CN113597136A - Cooling device is used in processing of SMT paster - Google Patents
Cooling device is used in processing of SMT paster Download PDFInfo
- Publication number
- CN113597136A CN113597136A CN202110861067.4A CN202110861067A CN113597136A CN 113597136 A CN113597136 A CN 113597136A CN 202110861067 A CN202110861067 A CN 202110861067A CN 113597136 A CN113597136 A CN 113597136A
- Authority
- CN
- China
- Prior art keywords
- extrusion plate
- rod section
- cooling
- rod
- processing according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 28
- 238000012545 processing Methods 0.000 title claims abstract description 19
- 238000001125 extrusion Methods 0.000 claims abstract description 33
- 238000003466 welding Methods 0.000 claims abstract description 14
- 239000000110 cooling liquid Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 13
- 238000003756 stirring Methods 0.000 claims abstract description 8
- 230000000694 effects Effects 0.000 claims abstract description 5
- 239000007788 liquid Substances 0.000 claims abstract description 5
- 229920001971 elastomer Polymers 0.000 claims description 19
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 claims description 15
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 15
- 238000007789 sealing Methods 0.000 claims description 14
- 210000005056 cell body Anatomy 0.000 claims description 13
- 239000012528 membrane Substances 0.000 claims description 13
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 10
- 210000004907 gland Anatomy 0.000 claims description 8
- 230000003712 anti-aging effect Effects 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 239000004816 latex Substances 0.000 claims description 5
- 229920000126 latex Polymers 0.000 claims description 5
- 239000002994 raw material Substances 0.000 claims description 5
- 239000004094 surface-active agent Substances 0.000 claims description 5
- 239000011787 zinc oxide Substances 0.000 claims description 5
- 239000002826 coolant Substances 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 6
- 238000009434 installation Methods 0.000 abstract description 4
- 238000012546 transfer Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000012549 training Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a cooling device for SMT (surface mount technology) patch processing, which comprises a table body, wherein an installation frame is arranged on the table body, a welding machine and a patch fixing clamp are arranged in the installation frame, a groove body is embedded on the table body, an extrusion plate is arranged in the groove body, a refrigerator is arranged on the top surface of the extrusion plate, a rotary driving piece is arranged at the bottom of the groove body, a driving rod is arranged at the output end of the rotary driving piece, the driving rod consists of a threaded rod section at the bottom and a smooth rod section at the top, the driving rod movably penetrates through the extrusion plate, a stirring piece is arranged at the top end of the driving rod, an elastic diaphragm is packaged at the top of the groove body, a sealed cavity is formed between the elastic diaphragm and the extrusion plate, and cooling liquid is injected into the cavity. The cooling device adopts a liquid cooling mode, the cooling liquid is fully contacted with the patch board through the diaphragm during cooling, and the stirrer is matched to ensure that the heat transfer efficiency of the contact surface is high, the cooling effect is good, the damage of the board can not be caused, and the influence on the welding process can not be caused; only one driving piece is adopted, the structure is simple, the operation and the control are convenient, and the use cost is low.
Description
Technical Field
The invention relates to the technical field of cooling, in particular to a cooling device for SMT patch processing.
Background
SMT is Surface mount Technology (Surface Mounted Technology), an acronym for Surface Mounted Technology, which is currently the most popular technique and process in the electronic assembly industry. SMT chip is a circuit assembly technique in which a leadless or short lead surface-mounted component is mounted on the surface of a printed circuit board or other substrate, and then soldered or assembled by means of reflow soldering or dip soldering. The SMT patch production line is matched with a large-scale electronic factory or a school training base of school and enterprise cooperation so as to produce PCB products with different specifications and different purposes.
When SMT (surface mount technology) chip processing is carried out, because the welding process can generate high temperature, if cooling measures are not taken in time, the solder paste can collapse, poor welding is caused, and even a substrate is burnt out. The existing cooling mode is that air cooling is adopted immediately after welding, the cooling rate is general, and the damage of components and parts just welded is easily caused by high-speed moving air current.
Disclosure of Invention
The invention aims to provide a cooling device for SMT (surface mount technology) chip processing, which solves the problems that the cooling efficiency is general, components are easily damaged and the like in a cooling mode during SMT chip processing.
The invention realizes the purpose through the following technical scheme:
the utility model provides a heat sink is used in processing of SMT paster, includes the stage body, be equipped with the mounting bracket on the stage body, be equipped with welding machine and paster mounting fixture in the mounting bracket, it is open cell body to inlay on the stage body and be equipped with the top, be equipped with the stripper plate that can move about from top to bottom in the cell body, the top surface of stripper plate is equipped with the refrigerator, and the bottom of cell body is equipped with rotary driving spare, rotary driving spare's output is equipped with the actuating lever, the actuating lever comprises the screw rod section at bottom and the smooth rod section at top, and the stripper plate is passed in the actuating lever activity, and the top of actuating lever is equipped with stirring piece, and the top of cell body is packaged with elastic diaphragm, form sealed cavity between elastic diaphragm and the stripper plate, and it has the coolant liquid to inject in the cavity.
The improved structure is characterized in that a threaded hole matched with the threaded rod section of the driving rod is formed in the extrusion plate, the driving rod penetrates through the threaded hole through the threaded rod section or the smooth rod section of the driving rod in a movable mode, when the driving rod is driven to rotate by the rotary driving piece, the extrusion plate moves upwards along the threaded rod section of the driving rod and finally stays at the height position of the smooth rod section or moves downwards along the threaded rod section, and when the extrusion plate stays at the height position of the smooth rod section, the elastic membrane is extruded by cooling liquid to protrude upwards and contacts with the lower surface of a paster on the paster fixing clamp.
The further improvement is that the raw materials for preparing the elastic membrane comprise 50-80 parts of centrifugal concentrated natural latex, 10-30 parts of synthetic isoprene latex, 0.5-2 parts of potassium hydroxide, 0.2-1.2 parts of zinc oxide, 0.5-1 part of surfactant and 0.05-0.5 part of anti-aging agent, and the elastic membrane is prepared by a conventional membrane forming process.
The further improvement is that the thickness of the elastic membrane in the uncompressed state is 0.2-0.8 mm.
The improved structure is characterized in that a plurality of guide rods are arranged in the groove body, and the guide rods vertically and movably penetrate through the extrusion plate.
The improved structure is characterized in that rubber sealing rings are arranged on the upper surface and the lower surface of the position where the guide rod penetrates through the extrusion plate, the rubber sealing rings are in close contact with the side wall of the guide rod, and the tightness of the penetrating position of the guide rod is guaranteed.
The improved structure is characterized in that a rubber sealing gland is sleeved on the smooth rod section of the driving rod, and when the extrusion plate stays at the height position of the smooth rod section, the rubber sealing gland is fully attached to the upper surface of the extrusion plate, so that the sealing performance of the penetration position of the driving rod is ensured.
The further improvement lies in that the driving rod is made of elastic rubber, the outer wall of the threaded rod section of the driving rod is in interference fit with the threaded hole in the extrusion plate, and the interference magnitude is 0.12-0.16 mm.
The further improvement is that the groove body and the extrusion plate are both made of vacuum heat insulation plates.
The invention has the beneficial effects that: the cooling device adopts a liquid cooling mode, the cooling liquid is fully contacted with the patch board through the diaphragm during cooling, the patch board can be fully attached even if the surface of the board is uneven, and the stirring of the stirrer is matched, so that the contact surface heat transfer efficiency is high, the cooling effect is good, the damage of the board cannot be caused, and the influence on the welding process cannot be caused; the cooling device only adopts one driving piece, has a simple structure, is convenient to control and has low use cost.
Drawings
FIG. 1 is a state diagram of the present invention when not cooling;
FIG. 2 is a state diagram of the present invention during cooling;
FIG. 3 is a schematic view of the drive rod;
in the figure: 1. a table body; 2. a mounting frame; 3. welding machine; 4. fixing a clamp by a patch; 5. a trough body; 6. a pressing plate; 7. a refrigerator; 8. a rotary drive member; 9. a drive rod; 901. a threaded rod section; 902. a smooth rod section; 10. a stirring sheet; 11. an elastic diaphragm; 12. a guide bar; 13. a rubber seal ring; 14. and (5) sealing the gland with rubber.
Detailed Description
The present application will now be described in further detail with reference to the drawings, it should be noted that the following detailed description is given for illustrative purposes only and is not to be construed as limiting the scope of the present application, as those skilled in the art will be able to make numerous insubstantial modifications and adaptations to the present application based on the above disclosure.
Referring to fig. 1 to 3, a cooling device for SMT patch processing includes a table body 1, an installation frame 2 is disposed on the table body 1, a welding machine 3 and a patch fixing clamp 4 are disposed in the installation frame 2, the patch fixing clamp 4 is formed by a cylinder expansion piece and a clamping thimble, and is used for fixing a patch plate, and the welding machine 3 is used for welding a circuit or a component; inlay on the stage body 1 and be equipped with the top and be open cell body 5, cell body 5 can be circular or square, be equipped with the stripper plate 6 that can move about from top to bottom in the cell body 5, the top surface of stripper plate 6 is equipped with refrigerator 7, for example semiconductor refrigerator, corresponding piece that heats can be installed at the lower surface of stripper plate 6, the bottom of cell body 5 is equipped with rotary driving spare 8, for example, a motor, rotary driving spare 8's output is equipped with actuating lever 9, actuating lever 9 comprises the smooth pole section 902 at the screw thread pole section 901 of bottom and top, the activity of actuating lever 9 passes stripper plate 6, the top of actuating lever 9 is equipped with stirring piece 10, cell body 5's top encapsulation has elastic diaphragm 11, form sealed cavity between elastic diaphragm 11 and the stripper plate 6, and it has the coolant liquid to pour into in the cavity.
In the invention, the extrusion plate 6 is provided with a threaded hole matched with the threaded rod section 901 of the driving rod 9, the driving rod 9 movably penetrates through the threaded hole through the threaded rod section 901 or the smooth rod section 902 of the driving rod 9, when the driving rod 9 is driven to rotate by the rotary driving piece 8, the extrusion plate 6 moves upwards along the threaded rod section 901 of the driving rod 9 and finally stays at the height position of the smooth rod section 902 or moves downwards along the threaded rod section 901, and when the extrusion plate 6 stays at the height position of the smooth rod section 902, the elastic membrane 11 is extruded by the cooling liquid to bulge upwards and is contacted with the lower surface of the patch on the patch fixing clamp 4.
In the invention, the raw materials for preparing the elastic membrane 11 comprise 50-80 parts of centrifugal concentrated natural latex, 10-30 parts of synthetic isoprene latex, 0.5-2 parts of potassium hydroxide, 0.2-1.2 parts of zinc oxide, 0.5-1 part of surfactant and 0.05-0.5 part of anti-aging agent, and are prepared by a conventional film forming process. For example, in one embodiment, the raw materials for preparation include 60 parts of centrifugal concentrated natural latex, 20 parts of synthetic isoprene latex, 1 part of potassium hydroxide, 0.8 part of zinc oxide, 0.6 part of surfactant, and 0.2 part of anti-aging agent. In another embodiment, the preparation raw materials comprise 80 parts of centrifugal concentrated natural latex, 15 parts of synthetic isoprene latex, 1.5 parts of potassium hydroxide, 1 part of zinc oxide, 0.8 part of surfactant and 0.4 part of anti-aging agent. The elastic membrane 11 prepared from the materials has the characteristics of high elasticity and high flexibility, is not easy to break and has good durability. When the heat conduction device is used, the heat conduction device can be fully attached to the surface of a patch through stretching deformation, gaps are few after the attachment, the contact area is increased, the heat conduction efficiency is improved, and the heat conduction device cannot be damaged due to edges and corners of the surface of the patch after the attachment. The thickness of the elastic membrane 11 in the non-compressed state is 0.2-0.8mm, preferably 0.5mm, and cannot be too thick, which would affect the heat conduction.
In the invention, a plurality of guide rods 12 are arranged in the groove body 5, and the guide rods 12 vertically and movably penetrate through the extrusion plate 6. The guide rods 12 function as guide rails so that the compression plate 6 can be stably moved up and down in the groove body 5.
In addition, in order to ensure that the cooling liquid does not leak, the periphery of the extrusion plate 6 is in sliding contact with the inner wall of the groove body 5, and the sealing performance is well treated, for example, rubber edges are added on the periphery of the extrusion plate 6. Aiming at the insertion position of the driving rod 9, rubber sealing rings 13 are arranged on the upper surface and the lower surface of the extrusion plate 6 at the position where the guide rod 12 is inserted, and the rubber sealing rings 13 are in close contact with the side wall of the guide rod 12, so that the sealing performance of the insertion position of the guide rod 12 is ensured. To the interlude position of actuating lever 9, the cover is equipped with rubber gland 14 on the smooth pole section 902 of actuating lever 9, and when stripper plate 6 stopped in smooth pole section 902 high position, rubber gland 14 fully laminated on stripper plate 6 upper surface, guaranteed the leakproofness of actuating lever 9 interlude position. The driving rod 9 is made of elastic rubber, the outer wall of the threaded rod section 901 of the driving rod 9 is in interference fit with the threaded hole in the extrusion plate 6, the interference magnitude is 0.12-0.16mm, the interference magnitude is not too large or too small, too large can cause too large driving resistance, and too small can affect the sealing property. The sealing is increased by an interference fit when the stripper plate 6 is in the threaded rod section 901 and by the rubber gland 14 when the stripper plate 6 is in the smooth rod section 902.
In the invention, the tank body 5 and the extrusion plate 6 are both made of vacuum heat insulation plates, so that the heat conduction of the low-temperature cooling liquid is ensured to be basically carried out only at the position of the elastic diaphragm 11.
The application process of the invention comprises the following steps: fix paster panel through paster mounting fixture 4 earlier, then carry out the welding process of circuit or components and parts through welding machine 3, add man-hour or process the completion after, can adopt the heat sink to carry out the cooling of paster panel, concrete operation is: the cooling liquid is cooled to a low temperature through the refrigerator 7 in advance, the rotary driving piece 8 is controlled to rotate towards one direction, the extrusion plate 6 moves upwards along the threaded rod section 901 of the driving rod 9, the moving process is realized, the space above the extrusion plate 6 is reduced, the elastic diaphragm 11 is extruded to deform upwards in a protruding mode, when the extrusion plate 6 rises to the smooth rod section 902, the elastic diaphragm 11 is just fully attached to the lower surface of a patch plate, heat exchange can be realized, high temperature on the patch plate is gradually transferred into the cooling liquid, the rotary driving piece 8 continues to rotate at the moment, the extrusion plate 6 cannot rise, the height is kept unchanged, the rotary driving piece 8 can be driven to rotate to drive the stirring piece 10 to stir the cooling liquid, the heated cooling liquid and the unheated cooling liquid at the lower part are uniformly mixed, and therefore the heat conduction efficiency of a contact position can be improved. After the cooling is accomplished, control rotary driving spare 8 and rotate towards another direction, and the stripper plate 6 can move down this moment, gets back to initial position, and corresponding elastic diaphragm 11 can kick-back and break away from paster panel, conveniently carries out the processing of next step or takes off the panel of more renewing.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention.
Claims (9)
1. The utility model provides a heat sink is used in processing of SMT paster, includes stage body (1), be equipped with on stage body (1) mounting bracket (2), be equipped with welding machine (3) and paster mounting fixture (4) in mounting bracket (2), its characterized in that: inlay on stage body (1) and be equipped with the top and be open cell body (5), be equipped with stripper plate (6) that can move about from top to bottom in cell body (5), the top surface of stripper plate (6) is equipped with refrigerator (7), and the bottom of cell body (5) is equipped with rotary driving spare (8), the output of rotary driving spare (8) is equipped with actuating lever (9), actuating lever (9) comprise threaded rod section (901) of bottom and smooth rod section (902) at top, and stripper plate (6) are passed in actuating lever (9) activity, and the top of actuating lever (9) is equipped with stirring piece (10), and the top encapsulation of cell body (5) has elastic diaphragm (11), form sealed cavity between elastic diaphragm (11) and stripper plate (6), and it has the coolant liquid to pour into in the cavity.
2. A temperature reducing device for SMT patch processing according to claim 1, wherein: the flexible chip mounter is characterized in that a threaded hole matched with the threaded rod section (901) of the driving rod (9) is formed in the extrusion plate (6), the driving rod (9) movably penetrates through the threaded hole through the threaded rod section (901) or the smooth rod section (902), when the driving rod (9) is driven to rotate by the rotary driving piece (8), the extrusion plate (6) moves upwards along the threaded rod section (901) of the driving rod (9) and finally stays at the height position of the smooth rod section (902) or moves downwards along the threaded rod section (901), and when the extrusion plate (6) stays at the height position of the smooth rod section (902), the elastic membrane (11) is extruded by cooling liquid to protrude upwards and is contacted with the lower surface of a chip on the chip fixing clamp (4).
3. A temperature reducing device for SMT patch processing according to claim 1 or 2, wherein: the elastic membrane (11) is prepared from raw materials including 50-80 parts of centrifugal concentrated natural latex, 10-30 parts of synthetic isoprene latex, 0.5-2 parts of potassium hydroxide, 0.2-1.2 parts of zinc oxide, 0.5-1 part of surfactant and 0.05-0.5 part of anti-aging agent by a conventional membrane forming process.
4. A cooling device for SMT patch processing according to claim 3, wherein: the thickness of the elastic membrane (11) in an uncompressed state is 0.2-0.8 mm.
5. A temperature reducing device for SMT patch processing according to claim 1 or 2, wherein: a plurality of guide rods (12) are arranged in the groove body (5), and the guide rods (12) vertically and movably penetrate through the extrusion plate (6).
6. A cooling device for SMT patch processing according to claim 5, wherein: the upper and lower surfaces of the position of the guide rod (12) which penetrates through the extrusion plate (6) are provided with rubber sealing rings (13), and the rubber sealing rings (13) are in close contact with the side wall of the guide rod (12) to ensure the tightness of the penetrating position of the guide rod (12).
7. A temperature reducing device for SMT patch processing according to claim 2, wherein: the smooth pole section (902) of actuating lever (9) are gone up the cover and are equipped with rubber gland (14), when stripper plate (6) stop in smooth pole section (902) high position, rubber gland (14) fully laminate at stripper plate (6) upper surface, guarantee the leakproofness of actuating lever (9) interlude position.
8. A temperature reducing device for SMT patch processing according to claim 2, wherein: the driving rod (9) is made of elastic rubber, the outer wall of a threaded rod section (901) of the driving rod (9) is in interference fit with a threaded hole in the extrusion plate (6), and the interference magnitude is 0.12-0.16 mm.
9. A temperature reducing device for SMT patch processing according to claim 2, wherein: the trough body (5) and the extrusion plate (6) are both made of vacuum heat insulation plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110861067.4A CN113597136A (en) | 2021-07-29 | 2021-07-29 | Cooling device is used in processing of SMT paster |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110861067.4A CN113597136A (en) | 2021-07-29 | 2021-07-29 | Cooling device is used in processing of SMT paster |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113597136A true CN113597136A (en) | 2021-11-02 |
Family
ID=78251495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110861067.4A Withdrawn CN113597136A (en) | 2021-07-29 | 2021-07-29 | Cooling device is used in processing of SMT paster |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113597136A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114083076A (en) * | 2022-01-14 | 2022-02-25 | 邳州市安达电子有限公司 | Brazing device suitable for LED chip |
-
2021
- 2021-07-29 CN CN202110861067.4A patent/CN113597136A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114083076A (en) * | 2022-01-14 | 2022-02-25 | 邳州市安达电子有限公司 | Brazing device suitable for LED chip |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113597136A (en) | Cooling device is used in processing of SMT paster | |
| CN218946587U (en) | Frock is fixed with PIN needle to IGBT welding | |
| CN103715106B (en) | The manufacture method of a kind of SPM and SPM | |
| CN209953957U (en) | Flexible welding device | |
| CN213847467U (en) | SMT (surface mount technology) surface mounting equipment for semiconductor electronic components | |
| CN217859308U (en) | DBC board fixed knot constructs and ultrasonic welding device | |
| CN204497951U (en) | A kind of small power module power source | |
| CN113660818B (en) | PCBA assembly structure and assembly method based on lever principle | |
| CN212848320U (en) | Pulse heating block structure for chip packaging | |
| CN210378649U (en) | Resistance value automatic correction equipment of resistance chip with welding lead | |
| CN209330477U (en) | It is a kind of to utilize package sealing with laser wiring thin film panel assembly | |
| CN214429787U (en) | Plasma etching equipment | |
| CN207835959U (en) | A kind of weld-ring automatic Picking device for discharging | |
| CN208016176U (en) | Power device presses structure in New energy electric vehicle controller | |
| CN109884349A (en) | A kind of elastic force automatic crimping device | |
| CN219145968U (en) | Efficient and energy-saving inverter heat dissipation bracket | |
| CN213278033U (en) | Semiconductor vacuum coating microwave circuit shell assembling and pressing device | |
| CN111132540A (en) | Multi-head multi-row intelligent LED chip mounter | |
| CN203467082U (en) | Local vacuum plugging device | |
| CN217859307U (en) | PIN transfer fixing structure and PIN ultrasonic welding device | |
| CN213888057U (en) | Metal part precision forming die | |
| CN211240328U (en) | Automatic PCB board pressfitting machine | |
| CN220993068U (en) | Reflow soldering jig | |
| CN220739747U (en) | Wave soldering jig | |
| CN212578423U (en) | Mainboard fixing device for television assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20211102 |