CN211698061U - Semiconductor parameter testing mechanism - Google Patents
Semiconductor parameter testing mechanism Download PDFInfo
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- CN211698061U CN211698061U CN201922151824.XU CN201922151824U CN211698061U CN 211698061 U CN211698061 U CN 211698061U CN 201922151824 U CN201922151824 U CN 201922151824U CN 211698061 U CN211698061 U CN 211698061U
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Abstract
The utility model relates to a semiconductor parameter test mechanism, including carrying the runner, first buffering subassembly, locating component, second buffering subassembly have set gradually along carrying the defeated material direction of runner, locating component's top is provided with parameter testing subassembly, first buffering subassembly is used for controlling the orderly transport of the product that awaits measuring, fixes a position the product that awaits measuring through locating component, and parameter testing subassembly carries out parameter test to it, second buffering subassembly is used for controlling the orderly transport of the product that has surveyed. The utility model relates to a semiconductor parameter test mechanism has the advantage of automatic, reduce measuring error, improvement production efficiency.
Description
Technical Field
The utility model relates to a semiconductor parameter testing mechanism belongs to semiconductor test technical field.
Background
With the continuous development of modern technologies, electronic products such as computers and mobile phones become more and more popular, and become an indispensable part of our lives. The core elements in electronic products such as computers and mobile phones are very closely related to semiconductors. The semiconductor production flow consists of wafer manufacturing, wafer testing, chip packaging and post-packaging testing. After plastic packaging, a series of operations such as post-curing, rib cutting and forming, electroplating, printing and the like are performed. The test procedure after packaging is to carry out multi-aspect test on the performance index of the packaging to ensure that the packaging can be delivered only after the quality is over-qualified. In the traditional test method, the corresponding measuring tools are manually adopted to test the performance of the packaged semiconductor product such as current, parameters and the like, the test error is large, the working efficiency is low, the labor cost is high, and the economic benefit of an enterprise cannot be improved.
Disclosure of Invention
An object of the utility model is to overcome above-mentioned not enough, provide a semiconductor parameter testing mechanism who reduces measuring error, improves production efficiency.
The purpose of the utility model is realized like this: the utility model provides a semiconductor parameter test mechanism, includes and carries the runner, has set gradually first buffering subassembly, locating component, second buffering subassembly along the defeated material direction of carrying the runner, locating component's top is provided with parameter testing subassembly, first buffering subassembly is used for controlling the orderly transport of the product that awaits measuring, fixes a position the product that awaits measuring through locating component, and parameter testing subassembly carries out the parameter test to it, second buffering subassembly is used for controlling the orderly transport of the product that has surveyed.
Preferably, the parameter testing component comprises a parameter testing component cylinder, a parameter testing component push plate is arranged at the telescopic end of the parameter testing component cylinder, a parameter testing component push block is arranged on the parameter testing component push plate, a parameter testing component fixing seat is arranged below the parameter testing component push plate, a parameter testing component connecting block is arranged on the parameter testing component fixing seat, a parameter testing component clamping block is arranged on the parameter testing component connecting block, a parameter testing component sensing piece is clamped on the parameter testing component clamping block, and the parameter testing component push block is located on the outer side of the parameter testing component sensing piece.
Preferably, the parameter testing component connecting block is provided with a parameter testing component waist-shaped hole, a parameter testing component adjusting bolt is arranged in the parameter testing component waist-shaped hole, and the parameter testing component connecting block is connected with the parameter testing component fixing seat through the parameter testing component adjusting bolt.
Preferably, the parameter testing component cylinder is arranged on one side of the conveying flow channel through a parameter testing component cylinder seat.
Preferably, first buffering subassembly and second buffering subassembly adopt the buffering subassembly of looks isostructure, the buffering subassembly includes the buffering subassembly cylinder, the flexible end of buffering subassembly cylinder is provided with the buffering subassembly lifter plate, upwards be provided with the buffering subassembly fender material post on the buffering subassembly lifter plate, buffering subassembly fender material post is located and carries the runner under, the buffering subassembly keeps off the top of material post and upwards extends and pass and carry the runner.
Preferably, the buffer component material blocking column is provided with a left material blocking column and a right material blocking column.
Preferably, the locating component comprises a locating component cylinder, a locating component lifting plate is arranged at the telescopic end of the locating component cylinder, a locating component blocking column is upwards arranged on the locating component lifting plate and is located under the conveying flow channel, and the top end of the locating component blocking column upwards extends and penetrates through the conveying flow channel.
Preferably, the positioning assembly material blocking column is provided with a left material blocking column and a right material blocking column.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model relates to a semiconductor parameter test mechanism can realize having the advantage of automatic, reducing measuring error, improving production efficiency to product continuous type is carried and is tested.
Drawings
Fig. 1 is a schematic structural diagram of a current testing apparatus of the present invention.
Fig. 2 is a top view of fig. 1.
Fig. 3 is an enlarged view of a portion a in fig. 2.
Fig. 4 is a schematic structural diagram of a test product.
Fig. 5 is a schematic structural view of the feeding mechanism.
Fig. 6 is a schematic structural diagram of the current testing mechanism 5.
Fig. 7 is a side view of fig. 6.
Fig. 8 is a schematic view of the upper clamping assembly induction fixture and the lower clamping assembly induction fixture of fig. 6 cooperating to clamp a product.
FIG. 9 is a schematic structural diagram of a parametric test mechanism.
Fig. 10 is a side view of fig. 9.
FIG. 11 is a schematic view of the parametric test assembly of FIG. 9 with the cylinder block removed.
Wherein:
Conveying flow channel 2
The feeding mechanism 3, a feeding mechanism cylinder 301, a feeding mechanism lifting plate 302, a feeding mechanism supporting plate 303, a feeding mechanism material blocking column 304, a feeding mechanism connecting plate 305 and a feeding mechanism pressing column 306
The device comprises a parameter testing mechanism 6, a first buffer component 601, a positioning component 602, a positioning component cylinder 602.1, a positioning component lifting plate 602.2, a positioning component material blocking column 602.3, a second buffer component 603, a buffer component cylinder 603.1, a buffer component lifting plate 603.2, a buffer component material blocking column 603.3, a parameter testing component 604, a parameter testing component cylinder 604.1, a parameter testing component cylinder seat 604.2, a parameter testing component push plate 604.3, a parameter testing component push block 604.4, a parameter testing component fixing seat 604.5, a parameter testing component connecting block 604.6, a parameter testing component clamping block 604.7 and a parameter testing component sensing piece 604.8
And a cover plate 8.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without any creative work belong to the protection scope of the present invention.
Referring to fig. 1-11, the present invention relates to a current testing device, which comprises a machine plate 1, a conveying flow channel 2 is arranged on the top surface of the machine plate 1 in parallel, a cover plate 8 is arranged on the top of the conveying flow channel 2, a feeding area, a testing area and a buffering area are sequentially arranged on the conveying flow channel 2 along the conveying direction, the feeding area is provided with a feeding mechanism 3, the feeding mechanism 3 is used for sequentially feeding products 7 to be tested to the testing area for testing, the testing area is provided with a current testing mechanism 5 and a parameter testing mechanism 6, the current testing mechanism 5 and the parameter testing mechanism 6 are respectively used for carrying out current testing and parameter testing on a product 7 to be tested entering the testing area, the buffer area is provided with a buffer mechanism 4, and the buffer mechanism 4 is used for sequentially conveying the tested products 7 to the next procedure;
the product 7 comprises a product body 701, wherein a front pin 702 and a rear pin 702 bent downwards are arranged on one side of the product body 701, and a front pin 703, a middle pin 703 and a rear pin 703 bent downwards are arranged on the other side of the product body 701;
in the work, the machine plate 1 is arranged along the material conveying direction in a 45-degree downward inclination manner, and the products 7 on the conveying flow channel 2 can freely slide down by means of the gravity of the products, so that the product conveying is realized, the production energy consumption is reduced, and the production cost is saved;
the feeding mechanism 3 comprises a feeding mechanism cylinder 301 arranged on the bottom surface of the machine plate 1, the telescopic end of the feeding mechanism cylinder 301 is arranged downwards, the telescopic end of the feeding mechanism cylinder 301 is provided with a feeding mechanism lifting plate 302 which is horizontally arranged, one end of the feeding mechanism lifting plate 302 is connected with the telescopic end of the feeding mechanism cylinder 301 through a connecting piece, the other end of the feeding mechanism lifting plate 302 is upwards provided with a feeding mechanism blocking column 304, the feeding mechanism blocking column 304 is provided with a left side and a right side, the feeding mechanism blocking column 304 is positioned under the conveying flow channel 2, the top end of the feeding mechanism blocking column 304 upwards extends and penetrates through the conveying flow channel 2, the middle part of the feeding mechanism lifting plate 302 is upwards provided with a vertical feeding mechanism supporting plate 303, the top of the feeding mechanism supporting plate 303 is provided with a feeding mechanism connecting plate 305, and one end of the feeding mechanism connecting plate is connected with the feeding mechanism supporting plate 305, the other end of the feeding mechanism connecting plate 305 is provided with a feeding mechanism pressing column 306 downwards, the feeding mechanism pressing column 306 is positioned right above the conveying flow channel 2, and the feeding mechanism pressing column 306 is positioned behind the feeding mechanism blocking column 304;
when the cylinder of the feeding mechanism extends out, the lifting plate of the feeding mechanism descends to drive the material blocking column of the feeding mechanism and the pressing column of the feeding mechanism to move downwards simultaneously, the material blocking column of the feeding mechanism cancels the blocking force on the product A, so that the product A slides into a testing area, and the pressing column of the feeding mechanism generates pressing force on the product B; when the feeding mechanism cylinder retracts, the feeding mechanism lifting plate rises, the feeding mechanism material blocking column and the feeding mechanism pressing column move upwards simultaneously, the feeding mechanism pressing column cancels pressing force on the product B, so that the product B and other products slide forwards in sequence, the feeding mechanism material blocking column generates blocking force on the product B, and meanwhile, the product C slides to the position under the feeding mechanism pressing column; when the feeding mechanism cylinder extends out, the feeding mechanism lifting plate descends to drive the feeding mechanism material blocking column and the feeding mechanism pressing column to move downwards simultaneously, the feeding mechanism material blocking column cancels the blocking force on the product B, so that the product B slides into the first buffer area, the feeding mechanism pressing column generates pressing force on the product C, and the product C is repeatedly and circularly operated in the mode, and a plurality of products are sequentially conveyed into the test area.
The current testing mechanism 5 comprises a current testing mechanism supporting plate 501 vertically inserted on the machine plate 1, the current testing mechanism supporting plate 501 is positioned on the right side of the conveying flow channel 2, an upper clamping assembly 502 and a lower clamping assembly 503 are arranged on the inner side surface of the current testing mechanism supporting plate 501, and the upper clamping assembly 502 and the lower clamping assembly 503 are respectively positioned above and below the machine plate 1;
the upper clamping assembly 502 comprises an upper clamping assembly cylinder 502.1 with a downward telescopic end, the upper clamping assembly cylinder 502.1 is arranged at the top of the current testing mechanism supporting plate 501 through an upper clamping assembly cylinder seat 502.2, an upper clamping assembly guide rail 502.3 which is vertically arranged is arranged below the upper clamping assembly cylinder 502.1, the upper clamping assembly guide rail 502.3 is arranged at the upper section of the current testing mechanism supporting plate 501, an upper clamping assembly sliding block 502.4 is arranged on the upper clamping assembly guide rail 502.3, an upper clamping assembly moving seat 502.5 is arranged on the upper clamping assembly sliding block 502.4, a front upper clamping assembly supporting block 502.6 and a rear upper clamping assembly supporting block 502.5 are arranged on the upper clamping assembly moving seat, an upper clamping assembly fixing block 502.7 is arranged below the front upper clamping assembly supporting block 502.6 and the rear upper clamping assembly supporting block 502.6, a plurality of upper clamping assembly buffer columns 502.8 are arranged between the upper clamping assembly fixing block 502.7 and the upper clamping assembly supporting block 502.6, an upper clamping assembly buffer spring 502.9 is sleeved on the upper clamping assembly buffer column 502.8, and an upper clamping assembly induction clamp 502.10 is arranged on the upper clamping assembly fixing block 502.7;
preferably, a current testing mechanism limiting member 504 is arranged at the lower section of the upper clamping assembly induction clamp 502.10;
the lower clamping assembly 503 comprises a lower clamping assembly cylinder 503.1 with an upward telescopic end, the lower clamping assembly cylinder 503.1 is arranged at the bottom of the current testing mechanism supporting plate 501 through a lower clamping assembly cylinder seat 503.2, a lower clamping assembly guide rail 503.3 which is vertically arranged is arranged above the lower clamping assembly cylinder 503.1, the lower clamping assembly guide rail 503.3 is arranged at the lower section of the current testing mechanism supporting plate 501, a lower clamping assembly sliding block 503.4 is arranged on the lower clamping assembly guide rail 503.3, a lower clamping assembly moving seat 503.5 is arranged on the lower clamping assembly sliding block 503.4, a front lower clamping assembly supporting block 503.6 and a rear lower clamping assembly supporting block are arranged on the lower clamping assembly moving seat 503.5, a lower clamping assembly fixing block 503.7 is arranged above the front lower clamping assembly supporting block 503.6 and the rear lower clamping assembly supporting block 503.7, a plurality of lower clamping assembly supporting blocks 503.8 are arranged between the lower clamping assembly supporting block 503.7 and the lower clamping assembly supporting block 503.6, a lower clamping assembly buffer spring 503.9 is sleeved on the lower clamping assembly buffer column 503.8, and a lower clamping assembly induction clamp 503.10 is arranged on the lower clamping assembly fixing block 503.7;
the upper clamping assembly cylinder and the lower clamping assembly cylinder extend out simultaneously to drive the upper clamping assembly moving seat and the lower clamping assembly moving seat to move downwards and upwards respectively, so that the upper clamping assembly induction clamp 502.10 and the lower clamping assembly induction clamp 503.10 clamp the two first pins 702 of the product 7 and feed current test results back to the system.
The parameter testing mechanism 6 sequentially comprises a first buffering component 601, a positioning component 602 and a second buffering component 603 along the conveying direction of the conveying runner 2, a parameter testing component 604 is arranged above the positioning component 602, the first buffering component 601 is used for controlling ordered conveying of the products 7 to be tested, the products 7 to be tested are positioned through the positioning component 602, the parameter testing component 604 performs parameter testing on the products, and the second buffering component 603 is used for controlling ordered conveying of the tested products 7;
the parameter testing component 604 comprises a parameter testing component cylinder 604.1 which is transversely arranged, the parameter testing component cylinder 604.1 is arranged on the top surface of the machine plate 1 at the left side of the conveying flow channel 2 through a parameter testing component cylinder seat 604.2, the telescopic end of the parameter testing component cylinder 604.1 is inward, the telescopic end of the parameter testing component cylinder 604.1 is provided with a parameter testing component push plate 604.3, the inner side surface of the parameter testing component push plate 604.3 is provided with a parameter testing component push block 604.4, a parameter testing component fixing seat 604.5 is arranged below the parameter testing component push plate 604.3, the parameter testing component fixing seat 604.5 is fixedly connected with the machine plate 1, the parameter testing component fixing seat 604.5 is provided with a parameter testing component connecting block 604.6, the inner side of the parameter testing component connecting block 604.6 is provided with a parameter testing component clamping block 604.7, and a parameter testing component induction piece 604.8 is clamped on the parameter testing component clamping block 604.7, the parameter testing component push block 604.4 is positioned at the outer side of the parameter testing component sensing piece 604.8;
a parameter testing component waist-shaped hole 604.9 is formed in the parameter testing component connecting block 604.6, a parameter testing component adjusting bolt is arranged in the parameter testing component waist-shaped hole 604.9, and the parameter testing component connecting block 604.6 is connected with the parameter testing component fixing seat 604.5 through the parameter testing component adjusting bolt;
when the parameter testing component cylinder extends out, the parameter testing component push block is pushed to move inwards, so that the parameter testing component sensing piece is in contact with the second pin of the product and the parameter testing result is fed back to the system;
the first buffer component 601 and the second buffer component 603 adopt buffer components with the same structure, each buffer component comprises a buffer component cylinder 603.1 arranged on the bottom surface of the machine plate 1, the telescopic end of the buffer component cylinder 603.1 is arranged downwards, the telescopic end of the buffer component cylinder 603.1 is provided with a horizontally-placed buffer component lifting plate 603.2, one end of the buffer component lifting plate 603.2 is connected with the telescopic end of the buffer component cylinder 603.1 through a connecting piece, the other end of the buffer component lifting plate 603.2 is upwards provided with a buffer component material blocking column 603.3, the buffer component material blocking columns 603.3 are arranged in a left and right mode, the buffer component material blocking columns 603.3 are positioned under the conveying flow channel 2, and the top ends of the buffer component material blocking columns 603.3 extend upwards and penetrate through the conveying flow channel 2;
locating component 602 is including setting up in the locating component cylinder 602.1 of quick-witted board 1 bottom surface, locating component cylinder 602.1's flexible end is downward, locating component cylinder 602.1's flexible end is provided with the locating component lifter plate 602.2 of keeping flat, be connected through the connecting piece between locating component lifter plate 602.2's one end and locating component cylinder 602.1's the flexible end, locating component lifter plate 602.2's the other end upwards is provided with locating component fender stockpost 602.3, locating component fender stockpost 602.3 is provided with about two, locating component keeps off stockpost 602.3 and is located and carries runner 2 under, locating component keeps off the top of stockpost 602.3 and upwards extends and pass and carry runner 2.
The use method of the parameter testing mechanism comprises the following steps:
step one, the product to be measured passes through the first buffer component and is transited into the positioning component,
secondly, positioning and fixing the product to be detected by the positioning assembly;
thirdly, the parameter testing component carries out parameter testing on the product to be tested;
and step four, the tested product passes through the second buffer assembly and is transited to the next area.
The buffer mechanism 4 comprises a plurality of groups of buffer components arranged at intervals along the material conveying direction, the buffer components have the same structure as the first buffer component 601 and the second buffer component 603, and the plurality of groups of buffer components are used for orderly conveying the measured products 7 to the next procedure at intervals.
A method for using a semiconductor current testing device comprises the following steps:
step one, arranging a machine plate in a 45-degree downward inclination manner along a material conveying direction, and enabling a plurality of products to be detected to orderly slide forwards in a material conveying flow channel by means of self gravity;
secondly, the products to be tested pass through a feeding area and are sequentially fed into a testing area through a feeding mechanism;
thirdly, the products to be tested entering the test area are subjected to current test and parameter test respectively through the current test mechanism and the parameter test mechanism;
and step four, the tested products pass through a buffer area, and the tested products are sequentially conveyed to the next procedure through a buffer mechanism.
The above is only a specific application example of the present invention, and does not constitute any limitation to the protection scope of the present invention. All the technical solutions formed by equivalent transformation or equivalent replacement fall within the protection scope of the present invention.
Claims (8)
1. A semiconductor parameter testing mechanism is characterized in that: including carrying runner (2), first buffering subassembly (601), locating component (602), second buffering subassembly (603) have set gradually along the defeated material direction of carrying runner (2), the top of locating component (602) is provided with parameter test subassembly (604), first buffering subassembly (601) are used for controlling the product (7) of awaiting measuring and carry in order, fix a position product (7) of awaiting measuring through locating component (602), and parameter test subassembly (604) carries out parameter test to it, second buffering subassembly (603) are used for controlling the product (7) of having surveyed and carry in order.
2. The semiconductor parametric test mechanism of claim 1, wherein: the parameter testing component (604) comprises a parameter testing component cylinder (604.1), the telescopic end of the parameter testing component cylinder (604.1) is provided with a parameter testing component push plate (604.3), the parameter testing component push plate (604.3) is provided with a parameter testing component push block (604.4), the below of the parameter testing component push plate (604.3) is provided with a parameter testing component fixing seat (604.5), the parameter testing component fixing seat (604.5) is provided with a parameter testing component connecting block (604.6), the parameter testing component connecting block (604.6) is provided with a parameter testing component clamping block (604.7), the parameter testing component clamping block (604.7) is clamped with a parameter testing component sensing piece (604.8), and the parameter testing component push block (604.4) is located at the outer side of the parameter testing component sensing piece (604.8).
3. The semiconductor parametric test mechanism of claim 2, wherein: the device is characterized in that a parameter testing component waist-shaped hole (604.9) is formed in the parameter testing component connecting block (604.6), a parameter testing component adjusting bolt is arranged in the parameter testing component waist-shaped hole (604.9), and the parameter testing component connecting block (604.6) is connected with the parameter testing component fixing seat (604.5) through the parameter testing component adjusting bolt.
4. The semiconductor parametric test mechanism of claim 2, wherein: the parameter testing component cylinder (604.1) is arranged on one side of the conveying flow channel (2) through a parameter testing component cylinder seat (604.2).
5. The semiconductor parametric test mechanism of claim 1, wherein: first buffer module (601) and second buffer module (603) adopt the buffer module of looks isostructure, the buffer module includes buffer module cylinder (603.1), the flexible end of buffer module cylinder (603.1) is provided with buffer module lifter plate (603.2), upwards be provided with buffer module fender material post (603.3) on buffer module lifter plate (603.2), buffer module fender material post (603.3) is located and carries under runner (2), the top that buffer module kept off material post (603.3) upwards extends and passes and carries runner (2).
6. The semiconductor parametric test mechanism of claim 5, wherein: the material blocking columns (603.3) of the buffer assembly are arranged in a left and a right mode.
7. The semiconductor parametric test mechanism of claim 1, wherein: locating component (602) includes locating component cylinder (602.1), the flexible end of locating component cylinder (602.1) is provided with locating component lifter plate (602.2), upwards be provided with locating component fender post (602.3) on locating component lifter plate (602.2), locating component keeps off post (602.3) and is located and carries runner (2) under, locating component keeps off the top of post (602.3) and upwards extends and pass and carries runner (2).
8. The semiconductor parametric test mechanism of claim 7, wherein: the positioning component material blocking column (602.3) is provided with a left material blocking column and a right material blocking column.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922151824.XU CN211698061U (en) | 2019-12-04 | 2019-12-04 | Semiconductor parameter testing mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922151824.XU CN211698061U (en) | 2019-12-04 | 2019-12-04 | Semiconductor parameter testing mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211698061U true CN211698061U (en) | 2020-10-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922151824.XU Active CN211698061U (en) | 2019-12-04 | 2019-12-04 | Semiconductor parameter testing mechanism |
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| Country | Link |
|---|---|
| CN (1) | CN211698061U (en) |
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- 2019-12-04 CN CN201922151824.XU patent/CN211698061U/en active Active
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