CN215815791U - Bonding jig - Google Patents

Abstract

The application discloses a bonding jig which comprises a supporting piece, wherein a supporting plate is placed on the supporting piece and used for supporting a chip to be bonded; the support member is provided with an accommodating cavity with an opening, at least one first rotating shaft is arranged in the accommodating cavity, and the first rotating shaft is configured to move to the other side after rising from any one side and is used for jacking the supporting plates in sequence. According to the technical scheme that this application embodiment provided, through providing a nation decides tool, with the setting chamber that holds in the support piece, set up the pivot holding the intracavity, remove progressively jack-up backup pad from a side to the opposite side through the pivot for the pin of panel nation can be atress in proper order, oppresses the particle in the ACF in proper order, improves the reliability of nation.

Description

Bonding jig

Technical Field

The utility model relates to the field of chip bonding, in particular to a bonding jig.

Background

In the OLED design, the number of pins bonded by a cop (chip on panel) IC chip is usually less than 4, the maximum number of IC channels is determined by the number of bonded rows and the pitch on the panel, and the pitch on the panel on the IC chip is too small, which may cause the IC chip to be bonded at risk. Therefore, the maximum channel number of the IC can be effectively increased by increasing the row number of the IC binding, and the maximum support resolution of the IC is further improved.

However, in the IC bonding process, the larger the number of rows of pins, the smaller the number of particles in the ACF (Anisotropic Conductive Film) pressed by the pins in the middle of the IC, which may easily cause poor IC bonding.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned drawbacks and deficiencies of the prior art, it is desirable to provide a bonding jig.

In a first aspect, a bonding jig is provided, which comprises a supporting piece, wherein a supporting plate is placed on the supporting piece, and the supporting plate is used for supporting a chip to be bonded;

the support member is provided with an accommodating cavity with an opening, at least one first rotating shaft is arranged in the accommodating cavity, and the first rotating shaft is configured to move to the other side after rising from any one side and is used for jacking the supporting plates in sequence.

Furthermore, a plurality of first rotating shafts are arranged in the accommodating cavity, and the first rotating shafts are configured to move up and down from any one side to the other side in sequence and used for jacking up the supporting plate in sequence.

Further, a chain is surrounded outside the plurality of first rotating shafts.

Furthermore, many one side that first pivot is kept away from the backup pad is provided with at least one second pivot, the chain surrounds first pivot with the setting of second pivot.

Further, the width of the accommodating cavity and the width occupied by the first rotating shafts are not less than the width of the pins of the chip to be bonded.

Further, the support plate is a planar support plate.

Further, the thickness of the supporting plate is 10-300 μm.

According to the technical scheme that this application embodiment provided, through providing a nation decides tool, with the setting chamber that holds in the support piece, set up the pivot holding the intracavity, remove progressively jack-up backup pad from a side to the opposite side through the pivot for the pin of panel nation can be atress in proper order, oppresses the particle in the ACF in proper order, improves the reliability of nation.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:

FIG. 1 is a schematic diagram of a bonding fixture in this embodiment;

FIG. 2 is a schematic diagram of the bonding tool in the present embodiment;

fig. 3-4 are schematic diagrams illustrating a working process of the bonding jig in this embodiment.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and are not limiting of the utility model. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

Referring to fig. 1 and fig. 2, the present embodiment provides a bonding jig, including a supporting member 1, a supporting plate 3 is disposed on the supporting member 1, and the supporting plate 3 is used for supporting a chip 10 to be bonded;

the supporting member 1 is provided with an accommodating cavity 2 with an opening, at least one first rotating shaft 4 is arranged in the accommodating cavity 2, and the first rotating shaft 4 is configured to move from any one side to the other side after rising and is used for sequentially jacking up the supporting plate 3.

Bonding tool in this embodiment, with the setting up of support piece 1 and hold chamber 2, set up first pivot in holding chamber 2, remove progressively jack-up backup pad from a side to the opposite side through first pivot for the pin of panel bonding can be the atress in proper order, oppresses the particle in the ACF in proper order, improves the reliability of bonding.

Preferably, a plurality of first rotating shafts 4 are provided in the accommodating chamber 2, and the plurality of first rotating shafts 4 are configured to sequentially move up and down from any one side to the other side, and are used for sequentially jacking up the supporting plate 3.

Bonding tool in this embodiment is including support piece 1, backup pad 3 is placed to support piece 1 top, treat bonded chip 10 and panel 14 through backup pad 3 support, set up in support piece 1 and hold chamber 2, hold and set up first pivot 4 in the chamber 2, jack-up backup pad 3 through first pivot 4, further progressively treat bonded chip 10 and panel 14 and exert pressure, make pin 11 of treating on the bonded chip 10 and pin 13 on the panel 14 atress in proper order and all even atresss, oppress the particle in the ACF13 in proper order, make the reliability that chip pin 11 was bonded improve.

Preferably, a plurality of first rotating shafts 4 are arranged in the accommodating cavity 2 in the supporting member 1, the first rotating shafts 4 sequentially ascend from any side to the other side, sequentially jack up the supporting plate 3, further gradually apply pressure to the chips 10 to be bonded and the panel 14, as shown in fig. 3 to 4, the first rotating shafts 4 in the accommodating cavity 2 ascend from the right side, descend after jacking up the supporting plate 3, sequentially descend leftwards, each first rotating shaft 4 ascends and descends after jacking up the supporting plate 3, and the chips 10 to be bonded apply pressure according to a certain sequence.

Further, the plurality of first rotating shafts 4 are surrounded by a chain 5.

As shown in fig. 1, chains 5 surround a plurality of first rotating shafts 4 in this embodiment, when a certain first rotating shaft 4 rises, the chains 5 surrounding the first rotating shaft 4 also rise to support a supporting plate 3, so that the supporting force obtained by the supporting plate 3 and a chip 10 to be bonded is surface support, the occurrence of point support is reduced, the force applied to chip pins 11 moves uniformly, the supporting force applied to the chip pins 11 is in smooth transition, and the reliability of bonding the chip pins is improved.

Furthermore, at least one second rotating shaft 6 is arranged on one side, far away from the supporting plate 3, of the first rotating shafts 4, and the chain 5 surrounds the first rotating shafts 4 and the second rotating shafts 6.

As shown in fig. 1, a second rotating shaft 6 is further disposed in the accommodating cavity 2 of this embodiment, the second rotating shaft 6 is disposed below the first rotating shaft 4, the chain 5 simultaneously surrounds the second rotating shaft 6, and the surrounded chain 5 is tensioned through the second rotating shaft 6, so that when the first rotating shaft 4 moves up and down, the chain 5 is also in a tensioned state, the supporting force for the supporting plate 3 is in a gentle transition, for example, the pressure of the currently rising rotating shaft to the supporting plate and the panel pins is 10MPA, the pressure of the currently rising rotating shaft to the supporting plate is 5MPA, which is half of the center, and gradually decreases outwards, so that the supporting plate and the panel pins receive a relatively uniform force.

The number of the second rotating shafts 6 used for tensioning the chain 5 can be determined according to actual conditions, if the accommodating cavity is large, two or more second rotating shafts can be arranged for tensioning, and when the size of the accommodating cavity is small, one second rotating shaft is arranged for tensioning, so that the effect can be achieved.

Further, the width of the accommodating cavity 2 and the occupied width of the first rotating shafts 4 are not less than the width of the chip pins 11 to be bonded.

In order to guarantee that the chip pins can all receive the force of pivot jack-up, will hold more than or equal to that chamber width, the shared width setting of many first pivots treat bonding chip pin width, rise in proper order when the pivot and exert pressure to the chip pin, carry out pressure application in proper order from one side to the opposite side of chip, guarantee that the chip pin is whole to be atress in proper order, improve the reliability of bonding.

Further, the support plate 3 is a planar support plate.

In this embodiment, adopt plane supporting material as the backup pad for the holding power that applys to the chip pin is smooth transition, and the condition of pressure is applyed to the interval does not appear, guarantees the gradual gentle oppression ACF particle of chip pin, and can not appear the indentation on the ACF, improves the reliability of bonding.

Further, the thickness of the support plate 3 is 10 to 300 μm.

The bonding jig in the embodiment is applied to the field of chip bonding, the thickness of the supporting plate can be set to be 10-300 microns, the supporting plate is similar to a flexible panel material under the current thickness, and when the supporting plate is jacked up by the rotating shaft, the supporting plate at the current position is locally deformed to support a panel to be bonded; the supporting plate can be made of conventional metal materials such as steel sheets or carbon alloy materials.

The nation that this embodiment adopted decides tool moves through the upper and lower level of pivot, drives the chain from a side to the gradual jack-up backup pad of opposite side for the pin of chip nation can atress in proper order, improves the reliability of nation.

It will be understood that any orientation or positional relationship indicated above with respect to the terms "central," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc., is based on the orientation or positional relationship shown in the drawings and is for convenience in describing and simplifying the utility model, and does not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and is therefore not to be considered limiting of the utility model. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be understood by those skilled in the art that the scope of the present invention is not limited to the specific combination of the above-mentioned features, but also covers other embodiments formed by any combination of the above-mentioned features or their equivalents without departing from the spirit of the present invention. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.

Claims (7)

1. The bonding jig is characterized by comprising a supporting piece, wherein a supporting plate is placed on the supporting piece and used for supporting a chip to be bonded;

the support member is provided with an accommodating cavity with an opening, at least one first rotating shaft is arranged in the accommodating cavity, and the first rotating shaft is configured to move to the other side after rising from any one side and is used for jacking the supporting plates in sequence.

2. A bonding jig according to claim 1, wherein a plurality of the first rotating shafts are provided in the accommodating chamber, and the plurality of the first rotating shafts are configured to move up and down in sequence from any one side to the other side for sequentially jacking up the supporting plates.

3. A bonding jig according to claim 2, characterized in that the plurality of first rotating shafts are surrounded by chains.

4. A bonding jig according to claim 3, characterized in that at least one second rotating shaft is arranged on one side of the first rotating shafts away from the supporting plate, and the chain is arranged to surround the first rotating shafts and the second rotating shafts.

5. A bonding fixture according to claim 2, wherein the width of the receiving cavity and the width occupied by the plurality of first pivot axes are not less than the width of the chip pins to be bonded.

6. A bonding fixture according to claim 1, characterised in that the support plate is a planar support plate.

7. A bonding jig according to claim 1, characterised in that the supporting plate thickness is 10-300 μm.

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