding of the tip is 30 μm, and the working face angle FA of the tip is 8 degrees.

Further, a grid-like groove is provided on the surface of the front end of the tip.

Furthermore, the grid-shaped grooves are formed by arranging a plurality of grooves in a longitudinal and transverse mode and intersecting with each other, the depth of each groove is 1-2 mu m, and the width of each groove is 1-2 mu m.

The utility model has the following main beneficial effects:

the utility model solves the technical problems that when the welding ball is a copper ball and the pressure welding window is a copper material, the copper ball is easy to deform and askew, and the condition of pressure deviation failure of the welding point is effectively avoided, thereby greatly improving the product quality and the production efficiency.

Drawings

FIG. 1 is a schematic diagram of the general structure of one embodiment of the present invention;

FIG. 2 is an enlarged view of a portion (tip) of one embodiment of the present invention;

fig. 3 is a schematic bottom view of the front end of the tip in an embodiment of the present invention.

In the figure:

1-a cutter body; 2-taper core hole;

3-the tip of the mouth; 301-grid-like grooves;

TL-total length of cutter body and tip; TD-diameter of the cutter body;

MT A-main cone angle; CA-chamfering of the conical core hole;

h is the diameter of the conical core hole; CD-the inside tangent diameter of the tip;

OR-the outside blend radius of the tip; t is the diameter of the front end of the tip;

FA-face angle of the tip.

Detailed Description

In order to facilitate a better understanding of the technical solutions of the present invention for those skilled in the art, an embodiment of the present invention is described below with reference to the accompanying drawings:

as shown in fig. 1, a special chopper for semiconductor packaging bonding wires comprises a cutter body 1, a conical core hole 2 and a tip 3, wherein the conical core hole 2 penetrates through the cutter body 1 and the tip 3 from top to bottom, a bonding wire (not shown in the figure) is arranged in the conical core hole 2, and the cutter body 1 and the tip 3 are rotating bodies taking a central axis of the conical core hole 2 as a symmetry axis; in this embodiment, the cutter body 1 has a cylindrical shape in the middle and rear portions thereof, the cutter body 1 has a conical shape in the front portion thereof, and the tip 3 is located on the conical top of the front portion of the cutter body 1.

As shown in fig. 2, the outer side surface of the front end of the tip 3 is an arc surface, so that a certain angle, namely a working surface angle FA, is formed between the outer side surface and the working surface; the arc formed by the arc surface tangent to the longitudinal section of the tip 3 forms a part of the outer radius. The portion of the conical core hole 2 in the tip 3 is generally cylindrical with a diameter H, but at the front end opening of the tip 3, i.e., at the front end of the conical core hole 2, from the rear to the front (from the top to the bottom in fig. 2), the conical core hole 2 is flared, and from the chamfer CA forming the conical core hole 2, the inscribed angle diameter CD of the tip 3 corresponds to the chamfer CA.

As shown in fig. 3, a lattice-shaped groove 301 is provided on the surface of the front end of the tip 3 (including the front end surface of the conical core hole 2), and the lattice-shaped groove 301 is formed by arranging a plurality of grooves in a longitudinal and transverse direction and intersecting each other, each groove having a depth of 1 to 2 μm and a width of 1 to 2 μm, and functions to expand the frictional force of the front end surface of the tip 3.

In the present embodiment, the diameter T (excluding the diameter-reduced portion due to the curved surface design) of the front end of the tip 3 is 130 μm, the outside radius OR of the tip 3 is 30 μm, the face angle fa (face angle) of the tip 3 is 8 degrees, the inside corner diameter CD of the tip 3 is 58 μm, the chamfer CA of the conical core hole 2 is 70 degrees, and the diameter H (excluding the diameter-enlarged portion after the trumpet-shaped opening) of the conical core hole 2 within the tip 3 is 33 μm. The total length TL of the cutter body 1 and the tip 3 is 11100 μm, the diameter TD of the cutter body 1 (excluding the tapered front portion) is 1598 μm, and the main cone angle mta (main Taper angle) of the front portion of the cutter body 1 is 20 degrees.

Claims

1. A special chopper for semiconductor packaging bonding wires comprises a cutter body (1), a conical core hole (2) and a tip (3), wherein the conical core hole (2) penetrates through the cutter body (1) and the tip (3) from top to bottom, the conical core hole (2) is used for allowing the bonding wires to pass through, the cutter body (1) and the tip (3) are rotating bodies taking the central axis of the conical core hole (2) as a symmetry axis, and the tip (3) is positioned on the top surface of the front end of the cutter body (1); the front end lateral surface of mouth point (3) is the arcwall face, and the front end opening part of awl core hole (2) is tubaeform by being before backward and enlarges to form Chamfer (CA) of awl core hole (2), its characterized in that: the degree of the Chamfer (CA) is 70 degrees.

2. The special cleaver for semiconductor packaging bonding wires as claimed in claim 1, wherein: the diameter (H) of the cone core hole (2) is 33 μm, the diameter (T) of the front end of the tip (3) is 130 μm, the diameter (CD) of the internal tangent angle of the tip (3) is 58 μm, the radius (OR) of the external radius of the tip (3) is 30 μm, and the working Face Angle (FA) of the tip (3) is 8 degrees.

3. The special cleaver for semiconductor packaging bonding wires as claimed in claim 1, wherein: the surface of the front end of the nozzle tip (3) is provided with a grid-shaped groove (301).

4. The special cleaver for semiconductor packaging bonding wires as claimed in claim 3, wherein: the grid-shaped grooves (301) are formed by arranging a plurality of grooves in a longitudinal and transverse mode and intersecting with each other, the depth of each groove is 1-2 mu m, and the width of each groove is 1-2 mu m.