CN211858591U - Cleaver for wire bonding - Google Patents

Cleaver for wire bonding Download PDF

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Publication number
CN211858591U
CN211858591U CN202020532265.7U CN202020532265U CN211858591U CN 211858591 U CN211858591 U CN 211858591U CN 202020532265 U CN202020532265 U CN 202020532265U CN 211858591 U CN211858591 U CN 211858591U
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CN
China
Prior art keywords
cleaver
strip
wire bonding
tool bit
shaped
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Active
Application number
CN202020532265.7U
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Chinese (zh)
Inventor
李世雄
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Joulwatt Technology Co Ltd
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Joulwatt Technology Hangzhou Co Ltd
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Priority to CN202020532265.7U priority Critical patent/CN211858591U/en
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Publication of CN211858591U publication Critical patent/CN211858591U/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H01L2224/78303—Shape of the pressing surface, e.g. tip or head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

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  • Wire Bonding (AREA)

Abstract

The utility model relates to a cleaver for lead bonding, be in including blade and setting the tool bit of blade one end to and run through the line hole that whole blade and tool bit central point put, wherein, the tool bit is spherical or non-spherical convex surface, is equipped with the bar slot on this convex surface, the distribution of bar slot makes this cleaver when the first solder joint of bonding, lets the at least partial bottom surface of first solder joint receives the bar slot covers. Through design bar slot on the tool bit convex surface, can solve current lead bonding in-process, spherical bad problem appears in first solder joint to improve welding quality, reduce the defective rate of product.

Description

Cleaver for wire bonding
Technical Field
The utility model belongs to the technical field of the semiconductor welding technique and specifically relates to a can improve wire bonding that the solder ball is spherical bad and use chopper is related to.
Background
As integrated circuits evolve, advanced packaging techniques are continually changing to accommodate the requirements and challenges of new processes and materials for various semiconductors. Most of connections between chips inside a semiconductor package and external pins and between chips are connected by metal wires, and the current process includes gold wires, copper wires, aluminum wires and the like, which are the key points in the whole packaging process.
And welding the chip pin and the chip lead frame by using an ultrasonic welding technology. Specifically, in the ultrasonic metal welding process, high-frequency vibration waves generated by a welding device are transmitted between two metal surfaces to be welded together through a chopper welding needle of the welding device, and the two metal surfaces to be welded are subjected to mechanical friction with each other under pressure, so that fusion between respective molecular layers of the two metal surfaces is caused, and the fusion causes the two metal surfaces to be jointed with each other, thereby welding the two metal members with each other. The ultrasonic welding technology has the advantages of short welding time, low requirement on the surface of the welded metal, high fusion strength, good conductivity, no spark and close to cold processing, thereby being an ideal metal welding mode. At present, more than 90% of all package pins are connected by adopting an ultrasonic welding technology.
On the other hand, currently, in order to reduce reflow and save cost, RDL technology is used to rewire the chip surface, and RDL is usually made of copper-nickel-gold, that is, a layer of nickel is plated on a thick copper layer, and then a layer of thin gold is plated, so that the melting points of various metal layers are different, and poor ball shape is likely to occur in the ball bonding process.
Referring to fig. 1, fig. 1 shows a conventional wire bonding process in the prior art, which includes the following steps: a first bond pad 100 is formed (e.g., on the surface of the chip), a wire loop 110 is formed, and finally a second bond pad 120 is formed (e.g., on the leadframe/substrate). In the wire bonding process, after the first bonding (forming the first bonding point 100) is completed, the chopper 1 'moves to the second bonding position, the outer wall of the chopper 1' (namely the outer wall of the chopper head) applies pressure to the metal wire to complete the second bonding, and the tail wire is pulled after the welding to prepare for forming the metal ball in the next bonding cycle.
Referring to fig. 2, fig. 2 is a schematic diagram illustrating a first solder joint formed in the prior art. Referring to fig. 1, a first weld point 100 is comprised of a neck 101 and a mouth 102 and a bottom 103, wherein the mouth 102 and the bottom 103 are the main parts of the first weld point. When the first welding point 100 is formed, the conventional riving knife 1' does not have bad spherical shape for some products with no shaking of the frame. However, some frames have shaking, and chips with RDL technology are welded by using the RDL which is hard and needs larger pressure and ultrasonic action, and the shaking of the frames causes resonance, so that the generated spherical shape is not easy to control, and the spherical shape is not good.
Referring to fig. 3, fig. 3 is a schematic diagram of poor sphericity. As shown in the figure, when the first welding point is formed by pressing the cleaver, the relative displacement between the cleaver and the frame can be caused due to the shaking of the frame, the bottom of the first welding point has poor sphericity caused by uneven extrusion, so that the bottom expands towards the direction with small extrusion force.
Therefore, how to prevent such a defect is a technical problem that those skilled in the art generally pay attention to.
Disclosure of Invention
In view of this, the utility model aims at providing a chopper for wire bonding can solve current wire bonding in-process, and spherical bad problem appears in first solder joint to improve welding quality, reduce the defective rate of product.
According to the utility model discloses a cleaver for lead bonding, the cleaver includes blade and the tool bit of setting in shown blade one end to and run through whole blade and the line hole that tool bit central point put, wherein, the terminal surface of tool bit is spherical or non-spherical convex surface, is equipped with the bar slot on this convex surface, the distribution of bar slot makes this cleaver when the first solder joint of bonding, lets the at least partial bottom surface of first solder joint receives the bar slot covers.
Preferably, the wire hole is provided with an opening at the position of the cutter head, and the aperture of the opening is larger than that of the wire hole in the cutter body.
Preferably, the line hole is gradually narrowed inward at the opening to form a shape corresponding to the mouth of the first welding point.
Preferably, the strip shape of the strip-shaped groove is a strip-shaped groove formed by a plurality of concentric circles, the center of the plurality of concentric circles is used as the center of the cutter head, and the diameter of the smallest concentric circle is larger than the caliber of the opening.
Preferably, the strip of the strip-shaped groove is a spiral groove, and the starting point of the spiral groove is located on the circumference of the opening.
Preferably, the strip shape of the strip-shaped grooves is a plurality of strip-shaped grooves presenting radial shape, and each radial strip-shaped groove radiates from the opening to the edge of the cutter head.
Preferably, the strip-shaped grooves are sectional strip-shaped grooves, each section of strip-shaped groove is arc-shaped or line-segment-shaped, and the sectional strip-shaped grooves are regularly distributed on the surface of the cutter head.
The utility model discloses a make bar groove on the convex surface of chopper tool bit, on the one hand, thereby can effective absorption part vibrations kinetic energy reduce the spherical bad that resonance arouses when taking place vibrations, on the other hand can increase the area of contact of solder ball and chopper tool bit for solder ball and chopper in close contact with reduce the solder ball that the frame rocked and lead to and remove, and the power is more even when making the solder ball receive the extrusion, improves spherical quality.
Drawings
Fig. 1 is a schematic diagram of the process steps of wire bonding in general in the prior art.
Fig. 2 is a schematic diagram of forming a first solder joint in the prior art.
Fig. 3 is a schematic diagram of a spherical defect in the prior art.
Fig. 4 is a schematic sectional view of a chopper according to a first embodiment of the present invention.
Fig. 5 is a plan view of a tip end surface according to a first embodiment of the present invention.
Fig. 6 is a plan view of a tip end surface according to a second embodiment of the present invention.
Fig. 7 is a plan view of a tip end surface according to a third embodiment of the present invention.
Fig. 8 is a plan view of a tip end surface according to a fourth embodiment of the present invention.
Detailed Description
The present invention will be described in detail with reference to the specific embodiments shown in the drawings, but the embodiments are not limited to the present invention, and structural, methodological, or functional changes made by those skilled in the art according to the embodiments are included in the scope of the present invention.
As described in the background art, in the conventional wire bonding process, when a first solder joint is soldered, due to frame shaking and resonance caused in some devices, the spherical shape of the first solder joint is easily deformed badly, and in some high-precision devices, the deformation easily touches an adjacent solder joint by mistake, thereby causing short circuit of the devices.
In order to overcome the problem, the utility model provides a new chopper for wire bonding, this chopper is through the bar recess that increases solder ball in close contact with in the tool bit design for the solder ball is when the welding, and inseparable contact is on the tool bit of chopper, thereby reduces to rock and the spherical bad that resonance arouses, improves the welding quality, reduces the defective rate of device.
The technical solution of the present invention will be described in detail through the following embodiments.
Implementation mode one
Referring to fig. 4, fig. 4 is a schematic cross-sectional view of a riving knife according to a first embodiment of the present invention, and as shown in the figure, the riving knife includes a knife body 1, a knife head 2, and a wire hole 3 penetrating through the whole center positions of the knife body 1 and the knife head 2. The cutting head 2 is arranged at the end of the blade 1, in one embodiment, the cutting head 2 tapers downwardly along the length of the blade 1, and the cutting head 2 presents a convex surface 20, which may be spherical or aspherical, on the end surface of the cutting head 2. The hole 3 is provided with an opening 31 at the position of the cutter head 1, and the caliber of the opening 31 is larger than that of the hole 3 in the cutter body 1.
Preferably, the string hole 3 is gradually narrowed inward at the opening 31 to form a shape corresponding to the mouth of the first welding point.
Referring to fig. 5, fig. 5 is a plan view of a tool bit end surface according to a first embodiment of the present invention. The convex surface 20 is provided with strip-shaped grooves 21, and the distribution of the strip-shaped grooves 21 is such that when the cleaver is used for bonding a first welding point, at least part of the bottom surface of the first welding point is covered by the strip-shaped grooves 21. In the embodiment shown in fig. 5, the stripe shape of these stripe grooves is a stripe groove composed of a plurality of concentric circles centered on the center of the bit head, and the diameter of the smallest concentric circle is larger than the caliber of the string hole opening 31. The concentric grooves have the function of absorbing part of the kinetic energy when vibration occurs, thereby reducing the frequency of resonance. In addition, when the solder ball is extruded into a first welding spot, the bottom end face of the solder ball can be in contact with the end face of the cutter head 2 of the chopper, the concentric grooves are additionally arranged on the end face of the cutter head 2, the contact area of the solder ball and the cutter head can be effectively increased, the solder ball can be in contact with the cutter head more tightly, and therefore the phenomenon that the center of the chopper and the center of the solder ball are displaced due to lead shaking can be reduced, and the situation that the solder ball is poor in spherical shape when being extruded is reduced. The distribution density of the concentric circles depends on the processing conditions, and denser stripes can improve the contact area and the bonding tightness. In addition, although the concentric stripes are shown throughout the entire end surface, it is understood that the concentric stripes appear only on a part of the end surface, which can bring about the effects of the present invention.
Referring to fig. 6, fig. 6 is a plan view of a tool bit end surface according to a second embodiment of the present invention. As shown in the drawing, in this second embodiment, the stripe of the stripe groove 21' is a spiral slot whose start point is located on the circumference of the opening. The helical slot may be a complete helical stripe which spirals around the aperture 31 or several different helical stripes, each spaced apart and spiraling around the aperture 31. The density of the distribution between the helical striations, depending on the processing conditions, generally speaking, the denser striations may result in increased contact area and bond tightness.
Referring to fig. 7, fig. 7 is a plan view of a tool bit end surface according to a third embodiment of the present invention. As shown in the figure, in this third embodiment, the stripe shape of the stripe-shaped groove 21 ″ is a plurality of stripe-shaped grooves presenting radial shape, and each radial stripe-shaped groove radiates from the opening 31 to the edge of the cutter head 2. The distribution density of the radial stripes depends on the machining conditions, and in one embodiment, because the convex surface 20 of the tool tip 2 is entirely arc-shaped, the strip-shaped grooves 21 ″ are relatively large at positions close to the edges of the convex surface 20, and circular grooves around the center can be provided for supplement (not shown). The rest is the same as the first embodiment, and the description is omitted here.
Referring to fig. 8, fig. 8 is a plan view of a head end surface according to a fourth embodiment of the present invention. The strip-shaped grooves 21 '″ are sectional strip-shaped grooves, each section of the strip-shaped grooves is arc-shaped or line-segment-shaped, and the sectional strip-shaped grooves 21' ″ are regularly or irregularly distributed on the surface of the cutter head. The distribution density between each segment of the grooves depends on the processing conditions. The rest is the same as the first embodiment, and the description is omitted here.
To sum up, the utility model discloses a make bar groove on the convex surface of chopper tool bit, on the one hand, thereby can effective absorption part vibrations kinetic energy reduce the spherical bad that resonance arouses when taking place vibrations, on the other hand can increase the area of contact of solder ball and chopper tool bit for solder ball and chopper in close contact with reduce the solder ball that the frame rocked and lead to and remove, and the power is more even when making the solder ball receive the extrusion, improves spherical quality.
Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims.

Claims (7)

1. A cleaver for wire bonding is characterized in that: the utility model discloses a welding spot welding device, including the cleaver, bar groove, the distribution of bar groove makes this cleaver when the first solder joint of bonding, lets at least partial bottom surface of first solder joint receive bar groove covers, the cleaver includes the blade and sets up the tool bit of blade one end to and run through whole blade and the line hole of tool bit central point position, wherein, the terminal surface of tool bit is spherical or non-spherical convex surface, is equipped with the bar groove on this convex surface, the distribution of bar groove makes this cleaver.
2. The wire bonding cleaver of claim 1, wherein: the wire hole is arranged at the position of the cutter head and is provided with an opening, and the caliber of the opening is larger than the aperture of the wire hole in the cutter body.
3. The wire bonding cleaver of claim 2, wherein: the line hole is gradually contracted inwards at the opening to form a shape corresponding to the mouth of the first welding point.
4. The wire bonding cleaver of claim 2, wherein: the strip-shaped groove is formed by a plurality of concentric circles, the center of the tool bit is used as the center of the circle, and the diameter of the smallest concentric circle is larger than the caliber of the opening.
5. The wire bonding cleaver of claim 2, wherein: the strip of the strip-shaped groove is a spiral fine groove, and the starting point of the spiral fine groove is positioned on the circumference of the opening.
6. The wire bonding cleaver of claim 2, wherein: the strip-shaped grooves are radially arranged in a strip shape, and each radial strip-shaped groove radiates towards the edge of the cutter head through the opening.
7. The wire bonding cleaver of claim 2, wherein: the strip-shaped grooves are sectional strip-shaped grooves, each section of strip-shaped groove is arc-shaped or line-segment-shaped, and the sectional strip-shaped grooves are regularly distributed on the surface of the cutter head.
CN202020532265.7U 2020-04-13 2020-04-13 Cleaver for wire bonding Active CN211858591U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020532265.7U CN211858591U (en) 2020-04-13 2020-04-13 Cleaver for wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020532265.7U CN211858591U (en) 2020-04-13 2020-04-13 Cleaver for wire bonding

Publications (1)

Publication Number Publication Date
CN211858591U true CN211858591U (en) 2020-11-03

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020532265.7U Active CN211858591U (en) 2020-04-13 2020-04-13 Cleaver for wire bonding

Country Status (1)

Country Link
CN (1) CN211858591U (en)

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GR01 Patent grant
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: Room 901-23, 9 / F, west 4 building, Xigang development center, 298 Zhenhua Road, Sandun Town, Xihu District, Hangzhou City, Zhejiang Province

Patentee after: Jiehuate Microelectronics Co.,Ltd.

Address before: Room 901-23, 9 / F, west 4 building, Xigang development center, 298 Zhenhua Road, Sandun Town, Xihu District, Hangzhou City, Zhejiang Province

Patentee before: JOULWATT TECHNOLOGY (HANGZHOU) Co.,Ltd.

CP01 Change in the name or title of a patent holder