CN114083076A

CN114083076A - Brazing device suitable for LED chip

Info

Publication number: CN114083076A
Application number: CN202210039748.7A
Authority: CN
Inventors: 陈平章; 陈果章
Original assignee: Pizhou Anda Electronics Co ltd
Current assignee: Pizhou Anda Electronics Co ltd
Priority date: 2022-01-14
Filing date: 2022-01-14
Publication date: 2022-02-25
Anticipated expiration: 2042-01-14
Also published as: CN114083076B

Abstract

The application discloses a soldering device suitable for LED chips, which comprises a reinforcing plate, a position adjusting assembly and a clamping assembly, the top of the reinforcing plate is fixedly connected with a fixing plate through a supporting plate, the bottom of the fixing plate is provided with a clamping component, the clamping assembly comprises a finger cylinder, a first motor and a second hydraulic cylinder, the top end of the finger cylinder is penetrated by a first threaded rod, the first threaded rod is sleeved in the lifting plate, a first motor is arranged at the right end of the first threaded rod, the top of the lifting plate is provided with a second hydraulic cylinder, the finger cylinder is connected with the lifting plate in a sliding way, the bottom of the finger cylinder is provided with a position adjusting component, the position adjusting component comprises a moving block, a connecting block and a limiting mechanism, the bottom of the moving block is clamped in the annular groove and is in sliding connection with the annular groove, and the annular groove is formed in the top of the reinforcing plate. The application provides an adsorbable waste gas, have cooling protection effect and rotatable regulation's brazing device.

Description

Brazing device suitable for LED chip

Technical Field

The application relates to a brazing device, in particular to a brazing device suitable for an LED chip.

Background

Brazing, which is a welding method that after brazing filler metal lower than the melting point of a weldment and the weldment are heated to the melting temperature of the brazing filler metal at the same time, the liquid brazing filler metal is used for filling the gaps of solid workpieces to connect the metals. During brazing, an oxide film and oil stains on a contact surface of a base material are removed firstly, so that a capillary tube can play a role after the brazing filler metal is melted, and the wettability and the capillary fluidity of the brazing filler metal are improved. Brazing is divided into brazing and soldering according to the melting point of the brazing filler metal.

The chip does not get rid of the debris on surface before brazing and influences the welding effect easily, and the chip is spacing to place the difficult regulation in back position, is unfavorable for the contact of brazing filler metal and chip, restriction welded scope, and the difficult removal in position of brazing filler metal is adjusted, influences brazed effect, and the cooling structure cooling effect on the device is unsatisfactory, is difficult for cooling down the protection to chip and limit structure, is unfavorable for the use of whole device.

Disclosure of Invention

The brazing device suitable for the LED chip comprises a reinforcing plate, a position adjusting assembly and a clamping assembly, wherein the top of the reinforcing plate is fixedly connected with a fixing plate through a supporting plate, the bottom of the fixing plate is provided with the clamping assembly, the clamping assembly comprises a finger cylinder, a first motor and a second hydraulic cylinder, the top end of the finger cylinder is penetrated through by a first threaded rod, the first threaded rod is sleeved in a lifting plate, the right end of the first threaded rod is provided with the first motor, the top of the lifting plate is provided with the second hydraulic cylinder, the finger cylinder is in sliding connection with the lifting plate, the bottom of the finger cylinder is provided with the position adjusting assembly, the position adjusting assembly comprises a moving block, a connecting block and a limiting mechanism, the bottom of the moving block is clamped in the annular groove and is in sliding connection with the annular groove, the annular groove is formed in the top of the reinforcing plate, and the top of the moving block is fixedly connected with the first hydraulic cylinder, the utility model discloses a cooling device, including locating piece, cooling subassembly, water tank, reinforcing plate, water tank, connecting block, locating piece internally mounted have stop gear, the cooling subassembly is installed to locating piece one side, the cooling subassembly includes cooling plate, water tank and first fan, cooling plate rigid coupling is on the reinforcing plate, two the cooling plate passes through the cooling pipe and is connected on one side of the water tank, water tank top rigid coupling has first fan, one side rigid coupling that the water tank was kept away from to the reinforcing plate has the case of handling.

Further, first fan bottom rigid coupling has the tuber pipe, the tuber pipe is the T type of invering, tuber pipe one end is run through and is cup jointed with the cooling tube behind the water tank lateral wall, the water pump is installed to tuber pipe one side, the water pump rigid coupling is in water tank inner chamber bottom, water tank right side top rigid coupling has the fluviograph.

Further, the shift mechanism is installed to centre gripping subassembly top, the shift mechanism includes mounting panel, second threaded rod and fourth motor, the mounting panel rigid coupling is at second hydraulic cylinder top, mounting panel top rigid coupling has the slider, the slider is run through by the second threaded rod, the second threaded rod cup joints inside the fixed plate, rotate between second threaded rod and the fixed plate and be connected, second threaded rod one end rigid coupling has the output shaft of fourth motor, the gomphosis of fourth motor is in the fixed plate.

Further, adsorption apparatus constructs is still installed to the fixed plate bottom, adsorption apparatus constructs including adsorption plate, hydraulic push rod and purge tube, fixed plate top gomphosis has the purge tube, the purge tube passes through the adsorption tube and is connected with the adsorption plate, the adsorption plate top is passed through the shaft joint and is connected with hydraulic push rod, hydraulic push rod top gomphosis is in the fixed plate, the inside block of shaft joint has the connecting piece, connecting piece bottom rigid coupling is at the adsorption plate top, rotate between connecting piece and the shaft joint and be connected, the connecting axle has all been cup jointed at the connecting piece both ends, the connecting axle both ends all with the regulating wheel between the meshing be connected, regulating wheel one side rigid coupling has the output shaft of third motor, the third motor rigid coupling is in shaft joint one side.

Further, the locating piece bottom rigid coupling has the sleeve pipe, the rigid coupling has the gag lever post on the sleeve pipe, the gag lever post block is in the spacing groove on the connecting pipe, the spacing groove is the L type, rotate between locating piece and the connecting pipe and be connected, connecting pipe bottom rigid coupling has the second gear, the meshing of second gear right side has first gear, rotate between first gear and the gusset plate inner chamber and be connected, the output shaft fixed connection of first gear top and second motor, the gomphosis of second motor is on the gusset plate.

Further, stop gear includes first limiting plate, spring and fixed block, locating piece inner chamber bottom rigid coupling has two fixed blocks, the regulation pole has been cup jointed to fixed block one end, adjust the pole end and run through the locating piece lateral wall, through threaded connection between regulation pole and the second limiting plate, sliding connection between locating piece inner chamber bottom and locating piece is blocked to second limiting plate bottom.

Further, two install first limiting plate between the second limiting plate, sliding connection, and two between first limiting plate bottom and the locating piece inner chamber bottom the rigid coupling has the spring between the first limiting plate, first limiting plate is located the fixed block both sides, miniature vibrating motor is all installed to the fixed block left and right sides, the miniature vibrating motor rigid coupling is in the second limiting plate outside, the size of second limiting plate is greater than first limiting plate.

Furthermore, a cooling block is lapped at the bottom of the positioning block, a cooling coil is embedded in the cooling block, two ends of the cooling coil penetrate through the side wall of the cooling block and then are sleeved on connecting hoses, one of the connecting hoses is connected with the water pump, and the other connecting hose is connected with the water tank.

Further, handle incasement internally mounted and have clean mechanism, clean mechanism includes filter frame, washing shower nozzle and second fan, the rigid coupling has the guide block on handling the incasement wall, guide block one side block has the filter frame, sliding connection between filter frame and the guide block, the rocker has been cup jointed on the filter frame, the case lid is run through on the rocker top.

Further, the case lid block is handling the roof portion, case lid bottom gomphosis has the second fan, the water pipe is all installed to second fan both sides, water pipe bottom rigid coupling has the washing shower nozzle, the washing shower nozzle all runs through case lid bottom lateral wall.

The application has the advantages that: provides a soldering device which can absorb waste gas, has the cooling protection effect and can be adjusted in a rotating way.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.

FIG. 1 is a schematic perspective view of a soldering apparatus for LED chips according to an embodiment of the present application;

FIG. 2 is a schematic view of the overall structure of the embodiment shown in FIG. 1;

FIG. 3 is a schematic top view of the reinforcement plate structure of the embodiment shown in FIG. 1;

FIG. 4 is a schematic diagram of a first stop plate structure in the embodiment shown in FIG. 1;

FIG. 5 is a schematic view of the cooling block structure in the embodiment of FIG. 1;

FIG. 6 is a schematic view of the spacing rod of the embodiment of FIG. 1;

FIG. 7 is a schematic view of the second threaded rod arrangement of the embodiment of FIG. 1;

FIG. 8 is a schematic view of the connector structure of the embodiment of FIG. 1;

FIG. 9 is a schematic view of the air duct structure of the embodiment shown in FIG. 1;

FIG. 10 is a schematic view of the filter frame structure of the embodiment of FIG. 1;

fig. 11 is a schematic view of a part of an enlarged structure at a of fig. 2 in the embodiment shown in fig. 1.

The meaning of the reference symbols in the figures: 1. a fixing plate; 101. mounting a plate; 2. a support plate; 3. a cooling plate; 301. a cooling pipe; 4. a reinforcing plate; 401. an annular groove; 5. a moving block; 6. a first hydraulic cylinder; 7. cooling the block; 701. a cooling coil; 702. a connecting hose; 8. a connecting plate; 9. connecting blocks; 10. a finger cylinder; 11. a first motor; 12. an adsorption plate; 13. a first threaded rod; 14. a second hydraulic cylinder; 15. a second threaded rod; 16. a lifting plate; 17. a hydraulic push rod; 1701. a coupling; 18. a purge tube; 19. an adsorption tube; 20. a second motor; 2001. a first gear; 21. positioning blocks; 2101. a first limit plate; 2102. adjusting a rod; 2103. a spring; 2104. a second limiting plate; 2105. a fixed block; 22. a sleeve; 2201. a limiting rod; 23. a connecting pipe; 24. a second gear; 25. a connecting shaft; 26. an adjustment wheel; 27. a connecting member; 28. a third motor; 29. a fourth motor; 30. a slider; 31. a water tank; 3101. a water pump; 3102. a water level gauge; 32. a first fan; 3201. an air duct; 33. a filter frame; 34. a treatment tank; 35. a micro vibration motor; 36. a box cover; 37. cleaning the spray head; 38. a second fan; 39. a rocker; 40. and a guide block.

Detailed Description

In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

In this application, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in this application will be understood by those of ordinary skill in the art as appropriate.

Furthermore, the terms "mounted," "disposed," "provided," "connected," and "sleeved" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

Referring to fig. 1 to 11, the soldering device suitable for LED chips includes a reinforcing plate 4, a position adjusting assembly and a clamping assembly, the top of the reinforcing plate 4 is fixedly connected with a fixing plate 1 through a support plate 2, the bottom of the fixing plate 1 is provided with the clamping assembly, the clamping assembly includes a finger cylinder 10, a first motor 11 and a second hydraulic cylinder 14, the top end of the finger cylinder 10 is penetrated through by a first threaded rod 13, the first threaded rod 13 is sleeved in a lifting plate 16, the right end of the first threaded rod 13 is provided with the first motor 11, the top of the lifting plate 16 is provided with the second hydraulic cylinder 14, the finger cylinder 10 is slidably connected with the lifting plate 16, the bottom of the finger cylinder 10 is provided with the position adjusting assembly, the position adjusting assembly includes a moving block 5, a connecting block 9 and a limiting mechanism, the bottom of the moving block 5 is clamped in an annular groove 401 and slidably connected with the annular groove 401, the annular groove 401 is formed in the top of the reinforcing plate 4, the top of the moving block 5 is fixedly connected with a first hydraulic cylinder 6, the top end of the first hydraulic cylinder 6 is provided with a connecting block 9, the connecting block 9 is connected with the positioning block 21 through a connecting plate 8, a limiting mechanism is arranged inside the positioning block 21, a cooling component is arranged on one side of the positioning block 21 and comprises a cooling plate 3, a water tank 31 and a first fan 32, the cooling plate 3 is fixedly connected to the reinforcing plate 4, the two cooling plates 3 are connected with one side of the water tank 31 through cooling pipes 301, the top of the water tank 31 is fixedly connected with the first fan 32, one side of the reinforcing plate 4, far away from the water tank 31, is fixedly connected with a processing box 34, the clamping component can clamp and move the solder, and the solder is heated by an external welding gun to enable the bottom of the solder to be in contact with an area needing to be welded on the LED chip, the position adjusting assembly can limit the LED chip and adjust the position of the LED chip, so that the positions of the chip which are different can be adjusted and then welded conveniently.

In the above technical scheme, the solder can be clamped by the two clamping jaws at the bottom of the finger cylinder 10, the bottom end of the solder is bent to be in contact with a chip, the first motor 11 and the first threaded rod 13 can drive the finger cylinder 10 to move within the contact range of the adjustable solder and the chip, the second hydraulic cylinder 14 drives the finger cylinder 10 to move up and down, the solder is convenient to fuse and adhere to the chip after being heated, the top of the movable block 5 is clamped with the positioning hole, when the movable block 5 moves, the annular groove 401 guides the movement of the movable block 5, when the movable block 5 needs to be fixed, a bolt is installed in the positioning hole in the movable block 5, the bottom end of the bolt is inserted into the top of the reinforcing plate 4, and the positioning of the movable block 5 can be realized.

As an optimized technical scheme, an air pipe 3201 is fixedly connected to the bottom of the first fan 32, the air pipe 3201 is an inverted T-shaped pipe, one end of the air pipe 3201 penetrates through the side wall of the water tank 31 and then is sleeved with the cooling pipe 301, a water pump 3101 is installed on one side of the air pipe 3201, the water pump 3101 is fixedly connected to the bottom of the inner cavity of the water tank 31, and a water level gauge 3102 is fixedly connected to the top of the right side of the water tank 31.

First fan 32 among the above-mentioned technical scheme ventilates to cooling plate 3 inside through tuber pipe 3201, tuber pipe 3201 soaks in water tank 31, carry out the water-cooling, the inside water level of water level gauge 3102 detectable water tank 31, be convenient for in time to the inside water supply source that supplys of water tank 31, keep the inside rivers of water tank 31 to wrap up tuber pipe 3201, improve the cooling effect of cooling subassembly, the sealing washer has been cup jointed at the both ends that tuber pipe 3201 runs through water tank 31, the sealing washer rigid coupling is in water tank 31, can keep the inside sealed effect of water tank 31, reduce rivers escape water tank 31.

As an optimized scheme, a shifting mechanism is installed above the clamping component, the shifting mechanism includes a mounting plate 101, a second threaded rod 15 and a fourth motor 29, the mounting plate 101 is fixedly connected to the top of the second hydraulic cylinder 14, a sliding block 30 is fixedly connected to the top end of the mounting plate 101, the sliding block 30 is penetrated by the second threaded rod 15, the second threaded rod 15 is sleeved inside the fixing plate 1, the second threaded rod 15 is rotatably connected with the fixing plate 1, an output shaft of the fourth motor 29 is fixedly connected to one end of the second threaded rod 15, the fourth motor 29 is embedded in the fixing plate 1, the fourth motor 29 on the shifting mechanism drives the second threaded rod 15 to move, the sliding block 30 stably moves on the second threaded rod 15 and then drives the mounting plate 101 to drive the second hydraulic cylinder 14 to move back and forth at the bottom of the fixing plate 1, so as to bring convenience for contacting chips at different positions installed on the limiting mechanism, the contactable range of the solder and the chip is enlarged, and the chip is convenient to braze.

As a further optimized technical solution, an adsorption mechanism is further installed at the bottom of the fixed plate 1, the adsorption mechanism includes an adsorption plate 12, a hydraulic push rod 17 and a purification tube 18, the purification tube 18 is embedded at the top of the fixed plate 1, the purification tube 18 is connected with the adsorption plate 12 through an adsorption tube 19, the top of the adsorption plate 12 is connected with the hydraulic push rod 17 through a coupling 1701, the top end of the hydraulic push rod 17 is embedded in the fixed plate 1, a connecting member 27 is clamped inside the coupling 1701, the bottom end of the connecting member 27 is fixedly connected to the top of the adsorption plate 12, the connecting member 27 is rotatably connected to the coupling 1701, two ends of the connecting member 27 are respectively sleeved with a connecting shaft 25, two ends of the connecting shaft 25 are respectively engaged with an adjusting wheel 26, one side of the adjusting wheel 26 is fixedly connected to an output shaft of a third motor 28, the third motor 28 is fixedly connected to one side of the coupling 1701, the inner wall of the purification tube 18 is fixedly connected with activated carbon particles, so that preliminary adsorption treatment can be performed on waste gas, threads are formed in the top end of the purification tube 18, the threads are externally connected with purification equipment to enable negative pressure to be generated in the adsorption tube 19, waste gas adsorbed by an adsorption mechanism can be purified, and waste gas pollution caused by brazing is reduced; the bottom of the adsorption plate 12 is provided with an adsorption port, the third motor 28 drives the adjusting wheel 26 to rotate, the adjusting wheel 26 is meshed with the connecting shaft 25 to drive the connecting shaft 25 to rotate, the connecting shaft 25 drives the connecting piece 27 to rotate, the adsorption plate 12 is inclined, the angle of the adsorption plate 12 is adjusted, the contact area between the adsorption plate 12 and waste gas can be enlarged, and waste gas generated by brazing rises and is adsorbed by the adsorption plates 12 on the two sides of the second hydraulic cylinder 14.

As an expansion scheme, a sleeve 22 is fixedly connected to the bottom of the positioning block 21, a limit rod 2201 is fixedly connected to the sleeve 22, the limit rod 2201 is clamped in a limit groove on the connecting pipe 23, the limit groove is L-shaped, the positioning block 21 is rotatably connected to the connecting pipe 23, a second gear 24 is fixedly connected to the bottom of the connecting pipe 23, a first gear 2001 is engaged to the right side of the second gear 24, the first gear 2001 is rotatably connected to an inner cavity of the reinforcing plate 4, the top of the first gear 2001 is fixedly connected to an output shaft of the second motor 20, and the second motor 20 is embedded to the reinforcing plate 4.

The sleeve 22 fixedly connected with the bottom of the positioning block 21 is sleeved in the connecting pipe 23, the limiting rod 2201 is clamped in a limiting groove on the connecting pipe 23, the positioning block 21 is rotated, the limiting rod 2201 is clamped with the tail end of the limiting groove, the installation position of the sleeve 22 is limited, connection of the sleeve 22 and the connecting pipe 23 is realized, the rotation direction of the sleeve 22 during installation is the same as that of the second gear 24, when the position of the positioning block 21 needs to be adjusted, the second motor 20 drives the first gear 2001 to rotate, the first gear 2001 is meshed with the second gear 24, the second gear 24 and the positioning block 21 are further driven to rotate, position adjustment of the positioning block 21 is realized, when the positioning block 21 rotates on the reinforcing plate 4, the bottom end of the moving block 5 is clamped in the annular groove 401 to slide, synchronous movement adjustment of the positioning block 21 and the moving block 5 is realized, when the positioning block 21 needs to be detached from the top of the connecting pipe 23, the sleeve 22 is rotated reversely, so that the limiting rod 2201 moves in the limiting groove, the first hydraulic cylinder 6 is utilized to drive the connecting block 9 and the positioning block 21 to move upwards, the sleeve 22 moves upwards, the limiting rod 2201 is separated from the limiting groove, and the positioning block 21 is detached.

As a further preferable scheme, the limit mechanism comprises a first limit plate 2101, a spring 2103 and a fixed block 2105, two fixed blocks 2105 are fixedly connected to the bottom of the inner cavity of the positioning block 21, one end of each fixed block 2105 is sleeved with an adjusting rod 2102, the end of the adjusting rod 2102 penetrates through the side wall of the positioning block 21, the adjusting rod 2102 is connected with the second limiting plate 2104 through threads, the bottom of the second limit plate 2104 is clamped between the bottom of the inner cavity of the positioning block 21 and the positioning block 21 in a sliding connection mode, the LED chips are placed on one sides of the two first limit plates 2101 far away from the springs 2103, one sides of the chips far away from the first limit plates 2101 are clamped with the second limit plate 2104, the adjusting rods 2102 are rotated on two sides of the positioning block 21, one end of each adjusting rod 2102 rotates in the fixing block 2105, and the second limiting plate 2104 moves on the adjusting rods 2102 to clamp the left side and the right side of the chip, so that the chip is limited in the positioning block 21.

Furthermore, a first limiting plate 2101 is installed between the two second limiting plates 2104, the bottom of the first limiting plate 2101 is in sliding connection with the bottom of the inner cavity of the positioning block 21, a spring 2103 is fixedly connected between the two first limiting plates 2101, the first limiting plates 2101 are positioned at two sides of a fixing block 2105, the micro vibration motors 35 are installed at the left and right sides of the fixing block 2105, the micro vibration motors 35 are fixedly connected at the outer sides of the second limiting plates 2104, the size of the second limiting plates 2104 is larger than that of the first limiting plates 2101, the positioning block 21 can limit two LED chips, the limiting effect is good, the first limiting plates 2101 and the second limiting plates 2104 can be moved, so that the chips with different sizes can be limited and fixed, when the chips are brazed, the micro vibration motors 35 are controlled to work by using an external controller, and the micro vibration motors 35 can drive the chips to vibrate intermittently, the solder which is convenient to melt is filled in the area which needs to be welded on the chip, and the fitting degree of the solder and the chip is improved.

Further, locating piece 21 bottom overlap joint has cooling block 7, the inside gomphosis of cooling block 7 has cooling coil 701, cooling coil 701 both ends all run through behind the 7 lateral walls of cooling block cup joint on coupling hose 702, two coupling hose 702 is connected with water pump 3101, another coupling hose 702 is connected with water tank 31, and cooling block 7 is the metal material, and its inside cooling coil 701 both ends are connected with water pump 3101 and water tank 31 respectively, realize the circulation of rivers between water pump 3101 and water tank 31, guarantee the low temperature of cooling

block

7, and 7 tops of cooling block overlap joints with locating piece 21 can cool down the protection to locating piece 21, the rapid cooling after the chip brazes of being convenient for.

Further, handle case 34 internally mounted and have clean mechanism, clean mechanism includes filter frame 33, washing shower nozzle 37 and second fan 38, the rigid coupling has guide block 40 on handling the case 34 inner wall, guide block 40 one side block has filter frame 33, sliding connection between filter frame 33 and the guide block 40, rocker 39 has been cup jointed on filter frame 33, case lid 36 is run through on rocker 39 top, and the LED chip need clean the preliminary treatment before not brazing, opens the chamber door of handling case 34 one side, places the chip in filter frame 33, rotates rocker 39, moves down filter frame 33 and the cleaning solution contact that contains the sodium hydroxide of handling the bottom of case 34, soaks the solution processing to the oxide and the greasy dirt on chip surface, and the waterlogging caused by excessive rainfall that will move up filter frame 33 after soaking stews, reduces the remaining of cleaning solution on the chip.

Further, the case lid 36 block is at handling the top of case 34, case lid 36 bottom gomphosis has second fan 38, the water pipe is all installed to second fan 38 both sides, water pipe bottom rigid coupling has washing shower nozzle 37, washing shower nozzle 37 all runs through case lid 36 bottom lateral wall.

The external water source of water pipe sends into rivers and carries out the clear water with the chip of placing in filter frame 33 in water pipe and the washing shower nozzle 37 and wash, reduces the remaining of cleaning solution, and after the washing, second fan 38 with the heater strip air-dries the chip, and the moisture on chip surface volatilizees with higher speed, keeps the chip dry, opens the chamber door, takes out the chip from filter frame 33, will handle the inside remaining washing liquid discharge of case 34.

Has the advantages that:

oxide films and oil stains on the contact surfaces of the chips are removed and quickly dried in the air, so that the residues of impurities on the chips are reduced, and the chips are convenient to braze; the two chips can be simultaneously limited and placed, and the chips can be rotated to adjust positions to braze different areas on the chips; the structure for clamping the brazing filler metal can be movably adjusted, so that the brazing filler metal is convenient to contact and attach with the chip, and the brazing effect of the chip is improved; the cooling mechanism can rapidly cool the limiting mechanism and the chip, so that brazing forming is facilitated, waste gas generated during welding can be timely adsorbed and discharged, and environmental pollution is reduced.

It will be evident to those skilled in the art that the present application is not limited to the details of the foregoing illustrative embodiments, and that the present application may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

The above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims

1. Brazing device suitable for LED chip, its characterized in that: the device comprises a reinforcing plate (4), a position adjusting assembly and a clamping assembly, wherein the top of the reinforcing plate (4) is fixedly connected with a fixing plate (1) through a supporting plate (2), the bottom of the fixing plate (1) is provided with the clamping assembly, the clamping assembly comprises a finger cylinder (10), a first motor (11) and a second hydraulic cylinder (14), the top end of the finger cylinder (10) is penetrated through by a first threaded rod (13), the first threaded rod (13) is sleeved in a lifting plate (16), the right end of the first threaded rod (13) is provided with the first motor (11), the top of the lifting plate (16) is provided with the second hydraulic cylinder (14), the finger cylinder (10) is in sliding connection with the lifting plate (16), the bottom of the finger cylinder (10) is provided with the position adjusting assembly, the position adjusting assembly comprises a moving block (5), a connecting block (9) and a limiting mechanism, the bottom of the moving block (5) is clamped in the annular groove (401) and is in sliding connection with the annular groove (401), the annular groove (401) is formed in the top of the reinforcing plate (4), a first hydraulic cylinder (6) is fixedly connected to the top of the moving block (5), a connecting block (9) is installed at the top end of the first hydraulic cylinder (6), the connecting block (9) is connected with the positioning block (21) through a connecting plate (8), a limiting mechanism is installed inside the positioning block (21), a cooling assembly is installed on one side of the positioning block (21), the cooling assembly comprises a cooling plate (3), a water tank (31) and a first fan (32), the cooling plate (3) is fixedly connected to the reinforcing plate (4), the two cooling plates (3) are connected with one side of the water tank (31) through cooling pipes (301), and a first fan (32) is fixedly connected to the top of the water tank (31), one side of the reinforcing plate (4) far away from the water tank (31) is fixedly connected with a treatment tank (34).

2. The soldering apparatus for LED chips according to claim 1, wherein: first fan (32) bottom rigid coupling has tuber pipe (3201), tuber pipe (3201) is the T type of inversion, tuber pipe (3201) one end is run through behind water tank (31) lateral wall and is cup jointed with cooling pipe (301), water pump (3101) are installed to tuber pipe (3201) one side, water pump (3101) rigid coupling is in water tank (31) inner chamber bottom, water tank (31) right side top rigid coupling has fluviograph (3102).

3. The soldering apparatus for LED chips according to claim 1, wherein: the utility model discloses a hydraulic clamping device, including centre gripping subassembly, mounting panel (101), second threaded rod (15) and fourth motor (29), mounting panel (101) rigid coupling is at second hydraulic cylinder (14) top, mounting panel (101) top rigid coupling has slider (30), slider (30) are run through by second threaded rod (15), second threaded rod (15) cup joint inside fixed plate (1), rotate between second threaded rod (15) and fixed plate (1) and be connected, second threaded rod (15) one end rigid coupling has the output shaft of fourth motor (29), fourth motor (29) gomphosis is in fixed plate (1).

4. The soldering apparatus for LED chips according to claim 1, wherein: the bottom of the fixing plate (1) is further provided with an adsorption mechanism, the adsorption mechanism comprises an adsorption plate (12), a hydraulic push rod (17) and a purification tube (18), the purification tube (18) is embedded in the top of the fixing plate (1), the purification tube (18) is connected with the adsorption plate (12) through an adsorption tube (19), the top of the adsorption plate (12) is connected with the hydraulic push rod (17) through a coupler (1701), the top end of the hydraulic push rod (17) is embedded in the fixing plate (1), a connecting piece (27) is clamped in the coupler (1701), the bottom end of the connecting piece (27) is fixedly connected to the top of the adsorption plate (12), the connecting piece (27) is rotatably connected with the coupler (1701), two ends of the connecting piece (27) are respectively sleeved with a connecting shaft (25), two ends of the connecting shaft (25) are respectively engaged with an adjusting wheel (26), one side of the adjusting wheel (26) is fixedly connected with an output shaft of a third motor (28), the third motor (28) is fixedly connected to one side of the coupling (1701).

5. The soldering apparatus for LED chips according to claim 1, wherein: locating piece (21) bottom rigid coupling has sleeve pipe (22), the rigid coupling has gag lever post (2201) on sleeve pipe (22), gag lever post (2201) block is in the spacing inslot on connecting pipe (23), the spacing groove is the L type, rotate between locating piece (21) and connecting pipe (23) and be connected, connecting pipe (23) bottom rigid coupling has second gear (24), second gear (24) right side meshing has first gear (2001), rotate between first gear (2001) and gusset plate (4) inner chamber and be connected, the output shaft fixed connection of first gear (2001) top and second motor (20), second motor (20) gomphosis is on gusset plate (4).

6. The soldering apparatus for LED chips according to claim 1, wherein: stop gear includes first limiting plate (2101), spring (2103) and fixed block (2105), locating piece (21) inner chamber bottom rigid coupling has two fixed blocks (2105), regulation pole (2102) have been cup jointed to fixed block (2105) one end, it runs through locating piece (21) lateral wall to adjust pole (2102) end, through threaded connection between regulation pole (2102) and second limiting plate (2104), sliding connection between locating piece (21) inner chamber bottom and locating piece (21) is blocked to second limiting plate (2104) bottom.

7. The soldering apparatus for LED chips according to claim 6, wherein: two install first limiting plate (2101) between second limiting plate (2104), sliding connection between first limiting plate (2101) bottom and locating piece (21) inner chamber bottom, and two the rigid coupling has spring (2103) between first limiting plate (2101), first limiting plate (2101) is located fixed block (2105) both sides, miniature vibrating motor (35) are all installed to fixed block (2105) the left and right sides, miniature vibrating motor (35) rigid coupling is in the second limiting plate (2104) outside, the size of second limiting plate (2104) is greater than first limiting plate (2101).

8. The soldering apparatus for LED chips according to claim 1, wherein: the cooling block (7) is lapped at the bottom of the positioning block (21), the cooling coil (701) is embedded in the cooling block (7), two ends of the cooling coil (701) penetrate through the side wall of the cooling block (7) and then are sleeved on the connecting hose (702), one of the connecting hose (702) is connected with the water pump (3101), and the other connecting hose (702) is connected with the water tank (31).

9. The soldering apparatus for LED chips according to claim 1, wherein: handle case (34) internally mounted and have clean mechanism, clean mechanism includes filter frame (33), washing shower nozzle (37) and second fan (38), the rigid coupling has guide block (40) on handling case (34) inner wall, guide block (40) one side block has filter frame (33), sliding connection between filter frame (33) and guide block (40), filter frame (33) are gone up to cup joint rocker (39), case lid (36) is run through on rocker (39) top.

10. The soldering apparatus for LED chips according to claim 9, wherein: case lid (36) block is handling case (34) top, case lid (36) bottom gomphosis has second fan (38), the water pipe is all installed to second fan (38) both sides, water pipe bottom rigid coupling has washing shower nozzle (37), washing shower nozzle (37) all run through case lid (36) bottom lateral wall.