CN215645391U - Terminal bending device of IGBT electronic component - Google Patents
Terminal bending device of IGBT electronic component Download PDFInfo
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- CN215645391U CN215645391U CN202122456451.4U CN202122456451U CN215645391U CN 215645391 U CN215645391 U CN 215645391U CN 202122456451 U CN202122456451 U CN 202122456451U CN 215645391 U CN215645391 U CN 215645391U
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- 238000005452 bending Methods 0.000 title claims abstract description 74
- 238000003825 pressing Methods 0.000 claims abstract description 50
- 230000005540 biological transmission Effects 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
The utility model provides a terminal bending device of an IGBT electronic element, which comprises a base, a lifting frame, a bottom plate, a placing platform, a lower bending support plate, a lifting driving mechanism, an upper template, an upper pressure plate and an upper bending pressing block. The upper die plate is driven by the lifting driving mechanism, the upper pressing plate and the upper bending pressing block are lifted upwards, the IGBT electronic element to be bent is placed on the placing platform, then the lifting driving mechanism drives the upper die plate, the upper pressing plate and the upper bending pressing block to descend, a certain distance is reserved between the upper pressing plate and the upper die plate under the elastic action of the elastic piece, the upper pressing plate is contacted with the placing platform firstly, the position of the IGBT electronic element to be bent is stabilized, then the upper die plate and the upper bending pressing block continue to descend, and the upper bending pressing block and the lower bending supporting plate are matched to bend the terminal of the IGBT electronic element into a 90-degree angle. In the whole action process, the position of an IGBT electronic element is stable, the bending precision is high, and the product quality is improved; the terminal bending of a plurality of IGBT electronic components can be synchronously carried out, and the production efficiency is high.
Description
Technical Field
The utility model relates to the technical field of IGBT manufacturing, in particular to a terminal bending device of an IGBT electronic component.
Background
The IGBT is a short for insulated gate bipolar transistor. The IGBT module is a modularized semiconductor product formed by bridge packaging of an IGBT (insulated gate bipolar transistor) and an FWD (freewheeling diode chip) through a specific circuit; the packaged IGBT module is directly applied to equipment such as a frequency converter, a UPS (uninterrupted power supply) and the like.
In the production and assembly process of the IGBT module, the terminal of the IGBT electronic element needs to be bent by 90 degrees, manual bending is basically adopted at present, the working efficiency is low, the bending precision is not high, and even the subsequent assembly operation can be influenced.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model aims to provide a terminal bending device for an IGBT electronic component.
In order to achieve the purpose, the technical scheme adopted by the utility model for solving the technical problems is as follows: a terminal bending device of an IGBT electronic component comprises:
a base;
the lifting frame is vertically arranged on the base;
a base plate mounted on the base;
the placing platform is arranged on the bottom plate, and a plurality of positioning structures for placing the IGBT electronic elements are arranged on the placing platform;
the lower bending support plate is arranged on the bottom plate, and a terminal to be bent of the IGBT electronic element is lapped on the upper surface of the lower bending support plate;
the lifting driving mechanism is arranged on the lifting frame;
the upper template is arranged on the lifting frame through an upper and lower guide mechanism, and the lifting driving mechanism can drive the upper template to move up and down along the upper and lower guide mechanism;
the upper pressing plate is connected below the upper template through a guide rod, the upper pressing plate can move up and down along the guide rod and the upper template relatively, and an elastic part is arranged between the upper template and the upper pressing plate;
and the upper bending pressing block is arranged below the upper template, and the upper bending pressing block and the lower bending supporting plate are in a vertically matched state.
According to the technical scheme, the upper template, the upper pressing plate and the upper bending pressing block are driven to be lifted upwards through the lifting driving mechanism, the IGBT electronic element to be bent is placed on the placing platform, then the lifting driving mechanism drives the upper template, the upper pressing plate and the upper bending pressing block to descend, a certain distance is reserved between the upper pressing plate and the upper template under the elastic action of the elastic piece, the upper pressing plate is firstly contacted with the placing platform to stabilize the position of the IGBT electronic element to be bent, then the upper template and the upper bending pressing block continue to descend, and the upper bending pressing block and the lower bending supporting plate are matched to bend the terminal of the IGBT electronic element into a 90-degree angle; in the whole action process, the position of an IGBT electronic element is stable, the bending precision is high, and the product quality is improved; the terminal bending of a plurality of IGBT electronic components can be synchronously carried out, and the production efficiency is high.
Furthermore, the lifting driving mechanism is a connecting rod lifting mechanism, the connecting rod lifting mechanism comprises a guide sleeve, a transmission rod and a connecting rod mechanism which are vertically arranged, the transmission rod penetrates through the guide sleeve, the top of the transmission rod is connected with the connecting rod mechanism, and the upper template is connected to the lower end of the transmission rod.
By adopting the preferable scheme, manual operation is facilitated.
Furthermore, the lifting driving mechanism is a screw rod mechanism, a screw rod of the screw rod mechanism is vertically arranged on the lifting frame, and a nut of the screw rod mechanism is connected with the upper template.
By adopting the preferable scheme, the screw rod can be driven to rotate by the driving motor, and automatic lifting action is realized.
Furthermore, the upper and lower guide mechanism comprises two guide columns which are vertically arranged, and the upper template is connected with the guide sleeves on the guide columns.
Adopt above-mentioned preferred scheme, improve lift stability.
Further, when the upper pressing plate is in contact with the placing platform, the distance between the upper pressing plate and the upper surface of the IGBT electronic element is 0.1-0.3 mm.
With the preferred embodiment, the position of the IGBT electronic component is stably secured, and the component is not damaged.
Furthermore, the positioning structure of the placing platform comprises a groove matched with the outline of the IGBT electronic element and a positioning convex hull matched with the positioning hole of the IGBT electronic element.
By adopting the preferable scheme, the placement position precision of the IGBT electronic element is improved.
Furthermore, an outer arc angle is arranged on the lower bending supporting plate, and an inner arc angle matched with the outer arc angle is arranged on the upper bending pressing block.
By adopting the preferable scheme, the bending quality of the terminal of the IGBT electronic element is improved.
Furthermore, the lower bending support plate is detachably mounted on the bottom plate, and the upper bending pressing block is detachably mounted below the upper die plate.
By adopting the preferable scheme, the easily damaged parts are conveniently and independently replaced, and the use cost is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic perspective view of an embodiment of the present invention;
FIG. 2 is a cross-sectional view of one embodiment of the present invention;
FIG. 3 is an enlarged view of a portion of FIG. 2 at A;
FIG. 4 is a schematic view of a construction of one embodiment of the present invention in which the upper platen and the upper platen are hidden;
FIG. 5 is a schematic structural diagram of an IGBT electronic component before bending;
fig. 6 is a schematic structural view of the IGBT electronic component after bending.
Names of corresponding parts represented by numerals and letters in the drawings:
11-a base; 12-a lifting frame; 13-a base plate; 14-a placement platform; 141-a groove; 142-positioning the convex hull; 15-bending the supporting plate downwards; 151-outer arc angle; 16-a lifting drive mechanism; 161-a guide sleeve; 162-a drive link; 163-linkage; 17-upper template; 18-an upper platen; 19-bending and pressing blocks upwards; 191-inner arc angle; 21-an up-down guide mechanism; 211-guide pillars; 212-a guide sleeve; 22-a guide bar; 23-an elastic member; 90-IGBT electronic components.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 4, a terminal bending device for an IGBT electronic component includes:
a base 11;
a lifting frame 12 vertically installed on the base 11;
a base plate 13 mounted on the base 11;
a placement platform 14 installed on the bottom plate 13, wherein the placement platform 14 is provided with a plurality of positioning structures for placing the IGBT electronic components 90;
a lower bending support plate 15 mounted on the bottom plate 13, and a terminal to be bent of the IGBT electronic component 90 is lapped on an upper surface of the lower bending support plate 15;
a lifting driving mechanism 16 which is arranged on the lifting frame 12;
the upper template 17 is arranged on the lifting frame 12 through an upper and lower guide mechanism 21, and the lifting driving mechanism 16 can drive the upper template 17 to move up and down along the upper and lower guide mechanism 21;
the upper pressing plate 18 is connected below the upper template 17 through a guide rod 22, the upper pressing plate 18 can move up and down along the guide rod 22 and the upper template 17, and an elastic part 23 is arranged between the upper template 17 and the upper pressing plate 18;
and an upper bending pressing block 19 which is installed below the upper template 17, wherein the upper bending pressing block 19 and the lower bending supporting plate 15 are in a vertically matched state.
The beneficial effect of adopting above-mentioned technical scheme is: firstly, a lifting driving mechanism 16 drives an upper template 17, an upper pressing plate 18 and an upper bending pressing block 19 to be lifted upwards, an IGBT electronic element to be bent is placed on a placing platform 14, then the lifting driving mechanism 16 drives the upper template 17, the upper pressing plate 18 and the upper bending pressing block 19 to be lowered, a certain distance is reserved between the upper pressing plate 18 and the upper template 17 under the elastic force action of an elastic piece 23, the upper pressing plate 18 is firstly contacted with the placing platform 14 to stabilize the position of the IGBT electronic element to be bent, then the upper template 17 and the upper bending pressing block 19 continue to be lowered, the upper bending pressing block 19 and a lower bending supporting plate 15 are matched to bend the terminal of the IGBT electronic element into a 90-degree angle, the structure diagram before bending the terminal of the IGBT electronic element is shown in fig. 5, and the structure diagram after bending the terminal of the IGBT electronic element is shown in fig. 6; the IGBT electronic components are stable in position in the whole action process, the bending precision is high, terminals of the plurality of IGBT electronic components can be bent synchronously, and the production efficiency is high.
In other embodiments of the present invention, as shown in fig. 1, the lifting driving mechanism 16 is a link lifting mechanism, which includes a vertically arranged guide sleeve 161, a transmission rod 162 and a link mechanism 163, the transmission rod 162 is inserted into the guide sleeve 161, the top of the transmission rod 162 is connected to the link mechanism 163, and the upper mold plate 17 is connected to the lower end of the transmission rod 162. The beneficial effect of adopting above-mentioned technical scheme is: is convenient for manual operation.
In other embodiments of the present invention, the lifting driving mechanism is a screw mechanism, a screw rod of the screw mechanism is vertically installed on the lifting frame, and a nut of the screw mechanism is connected to the upper template. The beneficial effect of adopting above-mentioned technical scheme is: the screw rod can be driven to rotate by the driving motor, and automatic lifting action is realized.
In other embodiments of the present invention, as shown in fig. 1, the upper and lower guide mechanism 21 includes two guide posts 211 vertically installed, and the upper plate 17 is connected to guide sleeves 212 on the guide posts 211. The beneficial effect of adopting above-mentioned technical scheme is: the lifting stability is improved.
In other embodiments of the present invention, as shown in fig. 2, the upper platen 18 is spaced 0.1-0.3mm from the upper surface of the IGBT electronic components when the upper platen 18 is in contact with the placement stage 14. The beneficial effect of adopting above-mentioned technical scheme is: the position of the IGBT electronic component is stably regulated, and meanwhile, the component is not damaged.
In other embodiments of the present invention, as shown in fig. 4, the positioning structure of the placement platform 14 includes a groove 141 matching the contour of the IGBT electronic component and a positioning convex hull 142 matching the positioning hole of the IGBT electronic component. The beneficial effect of adopting above-mentioned technical scheme is: the placement position precision of the IGBT electronic element is improved.
In other embodiments of the present invention, as shown in fig. 2, 3 and 4, the lower bending support plate 15 is provided with an outer arc angle 151, and the upper bending pressing block 19 is provided with an inner arc angle 191 matching the outer arc angle. The beneficial effect of adopting above-mentioned technical scheme is: and the bending quality of the IGBT electronic element terminal is improved.
In other embodiments of the utility model, the lower bending support plate 15 is detachably mounted on the bottom plate 13, and the upper bending press block 19 is detachably mounted below the upper die plate 17. The beneficial effect of adopting above-mentioned technical scheme is: the easily damaged parts are conveniently and independently replaced, and the use cost is reduced.
The above embodiments are merely illustrative of the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the content of the present invention and implement the present invention, and not to limit the scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered in the scope of the present invention.
Claims (8)
1. A terminal bending device for an IGBT electronic component is characterized by comprising:
a base;
the lifting frame is vertically arranged on the base;
a base plate mounted on the base;
the placing platform is arranged on the bottom plate, and a plurality of positioning structures for placing the IGBT electronic elements are arranged on the placing platform;
the lower bending support plate is arranged on the bottom plate, and a terminal to be bent of the IGBT electronic element is lapped on the upper surface of the lower bending support plate;
the lifting driving mechanism is arranged on the lifting frame;
the upper template is arranged on the lifting frame through an upper and lower guide mechanism, and the lifting driving mechanism can drive the upper template to move up and down along the upper and lower guide mechanism;
the upper pressing plate is connected below the upper template through a guide rod, the upper pressing plate can move up and down along the guide rod and the upper template relatively, and an elastic part is arranged between the upper template and the upper pressing plate;
and the upper bending pressing block is arranged below the upper template, and the upper bending pressing block and the lower bending supporting plate are in a vertically matched state.
2. The terminal bending device for the IGBT electronic component as claimed in claim 1, wherein the lifting driving mechanism is a link lifting mechanism, the link lifting mechanism comprises a vertically arranged guide sleeve, a transmission rod and a link mechanism, the transmission rod is arranged through the guide sleeve, the top of the transmission rod is connected with the link mechanism, and the upper template is connected to the lower end of the transmission rod.
3. The terminal bending device for the IGBT electronic component as claimed in claim 1, wherein the lifting driving mechanism is a screw mechanism, a screw rod of the screw mechanism is vertically installed on the lifting frame, and a nut of the screw mechanism is connected with the upper template.
4. The device for bending a terminal of an IGBT electronic component according to claim 1, wherein the up-down guiding mechanism comprises two vertically installed guide pillars, and the upper mold plate is connected to guide sleeves on the guide pillars.
5. The IGBT electronic component terminal bending device of claim 1, wherein when the upper pressing plate is in contact with the placing platform, the upper pressing plate is spaced from the upper surface of the IGBT electronic component by 0.1-0.3 mm.
6. The IGBT electronic component terminal bending device according to claim 5, wherein the positioning structure of the placing platform comprises a groove matched with the shape of the IGBT electronic component and a positioning convex hull matched with the positioning hole of the IGBT electronic component.
7. The device for bending a terminal of an IGBT electronic component according to claim 6, wherein the lower bending support plate is provided with an outer arc angle, and the upper bending pressing block is provided with an inner arc angle matching the outer arc angle.
8. The device for bending a terminal of an IGBT electronic component according to claim 7, wherein the lower bending support plate is detachably mounted on the base plate, and the upper bending pressing block is detachably mounted below the upper die plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122456451.4U CN215645391U (en) | 2021-10-13 | 2021-10-13 | Terminal bending device of IGBT electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122456451.4U CN215645391U (en) | 2021-10-13 | 2021-10-13 | Terminal bending device of IGBT electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215645391U true CN215645391U (en) | 2022-01-25 |
Family
ID=79934690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122456451.4U Active CN215645391U (en) | 2021-10-13 | 2021-10-13 | Terminal bending device of IGBT electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215645391U (en) |
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2021
- 2021-10-13 CN CN202122456451.4U patent/CN215645391U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A Terminal Bending Device for IGBT Electronic Components Granted publication date: 20220125 Pledgee: Bank of China Limited Suzhou Wuzhong sub branch Pledgor: Yiqi new energy technology (Suzhou) Co.,Ltd. Registration number: Y2024980013290 |