CN211980568U - Combined type riving knife for semiconductor lead bonding - Google Patents
Combined type riving knife for semiconductor lead bonding Download PDFInfo
- Publication number
- CN211980568U CN211980568U CN202021048674.6U CN202021048674U CN211980568U CN 211980568 U CN211980568 U CN 211980568U CN 202021048674 U CN202021048674 U CN 202021048674U CN 211980568 U CN211980568 U CN 211980568U
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- China
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- riving knife
- pipe
- tool bit
- threading
- threaded
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
Abstract
The utility model discloses a combination formula riving knife for semiconductor lead bonding, including riving knife handle and riving knife tool bit, the riving knife tool bit is the wedge tool bit, the lower extreme of riving knife tool bit is equipped with flat pressing surface and oblique installation face, the riving knife tool bit is located oblique installation face department and inwards sets up threaded hole, screw thread installation pipe is installed to the spiro union in the screw hole, the outer end vertical fixation of screw thread installation pipe has the threading to draw the pipe, the threading draws the pipe and has seted up spacing mouth, the inner of threading draw the pipe is equipped with the end plate, and the inboard of end plate has the extrusion ball through compression spring support, the extrusion ball is under compression spring's effect down the part spheroid through spacing mouth stretch into to the threading draw the hole of. The utility model has the advantages of reasonable design, need not to set up the lead wire via hole, utilize the inner chamber of threading lead pipe as the lead wire via hole, the threading lead pipe passes through the spiro union mode assembly through the threaded mounting pipe in the chopper tool bit, and the loss cost of scraping and bringing is greatly reduced.
Description
Technical Field
The utility model discloses lead bonding technical field especially relates to a combination formula riving knife for semiconductor lead bonding.
Background
In the field of microelectronic packaging, wire bonding is commonly used for electrical interconnection between integrated circuit chips and between an integrated circuit chip and a peripheral circuit, and wedge bonding is one of the commonly used wire bonding methods. Wedge cleavers are important tools for wedge bonding, and the performance of wedge cleavers determines the quality, efficiency and economy of bonding. Wedge-shaped cleavers commonly used are made of high hardness, high toughness materials such as tungsten carbide (cemented carbide), titanium carbide, ceramics, etc., and have wire vias machined therein to enable wire feed during bonding. In the wedge bonding process, in order to ensure the bonding precision and the bonding quality, the lead is positioned in the center of the end face of the cutter head of the riving knife, and the lengths of the tail fibers are consistent; however, due to the matching problem of the lead through hole and the lead, the lead can move in the lead through hole (including moving along the lead through hole and moving perpendicular to the lead through hole), so that the lead deviates from the center of the end surface of the cutter head of the riving knife, and the tail is different in length, thereby affecting the welding precision and the consistency of the tail.
The existing wedge-shaped riving knife for the lead bonding has the defects in the use process, firstly, the lead through hole is directly processed on the riving knife head, the qualification rate is low, and the riving knife head is scrapped more; and secondly, the lead in the lead through hole is easy to shake, and needs to be optimized and improved.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome the above-mentioned problem that exists among the conventional art, provide a combination formula riving knife for semiconductor wire bonding.
In order to realize the technical purpose, the technical effect is achieved, the utility model discloses a realize through following technical scheme:
the utility model provides a combination formula riving knife for semiconductor lead bonding, includes the riving knife handle and fixes the riving knife tool bit at its lower extreme, the riving knife tool bit is the wedge tool bit, the lower extreme of riving knife tool bit is equipped with flat pressing surface and oblique installation face, the riving knife tool bit is located oblique installation face department and inwards offers threaded hole, threaded mounting pipe is installed to the spiro union in the screw hole, the outer end vertical fixation of threaded mounting pipe has the threading to draw the pipe, the threading is drawn the pipe and is located and offers spacing mouth with threaded mounting union coupling department, the inner of threading is drawn the pipe and is equipped with the end plate, and the inboard of end plate has the extrusion ball through compression spring support, the extrusion ball is in compression spring's effect part spheroid stretches into the threading draw hole of threading draw pipe through spacing mouth.
Further, in the combined type cleaver for semiconductor wire bonding, the included angle between the flat pressing surface and the inclined mounting surface is 120-150 degrees.
Further, in the combined type riving knife for semiconductor wire bonding, the outer side of the threaded mounting tube is provided with an external thread.
Further, in the combined type riving knife for semiconductor wire bonding, the inner diameter of the threaded mounting tube is larger than the diameter of the limiting opening, and the spherical diameter of the extrusion ball is equal to the inner diameter of the threaded mounting tube.
Further, in the combined type riving knife for semiconductor wire bonding, the riving knife handle is made of one of tungsten carbide and ceramic, and the riving knife head, the thread mounting tube and the threading guide tube are made of one of tungsten carbide and titanium carbide.
Further, in the above-mentioned combined type riving knife for semiconductor wire bonding, the extrusion ball is made of a silicon gel material.
The utility model has the advantages that:
the utility model has reasonable structural design, on one hand, the chopper head does not need to be provided with a lead through hole, the inner cavity of the threading guide pipe is used as the lead through hole, the threading guide pipe is assembled in the chopper head through the threaded mounting pipe in a threaded manner, and the loss cost caused by scrapping is greatly reduced through the threaded mounting pipe; on the other hand, the threaded mounting pipe is internally provided with an extrusion head through the compression spring in a butt joint mode, the extrusion head is utilized to extrude the lead inside the lead through hole, and then shaking of the lead through hole is effectively avoided.
Of course, it is not necessary for any product to achieve all of the above advantages simultaneously in practicing the invention.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of a cleaver head of the present invention;
FIG. 3 is a schematic structural view of a threading pipe of the present invention;
in the drawings, the components represented by the respective reference numerals are listed below:
the wedge-shaped wedge comprises 1-a wedge handle, 2-a wedge cutter head, 201-a flat pressing surface, 202-an inclined mounting surface, 203-a threaded hole, 3-a threaded mounting pipe, 4-a threading guide pipe, 5-a compression spring and 6-an extrusion ball.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1-3, the present embodiment is a combined type riving knife for semiconductor wire bonding, including a riving knife handle 1 and a riving knife head 2 fixed at a lower end thereof, where the riving knife head 2 is a wedge-shaped tool head, a flat pressing surface 201 and an inclined mounting surface 202 are arranged at a lower end of the riving knife head 2, and a threaded hole 203 is formed in the riving knife head 2 at the inclined mounting surface 202. The threaded mounting pipe 3 is installed in the threaded hole 203 in a threaded mode, and the threading guide pipe 4 is vertically fixed to the outer end of the threaded mounting pipe 3. Threading guide tube 4 is located and has seted up spacing mouth with threaded mounting pipe 3 junction, and the inner of threading guide tube 4 is equipped with the end plate, and the inboard of end plate has squeeze ball 6 through compression spring 5 support, and squeeze ball 6 is in the threading guide hole of threading guide tube 4 is stretched into through spacing mouthful to partial spheroid of effect of compression spring 5.
In this embodiment, the included angle between the flat pressing surface 201 and the inclined mounting surface 202 is 120-150 °.
In this embodiment, the outer side of the threaded mounting tube 3 is provided with an external thread. The inner diameter of the threaded mounting pipe 3 is larger than the diameter of the limiting opening, and the sphere diameter of the extrusion ball 6 is equal to the inner diameter of the threaded mounting pipe 3.
In this embodiment, the material of the cleaver handle 1 is one of tungsten carbide and ceramic, and the material of the cleaver head 2, the threaded installation pipe 3 and the threading guide pipe 4 is one of tungsten carbide and titanium carbide.
In this embodiment, the squeeze ball 6 is made of a silicone material.
One specific application of this embodiment is: the structure of the embodiment is reasonable in design, on one hand, the chopper head 2 does not need to be provided with a lead through hole, the inner cavity of the threading guide pipe 4 is used as the lead through hole, the threading guide pipe 4 is assembled in the chopper head 2 through the threaded mounting pipe 3 in a screwing mode, and the loss cost caused by scrapping is greatly reduced through the mode; on the other hand there is extrusion head 6 through 5 butts of compression spring in the threaded mounting pipe 3, utilizes extrusion head 6 to extrude the inside lead wire of lead wire via hole, and then effectively avoids it to appear rocking.
The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not exhaustive and do not limit the invention to the precise embodiments. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.
Claims (6)
1. The utility model provides a combination formula riving knife for semiconductor wire bonding, includes the riving knife handle and fixes the riving knife tool bit at its lower extreme, the riving knife tool bit is wedge tool bit, its characterized in that: the lower extreme of riving knife tool bit is equipped with flat pressing surface and oblique installation face, the riving knife tool bit is located oblique installation face department and inwards offers threaded hole, the spiro union is installed threaded installation pipe in the screw hole, the outer end vertical fixation of threaded installation pipe has the threading lead pipe, the threading lead pipe is located and has offered spacing mouth with threaded installation union coupling, the inner of threading lead pipe is equipped with the end plate, and the inboard of end plate has the extrusion ball through compression spring support, the extrusion ball is in compression spring's effect part spheroid stretches into to the threading lead hole of threading lead pipe through spacing mouthful.
2. The combination riving knife for semiconductor wire bonding of claim 1 wherein: the included angle between the flat pressing surface and the inclined mounting surface is 120-150 degrees.
3. The combination riving knife for semiconductor wire bonding of claim 1 wherein: and the outer side of the threaded mounting pipe is provided with an external thread.
4. The combination riving knife for semiconductor wire bonding of claim 1 wherein: the inner diameter of the threaded mounting pipe is larger than the diameter of the limiting opening, and the spherical diameter of the extrusion ball is equal to the inner diameter of the threaded mounting pipe.
5. The combination riving knife for semiconductor wire bonding of claim 1 wherein: the cleaver handle is made of one of tungsten carbide and ceramic, and the cleaver tool bit, the thread mounting pipe and the threading guide pipe are made of one of tungsten carbide and titanium carbide.
6. The combination riving knife for semiconductor wire bonding of claim 1 wherein: the extrusion ball is made of a silica gel material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021048674.6U CN211980568U (en) | 2020-06-08 | 2020-06-08 | Combined type riving knife for semiconductor lead bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021048674.6U CN211980568U (en) | 2020-06-08 | 2020-06-08 | Combined type riving knife for semiconductor lead bonding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211980568U true CN211980568U (en) | 2020-11-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021048674.6U Active CN211980568U (en) | 2020-06-08 | 2020-06-08 | Combined type riving knife for semiconductor lead bonding |
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| CN (1) | CN211980568U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114226941A (en) * | 2021-12-08 | 2022-03-25 | 中国电子科技集团公司第十三研究所 | Handheld spot welding tool for radio frequency microwave assembly |
-
2020
- 2020-06-08 CN CN202021048674.6U patent/CN211980568U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114226941A (en) * | 2021-12-08 | 2022-03-25 | 中国电子科技集团公司第十三研究所 | Handheld spot welding tool for radio frequency microwave assembly |
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| CP02 | Change in the address of a patent holder |
Address after: 213167 No. 18, Xinya Road, Wujin national high tech Industrial Development Zone, Changzhou City, Jiangsu Province Patentee after: Jiangsu Shengchuang Semiconductor Technology Co.,Ltd. Address before: 213000 No. 56 Yunhu Road, Jintan District, Changzhou City, Jiangsu Province Patentee before: Jiangsu Shengchuang Semiconductor Technology Co.,Ltd. |