CN215735646U

CN215735646U - High-speed paster equipment

Info

Publication number: CN215735646U
Application number: CN202121824306.0U
Authority: CN
Inventors: 王文; 林佛迎; 刘伟
Original assignee: Shenzhen Micro Group Semiconductor Technology Co ltd
Current assignee: Shenzhen Micro Group Semiconductor Technology Co ltd
Priority date: 2021-08-05
Filing date: 2021-08-05
Publication date: 2022-02-01
Anticipated expiration: 2031-08-05

Abstract

The utility model relates to high-speed chip mounting equipment which comprises a base, two feeders and two cross beams, wherein the two feeders are arranged on the base; the base is provided with a chip mounting area for placing a substrate; two sides of the patch area are respectively provided with a guide rail, and the two cross beams are arranged side by side and are respectively in sliding fit with the guide rails; at least one group of patch heads are respectively arranged on the cross beam; the two feeders are arranged at different ends of the guide rail, the feeding belt is placed, so that after the two cross beams move to the upper sides of the two feeders respectively, the suction nozzles of the chip mounting heads on the two cross beams respectively adsorb the devices on the material belts of the two feeders, then the two feeders move to the upper side of the chip mounting area, and the adsorbed devices are mounted on the substrate. Two sets of crossbeams that have the paster head respectively can adsorb the device respectively to can paste the dress respectively to the base plate on, the material is got simultaneously on both sides, can get the material simultaneously, pastes the dress simultaneously, also can be on one side when pasting the dress, the another side is waiting, and alternate operation prevents to hit the machine, has promoted and has pasted dress efficiency, stability and security height.

Description

High-speed paster equipment

Technical Field

The utility model relates to the field of patching, in particular to high-speed patching equipment.

Background

The chip mounting equipment in the related technology usually works by a single chip mounting head to realize the chip mounting process, the single chip mounting head carries out the chip mounting, the quantity of materials is small, the motion range is large during the chip mounting, the stroke is long, the efficiency is lower,

SUMMERY OF THE UTILITY MODEL

The technical problem to be solved by the present invention is to provide a high-speed chip mounting apparatus, aiming at the above-mentioned defects of the prior art.

The technical scheme adopted by the utility model for solving the technical problems is as follows: constructing high-speed chip mounting equipment, which comprises a base, two feeders and two cross beams;

a chip mounting area is arranged on the base and used for placing a substrate;

guide rails are respectively arranged on two sides of the patch area, and the two cross beams are arranged side by side and are respectively in sliding fit with the guide rails;

at least one group of patch heads are respectively arranged on the cross beam;

two the feeder sets up the difference end of guide rail, and the feed area is placed to let two the crossbeam removes two respectively behind the feeder upside, two the suction nozzle of the paster head on the crossbeam adsorbs two respectively behind the device on the feeder material area, moves again to paster district upside, pastes the adsorbed device dress to on the base plate.

Preferably, the mounting head is slidably mounted on the cross beam to adjust the position for mounting.

Preferably, the patch area is provided with a plurality of ejector pins capable of extending up and down so as to support the substrate after extending out upwards, and the substrate is attached to the patch area after retracting downwards.

Preferably, the patch area is provided with a plurality of adsorption holes for adsorbing the substrate.

Preferably, the base is further provided with a visual recognition device for photographing the substrate on the patch area to determine the relative position of the substrate.

Preferably, the visual recognition means comprises a camera.

Preferably, the upper end of the thimble is a flat head.

Preferably, a plurality of suction nozzles are arranged on the chip mounting head.

Preferably, each feeder comprises a plurality of groups of feeding seats with feeding belts.

The high-speed patch equipment has the following beneficial effects: two sets of crossbeams that have the paster head respectively can adsorb the device respectively to can paste the dress respectively to the base plate on, the material is got simultaneously on both sides, can get the material simultaneously, pastes the dress simultaneously, also can be on one side when pasting the dress, the another side is waiting, and alternate operation prevents to hit the machine, has promoted and has pasted dress efficiency, stability and security height.

Drawings

The utility model will be further described with reference to the accompanying drawings and examples, in which:

FIG. 1 is a schematic structural diagram of a high-speed die attachment apparatus according to an embodiment of the present invention;

fig. 2 is an enlarged schematic view of a partial view a of the patch area in fig. 1.

Detailed Description

For a more clear understanding of the technical features, objects and effects of the present invention, embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

As shown in fig. 1, the high-speed die bonder in one preferred embodiment of the present invention includes a base 1, two feeders 2, and two beams 3.

The base 1 is provided with a chip mounting area 11 for placing a substrate, two sides of the chip mounting area 11 are respectively provided with a guide rail 12, two beams 3 are arranged side by side and are respectively in sliding fit with the guide rails 12, and at least one group of chip mounting heads 31 are respectively arranged on the beams 3.

Two feeders 2 set up the difference end at guide rail 12, and the feed area is placed to let two crossbeams 3 remove respectively behind two feeders 2 upside, behind the device on two feeders 2 material areas is adsorbed respectively to the suction nozzle of the paster head 31 on two crossbeams 3, remove 11 upsides in paster district again, paste the adsorbed device and paste the dress on the base plate.

Two sets of crossbeams 3 that have paster head 31 respectively can adsorb the device respectively to can paste the dress respectively to the base plate on, the material is got simultaneously on both sides, can get the material simultaneously, pastes the dress simultaneously, also can be on one side when pasting the dress, the another side is waiting, and alternate operation prevents to hit the machine, has promoted and has pasted dress efficiency, stability and security height.

Each feeder 2 comprises a plurality of groups of feeding seats, and a specific number of feeding seats can be arranged according to the patch requirement to be adsorbed by the patch heads 31.

Be equipped with a plurality of suction nozzle on the paster head 31, can once only adsorb a plurality of devices, saved and made a round trip to get the time of material, efficiency is higher.

Further, the mounting heads 31 are slidably mounted on the cross beam 3 to adjust positions for mounting, in other embodiments, the two mounting heads 31 may not slide on the cross beam 3 and move by the cross beam 3 to realize mounting at specific positions.

As shown in fig. 2, the mounting area 11 is provided with a plurality of retractable pins 13 to support the substrate after extending upward and to attach the substrate to the mounting area 11 after retracting downward. Further, the top end of the thimble 13 is a flat head for supporting the substrate, and in other embodiments, the top end of the thimble 13 may also be a round head or a pointed head.

The patch area 11 is provided with a plurality of adsorption holes 14 for adsorbing the substrate, and preferably, the patch area 11 is a plane, so that a gap between the adsorption holes 14 and the substrate can be avoided, and the adsorption stability is improved.

Preferably, the base 1 is further provided with a visual recognition device for photographing the substrate on the mounting region 11 to determine the relative position of the substrate, so that the mounting position of the mounting head can be determined according to the relative position of the substrate, and the mounting position is accurate. Further, the visual recognition device comprises a camera, and the accurate position of the substrate is obtained through analysis after photographing.

It is to be understood that the above-described respective technical features may be used in any combination without limitation.

The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. The high-speed chip mounting equipment is characterized by comprising a base (1), two feeders (2) and two cross beams (3);

a patch area (11) is arranged on the base (1) and used for placing a substrate;

guide rails (12) are respectively arranged on two sides of the patch area (11), and the two cross beams (3) are arranged side by side and are respectively in sliding fit with the guide rails (12);

at least one group of patch heads (31) are respectively arranged on the cross beam (3);

two feeder (2) set up the difference end of guide rail (12), and the feed area is placed, in order to let two crossbeam (3) remove two respectively feeder (2) upside back, two the suction nozzle of paster head (31) on crossbeam (3) adsorbs two respectively behind the device on feeder (2) material area, remove again to paster district (11) upside, will adsorb the device dress arrive on the base plate.

2. A high-speed chip mounting apparatus according to claim 1, wherein the chip mounting head (31) is slidably mounted on the beam (3) to adjust a position for mounting.

3. A high-speed die attach apparatus according to claim 1, wherein said die attach region (11) is provided with a plurality of retractable pins (13) for supporting said substrate when extended upward and for engaging said substrate to said die attach region (11) when retracted downward.

4. A high-speed chip mounting apparatus according to claim 3, wherein said chip mounting area (11) is provided with a plurality of suction holes (14) for sucking said substrate.

5. A high-speed chip mounting apparatus according to claim 3, wherein the base (1) is further provided with a visual recognition device for photographing the substrate on the chip mounting area (11) to determine the relative position of the substrate.

6. A high-speed patch device according to claim 5, wherein said visual identification means comprises a camera.

7. A high-speed chip mounting apparatus according to claim 3, wherein the upper end of said ejector pin (13) is flat-headed.

8. The high-speed chip mounting device according to claim 1, wherein a plurality of suction nozzles are arranged on the chip mounting head (31).

9. High-speed paster device according to claim 1 wherein each feeder (2) comprises several groups of feeder seats on which the feeder belts are placed.