CN214266768U

CN214266768U - Circuit board part embossing mold utensil

Info

Publication number: CN214266768U
Application number: CN202022819690.7U
Authority: CN
Inventors: 杨晓飞
Original assignee: Suzhou Dongxing Mould Co ltd
Current assignee: Suzhou Dongxing Mould Co ltd
Priority date: 2020-11-30
Filing date: 2020-11-30
Publication date: 2021-09-24
Anticipated expiration: 2030-11-30

Abstract

The utility model discloses a circuit board part embossing mold utensil, including the suppression workstation, upper end one side of suppression workstation is provided with the fixed stay piece, the fixed stay piece is provided with the supporting connection piece in one side upper end towards the suppression workstation, the supporting connection piece is connected with passive punching press transmission piece and the inside power conversion mechanism that is provided with of passive punching press transmission piece. The utility model discloses, be provided with suppression buffer gear, suppression buffer gear is made by stereoplasm elastic material, can provide the required intensity of suppression to the suppression when the suppression, the circuit board when also can be for the suppression simultaneously provides the elasticity protection, for the circuit board provides the buffering, compare with prior art, provide the elasticity buffering of certain degree for the circuit board when suppressing the circuit board, guarantee going on smoothly of suppression promptly also provides the elasticity protection to the circuit board in the suppression, improve the suppression qualification rate of circuit board, the productivity is improved, the cost loss of circuit board suppression damage has been reduced.

Description

Circuit board part embossing mold utensil

Technical Field

The utility model relates to a mould suppression technical field specifically is a circuit board part embossing mold utensil.

Background

The circuit board has the name: ceramic circuit board, alumina ceramic circuit board, aluminium nitride ceramic circuit board, the PCB board, aluminium base board, the high frequency board, thick copper board, the impedance board, PCB, ultra-thin circuit board, printed circuit board etc., the circuit board makes the circuit miniaturation, it is direct-viewing, play an important role with electrical apparatus overall arrangement to fixed circuit's batch production and optimization, the circuit board can be called printed circuit board or printed circuit board, to large-scale circuit board production, the mould suppression is adopted to the prior art, make circuit board high pressure plastic forming, current circuit board embossing mold easily causes the harm to the circuit board in the suppression in the pressing process, lead to the product unqualified, draw low yield, the cost of consumption.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a circuit board part embossing mold utensil to solve the problem that proposes among the above-mentioned background art.

To achieve the above object, the present invention provides the following solutions:

a circuit board part pressing die comprises a pressing workbench, wherein a fixed supporting block is arranged on one side of the upper end of the pressing workbench, a supporting connecting block is arranged at the upper end of one side of the fixed supporting block, which faces the pressing workbench, the supporting connecting block is connected with a passive stamping transmission block, a power conversion mechanism is arranged in the passive stamping transmission block, a passive stamping connecting block is arranged on one side of the upper end of the passive stamping transmission block, which is far away from the fixed supporting block, a stamping arm is arranged outside one side of the upper end of the passive stamping transmission block, which is far away from the fixed supporting block, stamping arm openings are formed at both ends of the stamping arm, the passive stamping connecting block is in inserted fit with the stamping arm openings, the stamping arm opening at one end of the stamping arm, which is far away from the passive stamping connecting block, the stamping transmission block is internally provided with the power conversion mechanism, one side that the punching press arm was kept away from to punching press transmission piece lower extreme is provided with stamping motor, the inside power conversion mechanism of punching press transmission piece is connected to stamping motor's transmission end, the below of punching press arm is provided with the pressurized base, the base opening has been seted up to the intermediate position department of pressurized base, install suppression buffer gear in the base opening, the punching press arm is provided with the mould suppression head in the position department that corresponds suppression buffer gear.

As a further improvement of the technical scheme, table legs are arranged at four corners of the lower end of the pressing workbench, a stamping motor base is arranged at the lower end of the stamping motor, and the stamping motor base is arranged on the pressing workbench.

As a further improvement of the technical scheme, the pressing buffer mechanism is made of hard elastic materials, a buffer mechanism opening is formed in the middle of the pressing buffer mechanism, and a pressing buffer block is installed in the buffer mechanism opening.

As a further improvement of the technical scheme, the upper end of the pressing buffer block is provided with a pressing bearing block, the pressing bearing block is made of hard elastic materials, two sides of the lower end of the pressing bearing block are connected with buffer pressure columns, the middle position of the lower end of the pressing bearing block is connected with a first buffer spring, and the first buffer spring is arranged between the buffer pressure columns on two sides of the lower end of the pressing bearing block and is not in contact with the buffer pressure columns.

As a further improvement of the technical scheme, the upper end of the buffer pressure column is provided with a column head, the lower end of the column head is inwards sunken to form a cylindrical groove, the top end of the cylindrical groove in the column head is connected with a second buffer spring, one end, far away from the column head, of the second buffer spring is connected with a column foot, and the diameter of the column foot is the same as that of the cylindrical groove in the column head.

Compared with the prior art, the beneficial effects of the utility model are that:

be provided with suppression buffer gear, suppression buffer gear is made by stereoplasm elastic material, can provide the required intensity of suppression to the suppression when the suppression, the circuit board when also can be for the suppression provides the elasticity protection simultaneously, still be provided with the suppression buffer block in suppression buffer gear, cooperation through first buffer spring of suppression buffer block below and second buffer spring can further reduce the harm of suppression to the circuit board, for the circuit board provides the buffering, compare with prior art, provide the elasticity buffering of certain degree for the circuit board when suppressing the circuit board, guarantee going on smoothly of suppression promptly and also provide the elasticity protection to the circuit board in the suppression, the suppression qualification rate of circuit board is improved, the productivity is improved, the cost loss of circuit board suppression damage has been reduced.

Drawings

FIG. 1 is a schematic perspective view of a pressing mold for circuit board components;

FIG. 2 is a schematic diagram of a disassembled structure of a circuit board part pressing mold;

FIG. 3 is a schematic view of a disassembled structure of a pressing buffer block of a circuit board part pressing mold;

FIG. 4 is a schematic view of a disassembled structure of a buffer pressure column of a circuit board part pressing mold;

in the figure: 1. pressing a workbench; 2. fixing a supporting block; 3. passively punching a transmission block; 4. a punching arm; 5. stamping a transmission block; 6. a stamping motor; 7. a pressure-bearing base; 8. stamping a motor base; 9. a table leg; 10. supporting the connecting block; 11. passively punching a connecting block; 12. punching an opening of the arm; 13. pressing a head by a mould; 14. pressing a buffer block; 15. pressing a buffer mechanism; 16. an opening of the buffer mechanism; 17. a base opening; 18. pressing a bearing block; 19. buffering the pressure column; 20. A first buffer spring; 21. a column cap; 22. a second buffer spring; 23. a column base.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Example 1

Referring to fig. 1 to 4, in an embodiment of the present invention, a circuit board part pressing mold includes a pressing table 1, the pressing table 1 provides a support for a pressing device to ensure the grandli process of the pressing operation, a fixed support block 2 is disposed on one side of the upper end of the pressing table 1, a support connection block 10 is disposed on the upper end of one side of the fixed support block 2 facing the pressing table 1, the support connection block 10 is connected to a passive punching transmission block 3, a power conversion mechanism is disposed inside the passive punching transmission block 3, the passive punching transmission block 3 is supported by the fixed support block 2 to ensure the normal operation of the passive punching transmission block 3, the passive punching transmission block 3 synchronously converts the transmitted power to maintain the balance of the device, a passive punching connection block 11 is disposed on one side of the upper end of the passive punching transmission block 3 away from the fixed support block 2, a punching arm 4 is disposed outside one side of the upper end of the passive punching transmission block 3 away from the fixed support block 2, the punching arm 4 generates impact pressure on a circuit board under the action of pressure, punching arm openings 12 are formed in two ends of the punching arm 4, a passive punching connecting block 11 is matched with the punching arm openings 12 in an inserting manner, a punching transmission block 5 is connected in the punching arm opening 12 at one end, far away from the passive punching connecting block 11, of the punching arm 4, a power conversion mechanism is arranged in the punching transmission block 5, a punching motor 6 is arranged at one side, far away from the punching arm 4, of the lower end of the punching transmission block 5, the transmission end of the punching motor 6 is connected with the power conversion mechanism in the punching transmission block 5, the punching motor 6 is started, the internal mechanism of the punching transmission block 5 is driven to convert the rotary power of the punching motor 6 into up-and-down motion, the connected punching arm 4 is driven to move up and down, then, impact pressure on the circuit board to be pressed below the punching arm 4 is generated, a pressure bearing base 7 is arranged below the punching arm 4, base opening 17 has been seted up to pressurized base 7's intermediate position department, install suppression buffer gear 15 in the base opening 17, punching press arm 4 is provided with mould suppression head 13 in the position department that corresponds suppression buffer gear 15, punching press arm 4 drives mould suppression head 13 when doing the up-and-down motion and does the up-and-down motion, mould suppression head 13 produces impact pressure for the base opening 17 on the pressurized base 7 of below, place the circuit board that needs the suppression on base opening 17, make the circuit board press into required shape under the impact pressure of mould suppression head 13, suppression buffer gear 15 in the base opening 17 provides the elastic buffer protection for the circuit board when the suppression simultaneously.

Referring to fig. 1, table legs 9 are arranged at four corners of the lower end of a pressing workbench 1, the table legs 9 support the pressing workbench 1 to ensure the stability of the pressing workbench 1, a stamping motor base 8 is arranged at the lower end of a stamping motor 6, the stamping motor base 8 is installed on the pressing workbench 1, and the stamping motor base 8 provides a stable working environment for the stamping motor 6 to ensure the stability of the stamping motor 6 in working.

Referring to fig. 1, the pressing buffer mechanism 15 is made of a hard elastic material, and provides strength and elastic protection for the circuit board placed above the pressing buffer mechanism during pressing, a buffer mechanism opening 16 is formed in the middle of the pressing buffer mechanism 15, a pressing buffer block 14 is installed in the buffer mechanism opening 16, and the pressing buffer block 14 provides strength and buffering for the circuit board during pressing, so that the circuit board is not damaged due to excessive pressure during pressing.

Referring to fig. 3, a pressing receiving block 18 is disposed at the upper end of the pressing buffer block 14, the pressing receiving block 18 is made of a hard elastic material, buffer pressure columns 19 are connected to two sides of the lower end of the pressing receiving block 18, a first buffer spring 20 is connected to the middle position of the lower end of the pressing receiving block 18, the first buffer spring 20 is located between the buffer pressure columns 19 on two sides of the lower end of the pressing receiving block 18 and does not contact with the buffer pressure columns 19, the pressing receiving block 18 provides sufficient strength and elastic protection for a circuit board during pressing, the first buffer spring 20 deforms when receiving pressure to resist the pressure, provides buffering for the circuit board during pressing, and ensures that the circuit board is not damaged due to excessive pressure.

Referring to fig. 4, a column head 21 with a lower end recessed inwards to form a cylindrical groove is arranged at the upper end of the buffer pressure column 19, a second buffer spring 22 is connected to the top end of the cylindrical groove inside the column head 21, a column foot 23 is connected to one end, away from the column head 21, of the second buffer spring 22, the diameter of the column foot 23 is the same as that of the cylindrical groove inside the column head 21, when the buffer pressure column 19 is pressurized, the column head 21 moves downwards to press the second buffer spring 22, the second buffer spring 22 deforms to resist the pressurized force, a buffer effect is provided for the circuit board, and the circuit board is not damaged due to the excessive pressure.

The utility model discloses a theory of operation:

the circuit board that will treat the suppression is placed on base opening 17, start stamping motor 6, conversion through the inside power conversion mechanism of punching press driving block 5, turn into the power of up-and-down motion with the revolving force, make punching press arm 4 do up-and-down motion and drive mould pressing head 13 and do the up-and-down motion, produce the impact pressure for base opening 17 on the pressurized base 7, suppress the circuit board on base opening 17, when the suppression, the inside suppression buffer gear 15 that sets up of base opening 17 provides sufficient intensity and elastic protection for the circuit board, suppression buffer block 14 provides sufficient intensity and elastic buffer protection for the circuit board, make the circuit board can not lead to damaging because of factors such as pressure is too big when the suppression, influence the productivity and cause the cost consumption.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. The utility model provides a circuit board part embossing mold utensil, includes pressing work platform (1), its characterized in that: a fixed supporting block (2) is arranged on one side of the upper end of the pressing workbench (1), a supporting connecting block (10) is arranged on the upper end of one side of the fixed supporting block (2) facing the pressing workbench (1), the supporting connecting block (10) is connected with a passive punching transmission block (3), a power conversion mechanism is arranged in the passive punching transmission block (3), a passive punching connecting block (11) is arranged on one side of the upper end of the passive punching transmission block (3) far away from the fixed supporting block (2), a punching arm (4) is arranged outside one side of the upper end of the passive punching transmission block (3) far away from the fixed supporting block (2), punching arm openings (12) are formed in both ends of the punching arm (4), the passive punching connecting block (11) is in inserted connection fit with the punching arm openings (12), and a punching transmission block (5) is connected in the punching arm opening (12) at one end of the punching arm (4) far away from the passive punching connecting block (11), the inside power conversion mechanism that is provided with of punching press transmission piece (5), one side that punching press arm (4) were kept away from to punching press transmission piece (5) lower extreme is provided with stamping motor (6), the inside power conversion mechanism of punching press transmission piece (5) is connected to the transmission end of stamping motor (6), the below of punching press arm (4) is provided with pressurized base (7), base opening (17) have been seted up in the intermediate position department of pressurized base (7), install suppression buffer gear (15) in base opening (17), punching press arm (4) are provided with mould suppression head (13) in the position department that corresponds suppression buffer gear (15).

2. The circuit board component pressing die of claim 1, wherein: the stamping machine is characterized in that table feet (9) are arranged at four corners of the lower end of the pressing workbench (1), a stamping motor base (8) is arranged at the lower end of the stamping motor (6), and the stamping motor base (8) is installed on the pressing workbench (1).

3. The circuit board component pressing die of claim 1, wherein: the pressing buffer mechanism (15) is made of hard elastic materials, a buffer mechanism opening (16) is formed in the middle of the pressing buffer mechanism (15), and a pressing buffer block (14) is installed in the buffer mechanism opening (16).

4. The circuit board component pressing die of claim 3, wherein: the upper end of suppression buffer block (14) is provided with suppression and holds piece (18), suppression holds piece (18) and is made by hard elastic material, the lower extreme both sides of suppression holding piece (18) are connected with buffer pressure post (19), the intermediate position department of suppression holding piece (18) lower extreme is connected with first buffer spring (20), first buffer spring (20) hold between the buffer pressure post (19) of piece (18) lower extreme both sides and not contact with buffer pressure post (19) in the suppression.

5. The circuit board component pressing die of claim 4, wherein: the upper end of buffer pressure post (19) is provided with column cap (21) that the lower extreme inwards caves in and is the cylindrical shape recess, the top of the inside recess of column cap (21) is connected with second buffer spring (22), the one end that column cap (21) were kept away from in second buffer spring (22) is connected with column foot (23), the diameter of column foot (23) is the same between the recess of the inside cylindrical shape of column cap (21).