CN215771096U - High-efficient packaging hardware is used in integrated circuit chip design - Google Patents
High-efficient packaging hardware is used in integrated circuit chip design Download PDFInfo
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- CN215771096U CN215771096U CN202121626854.2U CN202121626854U CN215771096U CN 215771096 U CN215771096 U CN 215771096U CN 202121626854 U CN202121626854 U CN 202121626854U CN 215771096 U CN215771096 U CN 215771096U
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Abstract
The utility model discloses a high-efficiency packaging device for designing an integrated circuit chip, which relates to the field of chip packaging and comprises a packaging box, wherein an electromagnetic slide rail is mounted at the top end of the inner wall of the packaging box, a first telescopic rod is fixed below the electromagnetic slide rail, a clamping assembly is fixed at the output end of the first telescopic rod, a conveying belt is arranged at the bottom end of the interior of the packaging box, a first moving block is arranged in the packaging box, and an L rod is welded at one side of the first moving block. According to the chip packaging device, the problem that glue is slowly solidified when the traditional chip is packaged and pasted is solved, the first movable block moves downwards while the first telescopic rod drives the clamping assembly to move downwards, the gear rotates while the first movable block drives the fan blades to rotate, the fan blades rotate while the fan blades rotate, and the chip which is placed on the paster above the conveyor belt is dried while the fan blades rotate, so that the glue is quickly dried, the mark code can be better bonded with the chip, the mark code cannot fall off, and the practicability is improved.
Description
Technical Field
The utility model relates to the field of chip packaging, in particular to a high-efficiency packaging device for designing an integrated circuit chip.
Background
The integrated circuit chip is an electronic element comprising a silicon substrate, at least one circuit, a fixed seal ring, a grounding ring and at least one protective ring.
When carrying out the paster to the chip, current chip packaging hardware places the top at the chip through the artifical label paster of taking usually, carries out the differentiation of model kind to the chip, but current paster packaging hardware work efficiency is lower, and the effect of paster is not good, just places the paster in the glue top, can not make the laminating effect of glue and paster better, and the paster after the laminating still need wait for glue to solidify, and the time is longer, influences process flow on next step.
SUMMERY OF THE UTILITY MODEL
Based on this, the utility model aims to provide an efficient packaging device for designing an integrated circuit chip, so as to solve the technical problems that when the conventional chip packaging device is used for mounting a chip, a label patch is usually taken manually and placed above the chip, and the type of the chip is distinguished, but the conventional chip packaging device is low in working efficiency, poor in mounting effect, and the next step is influenced because the patch is only placed above glue, so that the bonding effect of the glue and the patch cannot be better, and the mounted patch needs to wait for the glue to solidify for a long time.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides an integrated circuit chip design is with high-efficient packaging hardware, includes the encapsulation case, the electromagnetism slide rail is installed on the top of encapsulation incasement wall, and the below of electromagnetism slide rail is fixed with first telescopic link, the output of first telescopic link is fixed with the centre gripping subassembly, the inside bottom of encapsulation incasement portion is provided with the conveyer belt, the encapsulation incasement portion is provided with first movable block, and the welding of one side of first movable block has the L pole, the inside opposite side that is located first movable block of encapsulation incasement portion is provided with the gear, and one side of gear is fixed with the transfer line, the dwang is installed through the bearing in the inside top that is located the conveyer belt of encapsulation incasement portion, and the one end that the conveyer belt is close to the dwang is fixed with the flabellum, bevel gear is all installed to the one end that the flabellum was kept away from to the dwang and the one end that the gear was kept away from to the transfer line.
By adopting the technical scheme, the problem that glue is slowly solidified when the traditional chip is packaged and pasted is solved, the first movable block moves downwards while the clamping component is driven by the first telescopic rod to move downwards, the gear rotates while the fan blade rotates, the chip placed on the paster above the conveyor belt is dried while the fan blade rotates, so that the glue is quickly dried, the mark code can be better bonded with the chip and cannot fall off, the practicability is improved, the purpose of conveniently clamping the paster is achieved, the paster can be clamped by driving the two groups of clamping blocks through the arranged second telescopic rod, the paster is placed at the gluing position of the chip, the second telescopic rod drives the second movable block to move downwards, so that the two groups of clamping blocks move outwards, and the paster falls to the glue position, the paster that drops is under the effect of the carriage release lever of downstream for the laminating effect of paster and glue is better, and the adhesive is inseparabler, is convenient for press from both sides the paster and gets and the paster.
The clamping assembly comprises a fixed block fixed at the output end of the first telescopic rod, a second telescopic rod is fixed inside the fixed block, a second moving block is fixed at the output end of the second telescopic rod, a moving rod is fixed on one side, away from the second telescopic rod, of the second moving block, two groups of connecting rods are connected to two sides of the second moving block through hinge seats, and a clamping block is connected to one end, away from the second moving block, of each connecting rod through a hinge seat.
Through adopting above-mentioned technical scheme, the centre gripping subassembly through setting up can be convenient for press from both sides the paster and get, through the carriage release lever that sets up, can extrude the paster downwards and make the paster better with the laminating effect of glue.
The L-shaped rod is further provided with a limiting block, wherein a groove matched with the outer wall of the L-shaped rod is formed in one side of the limiting block.
Through adopting above-mentioned technical scheme, can make to add through the stopper that sets up and hold the subassembly and drive the second and remove when the downstream to make the flabellum air-dry paster and glue, make the paster can be quick air-dry, improved the practicality.
The utility model is further arranged in such a way that a return spring is fixed at the bottom end of the inner wall of the packaging box at one side of the conveyor belt, and one end of the return spring is fixedly connected with the bottom of the first moving block.
Through adopting above-mentioned technical scheme, reset spring through setting up can carry out the atress to support first movable block, makes under reset spring's effect after stopper and L pole break away from, first movable block can not drop, has increased stability.
The utility model is further provided that one side of the push is provided with a rack meshed and connected with the gears, and the two groups of bevel gears are meshed and connected.
Through adopting above-mentioned technical scheme, drive rather than the rotation of meshing downwards at first movable block to can drive the rotation of two sets of meshed bevel gears, improve the practicality.
The utility model is further provided that the bottom of the fixed block is provided with a sliding groove matched with the clamping block.
Through adopting above-mentioned technical scheme, the connecting rod drives two sets of tight piece of clamp when removing and slides in the spout is inside to control two sets of tight piece relative movement that press from both sides, can not make two sets of upward movements under the effect of spout, only can the directional removal, thereby press from both sides tightly the paster.
In summary, the utility model mainly has the following beneficial effects:
1. according to the utility model, through the arrangement of the first moving block, the gear, the transmission rod, the rotating rod and the fan blades, the problem that glue is slowly solidified when the traditional chip is packaged and pasted is solved, the first telescopic rod drives the clamping component to move downwards, the first moving block moves downwards and simultaneously drives the gear to rotate, the gear rotates and simultaneously drives the fan blades to rotate, and the fan blades rotate and simultaneously blow the chip pasted on the upper part of the conveying belt to dry the glue quickly, so that the mark code can be better bonded with the chip, the mark code cannot fall off, and the practicability is improved;
2. according to the utility model, through the arrangement of the clamping component, the purpose of conveniently clamping the paster is achieved, the arranged second telescopic rod can drive the two groups of clamping blocks to clamp the paster, the paster is placed at the gluing position of the chip, the second telescopic rod drives the second moving block to move downwards, so that the two groups of clamping blocks move outwards, the paster falls to the glue, the falling paster has a better pasting effect with the glue under the action of the moving rod moving downwards, the pasting is tighter, and the paster is convenient to clamp and paste.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a side view of the present invention;
FIG. 3 is a schematic structural view of a clamping assembly of the present invention;
fig. 4 is a perspective view of an L-bar of the present invention.
In the figure: 1. packaging the box; 2. an electromagnetic slide rail; 3. a first telescopic rod; 4. a clamping assembly; 401. a fixed block; 402. a second telescopic rod; 403. a second moving block; 404. a connecting rod; 405. a clamping block; 406. A travel bar; 5. a conveyor belt; 6. an L-bar; 7. a first moving block; 8. a gear; 9. a transmission rod; 10. a bevel gear; 11. rotating the rod; 12. a fan blade; 13. a return spring; 14. and a limiting block.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
The following describes an embodiment of the present invention based on its overall structure.
A high-efficiency packaging device for designing an integrated circuit chip is disclosed, as shown in FIGS. 1-3, comprising a packaging box 1, wherein an electromagnetic slide rail 2 is installed at the top end of the inner wall of the packaging box 1, a first telescopic rod 3 is fixed below the electromagnetic slide rail 2, a clamping component 4 is fixed at the output end of the first telescopic rod 3, the clamping component 4 comprises a fixed block 401 fixed at the output end of the first telescopic rod 3, a second telescopic rod 402 is fixed inside the fixed block 401, a second movable block 403 is fixed at the output end of the second telescopic rod 402, a movable rod 406 is fixed at one side of the second movable block 403 far away from the second telescopic rod 402, two groups of connecting rods 404 are connected at two sides of the second movable block 403 through hinge seats, one end of the connecting rod 404 far away from the second movable block 403 is connected with a clamping block 405 through a hinge seat, a conveyor belt 5 is arranged at the bottom end inside the packaging box 1, a first movable block 7 is arranged inside the packaging box 1, and one side of the first moving block 7 is welded with an L-shaped rod 6, the other side of the packaging box 1, which is positioned at the first moving block 7, is provided with a gear 8, one side of the gear 8 is fixed with a transmission rod 9, a rotating rod 11 is arranged above the conveyor belt 5 and inside the packaging box 1 and is provided with a bearing, one end of the rotating rod 11, which is close to the conveyor belt 5, is fixed with a fan blade 12, and one end of the rotating rod 11, which is far away from the fan blade 12, and one end of the transmission rod 9, which is far away from the gear 8, are both provided with a bevel gear 10.
Referring to fig. 3, a limiting block 14 is fixed on one side of the fixing block 401, a groove matched with the outer wall of the L-shaped rod 6 is formed in one side of the limiting block 14, and the holding assembly 4 can drive the first moving block 7 to move when moving downwards through the set limiting block 14, so that the fan blade 12 air-dries the patch and the glue, the patch can be quickly air-dried, and the practicability is improved.
Referring to fig. 2, a return spring 13 is fixed at one side of the bottom end of the inner wall of the packaging box 1, which is located on the conveyor belt 5, and one end of the return spring 13 is fixedly connected with the bottom of the first moving block 7, the first moving block 7 can be stressed and supported by the return spring 13, and after the limiting block 14 is separated from the L-shaped rod 6, the first moving block 7 cannot fall off under the action of the return spring 7, so that the stability is improved.
Referring to the drawing, a rack engaged with the gear 8 is disposed on one side of the first moving block 7, and the two sets of bevel gears 10 are engaged with each other, so that the first moving block 7 drives the engaged gears 8 to rotate downward, and the two sets of engaged bevel gears 10 can be driven to rotate, thereby improving the practicability.
Referring to the figure, the bottom of the fixed block 401 is provided with a sliding groove matched with the clamping blocks 405, and the connecting rod 404 drives the two groups of clamping blocks 405 to slide in the sliding groove while moving, so that the two groups of clamping blocks 405 are controlled to move relatively, the two groups of clamping blocks 405 cannot move upwards under the action of the sliding groove, and only move directionally, so that the patch is clamped.
The working principle of the utility model is as follows: when a chip is pasted, firstly, glue is coated above the chip, the electromagnetic slide rail 2 controls the clamping component 4 to clamp the chip, the electromagnetic slide rail 2 moves the first telescopic rod 3 to one side inside the packaging box 1, the first telescopic rod 3 extends downwards, the second telescopic rod 402 is shortened to drive the second movable block 403 to move upwards inside the fixed block 401, the second movable block 403 drives the connecting rod 404 to move upwards while moving, the connecting rod 404 drives the two groups of clamping blocks 405 to slide inside the sliding groove while moving, so that the two groups of clamping blocks 405 are controlled to move relatively, the chip is clamped, the first telescopic rod 3 is contracted to drive the clamping component 4 to move upwards, the electromagnetic slide rail 2 moves the first telescopic rod 3 above the conveyor belt 5, when the limiting block 14 on one side of the fixed block 401 is attached to the L rod 6, the electromagnetic slide rail 2 stops, the conveyor belt 5 conveys the chip to the lower part of the first telescopic rod 3 to stop moving, the first telescopic rod 3 extends to drive the clamping component 4 to move downwards, when the clamping component 4 is close to a chip, the second telescopic rod 402 extends to drive the second moving block 403 to move downwards, the second moving block 403 moves downwards and drives the moving rod 406 to move downwards, so that the two groups of clamping blocks 405 move outwards, the clamped chip falls to the gluing position of the chip, the chip falls to be glued with glue, the moving rod 406 extrudes the chip downwards to enable the bonding effect of the chip and the glue to be better, the first telescopic rod 3 drives the fixed block 401 to move downwards and simultaneously drives the L rod 6 to move downwards, the L rod 6 moves downwards and drives the first moving block 7 to move downwards, the first moving block 7 moves downwards to extrude the reset spring 13, the first moving block 7 moves downwards to drive the gear 8 to rotate, the gear 8 rotates to drive the transmission rod 9 to rotate, the transmission rod 9 rotates and simultaneously drives the two groups of engaged bevel gears 10 to rotate, thereby bevel gear 10 rotates and drives dwang 11 and rotate, drives flabellum 12 and rotates when dwang 11 rotates, and the chip of conveying 5 conveying to flabellum 12 below laminating is blown to wind when flabellum 12 rotates for glue bonding is faster, and the paster is better with glue bonding effect.
Although embodiments of the present invention have been shown and described, the present embodiments are merely illustrative of the present invention and are not intended to limit the present invention, and the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples, and those skilled in the art can make modifications, substitutions, variations, etc. of the embodiments as required without departing from the principle and spirit of the present invention, but within the scope of the claims of the present invention.
Claims (6)
1. The utility model provides an integrated circuit chip designs and uses high-efficient packaging hardware, includes encapsulation case (1), its characterized in that: encapsulation case (1) inner wall's top is installed electromagnetism slide rail (2), and the below of electromagnetism slide rail (2) is fixed with first telescopic link (3), the output of first telescopic link (3) is fixed with centre gripping subassembly (4), the inside bottom of encapsulation case (1) is provided with conveyer belt (5), encapsulation case (1) inside is provided with first movable block (7), and one side welding of first movable block (7) has L pole (6), the inside opposite side that is located first movable block (7) of encapsulation case (1) is provided with gear (8), and one side of gear (8) is fixed with transfer line (9), dwang (11) are installed through the bearing in the inside top that is located conveyer belt (5) of encapsulation case (1), and the one end that dwang (11) are close to conveyer belt (5) is fixed with flabellum (12), the one end that gear (8) were all installed to the one end that gear (8) were kept away from to one end that dwang (12) and transfer line (9) were kept away from to flabellum (11), flabellum (11) Is provided with a bevel gear (10).
2. The high efficiency packaging apparatus for integrated circuit chip design according to claim 1, wherein: the clamping assembly (4) comprises a fixing block (401) fixed at the output end of the first telescopic rod (3), a second telescopic rod (402) is fixed inside the fixing block (401), a second moving block (403) is fixed at the output end of the second telescopic rod (402), a moving rod (406) is fixed on one side, away from the second telescopic rod (402), of the second moving block (403), two groups of connecting rods (404) are connected to the two sides of the second moving block (403) through hinged seats, and one end, away from the second moving block (403), of each connecting rod (404) is connected with a clamping block (405) through hinged seats.
3. The high efficiency packaging apparatus for integrated circuit chip design according to claim 2, wherein: a limiting block (14) is fixed to one side of the fixing block (401), and a groove matched with the outer wall of the L-shaped rod (6) is formed in one side of the limiting block (14).
4. The high efficiency packaging apparatus for integrated circuit chip design according to claim 1, wherein: and a return spring (13) is fixed at one side of the bottom end of the inner wall of the packaging box (1) on the conveyor belt (5), and one end of the return spring (13) is fixedly connected with the bottom of the first moving block (7).
5. The high efficiency packaging apparatus for integrated circuit chip design according to claim 1, wherein: one side of the first moving block (7) is provided with a rack meshed with a gear (8), and two groups of bevel gears (10) are meshed and connected.
6. The high efficiency packaging apparatus for integrated circuit chip design according to claim 2, wherein: the bottom of the fixed block (401) is provided with a sliding groove matched with the clamping block (405).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121626854.2U CN215771096U (en) | 2021-07-16 | 2021-07-16 | High-efficient packaging hardware is used in integrated circuit chip design |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121626854.2U CN215771096U (en) | 2021-07-16 | 2021-07-16 | High-efficient packaging hardware is used in integrated circuit chip design |
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| CN215771096U true CN215771096U (en) | 2022-02-08 |
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| CN202121626854.2U Active CN215771096U (en) | 2021-07-16 | 2021-07-16 | High-efficient packaging hardware is used in integrated circuit chip design |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115312445A (en) * | 2022-10-11 | 2022-11-08 | 山东中兴科技开发有限公司 | Package manufacturing equipment for integrated circuit |
| CN116741668B (en) * | 2023-06-15 | 2024-02-02 | 江苏东海半导体股份有限公司 | Multi-chip packaging and positioning device of integrated circuit and working method thereof |
-
2021
- 2021-07-16 CN CN202121626854.2U patent/CN215771096U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115312445A (en) * | 2022-10-11 | 2022-11-08 | 山东中兴科技开发有限公司 | Package manufacturing equipment for integrated circuit |
| CN115312445B (en) * | 2022-10-11 | 2022-12-13 | 山东中兴科技开发有限公司 | Package manufacturing equipment for integrated circuit |
| CN116741668B (en) * | 2023-06-15 | 2024-02-02 | 江苏东海半导体股份有限公司 | Multi-chip packaging and positioning device of integrated circuit and working method thereof |
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