CN213278033U

CN213278033U - Semiconductor vacuum coating microwave circuit shell assembling and pressing device

Info

Publication number: CN213278033U
Application number: CN202022801568.7U
Authority: CN
Inventors: 王保
Original assignee: Suzhou Vikings Precision Machinery Co ltd
Current assignee: Suzhou Vikings Precision Machinery Co ltd
Priority date: 2020-11-28
Filing date: 2020-11-28
Publication date: 2021-05-25
Anticipated expiration: 2030-11-28

Abstract

The utility model discloses a semiconductor vacuum coating microwave circuit shell assembling and pressing device, which comprises an arm machine frame and a lower template, wherein the arm machine frame comprises a support column, a base, a lower pressing rod, a gear shaft, an arm and a control box, one side of the lower pressing rod is of a zigzag structure, the lower pressing rod penetrates through the control box, a baffle is arranged at the top part, and a lower pressing plate is connected at the bottom part, the lower template is divided into an upper transverse plate, a lower transverse plate and a positioning vertical plate, in the actual operation process, the gear and the lower pressing rod are driven to move in a meshing way through the rotation of the arm, thereby completing the pressing and assembling of semiconductor leads of the semiconductor microwave circuit shell, the utility model has simple design and convenient operation, can be used for a long time, and can be used for completing the assembling of the semiconductor leads of the semiconductor microwave circuit shell under the condition that a tail order form or part of products are less, the cost is reduced and the energy is saved.

Description

Semiconductor vacuum coating microwave circuit shell assembling and pressing device

Technical Field

The utility model relates to a semiconductor package technical field, in particular to semiconductor vacuum coating microwave circuit shell equipment compression fittings.

Background

A semiconductor refers to a material having a conductivity between a conductor and an insulator at normal temperature. Semiconductors, a material whose conductivity can be controlled, ranging from insulators to conductors, have found widespread use in radios, televisions, and thermometry. Most of today's electronic products, such as computers, mobile phones or digital audio recorders, have a core unit closely related to semiconductors, wherein a semiconductor housing is an important component of the semiconductor, and in order to improve the heat dissipation power and heat dissipation uniformity of some devices, the semiconductor housing is required to be mounted, and some semiconductor leads are assembled on the semiconductor housing for connection. Most of the existing semiconductor lead assembly methods adopt automatic assembly, but under the condition that a tail order or an order is few or a part of products are missed to be assembled, automatic equipment is opened to produce a small amount of products, so that the cost is increased on one hand. On the other hand, resource waste is caused.

The utility model provides a semiconductor vacuum coating microwave circuit shell equipment compression fittings solves above-mentioned problem.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor vacuum coating microwave circuit shell equipment compression fittings solves above-mentioned problem.

For realizing the purpose of the utility model, the utility model adopts the technical scheme that: the arm machine frame comprises a support column, a base, a lower pressing rod, a gear shaft, an arm and a control box, wherein the support column is vertically fixed on the base, the control box is fixed at the top of the support column, the lower pressing rod penetrates through the control box, a baffle plate is arranged at the top of the lower pressing rod, a lower pressing plate is connected to the bottom of the lower pressing rod, one side of the lower pressing rod is of a zigzag structure, the gear shaft penetrates through the gear in the control box, two ends of the gear shaft extend out of the control box, the two ends of the gear shaft are fixed at two sides of the control box through a shaft collar, the arm is fixed at one end of the gear shaft through a lantern ring, the gear is in meshing contact with the zigzag structure of the lower pressing rod, 4-6 pressing pins are arranged at the bottom of the lower pressing plate, the distance between the pressing pins is matched with, Lower diaphragm and location riser, go up diaphragm and lower diaphragm and fix respectively in the top and the bottom of location riser, upward be equipped with the through-hole that supplies the pressure round pin to pass on the diaphragm, the through-hole with press round pin one-to-one mutual correspondence, the pressure round pin passes the through-hole and extends to near position in location riser middle part.

Furthermore, the lower pressing plate and the lower template are both made of bakelite materials.

Furthermore, the lower template is of an integrated structure.

Compared with the prior art, the utility model has the advantages that: in the actual operation process, the semiconductor lead wire is pre-assembled at the position where the semiconductor lead wire is required to be assembled on the semiconductor microwave circuit shell, then the semiconductor microwave circuit shell after the pre-assembly is placed on the lower transverse plate and is attached to the positioning vertical plate, the semiconductor lead wire pre-pressing pins correspond to each other one by one, the hand holds the arm to drive the gear to move in a meshing way with the sawtooth structure of the lower pressing plate, so that the lower pressing rod moves vertically upwards and downwards, the semiconductor lead wire of the semiconductor microwave circuit shell is assembled in a pressing way, the pressing rod moves upwards or downwards through the meshing motion, the damage to the semiconductor lead wire and the semiconductor microwave circuit shell caused by great force is avoided to a great extent, the upward and downward movement distance of the lower pressing rod can be controlled, the semiconductor lead wires with different lengths are assembled in a pressing way, the utility model, the design is simple, convenient operation can use for a long time, and the enterprise can utilize the repacking to put the equipment of accomplishing the semiconductor lead wire of semiconductor microwave circuit shell under the condition of less or partly missing the equipment of equipment to the order or order, reduce cost, the energy saving.

Drawings

FIG. 1 is a schematic structural view of the semiconductor vacuum coating microwave circuit housing assembling and pressing device of the present invention;

FIG. 2 is a front view of a portion of portion A of FIG. 1;

FIG. 3 is a schematic view of the engagement between the lower pressing rod and the gear in the structure of the assembling and pressing device for the vacuum-coated microwave circuit case of the semiconductor of the present invention;

in the figure: 1. an arm machine frame; 2, a lower template; 3, supporting columns; 4. a base; 5. a lower pressure lever; 6. a gear; 7. a gear shaft; 8. an arm; 9. a control box; 10. a baffle plate; 11. a lower pressing plate; 12. a saw-toothed structure; 13. a collar; 14. a collar; 15. pressing a pin; 16. an upper transverse plate; 17. a lower transverse plate; 18. the riser is positioned.

Detailed Description

In view of the deficiencies in the prior art, the technical solution of the present invention can be provided through long-term research and a large amount of practice. The technical solution in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention.

Fig. 1 is the utility model discloses a semiconductor vacuum coating film microwave circuit shell equipment compression fittings structure schematic diagram, fig. 2 is the front view of the partial schematic diagram of part A in fig. 1, and fig. 3 is the utility model discloses a depression bar and gear engagement's schematic diagram down in the semiconductor vacuum coating film microwave circuit shell equipment compression fittings structure, as shown in fig. 1, fig. 2 and fig. 3, the embodiment of the utility model provides a semiconductor vacuum coating film microwave circuit shell equipment compression fittings that provides: the device comprises an arm machine frame 1 and a lower template 2, wherein the arm machine frame 1 comprises a support column 3, a base 4, a lower pressing rod 5, a gear 6, a gear shaft 7, an arm 8 and a control box 9, the support column 3 is vertically fixed on the base 4, the control box 9 is fixed at the top of the support column 3, the lower pressing rod 5 penetrates through the control box 9, a baffle plate 10 is arranged at the top, a lower pressing plate 11 is connected at the bottom, a sawtooth structure 12 is arranged at one side of the lower pressing rod 5, the gear shaft 7 penetrates through the gear 6 in the control box 9, two ends of the gear shaft extend out of the control box 9, two ends of the gear shaft are fixed at two sides of the control box 9 through a shaft collar 13, the arm 8 is fixed at one end of the gear shaft 7 through a lantern ring 14, the gear 6 is in meshing contact with the sawtooth structure 12 of the lower pressing rod 5, 4-6 press pins 15 are arranged at the bottom of the lower pressing plate 11, and, the lower template 2 is divided into an upper transverse plate 16, a lower transverse plate 17 and a positioning vertical plate 18, the upper transverse plate 16 and the lower transverse plate 17 are respectively fixed at the top and the bottom of the positioning vertical plate 18, through holes for the pressing pins 15 to pass are formed in the upper transverse plate 16, the through holes correspond to the pressing pins 15 one by one, and the pressing pins 15 pass through the through holes and extend to the positions near the middle part of the positioning vertical plate 18.

Preferably, the lower pressing plate 11 and the lower template 2 are made of bakelite.

Preferably, the lower template 2 is of an integral structure.

The beneficial effects of the utility model include: in the actual operation process, the semiconductor lead wire is pre-assembled at the position where the semiconductor lead wire is required to be assembled on the semiconductor microwave circuit shell, then the semiconductor microwave circuit shell after the pre-assembly is placed on the lower transverse plate and is attached to the positioning vertical plate, the semiconductor lead wire pre-pressing pins correspond to each other one by one, the hand holds the arm to drive the gear to move in a meshing way with the sawtooth structure of the lower pressing plate, so that the lower pressing rod moves vertically upwards and downwards, the semiconductor lead wire of the semiconductor microwave circuit shell is assembled in a pressing way, the pressing rod moves upwards or downwards through the meshing motion, the damage to the semiconductor lead wire and the semiconductor microwave circuit shell caused by great force is avoided to a great extent, the upward and downward movement distance of the lower pressing rod can be controlled, the semiconductor lead wires with different lengths are assembled in a pressing way, the utility model, the design is simple, convenient operation can use for a long time, and the enterprise can utilize the repacking to put the equipment of accomplishing the semiconductor lead wire of semiconductor microwave circuit shell under the condition of less or partly missing the equipment of equipment to the order or order, reduce cost, the energy saving.

The utility model provides a semiconductor vacuum coating microwave circuit shell equipment compression fittings, it should be understood, above-mentioned embodiment is only for the explanation the utility model discloses a technical conception and characteristics, its aim at let the personage of familiar with this technique can understand the utility model discloses an according to in order to implement, can not restrict with this the utility model discloses a protection scope. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.

Claims

1. Semiconductor vacuum coating microwave circuit shell equipment compression fittings, its characterized in that: the arm machine frame comprises a support column, a base, a lower pressing rod, a gear shaft, an arm and a control box, wherein the support column is vertically fixed on the base, the control box is fixed at the top of the support column, the lower pressing rod penetrates through the control box, a baffle plate is arranged at the top of the lower pressing rod, a lower pressing plate is connected to the bottom of the lower pressing rod, one side of the lower pressing rod is of a zigzag structure, the gear shaft penetrates through the gear in the control box, two ends of the gear shaft extend out of the control box, the two ends of the gear shaft are fixed at two sides of the control box through a shaft collar, the arm is fixed at one end of the gear shaft through a lantern ring, the gear is in meshing contact with the zigzag structure of the lower pressing rod, 4-6 pressing pins are arranged at the bottom of the lower pressing plate, the distance between the pressing pins is matched with, Lower diaphragm and location riser, go up diaphragm and lower diaphragm and fix respectively in the top and the bottom of location riser, upward be equipped with the through-hole that supplies the pressure round pin to pass on the diaphragm, the through-hole with press round pin one-to-one mutual correspondence, the pressure round pin passes the through-hole and extends to near position in location riser middle part.

2. The assembly pressing device for the vacuum coating microwave circuit shell of the semiconductor of claim 1, wherein: the lower pressing plate and the lower template are both made of bakelite materials.

3. The assembly pressing device for the vacuum coating microwave circuit shell of the semiconductor of claim 1, wherein: the lower template is of an integrated structure.