CN211428120U

CN211428120U - Chopper for improving routing quality

Info

Publication number: CN211428120U
Application number: CN201922095538.6U
Authority: CN
Inventors: 钮友华; 林科闯
Original assignee: Xiamen Sanan Integrated Circuit Co Ltd
Current assignee: Hunan Sanan Semiconductor Co Ltd
Priority date: 2019-11-28
Filing date: 2019-11-28
Publication date: 2020-09-04
Anticipated expiration: 2029-11-28

Abstract

The utility model discloses a promote chopper of routing quality, including the cutter body, the cutter body is equipped with the bonding wire through-hole along the axial, the top face of cutter body include by the bonding wire through-hole sets gradually first section plane and second section plane to cutter body lateral wall direction, first section plane and perpendicular contained angle between the axial horizontal plane of bonding wire through-hole is less than the second section plane with contained angle between the horizontal plane. Through the arrangement of the two-section plane on the top end face of the cleaver, the first section plane enables the surface of the ball to be flat and the fish tail to be short after the ball is planted and the tangent line is cut, so that the quality of the solder ball is improved; the second section of plane ensures that the tail of the rear tangent line of the bonding wire is straight, the smoothness is high, the fishtail is short, and the quality of the connection wire is improved. Through the utility model discloses a tangent line quality of tangent line behind ball planting back tangent line and the bonding wire has been promoted simultaneously in two segmentation designs under the cutting force of less, for the interconnection provides stable process window between chip and the chip, the material cost is saved to some extent, and production efficiency improves greatly.

Description

Chopper for improving routing quality

Technical Field

The utility model relates to a welding jig field, in particular to promote chopper of routing quality.

Background

In the semiconductor packaging process, the wire bonding process is a key process, which realizes interconnection between chips and ports, and between chips, and realizes signal transmission. The wire bonding process basically comprises ball bonding, wire drawing arc, wedge bonding and wire cutting, wherein the wire cutting is a very critical step in the whole wire bonding process. The whole process is completed by a jig cleaver, and the design of the cleaver directly determines the quality of a tangent line.

Ordinary bonding wire process tangent line is on frame or base plate, and it can use big cutting force to carry out the tangent line, and the tangent line quality can be guaranteed, but the direct interconnected mode of chip and chip then need be the routing again after ball planting on the chip, and the action of the tangent line after the ball planting is used in on the chip, for avoiding not looping the chip and can not use big cutting force to accomplish this moment, and the problem of bringing is that the tangent line is unstable, and overall productivity ratio is relatively poor. Specifically, the wire bonding process for interconnection between chips comprises at least two wire cutting actions when one wire is welded: 1) the wire cutting is carried out after the ball planting, and the problems that the fish tail of the ball is too long, the wire tail left by a cleaver after the wire cutting is not straight and the like exist, so that the subsequent bonding wires are not sticky, the ball burning is crooked, the quality of a welding ball is influenced and the like; 2) the welding wire is cut after welding, and the unstable phenomenon is that the tail of the wire left at the position of the cleaver after the wire is cut is not straight, so that the subsequent burnt ball is crooked, and the quality of the subsequent welded ball is influenced. Therefore, it is necessary to design a new cleaver that can achieve better cutting quality with relatively smaller cutting force to improve the interconnection technology between chips to break through the process and productivity.

SUMMERY OF THE UTILITY MODEL

The utility model provides a promote chopper of routing quality has overcome the weak point that prior art exists.

The utility model provides an above-mentioned technical problem's technical scheme as follows:

the utility model provides a promote chopper of routing quality, includes the cutter body, the cutter body is equipped with the bonding wire through-hole along the axial, the top of cutter body face include by the bonding wire through-hole is to first section plane and the second section plane that the cutter body lateral wall direction set gradually, first section plane and perpendicular the contained angle between the axial horizontal plane of bonding wire through-hole is less than the second section plane with the contained angle between the horizontal plane.

Optionally, the angle between the first section plane and the horizontal plane is <5 °.

Optionally, an included angle between the second section plane and the horizontal plane is 5-11 °.

Optionally, the first section plane and the second section plane are connected through a first arc surface, and two ends of the first arc surface are respectively tangent to the first section plane and the second section plane.

Optionally, the first section plane starts from an edge of the wire bonding via.

Optionally, the length of the first section plane is 10% to 20% of the length of the top end face.

Optionally, the top end surface of the cutter body further includes a second arc surface, the second arc surface is connected between the second section plane and the side wall of the cutter body, and two ends of the second arc surface are respectively tangent to the second section plane and the side wall of the cutter body.

Optionally, the riving knife is a ceramic riving knife.

The utility model has the advantages that:

through the arrangement of the two-section plane on the top end face of the cleaver, the first section plane is close to the bonding wire through hole and has a smaller inclination relative to the horizontal plane, so that the flat surface and the short fishtail of the ball are ensured after the ball is planted and the tangent line is cut, the quality of the solder ball is improved, and the problems of connection failure of the subsequent bonding wire and the like are avoided; the second section of plane is far away from the bonding wire through hole and is greater than for the gradient of horizontal plane for the tangent line tail is straight behind the bonding wire, smoothness degree is high, and the fish tail is short, avoids follow-up burnt ball askew scheduling problem, has promoted the line quality. Through the utility model discloses a tangent line quality of tangent line behind ball planting back tangent line and the bonding wire has been promoted simultaneously in two segmentation designs under the cutting force of less, for the interconnection provides stable process window between chip and the chip, and one-time welding just can be accomplished, and the material cost is saved to some extent, and production efficiency improves greatly.

Drawings

FIG. 1 is a cross-sectional view of the riving knife of the present invention;

FIG. 2 is a schematic view of a detailed configuration of the top end face of the riving knife of FIG. 1;

FIG. 3 is a schematic view of a cut line after ball planting using a riving knife;

fig. 4 is a schematic view of a wire cut after wire bonding using a riving knife.

Detailed Description

The principles and features of the present invention are described below in conjunction with the following drawings, the examples given are only intended to illustrate the present invention and are not intended to limit the scope of the present invention.

Referring to fig. 1, a chopper for improving wire bonding quality includes a chopper body 1, the chopper body 1 is a columnar structure, and a bonding wire through hole 11 is axially formed along the chopper body. The welding wire passes through the welding wire through hole 11 to the top end surface 12 of the cutter body 1 to carry out the welding wire operation. Referring to fig. 1 and 2, the top end surface 12 of the blade body includes a first section plane 12a and a second section plane 12b sequentially arranged from the wire bonding through hole 11 to the side wall 13 of the blade body, wherein the first section plane 12a starts from the edge of the wire bonding through hole 11 and has a length 10% to 20% of the length of the top end surface 12, for example, the length of the first section plane 12a is 1 to 5 μm. The first section plane 12a and the second section plane 12b are connected through a first arc surface 12c, and two ends of the first arc surface 12c are respectively tangent to the first section plane 12a and the second section plane 12 b. The top end face of cutter body still includes second arc surface 12d, and second arc surface 12d connects between second section plane 12b and cutter body lateral wall 13, and both ends set up with second section plane 12b and cutter body lateral wall 13 tangent respectively. Through the arrangement of the two sections of arc surfaces, the top end surface serving as the operation surface is prevented from having an obvious corner, the quality is improved, and the service life of the riving knife is prolonged.

Referring to fig. 2, if a plane perpendicular to the axial direction of the wire bonding through hole 11 (i.e. the axial direction of the cutter body 1) is taken as a horizontal plane, an included angle α between the first section plane 12a and the horizontal plane is smaller than an included angle β between the second section plane 12b and the horizontal plane. In this embodiment, an included angle α between the first section plane 12a and the horizontal plane is less than 5 °, more preferably α is less than 3 °, and an included angle β between the second section plane 12b and the horizontal plane is 5 ° to 11 °, more preferably β is 8 ° to 11 °.

The above-mentioned riving knife is a ceramic riving knife, for example made of ruby or other materials.

The utility model discloses a two segmentation designs of chopper top end face, it is applicable in two kinds of in service behavior. Referring to fig. 3, after ball mounting, the cleaver 1 moves horizontally, the bonding wire 3 is cut off through the first section plane 12a, the solder ball 2 is left on the preset substrate, the first section plane 12 is close to the bonding wire through hole 11, the inclination angle is small, the obtained ball is ensured to have a flat surface and short fishtail, and the subsequent welding quality is high. Referring to fig. 4, after the wire is welded, the chopper 1 slides laterally, the welding wire 4 is cut off through the second section plane 12b, the second section plane is close to the outer wall of the chopper, the inclination angle is large, the smooth line and the short fish tail can be ensured, and the shearing quality is good.

The utility model discloses a chopper has been compatible two kinds of demands, need not big tangential force and can accomplish stable tangent line action, is applicable to various wire such as the higher copper line of gold thread and hardness for the interconnection adopts the lower copper line of cost to become possible between chip and the chip, has saved the material cost and has improved production efficiency.

The above-mentioned embodiment only is used for further explaining the utility model discloses a promote chopper of routing quality, nevertheless the utility model discloses do not confine the embodiment to, all be the basis the utility model discloses a technical entity is to any simple modification, the equivalent change and the decoration of making of above embodiment, all fall into the utility model discloses technical scheme's protection within range.

Claims

1. The utility model provides a promote chopper of routing quality, includes the cutter body, the cutter body is equipped with bonding wire through-hole, its characterized in that along the axial: the top end face of the cutter body comprises a first section plane and a second section plane which are sequentially arranged from the welding wire through hole to the side wall direction of the cutter body, and an included angle between the first section plane and a horizontal plane perpendicular to the axial direction of the welding wire through hole is smaller than an included angle between the second section plane and the horizontal plane.

2. The riving knife of claim 1 wherein: the angle between the first section plane and the horizontal plane is <5 °.

3. The riving knife of claim 1 or 2 wherein: the included angle between the second section plane and the horizontal plane is 5-11 degrees.

4. The riving knife of claim 1 wherein: the first section plane is connected with the second section plane through a first arc surface, and two ends of the first arc surface are respectively tangent to the first section plane and the second section plane.

5. The riving knife of claim 1 wherein: the first segment plane originates at an edge of the wire bond via.

6. The riving knife of claim 1 wherein: the length of the first section plane is 10% -20% of the length of the top end face.

7. The riving knife of claim 1 wherein: the top end face of the cutter body further comprises a second arc face, the second arc face is connected between the second section plane and the side wall of the cutter body, and two ends of the second arc face are respectively tangent to the second section plane and the side wall of the cutter body.

8. The riving knife of claim 1 wherein: the riving knife is a ceramic riving knife.