CN218123354U - Wedge-shaped riving knife for thick wire deep cavity bonding - Google Patents
Wedge-shaped riving knife for thick wire deep cavity bonding Download PDFInfo
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- CN218123354U CN218123354U CN202221977266.8U CN202221977266U CN218123354U CN 218123354 U CN218123354 U CN 218123354U CN 202221977266 U CN202221977266 U CN 202221977266U CN 218123354 U CN218123354 U CN 218123354U
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- wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
Abstract
The utility model discloses a wedge chopper for thick silk deep cavity bonding, including tool bit and handle of a knife, the tool bit is used for guiding and bonding the silk material, the handle of a knife and the tool bit are integrative structure, is equipped with transition portion between the two, the handle of a knife is connected with the tool bit through the transition portion, and the diameter of transition portion reduces gradually to the tool bit direction; the tool bit is provided with a guide groove, the wire can enter the guide groove, the wire can move along the grooving direction of the guide groove, the guide groove is provided with opposite bonding inclined planes, and the guide groove clamps the wire through the bonding inclined planes. The utility model has the advantages of be applicable to complicated spatial structure's lead bonding, and be convenient for produce the preparation.
Description
Technical Field
The utility model relates to a microelectronics packaging technology field especially relates to a wedge chopper that is used for dark chamber bonding of thick silk.
Background
With the development of the industries such as rail transit, smart grid and new energy automobile in China, a core device for power energy conversion and transmission, namely a power semiconductor device, needs to have better performance. Because the power semiconductor device needs to bear a large conducting current in operation, the power semiconductor device mostly adopts thick wires for ultrasonic wire bonding in the chip packaging stage.
In particular, ultrasonic wire bonding is an electrical interconnection that is made by guiding a metal wire with a wedge-shaped chopper to press it against a metal bond site, and by applying a normal pressure and ultrasonic vibration parallel to the plane of the bond site, causing it to produce a cold-weld effect.
However, the current semiconductor package gradually develops towards a three-dimensional structure with high density, multiple layers and multiple chips, the traditional wedge-shaped chopper can only be used for thick wire bonding of a conventional planar substrate, and due to the characteristics of the cutter head structure, the wedge-shaped chopper cannot be applied to wire bonding in a complex space structure (such as a deep cavity structure), so that the current wedge-shaped chopper has limitations and has a not wide application prospect.
Disclosure of Invention
The utility model aims to solve the technical problem that a wedge chopper for dark chamber bonding of thick silk is provided, can be applicable to complicated spatial structure, and the production preparation of being convenient for.
In order to solve the technical problem, the utility model provides a wedge chopper for thick silk deep cavity bonding, including tool bit and handle of a knife, the tool bit is used for guiding the silk material, be equipped with transition portion between handle of a knife and the tool bit, the handle of a knife is connected with the tool bit through the transition portion, and the horizontal cross-section of transition portion reduces to the tool bit direction from the junction of transition portion and handle of a knife gradually;
the tool bit is provided with a guide groove, the wire can enter the guide groove, the wire can move along the grooving direction of the guide groove, the guide groove is provided with opposite bonding inclined planes, and the guide groove clamps the wire through the bonding inclined planes.
Preferably, a first transition surface and a second transition surface are arranged between the tool shank and the tool bit, the first transition surface and the second transition surface are sequentially connected in the circumferential direction to form the transition portion, and the width of the first transition surface gradually decreases towards the direction of the tool bit.
Preferably, the first transition surface comprises a first inclined surface, a first connection surface and a first plane, the first inclined surface, the first connection surface and the first plane are sequentially connected with each other, the first inclined surface is obliquely arranged towards the direction of the first connection surface, the first connection surface is of a concave arc structure, the first plane is parallel to the central axis of the tool holder, the first plane is connected with the guide groove, and the distance between the first planes is 0.25-1.05 mm.
Preferably, the guide groove is provided with an abutting surface, the bonding inclined surface is connected with the first plane through the abutting surface, and the abutting surface, the bonding inclined surface and the first plane are arranged at an included angle.
Preferably, the second transition surface is inclined towards the direction of the cutter head, the cutter head is provided with a second plane, the second plane and the second transition surface are arranged at an included angle, and the guide groove is connected with the second transition surface through the second plane.
Preferably, the bonding inclined planes are connected through a second connecting surface, and the second connecting surface is of a concave arc structure; an edge angle is arranged on a port of the guide groove and connected with the second plane;
the second connecting surface can be combined with the bonding inclined surface to form a V-shaped groove structure.
Preferably, the included angle between the bonding inclined planes and the horizontal plane is 60-70 degrees, the maximum distance between the bonding inclined planes is 0.1-0.6 mm, and the radius of the second connecting surface is 0.01-0.05 mm; the radius of the edge angle is 0.05-0.25 mm.
Preferably, the tool holder is provided with a lead hole along the axial direction, the inlet end of the lead hole is positioned at the end part of the tool holder, the outlet end of the lead hole is positioned on the second transition surface, the diameter of the lead hole is 0.2-1.2 mm, the inlet end of the lead hole is in a horn mouth shape with an included angle of 40-120 degrees and a depth of 0.1-1 mm;
the lead hole is connected with the port of the guide groove through the second transition surface and the second plane.
Preferably, the tool shank is provided with a connecting plane, and the tool shank is directly connected with the other port of the guide groove through the connecting plane;
the position of the connecting plane is staggered with the position of the first transition surface and the position of the second transition surface.
Preferably, the tool bit and the tool shank are of an integral structure, the diameter of the tool shank is 1.59-3.17 mm, and the tool bit and the tool shank are both made of tungsten carbide, titanium carbide or ceramic.
Implement the utility model discloses, following beneficial effect has:
the utility model discloses a handle of a knife with be equipped with transition portion between the tool bit, the handle of a knife passes through transition portion with the tool bit is connected, just the diameter of transition portion by the junction of transition portion and handle of a knife to the tool bit direction reduces gradually to provide and dodge the effect, make the tool bit can get into if carry out the lead bonding among the complicated spatial structure such as dark cavity structure, thereby make this product have better suitability and wider application prospect.
Wherein, the tool bit is equipped with the guide groove, the silk material can get into in the guide groove, just the silk material can be followed the fluting direction of guide groove removes, makes the guide groove can provide the guide effect to the silk material, simultaneously, the guide groove is equipped with relative bonding inclined plane, the guide groove passes through the bonding inclined plane is cliied the silk material to provide limiting displacement, make the silk material remove along the regulation orbit, effectively ensured the encapsulation demand that semiconductor power device integrates, the structure is complicated.
Drawings
FIG. 1 is a block diagram of a wedge chopper for deep cavity bonding of thick filaments as described in the present invention;
FIG. 2 is an enlarged view of a portion of FIG. 1 at A;
FIG. 3 is a block diagram of the wedge-shaped riving knife head of the present invention;
fig. 4 is a cross-sectional view of a wedge-shaped riving knife for thick wire deep cavity bonding in accordance with the present invention.
Detailed Description
For the purpose of clearly illustrating the objects, technical solutions and advantages of the present invention, the present invention will be further described in detail with reference to the accompanying drawings. Only this statement, the utility model discloses the upper and lower, left and right, preceding, back, inside and outside etc. position words that appear or will appear in the text only use the utility model discloses an attached drawing is the benchmark, and it is not right the utility model discloses a concrete restriction.
With reference to fig. 1 to 4, an embodiment of the present invention provides a wedge-shaped riving knife for thick wire deep cavity bonding, including a knife head 1 and a knife handle 2, the knife head 1 is used for guiding and bonding a wire material.
The embodiment of the utility model provides a handle of a knife 2 with be equipped with transition portion 3 between the tool bit 1, handle of a knife 2 passes through transition portion 3 with tool bit 1 is connected, just the horizontal cross-section of transition portion 3 by transition portion 3 with the junction of handle of a knife 2 to 1 direction of tool bit reduces gradually to provide and dodge the effect, make tool bit 1 can get into if carry out the lead bonding in complicated spatial structure such as dark cavity structure, thereby make this product have better suitability and wider application prospect.
Wherein, tool bit 1 is equipped with guide groove 11, the silk material can get into in the guide groove 11, just the silk material can be followed guide groove 11's fluting direction removes, makes guide groove 11 can provide the guide effect to the silk material, simultaneously, guide groove 11 is equipped with relative bonding inclined plane 111, guide groove 11 passes through bonding inclined plane 111 is cliied the silk material to provide limiting displacement, make the silk material remove along the regulation orbit, the silk material of being convenient for bonds with the pad, thereby has effectively ensured the encapsulation demand that semiconductor power device integrates, the structure is complicated.
Specifically, for making transition portion 3 can provide the effect of dodging, handle of a knife 2 with be equipped with first transition face 31 and second transition face 32 between tool bit 1, first transition face 31 with second transition face 32 connects gradually along circumference and forms transition portion 3, and the width court of first transition face 31 tool bit 1 direction reduces gradually to dodge the inner wall of deep cavity structure, guarantee that tool bit 1 can touch the bottom of deep cavity structure. The first transition surfaces 31 are connected with each other through the second transition surface 32, so as to ensure a stable structure and further ensure that the wire bonding can be smoothly performed.
Further, the first transition surface 31 includes a first inclined surface 311, a first connection surface 312 and a first plane 313 which are sequentially interconnected, the first inclined surface 311 is disposed obliquely towards the first connection surface 312, and the first connection surface 312 is a concave arc structure so as to avoid an inner wall of the deep cavity structure; the first plane 313 is parallel to the central axis of the tool holder 2, the distance between the first planes 313 is 0.25-1.05 mm, and the first plane 313 is connected with the guide groove 11, so that an extension effect is provided, and deep cavity bonding of different depths is effectively ensured. Preferably, as one embodiment, the included angle between the first inclined surface 311 and the first plane 313 may be 100-150 °, and the transition is performed by the first connection surface 312 with a radius of 1-5 mm, and the length of the first plane 313 may be 0.5-5 mm, so as to be suitable for most deep cavity structures.
Preferably, the guiding groove 11 is provided with an abutting surface 113, the bonding inclined surface 111 is connected with the first plane 313 through the abutting surface 113, the bonding inclined surface 111 and the first plane 313 are arranged at an included angle, and the guiding groove 11 can abut against the bottom of the deep cavity structure through the abutting surface 113, so that a supporting and positioning effect is provided for the whole product, and further the wire bonding is facilitated.
More preferably, the second transition surface 32 is disposed obliquely toward the tool bit 1, so that the widths of the first transition surfaces 31 on both sides thereof gradually decrease toward the tool bit 1; the tool bit 1 is provided with a second plane 12, the second plane 12 and a second transition surface 32 are arranged at an included angle, and the guide groove 11 is connected with the second transition surface 32 through the second plane 12, so that a transition effect is achieved, and the stability of the structure is guaranteed.
As one example, the second transition surface 32 is angled at 20 ° to the central axis of the tool shank 2 to facilitate the provision of a first flat 313 that tapers in width.
On the other hand, combine fig. 2 and fig. 3, because the silk material is mostly cylindric structure, consequently, for further playing the limiting displacement to the silk material, it links to each other to connect face 112 through the second between the bonding inclined plane 111, just the face 112 is connected for the concave arc structure to the second is connected face 112 cooperation bonding inclined plane 111 and is pushed down the silk material, and then is convenient for the silk material to bond with the pad under the effect of ultrasonic energy, pressure, realizes the electric interconnection between chip and base plate.
As one embodiment, an included angle between the bonding inclined planes 111 and a horizontal plane is 60 to 70 °, and a maximum distance between the bonding inclined planes 111 is 0.1 to 0.6mm; the radius of the second connecting surface 112 is 0.01-0.05 mm, so as to be suitable for wire materials with the diameter of 0.1-0.6 mm.
Preferably, because the bonding is accomplished, tool bit 1 need cut off the silk material through vertical motion to wait for the bonding next time, consequently, bonding inclined plane 111 with second is connected face 112 and can make up and form the V-arrangement groove structure, not only plays the limiting displacement to the silk material, and operating personnel is as long as lift tool bit 1 simultaneously, alright make the silk material break away from guide groove 11 to the silk material cuts. Preferably, a rim 114 is provided at the end of the guide groove 11, and the rim 114 is connected to the second plane 12 for guiding the wire from the end of the guide groove 11 into the guide groove 11. As one example, the radius of the edge 114 is 0.05-0.25 mm, and the edges 114 are provided at both end ports of the guide groove 11.
More preferably, combine fig. 1 to 4 again, for further playing the limiting displacement to the silk material, handle of a knife 2 is equipped with pin hole 21 along its axial, the entry end 211 of pin hole 21 is located the tip of handle of a knife 2, the exit end 212 of pin hole 21 is located on second transition face 32, makes the silk material can get into in the pin hole 21 by the tip of handle of a knife 2 to stretch out by second transition face 32, then get into in the guide recess 11, mutually supports through pin hole 21 and guide recess 11, makes the silk material can move along prescribed orbit in the deep cavity structure. More preferably, the wire hole 21 is connected to the end of the guide groove 11 via the second transition surface 32 and the second plane 12, so that the wire can directly enter the guide groove 11 after passing through the outlet end 212 of the wire hole 21.
More preferably, the inlet end 211 of the wire hole 21 is in a bell mouth structure with an included angle of 40-120 degrees and a depth of 0.1-1 mm, so that the wire material can enter the wire hole 21, and the aperture of the straight wire hole 21 is 0.2-1.2 mm; the straightness accuracy of straight pin hole 21 is less than or equal to 0.01mm, the axiality is less than or equal to 0.01mm, the circularity is less than or equal to 0.005mm, make pin hole 21 play the limiting displacement to the silk material, guarantee that the silk material can move towards the exit end 212 of pin hole 21.
It should be noted that, when the deep cavity structure with a large depth is bonded, the tool holder 2 is not easily abutted to the inner wall of the deep cavity structure, the tool holder 2 is provided with the connecting plane 22, and the tool holder 2 is directly connected with the other port of the guide groove 11 through the connecting plane 22 so as to reduce the size of the tool holder 2 and avoid the inner wall of the deep cavity structure. The position of the connecting plane 22, the position of the first transition surface 31 and the position of the second transition surface 32 are staggered, so that the structures can be matched with each other.
In addition, for the convenience of production and manufacture, the tool bit 1 and the tool shank 2 are of an integral structure, and the diameter of the tool shank is 1.59-3.17 mm. And, tool bit 1 and handle of a knife 2 are made by tungsten carbide, titanium carbide or pottery to guarantee that product overall structure is firm, not fragile.
The foregoing is a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations are also considered as the protection scope of the present invention.
Claims (10)
1. A wedge-shaped riving knife for thick wire deep cavity bonding comprises a knife head and a knife handle, wherein the knife head is used for guiding wires;
the tool bit is provided with a guide groove, the wire can enter the guide groove, the wire can move along the grooving direction of the guide groove, the guide groove is provided with opposite bonding inclined planes, and the guide groove clamps the wire through the bonding inclined planes.
2. The wedge-shaped riving knife for thick wire deep cavity bonding as claimed in claim 1, wherein a first transition surface and a second transition surface are arranged between the knife handle and the knife head, the first transition surface and the second transition surface are sequentially connected in a circumferential direction to form the transition portion, and the width of the first transition surface is gradually reduced towards the knife head.
3. The wedge-shaped riving knife for thick wire deep cavity bonding as claimed in claim 2, wherein the first transition surface comprises a first inclined surface, a first connecting surface and a first plane surface which are sequentially interconnected, the first inclined surface is obliquely arranged towards the direction of the first connecting surface, the first connecting surface is a concave arc structure, the first plane surface is parallel to the central axis of the knife handle, the first plane surface is connected with the guiding groove, and the distance between the first plane surfaces is 0.25-1.05 mm.
4. The wedge-shaped riving knife for thick wire deep cavity bonding of claim 3 wherein the guide groove is provided with an abutment surface, the bonding inclined surface is connected with the first plane through the abutment surface, and the abutment surface is arranged at an included angle with the bonding inclined surface and the first plane.
5. The wedge-shaped riving knife for thick wire deep cavity bonding as claimed in claim 2, wherein said second transition surface is obliquely arranged towards said knife head, and said knife head is provided with a second plane surface, said second plane surface and said second transition surface are arranged at an angle with each other, and said guiding groove is connected with said second transition surface through said second plane surface.
6. The wedge-shaped riving knife for thick silk deep cavity bonding of claim 5, wherein the bonding inclined planes are connected through a second connecting surface, and the second connecting surface is a concave arc structure; an edge angle is arranged on a port of the guide groove and connected with the second plane;
the second connecting surface can be combined with the bonding inclined surface to form a V-shaped groove structure.
7. The wedge-shaped riving knife for thick silk deep cavity bonding of claim 6, wherein the included angle between the bonding inclined planes and the horizontal plane is 60-70 degrees, the maximum distance between the bonding inclined planes is 0.1-0.6 mm, and the radius of the second connecting surface is 0.01-0.05 mm; the radius of the edge angle is 0.05-0.25 mm.
8. The wedge-shaped riving knife for thick wire deep cavity bonding as claimed in claim 5, wherein the knife handle is provided with a wire hole along the axial direction, the inlet end of the wire hole is positioned at the end of the knife handle, the outlet end of the wire hole is positioned on the second transition surface, the diameter of the wire hole is 0.2-1.2 mm, the inlet end of the wire hole is in a bell mouth shape with an included angle of 40-120 degrees and a depth of 0.1-1 mm;
the lead hole is connected with the port of the guide groove through the second transition surface and the second plane.
9. The wedge-shaped riving knife for thick wire deep cavity bonding of claim 8, wherein the knife handle is provided with a connecting plane, and the knife handle is directly connected with the other port of the guide groove through the connecting plane;
the position of the connecting plane is staggered with the position of the first transition surface and the position of the second transition surface.
10. The wedge-shaped riving knife for thick wire deep cavity bonding of claim 1 wherein the knife head and the knife handle are of an integral structure, the diameter of the knife handle is 1.59-3.17 mm, and the knife head and the knife handle are both made of tungsten carbide, titanium carbide or ceramic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221977266.8U CN218123354U (en) | 2022-07-28 | 2022-07-28 | Wedge-shaped riving knife for thick wire deep cavity bonding |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221977266.8U CN218123354U (en) | 2022-07-28 | 2022-07-28 | Wedge-shaped riving knife for thick wire deep cavity bonding |
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| CN218123354U true CN218123354U (en) | 2022-12-23 |
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| CN202221977266.8U Active CN218123354U (en) | 2022-07-28 | 2022-07-28 | Wedge-shaped riving knife for thick wire deep cavity bonding |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116000511A (en) * | 2022-12-26 | 2023-04-25 | 深圳市海志亿半导体工具有限公司 | Cutter head for enhancing fine-pitch wire feeding forming effect |
-
2022
- 2022-07-28 CN CN202221977266.8U patent/CN218123354U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116000511A (en) * | 2022-12-26 | 2023-04-25 | 深圳市海志亿半导体工具有限公司 | Cutter head for enhancing fine-pitch wire feeding forming effect |
| CN116000511B (en) * | 2022-12-26 | 2024-04-09 | 深圳市海志亿半导体工具有限公司 | Cutter head for enhancing fine-pitch wire feeding forming effect |
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