CN215627739U - Be applied to heat dissipation of NVME interface SSD card and label - Google Patents
Be applied to heat dissipation of NVME interface SSD card and label Download PDFInfo
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- CN215627739U CN215627739U CN202120347302.1U CN202120347302U CN215627739U CN 215627739 U CN215627739 U CN 215627739U CN 202120347302 U CN202120347302 U CN 202120347302U CN 215627739 U CN215627739 U CN 215627739U
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Abstract
The utility model discloses a heat dissipation labeling device applied to an NVME interface SSD card, which comprises a chemical corrosion or electrolytic corrosion stainless steel plate, a double-sided adhesive layer, a heat conduction layer and a heat conduction adhesive layer, wherein the chemical corrosion or electrolytic corrosion stainless steel plate is attached to one surface of the double-sided adhesive layer, the other surface of the double-sided adhesive layer is attached to one surface of the heat conduction layer, and the other surface of the heat conduction layer is attached to one surface of the heat conduction adhesive layer. The heat conduction layer and the heat conduction adhesive layer have good heat conduction performance and can absorb heat on the SSD card; the stainless steel has large specific heat capacity and good heat storage performance, can absorb the heat of the heat conducting layer and radiate the heat to the air, and can avoid the sticking and the warping of the heat dissipation label caused by overhigh temperature of the SSD card; simple structure, convenient manufacture and convenient use.
Description
Technical Field
The utility model relates to the technical field of SSD card labels, in particular to a heat dissipation label applied to an NVME interface SSD card.
Background
With the coming of the electronic information era, the demand of electronic device labels is increasing day by day, most of the existing electronic device labels use plastic films and adhesive paper labels, and SSD cards generate large heat in the working process, so that the phenomenon that the labels are warped due to the fact that heat is difficult to dissipate is easily caused.
SUMMERY OF THE UTILITY MODEL
The utility model provides a radiating and labeling method applied to an NVME interface SSD card, which can well solve the problem that an electronic device label in the prior art is warped.
A heat dissipation labeling applied to an NVME interface SSD card is characterized by comprising: the chemical corrosion or electrolytic corrosion stainless steel plate is attached to one side of the double-sided adhesive layer, the other side of the double-sided adhesive layer is attached to one side of the heat conducting layer, and the other side of the heat conducting layer is attached to one side of the heat conducting adhesive layer.
Preferably, the heat-conducting layer is a copper foil layer, and two sides of the copper foil layer are respectively attached to the double-sided adhesive layer and the heat-conducting adhesive layer.
Preferably, the protective film comprises a protective film, wherein a chemical corrosion or electrolytic corrosion stainless steel plate and a double-sided adhesive layer are respectively attached to two sides of the protective film; the heat conducting layer comprises a copper foil layer, first double-sided adhesive and an artificially synthesized graphite film; the one side attached double-sided glue film of copper foil layer, wherein the attached first double-sided glue of copper foil layer another side, the attached synthetic graphite membrane of another side of first double-sided glue.
Preferably, the copper foil layer is any one of a copper foil, a carbon copper foil, a graphene-coated copper foil, and a nanocarbon-coated copper foil.
Preferably, when the heat conduction layer is the copper foil layer, the thickness of the heat conduction layer is 50-200 um.
Preferably, when the heat-conducting layer includes copper foil layer, first double faced adhesive tape and synthetic graphite membrane, the gross thickness of copper foil layer, first double faced adhesive tape and synthetic graphite membrane is 77 ~ 450um, and the thickness of protection film is 10um ~ 200 um.
Preferably, the heat-conducting adhesive layer is a heat-conducting double-sided adhesive or an acrylic adhesive.
Preferably, the heat conducting glue layer includes heat conducting silica gel and two second double-sided glues, wherein one side of one second double-sided glue is attached to the other side of the heat conducting layer, the other side of one second double-sided glue is attached to one side of the heat conducting silica gel, and the other side of the heat conducting silica gel is attached to one side of the other second double-sided glue.
Preferably, when the heat-conducting adhesive layer is a heat-conducting double-sided adhesive, the thickness of the heat-conducting adhesive layer is 50-300 um; when the heat-conducting adhesive layer is made of acrylic adhesive, the thickness of the heat-conducting adhesive layer is 10-50 um.
Preferably, the thickness of the heat-conducting silica gel is 0.1-0.5 mm, and the thickness of any second double-sided adhesive is 10-50 um.
Preferably, the thickness of the stainless steel plate subjected to chemical corrosion or electrolytic corrosion is set to be 0.2-0.6 mm, and the thickness of the double-sided adhesive layer is set to be 10-50 um.
The heat dissipation labeling applied to the NVME interface SSD card comprises a chemical corrosion or electrolytic corrosion stainless steel plate, a double-sided adhesive layer, a heat conduction layer and a heat conduction adhesive layer, wherein the chemical corrosion or electrolytic corrosion stainless steel plate is attached to one surface of the double-sided adhesive layer, the other surface of the double-sided adhesive layer is attached to one surface of the heat conduction layer, and the other surface of the heat conduction layer is attached to one surface of the heat conduction adhesive layer. During the use, the heat dissipation is pasted the attached surface in SSD card, the SSD card is at the in-process of work, can produce great heat, because heat-conducting layer and heat-conducting glue layer have good heat conductivility, the heat can be derived to chemical attack or electrolytic corrosion stainless steel tablet through heat-conducting layer and heat-conducting glue layer, and chemical attack or electrolytic corrosion stainless steel tablet have great specific heat capacity, heat-retaining property is good, the heat that can the rapid absorption heat-conducting layer and heat-conducting glue layer derive, chemical attack or electrolytic corrosion stainless steel tablet and air contact, the heat finally gives off in the air, with the SSD card surperficial temperature reduction that the heat dissipation was pasted and is contacted, avoid the heat dissipation to paste and stick the stick up.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
fig. 1 is a schematic view of a heat dissipation labeling structure applied to an NVME interface SSD card in the first embodiment;
fig. 2 is a cross-sectional view of a heat dissipation label applied to the SSD card of the NVME interface in the second embodiment;
fig. 3 is a schematic view of a heat-dissipating and labeling heat-conductive adhesive layer structure applied to the NVME interface SSD card in the third embodiment;
fig. 4 is a schematic diagram of a heat dissipation labeling structure applied to the NVME interface SSD card in the fourth embodiment;
fig. 5 is a schematic diagram of a heat dissipation labeling structure applied to the NVME interface SSD card in the fifth embodiment.
Description of reference numerals:
1. chemically or electrolytically corroded stainless steel brands; 2. a double-sided adhesive layer; 3. a heat conductive layer; 31. a copper foil layer; 32. a first double-sided adhesive; 33. artificially synthesizing a graphite film; 4. a heat-conducting adhesive layer; 41. heat conducting silica gel; 42. a second double-sided adhesive; 5. and (5) protecting the film.
Detailed Description
In the following description, for purposes of explanation, numerous implementation details are set forth in order to provide a thorough understanding of the various embodiments of the present invention. It should be understood, however, that these implementation details are not to be interpreted as limiting the utility model. That is, in some embodiments of the utility model, such implementation details are not necessary. In addition, some conventional structures and components are shown in simplified schematic form in the drawings.
In addition, the descriptions related to the first, the second, etc. in the present invention are only used for description purposes, do not particularly refer to an order or sequence, and do not limit the present invention, but only distinguish components or operations described in the same technical terms, and are not understood to indicate or imply relative importance or implicitly indicate the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Example one
Referring to fig. 1, fig. 1 is a schematic diagram of a heat dissipation labeling structure applied to an NVME interface SSD card in this embodiment. The heat dissipation label applied to the NVME interface SSD card in the embodiment comprises a chemical corrosion or electrolytic corrosion stainless steel plate 1, a double-sided adhesive layer 2, a heat conduction layer 3 and a heat conduction adhesive layer 4, wherein the chemical corrosion or electrolytic corrosion stainless steel plate 1 is attached to one surface of the double-sided adhesive layer 2, the other surface of the double-sided adhesive layer 2 is attached to one surface of the heat conduction layer 3, and the other surface of the heat conduction layer 3 is attached to one surface of the heat conduction adhesive layer 4.
In the case of applying to the heat dissipation label of the NVME interface SSD card, the chemical corrosion or electrolytic corrosion stainless steel plate 1, the double-sided adhesive layer 2, the heat conduction layer 3 and the heat conduction adhesive layer 4 are sequentially overlapped and attached, in the case, the heat conduction adhesive layer 4 has good viscosity, the whole heat dissipation label can be fixedly attached to the SSD card, the heat conduction adhesive layer 4 also has good heat conduction performance, the heat generated in the working process of the SSD card can be absorbed and transferred to the heat conduction layer 3, the heat conduction layer 3 also has good heat conduction performance, the heat of the heat conduction adhesive layer 4 attached to one side of the heat conduction adhesive layer can be absorbed, the other side of the heat conduction adhesive layer is connected with the double-sided adhesive layer 2, the double-sided adhesive layer 4 has good viscosity, the chemical corrosion or electrolytic corrosion stainless steel plate 1 and the heat conduction layer 3 can be fixedly attached, the chemical corrosion or electrolytic corrosion stainless steel plate 1 has good heat storage performance, and the heat of the heat conduction layer 3 can be absorbed, and in giving off the heat to the air, can avoid the heat dissipation to label because of the high temperature produces deformation, furtherly, can prevent that whole heat dissipation from labeling bonds and rises to stick up, and chemical corrosion or electrolytic corrosion stainless steel tablet 1 utilizes its good elasticity can also be fine support whole heat dissipation label.
Example two
Referring to fig. 2, fig. 2 is a cross-sectional view of a heat dissipation label applied to an NVME interface SSD card in the present embodiment. Unlike the first embodiment, the heat conductive layer 3 is a copper foil layer 31. Copper foil layer 31 uses and is any one of copper foil, carbon copper foil, graphite alkene coating copper foil or nanometer carbon coating copper foil, and the thickness of copper foil layer 31 material is 50 ~ 200um, and double faced adhesive tape 2 adopts the double faced adhesive tape, and the thickness of double faced adhesive tape is 10 ~ 50um, and heat conduction glue layer 4 adopts the heat conduction double faced adhesive tape material, and heat conduction double faced adhesive tape thickness is 50 ~ 300um, and chemical corrosion or electrolytic corrosion stainless steel tablet 1 thickness is 0.2 ~ 0.6 mm.
The heat conducting layer 3 is a copper foil layer 31, the copper foil layer 31 is made of a copper foil material, the thickness of the copper foil material is 50-200 um, the copper foil has good heat conducting performance and can absorb heat transferred by the heat conducting adhesive layer 4, and when the thickness of the copper foil material is smaller than 50um, the heat conducting performance of the heat conducting layer 3 can be reduced; when the thickness of the copper foil material is larger than 200um, the heat dissipation label can not be applied to the SSD card due to the excessive thickness. Double-sided adhesive layer 2 adopts the double faced adhesive tape, double-sided adhesive layer's thickness is 10 ~ 50um, double-sided adhesive layer 2 adopts the double faced adhesive tape, can realize copper foil layer 31 and chemical corrosion or electrolytic corrosion stainless steel tablet 1's connection, still can carry out fine fixing to the chemical corrosion of attached its one side or electrolytic corrosion stainless steel tablet 1 and the copper foil of attached another side, in order to guarantee the wholeness of product better, thickness setting when double-sided adhesive layer 2 is less than 10um, can influence whole double-sided adhesive layer 2's viscidity, thickness setting when double-sided adhesive layer 2 is greater than 50um, can postpone heat dissipation of heat-conducting layer 3, thereby influence the heat dispersion of whole product. Heat-conducting glue layer 4 adopts the heat-conducting double faced adhesive tape material, heat-conducting double faced adhesive tape thickness is 50 ~ 300um, heat that the SSD card of attached its one side produced in the course of the work can be absorbed to heat-conducting glue layer 4's heat-conducting double faced adhesive tape, when heat-conducting double faced adhesive tape thickness sets up and is less than 50um, the heat that produces in the SSD card course of the work can't be absorbed fast to heat-conducting property of heat-conducting double faced adhesive tape, when heat-conducting double faced adhesive tape thickness sets up and is greater than 300um, the heat dissipation label can be because of the too thick unable heat that uses on the SSD card. Chemical corrosion or electrolytic corrosion stainless steel tablet 1 thickness is 0.2 ~ 0.6mm, and when chemical corrosion or electrolytic corrosion stainless steel tablet 1 thickness is less than 0.2mm, the possibility of wearing out when carrying out product appearance design, when chemical corrosion or electrolytic corrosion stainless steel tablet 1 thickness is greater than 0.6mm, the heat dissipation is pasted and will be unable to use, and raw materials cost is also high.
EXAMPLE III
Referring to fig. 3, fig. 3 is a schematic view of a structure of a heat-dissipating and labeling thermal conductive adhesive layer applied to an NVME interface SSD card in the present embodiment. Unlike the first embodiment, the thermal conductive adhesive layer 4 includes a thermal conductive silicone rubber 41 and two second double-sided adhesives 42. One surface of one of the second double-sided adhesive 42 is attached to the other surface of the heat conducting layer 3, the other surface of the one second double-sided adhesive 42 is attached to one surface of the heat conducting silica gel 41, and the other surface of the heat conducting silica gel 41 is attached to one surface of the other second double-sided adhesive 42. The thickness of the heat-conducting silica gel 41 is 0.1-0.5 mm, and the thickness of any second double-sided adhesive 42 is 10-50 um.
Wherein, the heat conduction glue layer 4 includes heat conduction silica gel 41 and two second double faced adhesive tapes 42, heat conduction silica gel 41 is located between two second double faced adhesive tapes 42, one of them second double faced adhesive tape 42 another side is attached with heat conduction layer 3, another second double faced adhesive tape 42 another side is pasted in the SSD card, specifically when using whole heat dissipation to label, heat conduction glue layer 41 uses heat conduction silica gel 41 and two second double faced adhesive tapes 42, can guarantee that the subsides performance of whole label is better, it is more firm to paste with the SSD card, and then can prolong the live time of whole label. The thickness of the heat-conducting silica gel 41 is 0.1-0.5 mm, when the thickness of the heat-conducting silica gel 41 is smaller than 0.1mm, the heat-conducting performance of the heat-conducting layer 4 cannot be ensured, and when the thickness of the heat-conducting silica gel 41 is larger than 0.5mm, the use of the SSD card is influenced due to the fact that the whole heat-radiating label is too thick; any thickness of the second double-sided adhesive 42 is 10-50 um, when the thickness of any second double-sided adhesive 42 is less than 10um, the viscosity of the heat-conducting adhesive layer 4 is reduced, so that the label is easily delaminated, and when the thickness of any second double-sided adhesive 42 is more than 50um, the heat-conducting performance of the product is affected due to the fact that the heat-radiating label is too thick.
Example four
Referring to fig. 4, fig. 4 is a schematic diagram of a heat dissipation labeling structure applied to an NVME interface SSD card in this example. Different from the first embodiment, the heat dissipation label also comprises a protective film 5, wherein the two sides of the protective film 5 are respectively attached with a chemically corroded or electrolytically corroded stainless steel plate 1 and a double-sided adhesive layer 2; the heat conducting layer 3 comprises a copper foil layer 31, a first double-sided adhesive 32 and an artificially synthesized graphite film 33; one surface of the copper foil layer 31 is attached with the double-sided adhesive layer 2, the other surface of the copper foil layer 31 is attached with one surface of the first double-sided adhesive 32, and the other surface of the first double-sided adhesive 32 is attached with the synthetic graphite film 33. The material of protection film 5 is PET plastic film, and the thickness of protection film 5 is 10um ~ 200 um. The total thickness of the copper foil layer 31, the first double-sided adhesive 32 and the synthetic graphite film 33 is 77-450 um.
The protective film 5 can prevent the powder of the synthetic graphite film 33 from falling out of the closed double-sided adhesive layer 2. The copper foil layer 31, the first double-sided adhesive 32 and the artificially synthesized graphite film 33 of the heat conduction layer 3 are sequentially overlapped and attached, so that the heat conduction performance of the whole heat conduction layer 3 is better, the heat transferred by the heat conduction adhesive layer 4 can be absorbed more quickly, the heat dissipation of the SSD card in work is quicker, and the service life of the SSD card can be prolonged. In this embodiment, the protective film 5 is made of a PET plastic film, so that the stretch property is good and the manufacturing cost is low; the thickness of the protective film 5 is 10-200 um, the thickness of the protective film 5 is less than 10um, and the protective film 5 is easy to tear; the thickness of protection film 5 is greater than 200um, can reduce whole label radiating effect because of protection film 5 is too thick. The total thickness of the copper foil layer 31, the first double-sided adhesive 32 and the artificially synthesized graphite film 33 is 77-450 um, and when the total thickness of the copper foil layer 31, the first double-sided adhesive 32 and the artificially synthesized graphite film 33 is less than 77um, the heat-conducting performance of the whole heat-conducting layer 3 cannot be ensured; when the total thickness of the copper foil layer 31, the first double-sided adhesive 32 and the synthetic graphite film 33 is more than 450um, the use of the SSD card is affected.
EXAMPLE five
Referring to fig. 5, fig. 5 is a schematic diagram of a heat dissipation labeling structure applied to an NVME interface SSD card in this example. Different from the fourth embodiment, in the present embodiment, the heat conductive adhesive layer 4 includes a heat conductive silicone rubber 41 and two second double-sided adhesives 42, wherein one side of one second double-sided adhesive 42 is attached to the 31, the other side of one second double-sided adhesive is attached to one side of the 41, the other side of the 41 is attached to one side of the 42, and the other side of the 42 is attached to the SSD card.
The above description is only an embodiment of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (10)
1. A heat dissipation labeling applied to an NVME interface (SSD) card comprises: chemical corrosion or electrolytic corrosion stainless steel tablet (1), two-sided adhesive layer (2), heat-conducting layer (3) and heat-conducting adhesive layer (4), its characterized in that, chemical corrosion or electrolytic corrosion stainless steel tablet (1) attached in the one side wherein of two-sided adhesive layer (2), the another side of two-sided adhesive layer (2) attached in the one side wherein of heat-conducting layer (3), the another side of heat-conducting layer (3) attached in the one side wherein of heat-conducting adhesive layer (4).
2. The heat dissipation label applied to the NVME interface SSD card is characterized in that the heat conduction layer (3) is a copper foil layer (31), and the two sides of the copper foil layer (31) are respectively attached with the double-sided adhesive layer (2) and the heat conduction adhesive layer (4).
3. The heat dissipation label applied to the NVME interface SSD card is characterized by further comprising a protective film (5), wherein the chemically or electrolytically corroded stainless steel plate (1) and the double-sided adhesive layer (2) are respectively attached to two sides of the protective film (5); the heat conducting layer (3) comprises a copper foil layer (31), a first double-sided adhesive (32) and an artificially synthesized graphite film (33); the one side of copper foil layer (31) is attached double-sided adhesive layer (2), copper foil layer (31) another side is attached first double-sided adhesive (32) one side wherein, the another side of first double-sided adhesive (32) is attached synthetic graphite membrane (33).
4. The heat dissipation label applied to the NVME interface SSD card according to claim 2 or 3, wherein the copper foil layer (31) is any one of a copper foil, a carbon copper foil, a graphene-coated copper foil or a nano-carbon-coated copper foil.
5. The heat dissipation label applied to the NVME interface SSD card is characterized in that the thickness of the copper foil layer (31) is 50-200 um.
6. The heat dissipation labeling device applied to the NVME interface SSD card is characterized in that the total thickness of the copper foil layer (31), the first double-sided adhesive (32) and the synthetic graphite film (33) is 77-450 um, and the thickness of the protective film (5) is 10-200 um.
7. The heat dissipation label applied to the NVME interface SSD card is characterized in that the thermal adhesive layer (4) is a thermal double-sided adhesive or an acrylic adhesive.
8. The heat dissipation labeling device applied to the NVME interface SSD card is characterized in that the heat-conducting glue layer (4) comprises heat-conducting silica gel (41) and two second double-sided glues (42), wherein one side of one second double-sided glue (42) is attached to the other side of the heat-conducting layer (3), the other side of one second double-sided glue (42) is attached to one side of the heat-conducting silica gel (41), and the other side of the heat-conducting silica gel (41) is attached to one side of the other second double-sided glue (42).
9. The heat dissipation label applied to the NVME interface SSD card according to claim 7, wherein when the thermal adhesive layer (4) is a double-sided thermal adhesive, the thickness of the thermal adhesive layer (4) is 50-300 um; when heat-conducting adhesive layer (4) is acrylic acid glue, heat-conducting adhesive layer (4) thickness is 10 ~ 50 um.
10. The heat dissipation label applied to the NVME interface SSD card is characterized in that the thickness of the heat-conducting silica gel (41) is 0.1-0.5 mm, and the thickness of any second double-sided adhesive is 10-50 um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120347302.1U CN215627739U (en) | 2021-02-07 | 2021-02-07 | Be applied to heat dissipation of NVME interface SSD card and label |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120347302.1U CN215627739U (en) | 2021-02-07 | 2021-02-07 | Be applied to heat dissipation of NVME interface SSD card and label |
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| Publication Number | Publication Date |
|---|---|
| CN215627739U true CN215627739U (en) | 2022-01-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120347302.1U Active CN215627739U (en) | 2021-02-07 | 2021-02-07 | Be applied to heat dissipation of NVME interface SSD card and label |
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| CN (1) | CN215627739U (en) |
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- 2021-02-07 CN CN202120347302.1U patent/CN215627739U/en active Active
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Assignee: Huizhou xinximeng Photoelectric Technology Co.,Ltd. Assignor: Huizhou Changyu New Materials Co.,Ltd. Contract record no.: X2023980035369 Denomination of utility model: A heat dissipation label applied to NVME interface SSD cards Granted publication date: 20220125 License type: Common License Record date: 20230509 |