CN215680637U - Material conveying device and novel solid brilliant assembly line - Google Patents

Abstract

The utility model provides a material conveying device and a novel die bonding assembly line, wherein the novel die bonding assembly line comprises die bonding equipment and the material conveying device, the number of the die bonding equipment is the same as that of the carrying platforms, each die bonding equipment corresponds to one carrying platform, the material is a target substrate, and the die bonding equipment can be used for die bonding on the target substrate carried to the carrying platforms. The utility model has the beneficial effects that: the novel die bonding assembly line adopts a serial arrangement mode of die bonding equipment and material conveying devices, the die bonding equipment is arranged on the upper portion, the material conveying devices are arranged on the lower portion, the transverse width is reduced, the equipment maintenance is facilitated, the carrying distance of a target substrate is reduced, and the die bonding efficiency is improved.

Description

Material conveying device and novel solid brilliant assembly line

Technical Field

The utility model relates to the technical field of die bonding, in particular to a material conveying device and a novel die bonding assembly line.

Background

The die bonder is a key device in an LED packaging production line, and is used for transferring and mounting LED chips on a wafer to LED chip mounting positions on an LED board (e.g., a Mini LED display panel or a Micro LED display panel). Generally, when a die bonding process is performed, a die bonding assembly line is formed by a plurality of die bonding machines, and assembly line operation is performed to improve process efficiency.

The existing die bonder assembly line for the LED packaging production line is generally provided with a plurality of groups of die bonder on two sides of a conveyor belt, wherein each group of die bonder is used for transferring an LED chip of one color to an LED board. As shown in fig. 1, 3 sets of die bonder are respectively disposed at both sides of the conveyor belt 1, and each set has 2 die bonders. Specifically, the three die bonder sets are a die bonder 2 for transferring red LED chips onto an LED board, a die bonder 3 for transferring green LED chips onto an LED board, and a die bonder 4 for transferring blue LED chips onto an LED board, respectively.

When the die bonder assembly line works, the LED plate conveyed on the conveyor belt 1 firstly reaches the die bonder 2, at the moment, the LED plate is conveyed to a carrying platform of the die bonder 2 from the conveyor belt 1 through the conveying mechanism, and then the die bonder 2 transfers and installs the red LED chip on the LED plate; thereafter, the LED board on which the red LED chip is mounted is conveyed onto the conveyor belt 1 again; the conveyor belt 1 conveys the LED chips to a die bonder 3, at the moment, the LED chips are conveyed to a carrying platform of the die bonder 3 from the conveyor belt 1 through another conveying mechanism, and then the die bonder 3 transfers and installs the green LED chips on the LED chips; then, the LED board on which the green LED chips are mounted is conveyed onto the conveyor belt 1 again; the conveyor belt 1 conveys the LED chip to a die bonder 4, at the moment, the LED chip is conveyed to a carrying platform of the die bonder 4 from the conveyor belt 1 through another conveying mechanism, and then the die bonder 4 transfers and installs the blue LED chip on the LED chip; thereafter, the LED board on which the blue LED chips are mounted is conveyed onto the conveyor 1 again, and the LED board is conveyed by the conveyor 1 to a position where the next step is performed.

The existing die bonding assembly line has the following technical problems:

in the die bonding assembly line, if the red LED chips, the green LED chips and the blue LED chips are to be transferred and mounted, the LED board needs to be transported between the conveyor belt 1 and the die bonding machine many times, and the substrate needs to be aligned in each transportation process. On one hand, a large amount of time is consumed for links except for transferring and mounting the LED chip, and the process efficiency is reduced; on the other hand, too many process links are easy to cause process errors.

In order to solve the technical problems that the conventional die bonding assembly line needs to convey substrates for multiple times when performing die bonding process, which affects process efficiency and is prone to process errors, as shown in fig. 2, a patent named as a die bonding assembly line was previously applied by the company, and the die bonding assembly line includes a substrate conveying mechanism 10, a conveying mechanism (not shown in the figure) and a die bonding apparatus 20. The substrate transfer mechanism 10 is used for transferring a target substrate to be die-bonded. The number of the die bonding apparatuses 20 is plural, and the plural die bonding apparatuses 20 are sequentially distributed on the side of the substrate conveying mechanism 10 along the conveying direction of the substrate conveying mechanism 10. The conveying mechanism is used for conveying the target substrate between the substrate conveying mechanism 10 and each die bonding equipment 20; each die bonding apparatus 20 can transfer and mount a plurality of kinds of wafers onto a target substrate carried to the die bonding apparatus 20. In the die bonding process, first, the target substrate is transferred to a position corresponding to the die bonding apparatus 20 by the substrate transfer mechanism 10, then the target substrate is transferred from the substrate transfer mechanism 10 to the die bonding apparatus 20 by the transfer mechanism, thereafter, a plurality of kinds of wafers are transferred and mounted on the target substrate by the die bonding apparatus 20, and then the target substrate on which the plurality of kinds of wafers are transferred and mounted is transferred from the die bonding apparatus 20 to the substrate transfer mechanism 10 by the transfer mechanism. In the above process, only one transfer process (including the transfer of the target substrate from the substrate transfer mechanism 10 to the die bonding apparatus 20 and the transfer of the target substrate from the die bonding apparatus 20 to the substrate transfer mechanism 10 again) is required, and only one alignment process (i.e., the detection of whether the position of the target substrate is accurate and not shifted after the target substrate is transferred from the substrate transfer mechanism 10 to the die bonding apparatus 20) is required during the position transfer caused by the transfer. Therefore, the die bonding assembly line only needs one-time conveying process, time consumption of a non-crystal wafer transfer and installation link in the die bonding process is reduced, and process efficiency can be improved; meanwhile, the process links of multiple times of conveying among a plurality of die bonder equipment are omitted, and the probability of occurrence of process errors is correspondingly reduced.

Referring to fig. 2, the plurality of die attach apparatuses 20 are distributed on both sides of the substrate transfer mechanism 10, so that the number of die attach apparatuses 20 performing die attach processes matched with the substrate transfer mechanism 10 can be increased, and more die attach apparatuses 20 perform die attach processes simultaneously, thereby improving the die attach process efficiency. Specifically, in the die bonding process, the substrate transfer mechanism 10 may transfer a plurality of target substrates to positions corresponding to the plurality of die bonding apparatuses 20 located on both sides of the substrate transfer mechanism 10, respectively, transfer the target substrates from the substrate transfer mechanism 10 to the die bonding apparatuses 20 by the corresponding transfer mechanisms, and transfer the target substrates from the die bonding apparatuses 20 to the substrate transfer mechanism 10 after the die bonding apparatuses 20 complete the wafer transfer and mounting.

Each wafer bit unit group on the target substrate transferred on the substrate transfer mechanism 10 includes n wafer bits; n is not less than 2 and is an integer; each die bonding apparatus 20 can transfer and mount n kinds of wafers to the target substrate transported to the die bonding apparatus 20, and the n kinds of wafers correspond to n kinds of wafer sites in each wafer site unit group on the target substrate one to one. Specifically, each wafer bit cell group on the target substrate transferred on the substrate transfer mechanism 10 includes a red wafer bit, a green wafer bit, and a blue wafer bit; each die bonding apparatus 20 can transfer and mount three kinds of wafers, which are a red LED chip, a green LED chip, and a blue LED chip, to the target substrate that is carried onto the die bonding apparatus 20. The red LED chips, the green LED chips and the blue LED chips can be transferred and mounted on the target substrate in only one die bonding apparatus 20, and the target substrate does not need to be transferred and conveyed between the die bonding apparatuses 20 by the substrate conveying mechanism 10 and the conveying mechanism.

Specifically, referring to fig. 3, the die bonder apparatus 20 includes a stage (not shown), a wafer plate 21, a swing arm 22, and an image capturing device 24. The stage is used for carrying a target substrate (not shown in the figure), and the stage is provided with a first driving mechanism (not shown in the figure), wherein the first driving mechanism is used for driving the target substrate placed on the stage to move, so that each wafer contained in one wafer position unit group on the target substrate moves to the wafer fixing station. Specifically, the first driving mechanism can drive the target substrate to move, so that different wafer bit unit groups on the target substrate are located at the die bonding station.

Although the patent "die bonding line" previously applied by the present company solves the technical problems of the prior art, in the die bonding line, since the die bonding devices 20 are distributed on both sides of the substrate conveying mechanism 10, when the conveying mechanism conveys the target substrate between the substrate conveying mechanism 10 and the die bonding devices 20, the conveying distance is too large, which affects the die bonding efficiency.

SUMMERY OF THE UTILITY MODEL

The utility model provides a material conveying device, which comprises a material conveying and carrying mechanism and a carrying platform, wherein the carrying platform is provided with a carrying platform conveying belt, the material conveying and carrying mechanism comprises a material conveying mechanism and a lifting platform, the material conveying mechanism is used for conveying materials, the lifting platform is positioned at one side of the material conveying mechanism and used for conveying materials between the material conveying mechanism and the carrying platform, the number of the carrying platforms is the same as that of the material conveying and carrying mechanisms, each material conveying mechanism is positioned below the corresponding carrying platform, the material conveying mechanisms are positioned on the same straight line, the material conveying mechanism of one material conveying and carrying mechanism is adjacent to the lifting platform of the other adjacent material conveying and carrying mechanism, and the lifting platform comprises a lifting mechanism and a conveying belt arranged on the lifting mechanism;

when the lifting platform is lifted to the top, the lifting platform is level to the carrier conveying belt, so that materials are conveyed between the lifting platform and the carrier; when the lifting platform descends to the bottom, the lifting platform is level with the material conveying mechanism, and materials are conveyed to the material conveying mechanism through the lifting platform.

As a further improvement of the utility model, the material conveying mechanism is a material conveying belt.

The utility model also provides a novel die bonding assembly line which comprises die bonding equipment and the material conveying device, wherein the number of the die bonding equipment is the same as that of the bearing platforms, each die bonding equipment corresponds to one bearing platform, the material is a target substrate, and the die bonding equipment can be used for die bonding on the target substrate conveyed to the bearing platforms.

As a further improvement of the present invention, the die bonding apparatus can transfer and mount a plurality of types of wafers onto a target substrate carried on the carrier, where each wafer position unit group on the target substrate includes n wafer positions; n is not less than 2 and is an integer; each die bonder can transfer and mount n wafers to the target substrate conveyed to the carrying platform, and the n wafers correspond to n wafer positions in each wafer position unit group on the target substrate one by one.

As a further improvement of the present invention, each wafer position unit group on the target substrate includes a red wafer position, a green wafer position and a blue wafer position, and each die bonder can transfer and mount three kinds of wafers, which are respectively a red LED chip, a green LED chip and a blue LED chip, to the target substrate transported to the stage corresponding to the die bonder.

As a further improvement of the present invention, the die bonding apparatus further includes a wafer disc and a swing arm, wherein a first driving mechanism is arranged on the carrier, and the first driving mechanism is used for driving a target substrate placed on the carrier to move, so that each wafer contained in one wafer position unit group on the target substrate moves to a die bonding station;

the number of the wafer disks is multiple, each wafer disk is used for placing wafers, and the wafers placed on at least one wafer disk are different from those placed on other wafer disks;

the number of the swing arms is multiple, each swing arm corresponds to one wafer disc, and the swing arms respectively correspond to a plurality of wafer positions in one wafer position unit group of the target substrate;

each swing arm is provided with a second driving mechanism, and each second driving mechanism is used for driving the corresponding swing arm to sequentially move from the wafer disc corresponding to the swing arm to the die bonding station and from the die bonding station to the wafer disc corresponding to the swing arm;

the swing arms are used for taking wafers at the corresponding wafer disks respectively and transferring the wafers to corresponding wafer positions of a wafer position unit group located at a wafer fixing station on a target substrate in sequence at the wafer fixing station.

As a further improvement of the utility model, an image acquisition device is arranged at the die bonding station and is used for acquiring an image of the target substrate.

As a further improvement of the present invention, the die bonding apparatus further includes a control mechanism for controlling the plurality of second driving mechanisms, and the control mechanism controls each swing arm to sequentially reach a corresponding wafer position in the wafer position unit group of the die bonding station on the target substrate under the driving of the corresponding second driving mechanism.

As a further improvement of the present invention, in a die bonding apparatus, the number of the die disks is three, the number of the swing arms is three, the first die disk and the corresponding first swing arm form a first die bonding assembly, the second die disk and the corresponding second swing arm form a second die bonding assembly, the third die disk and the corresponding third swing arm form a third die bonding assembly, the first die bonding assembly and the second die bonding assembly are located on one side of the carrier, and the third die bonding assembly is located on the other side of the carrier.

As a further improvement of the present invention, the wafer disc of the first die attach assembly and the wafer disc of the second die attach assembly are located on the same straight line, and the wafer disc of the third die attach assembly and the wafer disc of the second die attach assembly are located on the same straight line.

The utility model has the beneficial effects that: the novel die bonding assembly line adopts a serial arrangement mode of die bonding equipment and material conveying devices, the die bonding equipment is arranged on the upper portion, the material conveying devices are arranged on the lower portion, the transverse width is reduced, the equipment maintenance is facilitated, the carrying distance of a target substrate is reduced, and the die bonding efficiency is improved.

Drawings

FIG. 1 is a schematic diagram of a conventional die bonding line;

FIG. 2 is a schematic diagram of a die bonding line;

FIG. 3 is a schematic diagram of a top view of the die attach apparatus shown in FIG. 2;

FIG. 4 is a schematic view of the material transfer device of the present invention;

FIG. 5 is a schematic structural diagram of a novel die bonding line of the present invention;

fig. 6 is a schematic structural diagram of a swing arm and a wafer tray in the die bonding apparatus.

Detailed Description

As shown in fig. 4, the present invention discloses a material conveying device, which includes material conveying and handling mechanisms and a carrier 205, wherein a carrier belt is installed on the carrier 205, the material conveying and handling mechanisms include a material conveying mechanism 100 and a plurality of carriers 205, the material conveying mechanism 100 is used for conveying materials, the carrier 101 is located at one side of the material conveying mechanism 100, the carrier 101 is used for conveying materials between the material conveying mechanism 100 and the carrier 205, the number of the carriers 205 is the same as the number of the carriers 205, each material conveying mechanism 100 is located below the corresponding carrier 205, the plurality of material conveying mechanisms 100 are located on the same straight line, the material conveying mechanism 100 of one material conveying and handling mechanism is adjacent to the carrier 101 of another material conveying and handling mechanism, the lifting table 101 includes a lifting mechanism and a conveyor belt mounted on the lifting mechanism.

When the lifting table 101 is lifted to the top, the lifting table 101 is level with the carrier conveyer belt, so that materials can be conveyed between the lifting table 101 and the carrier 205; when the lifting platform 101 descends to the bottom, the lifting platform 101 is level with the material conveying mechanism 100, and materials are conveyed to the material conveying mechanism 100 through the lifting platform 101.

The material conveying mechanism 100 is a material conveying belt.

For convenience of description, the first left material conveying and handling mechanism is referred to as a first material conveying and handling mechanism, and the lifting platform 101 and the material conveying mechanism 100 of the first material conveying and handling mechanism are referred to as a first lifting platform and a first material conveying mechanism, respectively; the second material conveying and carrying mechanism on the left side is called a second material conveying and carrying mechanism, and the lifting platform 101 and the material conveying mechanism 100 of the second material conveying and carrying mechanism are respectively called a second lifting platform and a second material conveying mechanism; similarly, the nth material conveying and carrying mechanism on the left side is referred to as the nth material conveying and carrying mechanism, and the lifting platform 101 and the material conveying mechanism 100 of the nth material conveying and carrying mechanism are referred to as the nth lifting platform and the nth material conveying mechanism respectively; the first stage 205 on the left is referred to as the first stage, the second stage 205 on the left is referred to as the second stage, and the nth stage 205 on the left is referred to as the nth stage; n represents a positive integer. For example, in fig. 4, when a material is fed, when the material needs to be processed at a first stage, the material passes through a first lifting table, a control system controls the first lifting table to lift up, the first lifting table lifts up the material, the first lifting table is level with a first stage conveyor belt, a conveyor belt on a first lifting mechanism rotates, the first stage conveyor belt also rotates, the material is conveyed onto the first stage conveyor belt, then, the first stage conveyor belt stops rotating, the conveyor belt of the first lifting table also stops rotating, the first lifting table descends to the bottom, a production device (for example, a die bonder) processes the material, after the processing is completed, a second lifting table is lifted, the second lifting table is level with the first stage conveyor belt, the first stage conveyor belt starts rotating, the conveyor belt of the second lifting table also starts rotating, the material is conveyed to the second lifting table, and then, the first carrying platform conveying belt stops rotating, the conveying belt of the second lifting platform also stops rotating, the second lifting platform descends to the bottom, the second lifting platform is level to the second material conveying mechanism, the conveying belt of the second lifting platform starts rotating to convey the processed materials to the second material conveying mechanism, and then the processed materials are conveyed to the next station through the third material conveying mechanism … … nth material conveying mechanism.

For example, when a material needs to be processed at the sixth loading platform, the first lifting platform to the fifth lifting platform cannot be lifted, the material is conveyed from the first material conveying mechanism to the fifth material conveying mechanism, when the material is conveyed to the sixth lifting platform, the sixth lifting platform is lifted to convey the material to the sixth loading platform for processing, and after the processing is finished, the processed material is conveyed to the seventh material conveying mechanism through the seventh lifting platform, so that the material can be processed at the idle loading platform.

As shown in fig. 5 and 6, the utility model further discloses a novel die bonding assembly line, which includes die bonding devices and the material conveying device, wherein the number of the die bonding devices is the same as that of the carriers 205, each die bonding device corresponds to one carrier 205, the material is a target substrate, and the die bonding devices can bond dies on the target substrate carried to the carriers 205.

Preferably, the die bonding apparatus is capable of transferring and mounting a plurality of types of wafers onto a target substrate transported to the stage 205.

In the die bonding process, first, a target substrate is transferred by the material transfer mechanism 100, the target substrate is transferred from the material transfer mechanism 100 onto the stage 205 by the lift table 101, thereafter, a plurality of types of wafers are transferred and mounted onto the target substrate by the die bonding apparatus, and thereafter, the target substrate on which the plurality of types of wafers are transferred and mounted is transferred from the stage 205 onto the material transfer mechanism 100 by the lift table 101. In the above process, only one transfer process (including the transfer of the target substrate from the material transfer mechanism 100 to the stage 205 and the transfer of the target substrate from the stage 205 to the material transfer mechanism 100 again) needs to be performed, and only one registration (i.e., the detection of whether the position of the target substrate is accurate and not shifted after the target substrate is transferred from the material transfer mechanism 100 to the stage 205) needs to be performed during the position transfer process caused by the transfer. Compared with the technical scheme that multiple carrying processes need to be carried out on the substrate conveying mechanism and the multiple die bonder in the prior art, the die bonder assembly line in the embodiment only needs one carrying process, so that the time consumption of a non-crystal wafer transfer installation link in the die bonder technological process is reduced, and the technological efficiency can be improved; meanwhile, the process links of multiple times of conveying among a plurality of die bonder equipment are omitted, and the probability of occurrence of process errors is correspondingly reduced.

In particular, the material transfer mechanism 100 may be a material conveyor belt. Of course, the material transfer mechanism 100 may be any other device having the function of transferring objects, in addition to the material transfer belt.

Each wafer position unit group on the target substrate transmitted by the material transmission mechanism 100 comprises n wafer positions; n is not less than 2 and is an integer; each die bonder is capable of transferring and mounting n kinds of wafers to the target substrate carried to the carrier 205, and the n kinds of wafers correspond to n kinds of wafer sites in each wafer site unit group on the target substrate one by one. Specifically, each wafer bit unit group on the target substrate conveyed on the material conveying mechanism 100 includes a red wafer bit, a green wafer bit, and a blue wafer bit; each die bonder can transfer and mount three kinds of wafers, which are a red LED chip, a green LED chip, and a blue LED chip, to a target substrate carried on the carrier 205. As described in the background section, in the conventional die bonding assembly line, when a die bonding process is performed on an RGB substrate, three die bonding machines are required to mount a red LED chip, a green LED chip, and a blue LED chip on the RGB substrate, respectively, and a conveyor belt and a plurality of die bonding machines are required to carry the RGB substrate for multiple times; in this embodiment, the red LED chip, the green LED chip and the blue LED chip can be transferred and mounted on the target substrate in one die bonder, and the target substrate does not need to be transported and conveyed between the die bonder via the material conveying mechanism 100 and the conveying mechanism.

The carrier 205 is provided with a first driving mechanism (not shown in the figure), and the first driving mechanism is used for driving a target substrate placed on the carrier 205 to move, so that each wafer contained in one wafer position unit group on the target substrate moves to the die bonding station. Specifically, the first driving mechanism can drive the target substrate to move, so that different wafer bit unit groups on the target substrate are located at the die bonding station.

Specifically, the first driving mechanism includes two sub-driving mechanisms for driving the target substrate to move in two mutually perpendicular directions within a horizontal plane, respectively; through the two sub-driving mechanisms, the first driving mechanism can drive the target substrate to move at any position in the horizontal plane, so that each wafer position contained in any wafer position unit group on the target substrate is positioned at a die bonding station.

The number of the wafer disks 201 is multiple, each wafer disk 201 is used for placing a wafer, and at least one wafer disk 201 is used for placing a different wafer than other wafer disks 201. Specifically, each wafer tray 201 is provided with an ejector pin mechanism, and the ejector pin mechanism is used for ejecting a chip in a wafer placed on the wafer tray 201, so that the ejected chip can be taken out when the swing arm 202 moves to the wafer tray 201.

The number of the swing arms 202 is multiple, each swing arm 202 corresponds to one wafer disk 201, and the multiple swing arms 202 respectively correspond to multiple wafer bits in one wafer bit unit group of the target substrate. Each swing arm 202 is provided with a second driving mechanism 203, and each second driving mechanism 203 is used for driving the corresponding swing arm 202 to move from the wafer tray 201 corresponding to the swing arm 202 to the die bonding station in sequence and from the die bonding station to the wafer tray 201 corresponding to the swing arm 202. The swing arms 202 are used for taking the chips from the corresponding wafer trays 201, and transferring the chips to the corresponding chip sites of a chip site unit group on the target substrate in sequence at the die bonding station. Specifically, each swing arm 202 has another driving mechanism for driving the swing arm 202 to move in the vertical direction, in addition to the second driving mechanism 203; when the swing arm 202 reaches the wafer disk 201 to pick up the wafer, the swing arm 202 is driven by the driving mechanism to move in the vertical direction, and the wafer lifted by the ejector pin mechanism is transferred to the swing arm 202, so that the wafer is picked up.

The number of the swing arms 202 is multiple, and for each swing arm 202, it corresponds to one wafer disk 201 and corresponds to one wafer position in one wafer position unit group on the target substrate, and each swing arm 202 can be driven by its corresponding second driving mechanism to move to the wafer disk 201 corresponding to the swing arm 202, pick up a wafer at the wafer disk 201, and move to a die bonding station on the carrier under the driving of the second driving mechanism, and transfer and mount the wafer to the wafer position corresponding to the swing arm 202 in the wafer position unit group on the target substrate located at the die bonding station. In the plurality of wafer disks 201, at least one wafer disk 201 is different from the other wafer disks 201 in wafer placement, that is, the plurality of wafer disks 201 are different in wafer placement with at least two different types of wafers. The number of the types of the wafers placed on the plurality of wafer disks 201 and the type of the wafer placed on each wafer disk 201 can be set according to the requirement, so that each swing arm 202 can fetch the wafer at the corresponding wafer disk 201, and the fetched wafer is consistent with the type of the wafer to be placed at the wafer position corresponding to the swing arm 202. In this case, when each chip site included in one chip site unit group on the target substrate is located at the die bonding station, the plurality of swing arms 202 may take one chip at the corresponding wafer tray 201, and transfer and mount the taken one chip to each chip site in the chip site unit group at the die bonding station, respectively, without moving the target substrate by the first driving mechanism. After the transfer installation of the wafers in each wafer position included in one wafer position unit group on the target substrate is completed, the target substrate needs to be moved by the first driving mechanism to a position where each wafer position in the next wafer position unit group on the target substrate is located at the die bonding station, and then the corresponding wafer needs to be transferred and installed to each wafer position in the wafer position unit group by the plurality of swing arms 202. And repeating the process to finish the transfer installation of the wafers of all wafer positions on the target substrate.

Specifically, in the present embodiment, the number of the wafer disks 201 is three, and the three wafer disks are respectively used for placing three different wafers, namely, a wafer with red LED chips, a wafer with green LED chips, and a wafer with blue LED chips. One wafer bit cell group on the target substrate has three wafer bits, which respectively require the transfer of mounted wafers as red LED chips, green LED chips, and blue LED chips. The number of the swing arms 202 is three, and the three swing arms correspond to the three wafer disks 201 respectively, and correspond to three wafer positions included in one wafer position unit group on the target substrate respectively. When each chip position included in one chip position unit group on the target substrate is located at a die bonding station, the first swing arm 202 is used for taking a red LED chip at a wafer disc 201 where a wafer with the red LED chip is placed, and transferring and mounting the taken red LED chip to a chip position where the red LED chip is required to be placed in the die bonding station unit group on the target substrate at the die bonding station; the second swing arm 202 is used for taking the green LED chip from the wafer tray 201 on which the wafer with the green LED chip is placed, and transferring and mounting the taken green LED chip to a wafer position on the target substrate, where the green LED chip is required to be placed, in the die bonding position unit group at the die bonding station; the third swing arm 202 is used for taking the blue LED chip from the wafer tray 201 on which the wafer with the blue LED chip is placed, and transferring and mounting the taken blue LED chip to a wafer position on the target substrate, where the blue LED chip is required to be placed, in the die bonding position unit group at the die bonding station.

In this embodiment, an image acquisition device is disposed at the die bonding station, and the image acquisition device is used for acquiring an image of the target substrate. The image of the target substrate acquired by the image acquisition device can be used for judging whether the moved target substrate meets the condition that each wafer position included in the next wafer position unit group is positioned at the die bonding station or not after the first driving mechanism drives the target substrate to move. If the position of the target substrate is not satisfied, the position of the target substrate needs to be further adjusted, for example, the target substrate is driven to move continuously by the first driving mechanism. If the wafer position is satisfied, the swing arms 202 can respectively transfer and mount the corresponding wafer to each wafer position in the wafer position unit group located at the die bonding station.

It should be noted that the image collected by the image collecting device may not only include a photo, but also be a dynamic video, and may also be continuous and real-time video monitoring information.

In order to improve the process efficiency, the die bonding equipment further comprises a control mechanism for controlling the plurality of second driving mechanisms 203, and the control mechanism controls the two swing arms 202 which continuously reach the die bonding station under the driving of the corresponding second driving mechanisms 203 to reach the die bonding station.

In a die bonding apparatus, the number of the wafer disks 201 is three, the number of the swing arms 202 is three, the first wafer disk 201 and the corresponding first swing arm 202 form a first die bonding assembly, the second wafer disk 201 and the corresponding second swing arm 202 form a second die bonding assembly, the third wafer disk 201 and the corresponding third swing arm 202 form a third die bonding assembly, the first die bonding assembly and the second die bonding assembly are located on one side of the carrier 205, and the third die bonding assembly is located on the other side of the carrier 205.

The wafer disc 201 of the first die bonding assembly and the wafer disc 201 of the second die bonding assembly are located on the same straight line, and the wafer disc 201 of the third die bonding assembly and the wafer disc 201 of the second die bonding assembly are located on the same straight line. Through the arrangement of the first die bonding assembly, the second die bonding assembly and the third die bonding assembly, die bonding can be performed more quickly, and the efficiency is improved.

The foregoing is a more detailed description of the utility model in connection with specific preferred embodiments and it is not intended that the utility model be limited to these specific details. For those skilled in the art to which the utility model pertains, several simple deductions or substitutions can be made without departing from the spirit of the utility model, and all shall be considered as belonging to the protection scope of the utility model.

Claims (10)

1. A material conveying device is characterized in that: the material conveying and carrying device comprises a material conveying and carrying mechanism and carrying platforms (205), wherein the carrying platforms (205) are provided with carrying platform conveying belts, the material conveying and carrying mechanism comprises a material conveying mechanism (100) and a lifting platform (101), the material conveying mechanism (100) is used for conveying materials, the lifting platform (101) is positioned on one side of the material conveying mechanism (100), the lifting platform (101) is used for conveying materials between the material conveying mechanism (100) and the carrying platforms (205), the carrying platforms (205) are multiple, the number of the material conveying and carrying mechanisms is the same as that of the carrying platforms (205), each material conveying mechanism (100) is positioned below the corresponding carrying platform (205), the multiple material conveying mechanisms (100) are positioned on the same straight line, the material conveying mechanism (100) of one material conveying mechanism is adjacent to the lifting platform (101) of the other adjacent material conveying and carrying mechanism, the lifting platform (101) comprises a lifting mechanism and a conveyor belt arranged on the lifting mechanism;

when the lifting platform (101) is lifted to the top, the lifting platform (101) is level to the carrier conveyer belt, so that materials are conveyed between the lifting platform (101) and the carrier (205); when the lifting platform (101) descends to the bottom, the lifting platform (101) is level with the material conveying mechanism (100), and materials are conveyed to the material conveying mechanism (100) through the lifting platform (101).

2. The material transfer device of claim 1, wherein: the material conveying mechanism (100) is a material conveying belt.

3. A novel solid brilliant assembly line which characterized in that: the material conveying device comprises die bonding equipment and the material conveying device as claimed in any one of claims 1 to 2, wherein the number of the die bonding equipment is the same as that of the carriers (205), each die bonding equipment corresponds to one carrier (205), the material is a target substrate, and the die bonding equipment can be used for die bonding on the target substrate conveyed to the carriers (205).

4. The novel die bonding assembly line of claim 3, wherein: the die bonder can transfer and mount various wafers to a target substrate carried to the carrying platform (205), wherein each wafer position unit group on the target substrate comprises n wafer positions; n is not less than 2 and is an integer; each die bonding device can transfer and mount n wafers to the target substrate conveyed to the carrying platform (205), and the n wafers correspond to n wafer positions in each wafer position unit group on the target substrate one by one.

5. The novel die bonding assembly line of claim 4, wherein: each wafer bit position group on the target substrate comprises a red wafer position, a green wafer position and a blue wafer position, each die bonder can transfer and mount three kinds of wafers which are respectively a red LED chip, a green LED chip and a blue LED chip to the target substrate which is conveyed to a carrying platform (205) corresponding to the die bonder.

6. The novel die bonding assembly line of claim 5, wherein: the die bonding equipment further comprises a wafer disc (201) and a swing arm (202), wherein a first driving mechanism is arranged on the carrying platform (205), and the first driving mechanism is used for driving a target substrate placed on the carrying platform (205) to move so as to enable each wafer contained in one wafer position unit group on the target substrate to move to a die bonding station;

the number of the wafer disks (201) is multiple, each wafer disk (201) is used for placing a wafer, and the wafers placed on at least one wafer disk (201) are different from those placed on other wafer disks (201);

the number of the swing arms (202) is multiple, each swing arm (202) corresponds to one wafer disc (201), and the swing arms (202) correspond to a plurality of wafer positions in one wafer position unit group of the target substrate respectively;

each swing arm (202) is provided with a second driving mechanism (203), and each second driving mechanism (203) is used for driving the corresponding swing arm (202) to sequentially move from the wafer disc (201) corresponding to the swing arm (202) to the die bonding station and from the die bonding station to the wafer disc (201) corresponding to the swing arm (202);

the swing arms (202) are used for taking wafers at the corresponding wafer disks (201) respectively and transferring the wafers to corresponding wafer positions of a wafer position unit group located at a die bonding station on a target substrate in sequence at the die bonding station.

7. The novel die bonding assembly line of claim 6, wherein: and an image acquisition device is arranged at the die bonding station and is used for acquiring an image of the target substrate.

8. The novel die bonding assembly line of claim 6, wherein: the die bonding equipment further comprises a control mechanism for controlling the plurality of second driving mechanisms (203), and the control mechanism controls the swing arms (202) to sequentially reach corresponding wafer positions in the wafer position unit group of the die bonding station on the target substrate under the driving of the corresponding second driving mechanisms (203).

9. The novel die bonding production line of any one of claims 6 to 8, wherein: in a die bonding device, the number of the wafer disks (201) is three, the number of the swing arms (202) is three, the first wafer disk (201) and the corresponding first swing arm (202) form a first die bonding assembly, the second wafer disk (201) and the corresponding second swing arm (202) form a second die bonding assembly, the third wafer disk (201) and the corresponding third swing arm (202) form a third die bonding assembly, the first die bonding assembly and the second die bonding assembly are located on one side of the carrying platform (205), and the third die bonding assembly is located on the other side of the carrying platform (205).

10. The novel die bonding assembly line of claim 9, wherein: the wafer disc (201) of the first die bonding assembly and the wafer disc (201) of the second die bonding assembly are located on the same straight line, and the wafer disc (201) of the third die bonding assembly and the wafer disc (201) of the second die bonding assembly are located on the same straight line.

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