CN215768872U - 检查装置 - Google Patents

检查装置 Download PDF

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Publication number
CN215768872U
CN215768872U CN202121306012.9U CN202121306012U CN215768872U CN 215768872 U CN215768872 U CN 215768872U CN 202121306012 U CN202121306012 U CN 202121306012U CN 215768872 U CN215768872 U CN 215768872U
Authority
CN
China
Prior art keywords
plunger
elastic body
opening
hole
conductive film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN202121306012.9U
Other languages
English (en)
Chinese (zh)
Inventor
星野智久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokowo Co Ltd
Original Assignee
Yokowo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokowo Co Ltd filed Critical Yokowo Co Ltd
Application granted granted Critical
Publication of CN215768872U publication Critical patent/CN215768872U/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
CN202121306012.9U 2020-06-22 2021-06-11 检查装置 Expired - Fee Related CN215768872U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020106765 2020-06-22
JP2020-106765 2020-06-22

Publications (1)

Publication Number Publication Date
CN215768872U true CN215768872U (zh) 2022-02-08

Family

ID=79187482

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202121306012.9U Expired - Fee Related CN215768872U (zh) 2020-06-22 2021-06-11 检查装置
CN202110651677.1A Pending CN113900004A (zh) 2020-06-22 2021-06-11 检查装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202110651677.1A Pending CN113900004A (zh) 2020-06-22 2021-06-11 检查装置

Country Status (5)

Country Link
US (1) US20230221350A1 (https=)
JP (1) JPWO2021261285A1 (https=)
CN (2) CN215768872U (https=)
TW (1) TW202201014A (https=)
WO (1) WO2021261285A1 (https=)

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4199209A (en) * 1978-08-18 1980-04-22 Amp Incorporated Electrical interconnecting device
US5427535A (en) * 1993-09-24 1995-06-27 Aries Electronics, Inc. Resilient electrically conductive terminal assemblies
US6264476B1 (en) * 1999-12-09 2001-07-24 High Connection Density, Inc. Wire segment based interposer for high frequency electrical connection
JP3427086B2 (ja) * 2000-02-23 2003-07-14 Ｎｅｃエレクトロニクス株式会社 Ｉｃソケット
JP2001332323A (ja) * 2000-05-24 2001-11-30 Anritsu Corp シリコン電極及び高周波接点シート並びにシリコン電極製造方法
JP3921163B2 (ja) * 2000-09-26 2007-05-30 株式会社アドバンストシステムズジャパン スパイラルコンタクタ及びその製造方法、並びにそれを用いた半導体検査装置、及び電子部品
JP3440243B2 (ja) * 2000-09-26 2003-08-25 株式会社アドバンストシステムズジャパン スパイラルコンタクタ
US6909056B2 (en) * 2002-01-17 2005-06-21 Ardent Concepts, Inc. Compliant electrical contact assembly
US7446545B2 (en) * 2003-05-08 2008-11-04 Unitechno Inc. Anisotropically conductive sheet
JP2007256060A (ja) * 2006-03-23 2007-10-04 Jsr Corp シート状プローブの製造方法
JP2009115579A (ja) * 2007-11-06 2009-05-28 Jsr Corp プローブ部材およびこのプローブ部材を用いたプローブカードならびにこれを用いたウエハ検査装置
US7816932B2 (en) * 2008-02-21 2010-10-19 Teradyne, Inc. Test system with high frequency interposer
JP5107431B2 (ja) * 2008-09-05 2012-12-26 日本発條株式会社 プローブカード
MY155882A (en) * 2009-03-10 2015-12-15 Johnstech Int Corp Electrically conductive pins for microcircuit tester
JP4482707B1 (ja) * 2009-07-13 2010-06-16 株式会社アドバンテスト 試験装置
US8487304B2 (en) * 2010-04-30 2013-07-16 International Business Machines Corporation High performance compliant wafer test probe
JP2013206707A (ja) * 2012-03-28 2013-10-07 Fujitsu Ltd 実装用アダプタ、プリント基板及びその製造方法
KR101266124B1 (ko) * 2012-04-03 2013-05-27 주식회사 아이에스시 고밀도 도전부를 가지는 테스트용 소켓 및 그 제조방법
MY188012A (en) * 2013-12-18 2021-11-09 Jf Microtechnology Sdn Bhd Compressible layer with integrated bridge in ic testing apparatus
JP6436711B2 (ja) * 2014-10-01 2018-12-12 日本発條株式会社 プローブユニット
JP6610322B2 (ja) * 2016-02-15 2019-11-27 オムロン株式会社 プローブピンおよびそれを用いた検査装置
JP2017194322A (ja) * 2016-04-19 2017-10-26 株式会社ヨコオ コンタクタ
JP2018194411A (ja) * 2017-05-17 2018-12-06 株式会社ヨコオ コンタクトプローブ及び検査用治具

Also Published As

Publication number Publication date
TW202201014A (zh) 2022-01-01
US20230221350A1 (en) 2023-07-13
WO2021261285A1 (ja) 2021-12-30
CN113900004A (zh) 2022-01-07
JPWO2021261285A1 (https=) 2021-12-30

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Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20220208