CN210349777U

CN210349777U - Automatic die bonder

Info

Publication number: CN210349777U
Application number: CN201921349391.2U
Authority: CN
Inventors: 李贤海
Original assignee: Suzhou Zhuomsen Electronic Technology Co Ltd
Current assignee: Suzhou Zhuomsen Electronic Technology Co Ltd
Priority date: 2019-08-19
Filing date: 2019-08-19
Publication date: 2020-04-17
Anticipated expiration: 2029-08-19

Abstract

The utility model discloses an automatic glue brilliant machine, include: the chip bears dish, lead frame and bears dish, tin cream mechanism, picks up mechanism and tin sticky mechanism, the chip bears dish, lead frame and bears dish and tin cream mechanism and arranges in proper order, it absorbs and places the chip that the mechanism bears the chip on the dish with the chip to pick up the lead frame bears the dish, tin sticky mechanism is stained with tin cream in the tin cream mechanism the lead frame bears on the dish, just pick up the mechanism with tin sticky mechanism drives the removal by same actuating mechanism, actuating mechanism includes: the device comprises a transverse bracket, a sliding block and a driving piece, wherein the transverse bracket stretches across the chip bearing disc, the lead frame bearing disc and the solder paste mechanism, the sliding block moves on the transverse bracket, the driving piece drives the sliding block to move on the transverse bracket, and the sliding block is respectively connected with the picking mechanism and the tin dipping mechanism. The utility model discloses can realize automatic tin sticky and glue brilliant operation, can save a large amount of manpowers, reduce the human cost simultaneously, improve production efficiency.

Description

Automatic die bonder

Technical Field

The utility model relates to the field of machine manufacturing, in particular to automatic die bonder.

Background

With the development and demand for semiconductor device performance and production scale, semiconductor wafer processing technology is constantly being developed and improved. The application of electronic technology and computer control can make the preparation process of semiconductor wafer progressively automatized, and can greatly raise the quality of wafer processing.

The production process of the diode is as follows: after being stained with tin, the chip and the lead frame are placed into a welding mechanism together for welding, after the welding is finished, a forming mechanism is used for forming an external shell of the chip, after the forming is finished, the rib cutting and pin bending operations are executed, and finally the test and the package are carried out. At present, chip tin sticking and crystal sticking are carried out in a manual mode, and not only is the working efficiency low, but also the labor cost is high.

SUMMERY OF THE UTILITY MODEL

The utility model provides an automatic glue brilliant machine to solve the above-mentioned technical problem who exists among the prior art.

In order to solve the technical problem, the utility model provides an automatic glue brilliant machine, include: the chip bears dish, lead frame and bears dish, tin cream mechanism, picks up mechanism and tin sticky mechanism, the chip bears dish, lead frame and bears dish and tin cream mechanism and arranges in proper order, it absorbs and places the chip that the mechanism bears the chip on the dish with the chip to pick up the lead frame bears the dish, tin sticky mechanism is stained with tin cream in the tin cream mechanism the lead frame bears on the dish, just pick up the mechanism with tin sticky mechanism drives the removal by same actuating mechanism, actuating mechanism includes: the device comprises a transverse bracket, a sliding block and a driving piece, wherein the transverse bracket stretches across the chip bearing disc, the lead frame bearing disc and the solder paste mechanism, the sliding block moves on the transverse bracket, the driving piece drives the sliding block to move on the transverse bracket, and the sliding block is respectively connected with the picking mechanism and the tin dipping mechanism.

Preferably, the solder paste mechanism includes: the tin cream dish, set up scraper and the servo drive of drive scraper reciprocating motion on the tin cream dish.

Preferably, the tin wetting mechanism comprises: the tin dipping device comprises a tin dipping disk, a plurality of tin dipping needles with the same height arranged on the tin dipping disk and a tin dipping cylinder driving the tin dipping disk to lift.

Preferably, a chip loading mechanism is disposed on one side of the chip carrier tray, and the chip loading mechanism includes: load-bearing platform, setting are at the swing mechanism of load-bearing platform bottom and the chip scraper blade of setting on load-bearing platform, wherein, load-bearing platform includes: the chip scraper comprises an outer frame connected with a swing mechanism and a carrying platform arranged in the outer frame, wherein a chip carrying disc is arranged on the carrying platform, the chip carrying disc is positioned on the carrying platform by a limiting mechanism, the edges of the carrying platform and the chip carrying disc are tightly connected with the side wall of the outer frame, rubber bristles are arranged in the middle of a chip scraper blade, and two ends of the chip scraper blade are respectively connected with a walking mechanism arranged on the side wall of the outer frame.

Preferably, the swing mechanism comprises a semicircular gear fixed at the bottom of the outer frame, a rack engaged with the semicircular gear, and a driving source for driving the rack to reciprocate back and forth, and a linear slide rail is arranged at the bottom of the rack.

Preferably, the walking mechanism adopts a motor, a screw rod connected with the motor and a screw rod ball on the screw rod, the screw rod ball is connected with the chip scraper, and the motor and the screw rod are both fixed on the side wall of the outer frame through a mounting seat.

Compared with the prior art, the utility model discloses can realize automatic tin sticky and glue brilliant operation, can save a large amount of manpowers, reduce the human cost simultaneously, improve production efficiency. Further, the utility model provides a tin sticky mechanism with pick up the mechanism and drive by same actuating mechanism, consequently, tin sticky action can go on in turn with gluing brilliant action simultaneously, further improved production efficiency.

Drawings

Fig. 1 is a schematic structural view of an automatic die bonder of the present invention;

fig. 2 is a schematic structural view of the middle chip loading mechanism of the present invention.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. It should be noted that the drawings of the present invention are simplified and use non-precise ratios, and are only used for the purpose of facilitating and clearly assisting the description of the embodiments of the present invention.

As shown in fig. 1, the utility model provides an automatic die bonder, include: the chip bears dish 1, lead frame and bears dish 2, tin cream mechanism 3, pick up mechanism 4 and tin sticky mechanism 5, wherein, the chip bears dish 1, lead frame and bears dish 2 and tin cream mechanism 3 and arrange in proper order, pick up mechanism 4 and bear the chip on the dish 2 with the chip and absorb and place the lead frame bears dish 2, tin sticky mechanism 5 is stained with the tin cream in tin cream mechanism 3 the lead frame bears on the dish 2. The pick-up mechanism 4 and the tin pick-up mechanism 5 are driven by the same driving mechanism 7, and the driving mechanism 7 comprises: the device comprises a transverse bracket 71 which spans the chip bearing disc 1, the lead frame bearing disc 2 and the solder paste mechanism 3, a sliding block 72 which moves on the transverse bracket 71 and a driving piece 73 which drives the sliding block 72 to move on the transverse bracket 71, wherein the sliding block 72 is respectively connected with the picking mechanism 4 and the tin dipping mechanism 5. Specifically, pick up the distance between mechanism 4 and the tin pick-up mechanism 5 and fix, certainly this distance with the chip bears dish 1, the lead frame bears dish 2 and tin cream mechanism 3 arranges the interval and corresponds to make pick up mechanism 4 and tin pick-up mechanism 5 can bear dish 2 and chip and bear dish 1 or tin cream mechanism 3 with the lead frame simultaneously and correspond, and then realize tin pick-up (be stained with from the tin cream dish and get the tin cream or be stained with the tin cream on the lead frame) and glue brilliant (place the chip on the lead frame that is stained with the tin cream or absorb the chip from the chip bears the dish) simultaneously.

With continued reference to fig. 1, the wicking mechanism 5 includes: the tin dipping device comprises a tin dipping disk 51, a plurality of tin dipping needles 52 with the same height arranged on the tin dipping disk 51 and a tin dipping cylinder 53 for driving the tin dipping disk 51 to ascend and descend, wherein the tin dipping needles 52 are set according to actual conditions, and the set positions and number of the tin dipping needles 52 correspond to the positions and number of tin dipping required. Further, in order to ensure the suction effect, the present embodiment will provide that the pickup mechanism 4 includes a vacuum chuck and a suction nozzle disposed on the vacuum chuck, preferably, the arrangement manner of the suction nozzle is the same as the arrangement manner of the tin dipping needles 52, and of course, the arrangement manner of the chips on the chip carrier tray 1 is also the same as the arrangement manner of the tin dipping needles 52.

Further, the solder paste mechanism 3 includes: the solder paste disc, the scraper arranged on the solder paste disc and the scraper driving the scraper to move in a reciprocating way. When the tin dipping device works, the scraper drives the scraper to move on the tin paste disc at regular intervals, so that the surface of the tin paste in the tin paste disc is scraped, and the tin dipping effect of the tin dipping needle 52 is ensured.

Preferably, a chip loading mechanism 6 is provided at one side of the chip carrier tray 1. Referring to fig. 2, the chip loading mechanism 6 is used to load chips into the jig so as to provide the chip carrier tray 1 with chips loaded in order. The chip loading mechanism 6 includes: the chip mounter includes a carrying platform 61, a swing mechanism 62 disposed at the bottom of the carrying platform 61, and a chip paddle 63 disposed on the carrying platform 61. The swing mechanism 62 is used for driving the bearing platform 61 to swing back and forth, the chip scraper 63 is arranged on the swing mechanism 62 and can slightly scrape the chip in the bearing platform 61, so that the chip clamped in the chip slot but not loaded in the chip slot is swept out or swept in, and the chip mounting effect is improved.

The bearing platform 61 includes: the chip cleaning device comprises an outer frame 611 connected with a swing mechanism 62 and a stage 612 arranged in the outer frame 611, wherein a chip carrier plate 613 is arranged on the stage 612, the chip carrier plate 613 is positioned on the stage 612 by a limiting mechanism 614, the edges of the stage 612 and the chip carrier plate 613 are tightly connected with the side wall of the outer frame 611, rubber bristles are arranged in the middle of the chip scraper 63, and two ends of the chip scraper 63 are respectively connected with a walking mechanism 64 arranged on the side wall of the outer frame 611. Specifically, the chip carrier plate 613 is laid on the stage 612 and is pressed and fixed by the limiting mechanism 614, and the chip carrier plate 613 and the stage 612 are tightly connected with the side wall of the outer frame 611, so that the chip carrier plate 613 can be prevented from falling into a gap in the moving process.

Further, in order to pick up or place the chip carrier tray, a chip storage bin may be movably connected to one side of the carrier platform 61, so as to facilitate the chip on the carrier platform 61 or receive the redundant chip in the carrier platform 61. Preferably, the outlet of the bearing platform 61 can be arranged at the end of the bearing platform 61, and the swinging direction of the bearing platform 61 is perpendicular to the moving direction of the chip scraper 63, so that the swinging mechanism 62 is matched with the chip scraper 63 to concentrate the chips to the outlet of the bearing platform 61, thereby facilitating the discharging of the chips. Of course, the chip material may be directly poured or may enter from the outlet.

Preferably, a vacuum adsorption cavity is arranged in the carrier 612, an opening corresponding to the chip carrying tray 613 is arranged on the vacuum adsorption cavity, the vacuum adsorption cavity is connected with an external vacuum generator, so that chips falling into chip grooves of the chip carrying tray can be adsorbed, and the chips are prevented from sliding off in the swinging process.

Preferably, the limiting mechanism 614 adopts pressing blocks, and the pressing blocks are arranged at four corners of the side wall of the outer frame and can press the four corners of the chip bearing tray. It should be noted that, since the chip tray 613 is tightly connected to the side wall of the outer frame 611, even if the position-limiting mechanism 614 is not provided, the chip clamped in the chip slot will not be greatly affected during the swinging process, so that the position-limiting mechanism 614 can be selected according to actual requirements. Of course, the positioning of the limiting mechanisms 614 at the four corners of the chip carrier tray 613 can reduce the influence of the limiting mechanisms 614 on the chips in the carrier platform 61.

With continued reference to fig. 2, the traveling mechanism 64 employs a motor, a screw connected to the motor, and a screw ball on the screw, the screw ball is connected to the chip scraper 63, and both the motor and the screw are fixed on the side wall of the outer frame 611 through a mounting seat. Specifically, chip scraper blade 63 has running gear 64 to drive, lightly scrapes on the surface of chip carrier plate 613, scrapes the in-process, and the chip that has entered into in the chip groove of chip carrier plate 613 can not receive the influence, and to the chip of card in the chip groove or half entering chip groove, then can be scraped or strickle off, has improved the utility model discloses a chip is packed into the chip and is born the work efficiency of plate 613.

Preferably, the swing mechanism 62 includes a semicircular gear 621 fixed to the bottom of the outer frame 611, a rack 622 engaged with the semicircular gear 621, and a driving source 623 for driving the rack 622 to reciprocate back and forth, and further, a linear slide rail (not shown) is disposed at the bottom of the rack 622. The driving source 623 generally adopts the cylinder, and the cylinder is through reciprocal pulling rack 622 for rack 622 constantly meshes with semicircular gear 621's circular arc limit, and then makes the continuous emergence swing of frame 611 of being connected with semicircular gear 621, the utility model provides a swing mechanism 62 simple structure, and convenient operation, low cost is convenient for realize.

It will be apparent to those skilled in the art that various changes and modifications may be made to the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.

Claims

1. An automatic die bonder, comprising: the chip bears dish, lead frame and bears dish, tin cream mechanism, picks up mechanism and tin sticky mechanism, the chip bears dish, lead frame and bears dish and tin cream mechanism and arranges in proper order, it absorbs and places the chip that the mechanism bears the chip on the dish with the chip to pick up the lead frame bears the dish, tin sticky mechanism is stained with tin cream in the tin cream mechanism the lead frame bears on the dish, just pick up the mechanism with tin sticky mechanism drives the removal by same actuating mechanism, actuating mechanism includes: the device comprises a transverse bracket, a sliding block and a driving piece, wherein the transverse bracket stretches across the chip bearing disc, the lead frame bearing disc and the solder paste mechanism, the sliding block moves on the transverse bracket, the driving piece drives the sliding block to move on the transverse bracket, and the sliding block is respectively connected with the picking mechanism and the tin dipping mechanism.

2. The automatic die bonder of claim 1, wherein the solder paste mechanism comprises: the tin cream dish, set up scraper and the servo drive of drive scraper reciprocating motion on the tin cream dish.

3. The automatic die bonder of claim 1, wherein said wicking mechanism comprises: the tin dipping device comprises a tin dipping disk, a plurality of tin dipping needles with the same height arranged on the tin dipping disk and a tin dipping cylinder driving the tin dipping disk to lift.

4. The automatic die bonder of claim 1, wherein a die loading mechanism is disposed on one side of the die carrier tray, the die loading mechanism comprising: load-bearing platform, setting are at the swing mechanism of load-bearing platform bottom and the chip scraper blade of setting on load-bearing platform, wherein, load-bearing platform includes: the chip scraper comprises an outer frame connected with a swing mechanism and a carrying platform arranged in the outer frame, wherein a chip carrying disc is arranged on the carrying platform, the chip carrying disc is positioned on the carrying platform by a limiting mechanism, the edges of the carrying platform and the chip carrying disc are tightly connected with the side wall of the outer frame, rubber bristles are arranged in the middle of a chip scraper blade, and two ends of the chip scraper blade are respectively connected with a walking mechanism arranged on the side wall of the outer frame.

5. The automatic die bonder of claim 4, wherein the swing mechanism comprises a semicircular gear fixed at the bottom of the outer frame, a rack engaged with the semicircular gear, and a driving source for driving the rack to reciprocate back and forth, and a linear slide rail is arranged at the bottom of the rack.

6. The automatic die bonder of claim 4, wherein the traveling mechanism comprises a motor, a lead screw connected to the motor, and a lead screw ball on the lead screw, the lead screw ball is connected to the chip scraper, and the motor and the lead screw are fixed on the side wall of the outer frame through a mounting base.