CN215696461U - Automatic cleaning equipment for glue overflow of integrated circuit package - Google Patents
Automatic cleaning equipment for glue overflow of integrated circuit package Download PDFInfo
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- CN215696461U CN215696461U CN202122056487.3U CN202122056487U CN215696461U CN 215696461 U CN215696461 U CN 215696461U CN 202122056487 U CN202122056487 U CN 202122056487U CN 215696461 U CN215696461 U CN 215696461U
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- integrated circuit
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- excessive glue
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Abstract
The utility model discloses automatic removing equipment for excessive glue of integrated circuit packaging. The glue dispensing device comprises a base, connecting frames are arranged at two ends of the top of the base, an electric cabinet is arranged at one end of each connecting frame, glue dispensing devices, a positioner and an overflow glue cleaner are sequentially connected to the tops of the two connecting frames, and a motor is arranged at one side of each of two ends of the top of the base. According to the automatic feeding device, the integrated circuit in the placing box is driven to be placed on the placing table through the first electric sucker, and then the integrated circuit on the placing table is placed on the conveying device through the second electric sucker, so that automatic feeding of the integrated circuit can be achieved, when a large batch of integrated circuits need to be cleaned of the excessive glue, manual feeding is replaced by automatic feeding, fatigue of workers due to long-time working strength of the workers is avoided, the excessive glue cannot be cleaned completely, excessive glue cleaning of the large batch of integrated circuits can be processed smoothly, and working efficiency of excessive glue cleaning is greatly improved.
Description
Technical Field
The utility model relates to the technical field of automatic cleaning equipment for packaging excessive glue, in particular to automatic cleaning equipment for integrated circuit packaging excessive glue.
Background
Packaging is the process of assembling an integrated circuit into a final chip product, which is simply to put an integrated circuit die produced by a foundry on a substrate for bearing, lead out pins, and then fix and package the die into a whole.
Traditional integrated circuit's encapsulation is encapsulated then the excessive glue by the manual work and is clear away, when large batch integrated circuit needs the excessive glue, the workman overflows to glue and clears away work load too big, leads to the long-time working strength of workman to cause workman's fatigue simultaneously the excessive glue clear away not clean enough, the large batch work of completion that simultaneously can not be quick, has influenced the excessive efficiency of gluing and clear away, the excessive glue does not clear away totally can lead to integrated circuit's damage.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to an automatic cleaning apparatus for removing the excessive glue of an integrated circuit package, so as to solve the problems mentioned in the background art.
In order to achieve the purpose, the utility model provides the following technical scheme: an automatic cleaning device for integrated circuit package glue overflow comprises a base, wherein connecting frames are installed at two ends of the top of the base, an electric cabinet is installed at one end of each connecting frame, a glue dispensing device, a positioner and a glue overflow cleaner are sequentially connected to the tops of the two connecting frames, a motor is installed at one side of each end of the top of the base, a conveying device is arranged at the output end of the motor in a rotating mode, a fixed frame is installed at one end, close to the electric cabinet, of the base, a first fixed rod is installed at the bottom inside the fixed frame, a rotating disc is installed at the top of the first fixed rod in a rotating mode, a placing table is installed on the outer surface of the rotating disc, a second fixed rod is installed at one end, far away from the conveying device, inside the fixed frame, a fixed block is installed at one end, close to the conveying device, of the second fixed rod, an electric telescopic rod is arranged inside the fixed block, the box of placing is installed to electric telescopic handle's output, first linear guide is installed at the inside top of fixed frame, first electric chuck is installed to first linear guide's removal end, second linear guide is installed to the inside one end that is close to conveyer of fixed frame, second electric chuck is installed to second linear guide's removal end, first control panel is installed to the bottom that the base is close to electric cabinet one end, conveyer's one end is kept away from to fixed frame and second control panel is installed, electric connection between first control panel and the motor, electric connection between second control panel, first linear guide, second linear guide, electric telescopic handle, rotary disk, first electric chuck and the second electric chuck.
Preferably, the locator and the excessive glue remover are connected with each other through a connecting rod.
Preferably, one end of the fixing frame, which is close to the conveying device, is provided with a through hole corresponding to the position of the conveying device.
Preferably, the central point of the placing table and the central point of the first electric suction cup are on the same vertical line, and the central point of the placing table and the central point of the second electric suction cup are on the same vertical line.
Preferably, the standing platforms are distributed on the outer surface of the rotating disc in an annular array.
Preferably, the electric telescopic rod and the central point of the first electric suction cup are on the same vertical line.
Compared with the prior art, the utility model has the beneficial effects that:
1. this excessive gluey automatic clear equipment of integrated circuit encapsulation, place the integrated circuit drive in the box through first electric sucking disc and place the bench, second electric sucking disc is again to placing the bench integrated circuit and put into conveyer, alright like this with the automatic feeding who realizes integrated circuit, like this when needs have large batch integrated circuit to need the excessive glue to clear away, automatic feeding replaces artifical material loading, can not cause the tired not clean enough that excessive glue was clear away simultaneously of workman because of the long-time working strength of workman, can handle the excessive glue of big batch integrated circuit smoothly and clear away, very big increase the work efficiency that the excessive glue was clear away.
2. According to the automatic removing equipment for the excessive glue of the integrated circuit package, the integrated circuit sequentially passes through the glue dispensing device, the positioner and the excessive glue remover on the conveying device, so that the automatic excessive glue removing of the integrated circuit can be realized, a machine can replace manual work to remove the excessive glue, and the situation that the excessive glue removing process of the integrated circuit is not clean enough due to accidental factors encountered by workers is avoided.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged view of the structure of the portion A in FIG. 1;
FIG. 3 is a schematic top view of the present invention;
in the figure: 1. a base; 2. a connecting frame; 3. an electric cabinet; 4. a dispensing device; 5. an overflow glue remover; 6. a connecting rod; 7. a positioner; 8. a conveying device; 9. a fixing frame; 10. a first fixing lever; 11. rotating the disc; 12. a placing table; 13. a second fixing bar; 14. a fixed block; 15. an electric telescopic rod; 16. placing the box; 17. a first linear guide rail; 18. a second linear guide; 19. a motor; 20. a first control panel; 21. a second control panel; 22. a first electric chuck; 23. and a second electric chuck.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, an embodiment of the present invention is shown: an automatic cleaning device for integrated circuit package glue overflow comprises a base 1, connecting frames 2 are installed at two ends of the top of the base 1, an electric cabinet 3 is installed at one end of each connecting frame 2, a glue dispensing device 4, a positioner 7 and a glue overflow remover 5 are sequentially connected to the tops of the two connecting frames 2, a motor 19 is installed at one side of each of two ends of the top of the base 1, a conveying device 8 is rotatably arranged at the output end of the motor 19, a fixed frame 9 is installed at one end, close to the electric cabinet 3, of the base 1, a first fixed rod 10 is installed at the bottom inside the fixed frame 9, a rotating disc 11 is rotatably installed at the top of the first fixed rod 10, a placing table 12 is installed on the outer surface of the rotating disc 11, a second fixed rod 13 is installed at one end, far away from the conveying device 8, inside the fixed frame 9, a fixed block 14 is installed at one end, close to the conveying device 8, and an electric telescopic rod 15 is arranged inside the fixed block 14, the output of electric telescopic handle 15 is installed and is placed box 16, first linear guide 17 is installed at the inside top of fixed frame 9, first electric suction cup 22 is installed to the removal end of first linear guide 17, second linear guide 18 is installed to the inside one end that is close to conveyer 8 of fixed frame 9, second electric suction cup 23 is installed to the removal end of second linear guide 18, base 1 is close to the bottom of 3 one end of electric cabinet and is installed first control panel 20, conveyer 8 was kept away from to fixed frame 9 one end is installed second control panel 21, electric connection between first control panel 20 and the motor 19, second control panel 21, first linear guide 17, second linear guide 18, electric telescopic handle 15, rotary disk 11, electric connection between first electric suction cup 22 and the second electric suction cup 23.
In this embodiment, the locator 7 and the excessive glue remover 5 are connected with each other by the connecting rod 6, so that after the integrated circuit is located by the locator 7, the excessive glue remover 5 can directly remove the excessive glue according to the locating result of the locator 7.
In this embodiment, a through hole corresponding to the position of the conveying device 8 is formed at one end of the fixing frame 9 close to the conveying device 8, so that the integrated circuit can be placed on the conveying device 8 through the second electric suction cup 23 from the through hole.
In this embodiment, the placing table 12 is on the same vertical line as the central point of the first electric suction cup 22, the placing table 12 is on the same vertical line as the central point of the second electric suction cup 23, the first electric suction cup 22 places the integrated circuit on the placing table 12, and the second electric suction cup 23 sucks the integrated circuit on the placing table 12.
In this embodiment, the placing tables 12 are distributed on the outer surface of the rotating disc 11 in the form of a circular array, and corresponding electric suction cups attract the placing tables 12 when the placing tables are moved to different positions.
In this embodiment, the center point of the electric telescopic rod 15 and the center point of the first electric suction cup 22 are on the same vertical line, so that the first electric suction cup 22 can suck away the integrated circuit in the placing box 16.
The working principle is as follows: when the integrated circuit is placed in the placing box 16 and the button on the second control panel 21 is pressed, the electric telescopic rod 15 in the fixing block 14 can jack up the integrated circuit in the placing box 16, the first electric suction cup 22 on the first linear guide rail 17 can move to the upper part of the placing box 16 to suck up the integrated circuit, then the first electric suction cup 22 moves to the upper part of the placing table 12 to place the integrated circuit on the placing table 12, when the placing table 12 rotates to the side of the conveying device 8, the second electric suction cup 23 on the second linear guide rail 18 can suck the integrated circuit on the placing table 12 until the integrated circuit moves to the upper part of the conveying device 8 to be placed, so that the automatic feeding of the integrated circuit can be realized, when the large batch of integrated circuits need to be cleaned by glue overflowing, the working efficiency is greatly increased, when the integrated circuit moves on the conveying device 8, the integrated circuit can be automatically dispensed when moving to the dispensing device 4, move 7 below the locator after having glued a little, can overflow the position of gluing and clear away as required and fix a position, the back that finishes of location, move and overflow behind gluey duster 5 bottoms, overflow the laser alright in 5 bottoms of gluey duster with overflowing gluey and clear away, just so can replace the manual work to go to overflow to glue and clear away by the machine, just so can not lead to the integrated circuit to damage because the in-process that the manual work overflowed gluey was clear away is not clean.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the utility model. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, e.g., as being fixed or detachable or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Claims (6)
1. The utility model provides an excessive automatic clear equipment of gluing of integrated circuit package, includes base (1), its characterized in that: the glue spraying machine is characterized in that a connecting frame (2) is installed at the top of the base (1), an electric cabinet (3) is installed at one end of the connecting frame (2), a glue dispensing device (4), a positioner (7) and a glue overflowing clearer (5) are sequentially connected to the top of the connecting frame (2), a motor (19) is installed at one side of each of the two ends of the top of the base (1), a conveying device (8) is arranged at the output end of the motor (19), a fixed frame (9) is installed at one end, close to the electric cabinet (3), of the base (1), a first fixed rod (10) is installed at the bottom inside the fixed frame (9), a driving motor is installed at the top of the first fixed rod (10), a rotating disc (11) is installed at the output end of the driving motor, a placing table (12) is installed on the outer surface of the rotating disc (11), and a second fixed rod (13) is installed at one end, far away from the conveying device (8), inside the fixed frame (9), the utility model discloses a conveying device, including base (1), second dead lever (13), fixed block (14) are installed to the one end that is close to conveyer (8) of second dead lever (13), the inside of fixed block (14) is provided with electric telescopic handle (15), electric telescopic handle (15)'s output is installed and is placed box (16), first linear guide (17) are installed at the inside top of fixed frame (9), first electric suction cup (22) are installed to the removal end of first linear guide (17), the inside of fixed frame (9) is close to the one end of conveyer (8) and installs second linear guide (18), second electric suction cup (23) are installed to the removal end of second linear guide (18), first control panel (20) are installed to the bottom that base (1) is close to electric cabinet (3) one end, conveyer (8) was kept away from to fixed frame (9) one end installs second control panel (21), the electric connection between first control panel (20) and motor (19), electric connection between second control panel (21), first linear guide (17), second linear guide (18), electric telescopic handle (15), rotary disk (11), first electric sucking disc (22) and second electric sucking disc (23).
2. The automatic cleaning device for the excessive glue of the integrated circuit package according to claim 1, wherein: the locator (7) and the excessive glue remover (5) are connected with each other through a connecting rod (6).
3. The automatic cleaning device for the excessive glue of the integrated circuit package according to claim 1, wherein: one end of the fixed frame (9) close to the conveying device (8) is provided with a through hole corresponding to the position of the conveying device (8).
4. The automatic cleaning device for the excessive glue of the integrated circuit package according to claim 1, wherein: the placing table (12) and the central point of the first electric sucker (22) are on the same vertical line, and the placing table (12) and the central point of the second electric sucker (23) are on the same vertical line.
5. The automatic cleaning device for the excessive glue of the integrated circuit package according to claim 1, wherein: the placing tables (12) are distributed on the outer surface of the rotating disk (11) in an annular array.
6. The automatic cleaning device for the excessive glue of the integrated circuit package according to claim 1, wherein: the electric telescopic rod (15) and the central point of the first electric suction cup (22) are on the same vertical line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122056487.3U CN215696461U (en) | 2021-08-30 | 2021-08-30 | Automatic cleaning equipment for glue overflow of integrated circuit package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122056487.3U CN215696461U (en) | 2021-08-30 | 2021-08-30 | Automatic cleaning equipment for glue overflow of integrated circuit package |
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| Publication Number | Publication Date |
|---|---|
| CN215696461U true CN215696461U (en) | 2022-02-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122056487.3U Active CN215696461U (en) | 2021-08-30 | 2021-08-30 | Automatic cleaning equipment for glue overflow of integrated circuit package |
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| CN (1) | CN215696461U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114571664A (en) * | 2022-02-28 | 2022-06-03 | 邵周明 | Flash removing device and method for semiconductor chip packaging |
-
2021
- 2021-08-30 CN CN202122056487.3U patent/CN215696461U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114571664A (en) * | 2022-02-28 | 2022-06-03 | 邵周明 | Flash removing device and method for semiconductor chip packaging |
| CN114571664B (en) * | 2022-02-28 | 2024-01-16 | 广东风华芯电科技股份有限公司 | Flash removing device and method for semiconductor chip packaging |
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