CN105563627A - Leveling and overlaying machine for raw ceramic chip through hole column protrusions - Google Patents

Leveling and overlaying machine for raw ceramic chip through hole column protrusions Download PDF

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Publication number
CN105563627A
CN105563627A CN201510942724.2A CN201510942724A CN105563627A CN 105563627 A CN105563627 A CN 105563627A CN 201510942724 A CN201510942724 A CN 201510942724A CN 105563627 A CN105563627 A CN 105563627A
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CN
China
Prior art keywords
bottom platen
leveling
rectangular base
hole
linear bearing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510942724.2A
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Chinese (zh)
Inventor
王海珍
吕琴红
田芳
白璐
庄园
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CETC 2 Research Institute
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CETC 2 Research Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CETC 2 Research Institute filed Critical CETC 2 Research Institute
Priority to CN201510942724.2A priority Critical patent/CN105563627A/en
Publication of CN105563627A publication Critical patent/CN105563627A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B11/00Apparatus or processes for treating or working the shaped or preshaped articles
    • B28B11/08Apparatus or processes for treating or working the shaped or preshaped articles for reshaping the surface, e.g. smoothing, roughening, corrugating, making screw-threads
    • B28B11/10Apparatus or processes for treating or working the shaped or preshaped articles for reshaping the surface, e.g. smoothing, roughening, corrugating, making screw-threads by using presses

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  • Engineering & Computer Science (AREA)
  • Structural Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)

Abstract

The invention discloses a leveling and overlaying machine for raw ceramic chip through hole column protrusions. By the adoption of the leveling and overlaying machine, the problem that when through hole column protrusions are leveled, a guiding rail is prone to being pressed and damaged is solved. The leveling and overlaying machine comprises a rectangular base (1). Four guiding supporting stand columns (2) are arranged on the rectangular base (1). A pressing table fixing plate (3) and a pneumatic oil hydraulic cylinder (4) are fixedly arranged at the top ends of the four guiding supporting stand columns. The four corners of a rectangular upper pressing table (5) are each provided with a linear bearing installing hole (6). A lower pressing table conveying guiding rail (9) is arranged on the portion, on the inner sides of the guiding supporting stand columns, of the rectangular base. The four vertical angles of a lower U-shaped pressing table fixing plate (12) are each provided with a lower pressing table guiding column (13) and a lower pressing table supporting spring (8). A leveling supporting base (8) is arranged on the portion, under the rectangular pressing table, of the rectangular base. The leveling supporting base (8) is lower than the lower bottom face of a top plate of the lower U-shaped pressing table fixing plate (12). According to the leveling and overlaying machine, the structure is simple, materials can be taken and placed conveniently and safely, and the cost performance is high.

Description

The convex leveling press of ceramic chips through hole post drum
Technical field
The present invention relates to a kind of flattening mechanism, particularly a kind of convex mechanism flattened of the drum to ceramic chips through hole post.
Background technology
LTCC production technology, exactly low-temperature co-fired ceramic powder is made green band, cut into slices shaping, shaping green band carries out punch, hole slip casting, conductor, the technique such as resistance printing makes required circuitous pattern, and can multiple passive element be imbedded wherein, then Multi-stacking compaction together, sinter at 900 DEG C, make the passive integration assembly of three-dimensional circuit network, also can be made into the three-dimensional circuit substrate of built-in passive element, IC and active device can be mounted on its surface, make passive/active integrated functional module.In process of production, metal paste is noted after in the through hole in ceramic chips, protruding through hole post drum can be formed convex, according to technological requirement, by after the convex leveling of through hole post drum, just will can carry out the lower road production process of ceramic chips.Prior art is undertaken by a press the convex leveling of green film perforation post drum, first the manual below of presenting a theatrical performance as the last item on a programme ceramic chips being placed on press, and then operation is presented a theatrical performance as the last item on a programme and pressed down, by the convex pressing of through hole post drum.This mode of operation is prone to accidents, and there is the inaccurate problem of ceramic chips placement location; If there is again guide rail easily by the problem of platform downforce crushing at the lower automatic driver that arranges of presenting a theatrical performance as the last item on a programme; If select bearing capacity the earth guide rail and leading screw to there is again the high problem of cost of investment.
Summary of the invention
The invention provides the convex leveling press of a kind of ceramic chips through hole post drum, solve the guide rail of existence when through hole post drum is convex to be flattened easily by the technical problem of crushing.
The present invention solves above technical problem by the following technical programs:
The convex leveling press of a kind of ceramic chips through hole post drum, comprise rectangular base, rectangular base is provided with four guide support columns, four guide support columns are set parallel to each other, and form rectangular shape, fixed head of presenting a theatrical performance as the last item on a programme is fixedly installed on the top of four guide support columns, be provided with Fuel Oil Pressure Pneumatic cylinder presenting a theatrical performance as the last item on a programme on fixed head, four angles of rectangle upper holder are respectively arranged with a linear bearing installing hole, linear bearing is provided with in linear bearing installing hole, guide support column is movably arranged in linear bearing, the top of the projecting shaft stretched out downwards of Fuel Oil Pressure Pneumatic cylinder is linked together by floating junction and rectangle upper holder, rectangular base inside guide support column is provided with bottom platen and transmits guide rail, transmit on guide rail at bottom platen and be movably set with bottom platen U-shaped fixed head, rectangular base between two bottom platens transmission guide rails is provided with leading screw, the bottom surface of the feed screw nut on leading screw and bottom platen U-shaped fixed head is fixed together, a bottom platen lead is respectively arranged with at four drift angle places of bottom platen U-shaped fixed head end face, present a theatrical performance as the last item on a programme in each of the lower on lead and be provided with bottom platen support spring, a through hole is provided with at four drift angle places of rectangle bottom platen, rectangle bottom platen is crimped on the top of the bottom platen support spring on bottom platen lead by through hole activity, rectangle bottom platen is provided with ceramic chips, rectangular base immediately below rectangle upper holder is provided with leveling supporting seat, the height of leveling supporting seat will lower than the top board bottom surface of bottom platen U-shaped fixed head.
In the through hole of rectangle bottom platen, be provided with bottom platen linear bearing, bottom platen lead is movably arranged in bottom platen linear bearing.
Bottom platen is raised above the position of bearing by invention by bottom platen support spring, be sent to the top of the bearing immediately below upper holder by transmitting leading screw.Pressing down of upper holder makes bottom platen drop on bearing, serves and makes the downforce of upper holder be born by bearing thus protect guide rail.When upper holder lifts, bearing is left in bottom platen lifting under the effect of bottom platen support spring, thus conveniently realizes the transmission of horizontal direction, the final leveling location realizing leveling ceramic chips.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Detailed description of the invention
Below in conjunction with accompanying drawing, the present invention is described in detail:
The convex leveling press of a kind of ceramic chips through hole post drum, comprise rectangular base 1, rectangular base 1 is provided with four guide support columns 2, four guide support columns 2 are set parallel to each other, and form rectangular shape, fixed head 3 of presenting a theatrical performance as the last item on a programme is fixedly installed on the top of four guide support columns 2, be provided with Fuel Oil Pressure Pneumatic cylinder 4 presenting a theatrical performance as the last item on a programme on fixed head 3, four angles of rectangle upper holder 5 are respectively arranged with a linear bearing installing hole 6, linear bearing 7 is provided with in linear bearing installing hole 6, guide support column 2 is movably arranged in linear bearing 7, the top of the projecting shaft stretched out downwards of Fuel Oil Pressure Pneumatic cylinder 4 is linked together by floating junction and rectangle upper holder 5, rectangular base 1 inside guide support column 2 is provided with bottom platen and transmits guide rail 9, transmit on guide rail 9 at bottom platen and be movably set with bottom platen U-shaped fixed head 12, rectangular base 1 between two bottom platens transmission guide rails 9 is provided with leading screw 10, feed screw nut 11 on leading screw 10 is fixed together with the bottom surface of bottom platen U-shaped fixed head 12, a bottom platen lead 13 is respectively arranged with at four drift angle places of bottom platen U-shaped fixed head 12 end face, present a theatrical performance as the last item on a programme in each of the lower on lead 13 and be provided with bottom platen support spring 14, a through hole 17 is provided with at four drift angle places of rectangle bottom platen 15, rectangle bottom platen 15 is crimped on the top of the bottom platen support spring 14 on bottom platen lead 13 by through hole 17 activity, rectangle bottom platen 15 is provided with ceramic chips 16, rectangular base 1 immediately below rectangle upper holder 5 is provided with leveling supporting seat 8, the height of leveling supporting seat 8 will lower than the top board bottom surface of bottom platen U-shaped fixed head 12.
In the through hole 17 of rectangle bottom platen 15, be provided with bottom platen linear bearing, bottom platen lead 13 is movably arranged in bottom platen linear bearing.
This pressure mechanism adopts Fuel Oil Pressure Pneumatic cylinder as the driving of four post guide type flattening pressure; Servomotor, guide rail and leading screw realize the entry/exit motion of workbench; The axis of guide, linear bearing and spring are used for unloading and should bear the flattening pressure on guide rail.This modern design, structure is simple, and pick and place and expect convenient, safety, cost performance is high, the domestic pressure mechanism also not having this type of the convex leveling of ceramic chips through hole post drum at present.

Claims (2)

1. the convex leveling press of ceramic chips through hole post drum, comprise rectangular base (1), rectangular base (1) is provided with four guide support columns (2), four guide support columns (2) are set parallel to each other, and form rectangular shape, fixed head of presenting a theatrical performance as the last item on a programme (3) is fixedly installed on the top of four guide support columns (2), fixed head of presenting a theatrical performance as the last item on a programme (3) is provided with Fuel Oil Pressure Pneumatic cylinder (4), four angles of rectangle upper holder (5) are respectively arranged with a linear bearing installing hole (6), linear bearing (7) is provided with in linear bearing installing hole (6), guide support column (2) is movably arranged in linear bearing (7), the top of the projecting shaft stretched out downwards of Fuel Oil Pressure Pneumatic cylinder (4) is linked together by floating junction and rectangle upper holder (5), it is characterized in that, the rectangular base (1) of guide support column (2) inner side is provided with bottom platen and transmits guide rail (9), transmit on guide rail (9) at bottom platen and be movably set with bottom platen U-shaped fixed head (12), rectangular base (1) between two bottom platens transmission guide rail (9) is provided with leading screw (10), feed screw nut (11) on leading screw (10) is fixed together with the bottom surface of bottom platen U-shaped fixed head (12), a bottom platen lead (13) is respectively arranged with at four drift angle places of bottom platen U-shaped fixed head (12) end face, present a theatrical performance as the last item on a programme in each of the lower on lead (13) and be provided with bottom platen support spring (14), a through hole (17) is provided with at four drift angle places of rectangle bottom platen (15), rectangle bottom platen (15) is crimped on the top of the bottom platen support spring (14) on bottom platen lead (13) by through hole (17) activity, rectangle bottom platen (15) is provided with ceramic chips (16), rectangular base (1) immediately below rectangle upper holder (5) is provided with leveling supporting seat (8), the height of leveling supporting seat (8) will lower than the top board bottom surface of bottom platen U-shaped fixed head (12).
2. the convex leveling press of a kind of ceramic chips through hole post drum according to claim 1, it is characterized in that, in the through hole (17) of rectangle bottom platen (15), be provided with bottom platen linear bearing, bottom platen lead (13) is movably arranged in bottom platen linear bearing.
CN201510942724.2A 2015-12-16 2015-12-16 Leveling and overlaying machine for raw ceramic chip through hole column protrusions Pending CN105563627A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510942724.2A CN105563627A (en) 2015-12-16 2015-12-16 Leveling and overlaying machine for raw ceramic chip through hole column protrusions

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510942724.2A CN105563627A (en) 2015-12-16 2015-12-16 Leveling and overlaying machine for raw ceramic chip through hole column protrusions

Publications (1)

Publication Number Publication Date
CN105563627A true CN105563627A (en) 2016-05-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510942724.2A Pending CN105563627A (en) 2015-12-16 2015-12-16 Leveling and overlaying machine for raw ceramic chip through hole column protrusions

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CN (1) CN105563627A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109760871A (en) * 2019-01-18 2019-05-17 东莞市联华焜智能装备技术有限公司 Garment clip fetches and delivers bag mechanism
CN111300331A (en) * 2019-12-19 2020-06-19 西北电子装备技术研究所(中国电子科技集团公司第二研究所) Large-pressure flip bonding method for bonding chip substrate after pre-welding
CN118181478A (en) * 2024-03-27 2024-06-14 思恩半导体科技(苏州)有限公司 Automatic leveling machine for raw ceramic chips

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060201349A1 (en) * 2005-02-02 2006-09-14 Roberts Kristian G Method and system for printing onto a deformable cast polymer article
CN101804568A (en) * 2010-03-19 2010-08-18 中国电子科技集团公司第二研究所 Linear motor driven air suspension motion platform
CN203128435U (en) * 2013-03-04 2013-08-14 潮州三环(集团)股份有限公司 Electronic ceramic sheet laminating machine
CN203721832U (en) * 2014-03-12 2014-07-16 恒泰精密股份有限公司 Automatic stacking machine
CN105060915A (en) * 2015-08-17 2015-11-18 太原风华信息装备股份有限公司 Surface-pressed type lamination device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060201349A1 (en) * 2005-02-02 2006-09-14 Roberts Kristian G Method and system for printing onto a deformable cast polymer article
CN101804568A (en) * 2010-03-19 2010-08-18 中国电子科技集团公司第二研究所 Linear motor driven air suspension motion platform
CN203128435U (en) * 2013-03-04 2013-08-14 潮州三环(集团)股份有限公司 Electronic ceramic sheet laminating machine
CN203721832U (en) * 2014-03-12 2014-07-16 恒泰精密股份有限公司 Automatic stacking machine
CN105060915A (en) * 2015-08-17 2015-11-18 太原风华信息装备股份有限公司 Surface-pressed type lamination device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109760871A (en) * 2019-01-18 2019-05-17 东莞市联华焜智能装备技术有限公司 Garment clip fetches and delivers bag mechanism
CN109760871B (en) * 2019-01-18 2024-05-03 东莞市一宏自动化设备有限公司 Clothes clamping and bag taking and conveying mechanism
CN111300331A (en) * 2019-12-19 2020-06-19 西北电子装备技术研究所(中国电子科技集团公司第二研究所) Large-pressure flip bonding method for bonding chip substrate after pre-welding
CN111300331B (en) * 2019-12-19 2021-08-06 西北电子装备技术研究所(中国电子科技集团公司第二研究所) Large-pressure flip bonding method for bonding chip substrate after pre-welding
CN118181478A (en) * 2024-03-27 2024-06-14 思恩半导体科技(苏州)有限公司 Automatic leveling machine for raw ceramic chips

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Application publication date: 20160511