CN211698060U - Semiconductor current testing device - Google Patents
Semiconductor current testing device Download PDFInfo
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- CN211698060U CN211698060U CN201922151407.5U CN201922151407U CN211698060U CN 211698060 U CN211698060 U CN 211698060U CN 201922151407 U CN201922151407 U CN 201922151407U CN 211698060 U CN211698060 U CN 211698060U
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Abstract
The utility model relates to a semiconductor current testing arrangement, including the machine board, be provided with the transport runner on the machine board, it is regional, test area territory and buffering region to have set gradually along defeated material direction on the transport runner, the regional department of pay-off is provided with feeding mechanism, feeding mechanism is used for sending the product that awaits measuring to test area territory in proper order in order to be equipped with the test, test area territory is provided with current test mechanism and parameter test mechanism, current test mechanism and parameter test mechanism are used for carrying out current test and parameter test to the product that awaits measuring in getting into test area territory respectively, buffering area department is provided with buffer gear, buffer gear is arranged in sending the product that has surveyed to down one process in proper order. The utility model relates to a semiconductor current testing arrangement has the advantage that reduces measuring error, improves production efficiency, practices thrift manufacturing cost.
Description
Technical Field
The utility model relates to a semiconductor current testing arrangement belongs to semiconductor test technical field.
Background
With the continuous development of modern technologies, electronic products such as computers and mobile phones become more and more popular, and become an indispensable part of our lives. The core elements in electronic products such as computers and mobile phones are very closely related to semiconductors. The semiconductor production flow consists of wafer manufacturing, wafer testing, chip packaging and post-packaging testing. After plastic packaging, a series of operations such as post-curing, rib cutting and forming, electroplating, printing and the like are performed. The test procedure after packaging is to carry out multi-aspect test on the performance index of the packaging to ensure that the packaging can be delivered only after the quality is over-qualified. In the traditional test method, the corresponding measuring tools are manually adopted to test the performance of the packaged semiconductor product such as current, parameters and the like, the test error is large, the working efficiency is low, the labor cost is high, and the economic benefit of an enterprise cannot be improved.
Disclosure of Invention
An object of the utility model is to overcome the aforesaid not enough, provide a structural design is reasonable, reduce measuring error, improve production efficiency, reduce cost in business's semiconductor current testing arrangement.
The purpose of the utility model is realized like this: the utility model provides a semiconductor current testing arrangement, includes the quick-witted board, be provided with the transport runner on the quick-witted board, it is regional, test area and buffering region to have set gradually the pay-off along defeated material direction on the transport runner, the regional department of pay-off is provided with feeding mechanism, feeding mechanism is arranged in sending the product that awaits measuring to test area in proper order in order to be equipped with the test, test area department is provided with current test mechanism and parameter test mechanism, current test mechanism and parameter test mechanism are used for carrying out current test and parameter test to the product that awaits measuring in getting into test area respectively, buffering area department is provided with buffer gear, buffer gear is arranged in sending the product that has surveyed to next process in proper order.
Preferably, feeding mechanism is including setting up in the feeding mechanism cylinder of quick-witted board bottom surface, the flexible end of feeding mechanism cylinder is provided with the feeding mechanism lifter plate, upwards be provided with feeding mechanism fender material post on the feeding mechanism lifter plate, feeding mechanism keeps off the material post and is located and carries the runner under, feeding mechanism keeps off the top of material post and upwards extends and pass and carry the runner, still be provided with the feeding mechanism backup pad on the feeding mechanism lifter plate, the top of feeding mechanism backup pad is provided with the feeding mechanism connecting plate, it compresses tightly the post to be provided with feeding mechanism downwards on the feeding mechanism connecting plate, feeding mechanism compresses tightly the post and is located and carries the runner directly over, and feeding mechanism compresses tightly the post and is located the rear that feeding mechanism kept off the material post.
Preferably, the current testing mechanism comprises a current testing mechanism supporting plate vertically inserted on the machine plate, an upper clamping component and a lower clamping component are arranged on the current testing mechanism supporting plate, the upper clamping component comprises an upper clamping component cylinder with a downward telescopic end, an upper clamping component guide rail vertically arranged is arranged below the upper clamping component cylinder, the upper clamping component guide rail is arranged on the current testing mechanism supporting plate, an upper clamping component sliding block is arranged on the upper clamping component guide rail, an upper clamping component moving seat is arranged on the upper clamping component sliding block, an upper clamping component supporting block is arranged on the upper clamping component moving seat, an upper clamping component fixing block is arranged below the upper clamping component supporting block, and a plurality of upper clamping component buffer columns are arranged between the upper clamping component fixing block and the upper clamping component supporting block, an upper clamping component induction clamp is arranged on the upper clamping component fixing block;
the lower clamping assembly and the upper clamping assembly are arranged in a vertically symmetrical mode.
Preferably, the upper clamping assembly buffer column is sleeved with an upper clamping assembly buffer spring.
Preferably, the lower section of the upper clamping assembly induction clamp is provided with a current testing mechanism limiting part.
Preferably, the parameter testing mechanism comprises a first buffering component, a positioning component and a second buffering component in sequence along the conveying direction of the conveying channel, a parameter testing component is arranged above the positioning component and comprises a parameter testing component cylinder, the telescopic end of the parameter testing component cylinder is provided with a parameter testing component push plate, the parameter testing component push plate is provided with a parameter testing component push block, a parameter testing component fixing seat is arranged below the parameter testing component push plate, a parameter testing component connecting block is arranged on the parameter testing component fixing seat, the parameter testing device comprises a parameter testing component and is characterized in that a parameter testing component clamping block is arranged on the parameter testing component connecting block, a parameter testing component induction piece is clamped on the parameter testing component clamping block, and a parameter testing component pushing block is located on the outer side of the parameter testing component induction piece.
Preferably, buffer gear includes along the multiunit buffering subassembly of defeated material direction interval arrangement, the buffering subassembly is including setting up in the buffering subassembly cylinder of quick-witted board bottom surface, the flexible end of buffering subassembly cylinder is provided with the buffering subassembly lifter plate, upwards be provided with the buffering subassembly on the buffering subassembly lifter plate and keep off the material post, the buffering subassembly keeps off the material post and is located and carries the runner under, the buffering subassembly keeps off the top of material post and upwards extends and pass and carry the runner.
Preferably, in operation, the deck is arranged to be inclined downwardly in the feeding direction.
Preferably, a cover plate is arranged at the top of the conveying flow channel.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model relates to a semiconductor current testing arrangement will carry the runner slope to arrange for the product can realize the product with the help of the free landing of gravity of self and carry, reduces the production energy consumption, practices thrift manufacturing cost, and its automatic structural design has replaced artifical test in the past, reduces measuring error, improves production efficiency.
Drawings
Fig. 1 is a schematic structural diagram of a semiconductor current testing apparatus according to the present invention.
Fig. 2 is a top view of fig. 1.
Fig. 3 is an enlarged view of a portion a in fig. 2.
Fig. 4 is a schematic structural diagram of a test product.
Fig. 5 is a schematic structural view of the feeding mechanism.
Fig. 6 is a schematic structural diagram of the current testing mechanism 5.
Fig. 7 is a side view of fig. 6.
Fig. 8 is a schematic view of the upper clamping assembly induction fixture and the lower clamping assembly induction fixture of fig. 6 cooperating to clamp a product.
FIG. 9 is a schematic structural diagram of a parametric test mechanism.
Fig. 10 is a side view of fig. 9.
FIG. 11 is a schematic view of the parametric test assembly of FIG. 9 with the cylinder block removed.
Wherein:
Conveying flow channel 2
The feeding mechanism 3, a feeding mechanism cylinder 301, a feeding mechanism lifting plate 302, a feeding mechanism supporting plate 303, a feeding mechanism material blocking column 304, a feeding mechanism connecting plate 305 and a feeding mechanism pressing column 306
The device comprises a parameter testing mechanism 6, a first buffer component 601, a positioning component 602, a positioning component cylinder 602.1, a positioning component lifting plate 602.2, a positioning component material blocking column 602.3, a second buffer component 603, a buffer component cylinder 603.1, a buffer component lifting plate 603.2, a buffer component material blocking column 603.3, a parameter testing component 604, a parameter testing component cylinder 604.1, a parameter testing component cylinder seat 604.2, a parameter testing component push plate 604.3, a parameter testing component push block 604.4, a parameter testing component fixing seat 604.5, a parameter testing component connecting block 604.6, a parameter testing component clamping block 604.7 and a parameter testing component sensing piece 604.8
And a cover plate 8.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without any creative work belong to the protection scope of the present invention.
Referring to fig. 1-11, the present invention relates to a semiconductor current testing device, which comprises a machine plate 1, a conveying flow channel 2 is arranged on the top surface of the machine plate 1 in parallel, a cover plate 8 is arranged on the top of the conveying flow channel 2, a feeding area, a testing area and a buffering area are sequentially arranged on the conveying flow channel 2 along the conveying direction, the feeding area is provided with a feeding mechanism 3, the feeding mechanism 3 is used for sequentially feeding products 7 to be tested to the testing area for testing, the testing area is provided with a current testing mechanism 5 and a parameter testing mechanism 6, the current testing mechanism 5 and the parameter testing mechanism 6 are respectively used for carrying out current testing and parameter testing on a product 7 to be tested entering the testing area, the buffer area is provided with a buffer mechanism 4, and the buffer mechanism 4 is used for sequentially conveying the tested products 7 to the next procedure;
the product 7 comprises a product body 701, wherein a front pin 702 and a rear pin 702 bent downwards are arranged on one side of the product body 701, and a front pin 703, a middle pin 703 and a rear pin 703 bent downwards are arranged on the other side of the product body 701;
in the work, the machine plate 1 is arranged along the material conveying direction in a 45-degree downward inclination manner, and the products 7 on the conveying flow channel 2 can freely slide down by means of the gravity of the products, so that the product conveying is realized, the production energy consumption is reduced, and the production cost is saved;
the feeding mechanism 3 comprises a feeding mechanism cylinder 301 arranged on the bottom surface of the machine plate 1, the telescopic end of the feeding mechanism cylinder 301 is arranged downwards, the telescopic end of the feeding mechanism cylinder 301 is provided with a feeding mechanism lifting plate 302 which is horizontally arranged, one end of the feeding mechanism lifting plate 302 is connected with the telescopic end of the feeding mechanism cylinder 301 through a connecting piece, the other end of the feeding mechanism lifting plate 302 is upwards provided with a feeding mechanism blocking column 304, the feeding mechanism blocking column 304 is provided with a left side and a right side, the feeding mechanism blocking column 304 is positioned under the conveying flow channel 2, the top end of the feeding mechanism blocking column 304 upwards extends and penetrates through the conveying flow channel 2, the middle part of the feeding mechanism lifting plate 302 is upwards provided with a vertical feeding mechanism supporting plate 303, the top of the feeding mechanism supporting plate 303 is provided with a feeding mechanism connecting plate 305, and one end of the feeding mechanism connecting plate is connected with the feeding mechanism supporting plate 305, the other end of the feeding mechanism connecting plate 305 is provided with a feeding mechanism pressing column 306 downwards, the feeding mechanism pressing column 306 is positioned right above the conveying flow channel 2, and the feeding mechanism pressing column 306 is positioned behind the feeding mechanism blocking column 304;
when the cylinder of the feeding mechanism extends out, the lifting plate of the feeding mechanism descends to drive the material blocking column of the feeding mechanism and the pressing column of the feeding mechanism to move downwards simultaneously, the material blocking column of the feeding mechanism cancels the blocking force on the product A, so that the product A slides into a testing area, and the pressing column of the feeding mechanism generates pressing force on the product B; when the feeding mechanism cylinder retracts, the feeding mechanism lifting plate rises, the feeding mechanism material blocking column and the feeding mechanism pressing column move upwards simultaneously, the feeding mechanism pressing column cancels pressing force on the product B, so that the product B and other products slide forwards in sequence, the feeding mechanism material blocking column generates blocking force on the product B, and meanwhile, the product C slides to the position under the feeding mechanism pressing column; when the feeding mechanism cylinder extends out, the feeding mechanism lifting plate descends to drive the feeding mechanism material blocking column and the feeding mechanism pressing column to move downwards simultaneously, the feeding mechanism material blocking column cancels the blocking force on the product B, so that the product B slides into the first buffer area, the feeding mechanism pressing column generates pressing force on the product C, and the product C is repeatedly and circularly operated in the mode, and a plurality of products are sequentially conveyed into the test area.
The current testing mechanism 5 comprises a current testing mechanism supporting plate 501 vertically inserted on the machine plate 1, the current testing mechanism supporting plate 501 is positioned on the right side of the conveying flow channel 2, an upper clamping assembly 502 and a lower clamping assembly 503 are arranged on the inner side surface of the current testing mechanism supporting plate 501, and the upper clamping assembly 502 and the lower clamping assembly 503 are respectively positioned above and below the machine plate 1;
the upper clamping assembly 502 comprises an upper clamping assembly cylinder 502.1 with a downward telescopic end, the upper clamping assembly cylinder 502.1 is arranged at the top of the current testing mechanism supporting plate 501 through an upper clamping assembly cylinder seat 502.2, an upper clamping assembly guide rail 502.3 which is vertically arranged is arranged below the upper clamping assembly cylinder 502.1, the upper clamping assembly guide rail 502.3 is arranged at the upper section of the current testing mechanism supporting plate 501, an upper clamping assembly sliding block 502.4 is arranged on the upper clamping assembly guide rail 502.3, an upper clamping assembly moving seat 502.5 is arranged on the upper clamping assembly sliding block 502.4, a front upper clamping assembly supporting block 502.6 and a rear upper clamping assembly supporting block 502.5 are arranged on the upper clamping assembly moving seat, an upper clamping assembly fixing block 502.7 is arranged below the front upper clamping assembly supporting block 502.6 and the rear upper clamping assembly supporting block 502.6, a plurality of upper clamping assembly buffer columns 502.8 are arranged between the upper clamping assembly fixing block 502.7 and the upper clamping assembly supporting block 502.6, an upper clamping assembly buffer spring 502.9 is sleeved on the upper clamping assembly buffer column 502.8, and an upper clamping assembly induction clamp 502.10 is arranged on the upper clamping assembly fixing block 502.7;
preferably, a current testing mechanism limiting member 504 is arranged at the lower section of the upper clamping assembly induction clamp 502.10;
the lower clamping assembly 503 comprises a lower clamping assembly cylinder 503.1 with an upward telescopic end, the lower clamping assembly cylinder 503.1 is arranged at the bottom of the current testing mechanism supporting plate 501 through a lower clamping assembly cylinder seat 503.2, a lower clamping assembly guide rail 503.3 which is vertically arranged is arranged above the lower clamping assembly cylinder 503.1, the lower clamping assembly guide rail 503.3 is arranged at the lower section of the current testing mechanism supporting plate 501, a lower clamping assembly sliding block 503.4 is arranged on the lower clamping assembly guide rail 503.3, a lower clamping assembly moving seat 503.5 is arranged on the lower clamping assembly sliding block 503.4, a front lower clamping assembly supporting block 503.6 and a rear lower clamping assembly supporting block are arranged on the lower clamping assembly moving seat 503.5, a lower clamping assembly fixing block 503.7 is arranged above the front lower clamping assembly supporting block 503.6 and the rear lower clamping assembly supporting block 503.7, a plurality of lower clamping assembly supporting blocks 503.8 are arranged between the lower clamping assembly supporting block 503.7 and the lower clamping assembly supporting block 503.6, a lower clamping assembly buffer spring 503.9 is sleeved on the lower clamping assembly buffer column 503.8, and a lower clamping assembly induction clamp 503.10 is arranged on the lower clamping assembly fixing block 503.7;
the upper clamping assembly cylinder and the lower clamping assembly cylinder extend out simultaneously to drive the upper clamping assembly moving seat and the lower clamping assembly moving seat to move downwards and upwards respectively, so that the upper clamping assembly induction clamp 502.10 and the lower clamping assembly induction clamp 503.10 clamp the two first pins 702 of the product 7 and feed current test results back to the system.
The parameter testing mechanism 6 sequentially comprises a first buffering component 601, a positioning component 602 and a second buffering component 603 along the conveying direction of the conveying runner 2, a parameter testing component 604 is arranged above the positioning component 602, the first buffering component 601 is used for controlling ordered conveying of the products 7 to be tested, the products 7 to be tested are positioned through the positioning component 602, the parameter testing component 604 performs parameter testing on the products, and the second buffering component 603 is used for controlling ordered conveying of the tested products 7;
the parameter testing component 604 comprises a parameter testing component cylinder 604.1 which is transversely arranged, the parameter testing component cylinder 604.1 is arranged on the top surface of the machine plate 1 at the left side of the conveying flow channel 2 through a parameter testing component cylinder seat 604.2, the telescopic end of the parameter testing component cylinder 604.1 is inward, the telescopic end of the parameter testing component cylinder 604.1 is provided with a parameter testing component push plate 604.3, the inner side surface of the parameter testing component push plate 604.3 is provided with a parameter testing component push block 604.4, a parameter testing component fixing seat 604.5 is arranged below the parameter testing component push plate 604.3, the parameter testing component fixing seat 604.5 is fixedly connected with the machine plate 1, the parameter testing component fixing seat 604.5 is provided with a parameter testing component connecting block 604.6, the inner side of the parameter testing component connecting block 604.6 is provided with a parameter testing component clamping block 604.7, and a parameter testing component induction piece 604.8 is clamped on the parameter testing component clamping block 604.7, the parameter testing component push block 604.4 is positioned at the outer side of the parameter testing component sensing piece 604.8;
a parameter testing component waist-shaped hole 604.9 is formed in the parameter testing component connecting block 604.6, a parameter testing component adjusting bolt is arranged in the parameter testing component waist-shaped hole 604.9, and the parameter testing component connecting block 604.6 is connected with the parameter testing component fixing seat 604.5 through the parameter testing component adjusting bolt;
when the parameter testing component cylinder extends out, the parameter testing component push block is pushed to move inwards, so that the parameter testing component sensing piece is in contact with the second pin of the product and the parameter testing result is fed back to the system;
the first buffer component 601 and the second buffer component 603 adopt buffer components with the same structure, each buffer component comprises a buffer component cylinder 603.1 arranged on the bottom surface of the machine plate 1, the telescopic end of the buffer component cylinder 603.1 is arranged downwards, the telescopic end of the buffer component cylinder 603.1 is provided with a horizontally-placed buffer component lifting plate 603.2, one end of the buffer component lifting plate 603.2 is connected with the telescopic end of the buffer component cylinder 603.1 through a connecting piece, the other end of the buffer component lifting plate 603.2 is upwards provided with a buffer component material blocking column 603.3, the buffer component material blocking columns 603.3 are arranged in a left and right mode, the buffer component material blocking columns 603.3 are positioned under the conveying flow channel 2, and the top ends of the buffer component material blocking columns 603.3 extend upwards and penetrate through the conveying flow channel 2;
locating component 602 is including setting up in the locating component cylinder 602.1 of quick-witted board 1 bottom surface, locating component cylinder 602.1's flexible end is downward, locating component cylinder 602.1's flexible end is provided with the locating component lifter plate 602.2 of keeping flat, be connected through the connecting piece between locating component lifter plate 602.2's one end and locating component cylinder 602.1's the flexible end, locating component lifter plate 602.2's the other end upwards is provided with locating component fender stockpost 602.3, locating component fender stockpost 602.3 is provided with about two, locating component keeps off stockpost 602.3 and is located and carries runner 2 under, locating component keeps off the top of stockpost 602.3 and upwards extends and pass and carry runner 2.
The use method of the parameter testing mechanism comprises the following steps:
step one, the product to be measured passes through the first buffer component and is transited into the positioning component,
secondly, positioning and fixing the product to be detected by the positioning assembly;
thirdly, the parameter testing component carries out parameter testing on the product to be tested;
and step four, the tested product passes through the second buffer assembly and is transited to the next area.
The buffer mechanism 4 comprises a plurality of groups of buffer components arranged at intervals along the material conveying direction, the buffer components have the same structure as the first buffer component 601 and the second buffer component 603, and the plurality of groups of buffer components are used for orderly conveying the measured products 7 to the next procedure at intervals.
A method for using a semiconductor current testing device comprises the following steps:
step one, arranging a machine plate in a 45-degree downward inclination manner along a material conveying direction, and enabling a plurality of products to be detected to orderly slide forwards in a material conveying flow channel by means of self gravity;
secondly, the products to be tested pass through a feeding area and are sequentially fed into a testing area through a feeding mechanism;
thirdly, the products to be tested entering the test area are subjected to current test and parameter test respectively through the current test mechanism and the parameter test mechanism;
and step four, the tested products pass through a buffer area, and the tested products are sequentially conveyed to the next procedure through a buffer mechanism.
The above is only a specific application example of the present invention, and does not constitute any limitation to the protection scope of the present invention. All the technical solutions formed by equivalent transformation or equivalent replacement fall within the protection scope of the present invention.
Claims (9)
1. A semiconductor current testing device is characterized in that: including quick-witted board (1), be provided with on quick-witted board (1) and carry runner (2), it is regional, test area and buffer area to carry to have set gradually the pay-off along defeated material direction on runner (2), pay-off region department is provided with feeding mechanism (3), feeding mechanism (3) are arranged in sending product (7) that await measuring to test area in proper order in order to be ready for the test, test area department is provided with current test mechanism (5) and parameter test mechanism (6), current test mechanism (5) and parameter test mechanism (6) are used for carrying out current test and parameter test to getting into product (7) that await measuring in the test area respectively, buffer area department is provided with buffer gear (4), buffer gear (4) are arranged in sending product (7) that have surveyed to next process in proper order.
2. A semiconductor current testing device according to claim 1, wherein: the feeding mechanism (3) comprises a feeding mechanism cylinder (301) arranged on the bottom surface of the machine plate (1), a feeding mechanism lifting plate (302) is arranged at the telescopic end of the feeding mechanism cylinder (301), a feeding mechanism blocking column (304) is upwards arranged on the feeding mechanism lifting plate (302), the feeding mechanism blocking column (304) is located under the conveying flow channel (2), the top end of the feeding mechanism blocking column (304) upwards extends and penetrates through the conveying flow channel (2), a feeding mechanism supporting plate (303) is further arranged on the feeding mechanism lifting plate (302), a feeding mechanism connecting plate (305) is arranged at the top of the feeding mechanism supporting plate (303), a feeding mechanism pressing column (306) is arranged on the feeding mechanism connecting plate (305) downwards, and the feeding mechanism pressing column (306) is located right above the conveying flow channel (2), and the feeding mechanism pressing column (306) is positioned behind the feeding mechanism material blocking column (304).
3. A semiconductor current testing device according to claim 1, wherein: the current testing mechanism (5) comprises a current testing mechanism supporting plate (501) vertically inserted on the machine plate (1), an upper clamping assembly (502) and a lower clamping assembly (503) are arranged on the current testing mechanism supporting plate (501), the upper clamping assembly (502) comprises an upper clamping assembly cylinder (502.1) with a downward telescopic end, an upper clamping assembly guide rail (502.3) vertically arranged is arranged below the upper clamping assembly cylinder (502.1), the upper clamping assembly guide rail (502.3) is arranged on the current testing mechanism supporting plate (501), an upper clamping assembly sliding block (502.4) is arranged on the upper clamping assembly guide rail (502.3), an upper clamping assembly moving seat (502.5) is arranged on the upper clamping assembly sliding block (502.4), an upper clamping assembly supporting block (502.6) is arranged on the upper clamping assembly moving seat (502.5), and an upper clamping assembly fixing block (502.7) is arranged below the upper clamping assembly supporting block (502.6), a plurality of upper clamping assembly buffer columns (502.8) are arranged between the upper clamping assembly fixing block (502.7) and the upper clamping assembly supporting block (502.6), and an upper clamping assembly induction clamp (502.10) is arranged on the upper clamping assembly fixing block (502.7);
the lower clamping assembly (503) and the upper clamping assembly (502) are arranged in an up-and-down symmetrical mode.
4. A semiconductor current testing device according to claim 3, wherein: an upper clamping component buffer spring (502.9) is sleeved on the upper clamping component buffer column (502.8).
5. A semiconductor current testing device according to claim 3, wherein: the lower section of the upper clamping assembly induction clamp (502.10) is provided with a current testing mechanism limiting piece (504).
6. A semiconductor current testing device according to claim 1, wherein: the parameter testing mechanism (6) sequentially comprises a first buffering component (601), a positioning component (602) and a second buffering component (603) along the conveying direction of the conveying flow channel (2), a parameter testing component (604) is arranged above the positioning component (602), the parameter testing component (604) comprises a parameter testing component cylinder (604.1), a parameter testing component push plate (604.3) is arranged at the telescopic end of the parameter testing component cylinder (604.1), a parameter testing component push block (604.4) is arranged on the parameter testing component push plate (604.3), a parameter testing component fixing seat (604.5) is arranged below the parameter testing component push plate (604.3), a parameter testing component connecting block (604.6) is arranged on the parameter testing component fixing seat (604.5), and a parameter testing component clamping block (604.7) is arranged on the parameter testing component connecting block (604.6), the parameter testing component fixture block (604.7) is clamped with a parameter testing component sensing piece (604.8), and the parameter testing component push block (604.4) is positioned on the outer side of the parameter testing component sensing piece (604.8).
7. A semiconductor current testing device according to claim 1, wherein: buffer gear (4) are including the multiunit buffering subassembly along defeated material direction interval arrangement, buffering subassembly is including setting up in buffering subassembly cylinder (603.1) of quick-witted board (1) bottom surface, the flexible end of buffering subassembly cylinder (603.1) is provided with buffering subassembly lifter plate (603.2), upwards be provided with buffering subassembly fender material post (603.3) on the buffering subassembly lifter plate, buffering subassembly keeps off material post (603.3) and is located and carries runner (2) under, buffering subassembly keeps off the top of material post (603.3) and upwards extends and pass and carry runner (2).
8. A semiconductor current testing device according to claim 1, wherein: in work, the machine plate (1) is arranged along the conveying direction in a downward inclined mode.
9. A semiconductor current testing device according to claim 1, wherein: and a cover plate (8) is arranged at the top of the conveying flow channel (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922151407.5U CN211698060U (en) | 2019-12-04 | 2019-12-04 | Semiconductor current testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922151407.5U CN211698060U (en) | 2019-12-04 | 2019-12-04 | Semiconductor current testing device |
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| Publication Number | Publication Date |
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| CN211698060U true CN211698060U (en) | 2020-10-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201922151407.5U Active CN211698060U (en) | 2019-12-04 | 2019-12-04 | Semiconductor current testing device |
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| CN (1) | CN211698060U (en) |
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2019
- 2019-12-04 CN CN201922151407.5U patent/CN211698060U/en active Active
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