CN217426333U - Display device and electronic apparatus - Google Patents

Display device and electronic apparatus Download PDF

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Publication number
CN217426333U
CN217426333U CN202221090118.4U CN202221090118U CN217426333U CN 217426333 U CN217426333 U CN 217426333U CN 202221090118 U CN202221090118 U CN 202221090118U CN 217426333 U CN217426333 U CN 217426333U
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China
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heat dissipation
plate
display device
display
dissipation layer
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CN202221090118.4U
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Chinese (zh)
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刘照东
周振东
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Beijing Xiaomi Mobile Software Co Ltd
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Beijing Xiaomi Mobile Software Co Ltd
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Abstract

The utility model discloses a display device and electronic equipment belongs to and shows technical field. The display device comprises a display panel, a first back plate, a heat dissipation layer and a driving chip, wherein the display panel comprises a display part and a connecting part which are connected, the first back plate is attached to one side face of the display part, one side face of the heat dissipation layer is attached to one side face, deviating from the display part, of the first back plate, the other side face of the heat dissipation layer is attached to one side face of the connecting part, and the driving chip is located on one side, deviating from the heat dissipation layer, of the connecting part and is connected with the connecting part. The present disclosure can improve reliability of a display device.

Description

Display device and electronic apparatus
Technical Field
The present disclosure relates to display technologies, and in particular, to a display device and an electronic apparatus.
Background
The display device is often disposed in the electronic device, so that the electronic device can have a display function.
In the related art, a display device mainly includes a display panel and a driving chip, the display panel and the driving chip are attached together, and the driving chip drives and controls the display panel.
However, the display device generates heat during operation, and particularly, in the case of high temperature and high humidity, the display panel and the driving chip are separated from each other, so that the display device cannot operate normally.
SUMMERY OF THE UTILITY MODEL
In order to overcome the problems in the related art to a certain extent, embodiments of the present disclosure provide a display device and an electronic apparatus, where the technical solution is as follows:
according to an aspect of the present disclosure, there is provided a display device including:
a display panel including a display part and a connection part connected to each other;
the first back plate is attached to one side surface of the display part;
one side surface of the heat dissipation layer is attached to one side surface of the first back plate, which is far away from the display part, and the other side surface of the heat dissipation layer is attached to one side surface of the connecting part;
and the driving chip is positioned on one side of the connecting part, which deviates from the heat dissipation layer, and is connected with the connecting part.
In one implementation of the present disclosure, the heat dissipation layer includes a heat dissipation plate;
the heating panel is graphite structure spare, the heating panel presss from both sides and establishes first backplate with between the connecting portion.
In one implementation of the present disclosure, the heat dissipation layer further comprises a support plate;
the supporting plate is attached to the heat dissipation plate, and the supporting plate is located at least one of the following positions:
the supporting plate is positioned between the first back plate and the heat dissipation plate;
the support plate is located between the heat dissipation plate and the connection portion.
In one implementation of the present disclosure, the heat dissipation layer includes two support plates;
one of the two support plates is located between the first back plate and the heat dissipation plate, and the other of the two support plates is located between the heat dissipation plate and the connection portion.
In one implementation of the present disclosure, the support plate is foam cotton.
In an implementation manner of the present disclosure, an orthographic projection of the driving chip on a plane where the heat dissipation layer is located in the heat dissipation layer.
In one implementation of the present disclosure, the display device further includes a second backplane;
the second back plate is located between the heat dissipation layer and the connecting portion.
In one implementation of the present disclosure, the display device further includes a buffer layer;
the buffer layer is located between the first backplane and the heat dissipation layer.
In one implementation of the present disclosure, the connection portion includes:
a first portion between the heat dissipation layer and the driving chip;
and one end of the second part is connected with the first part, and the other end of the second part deviates from the first part and bends in an arc shape to extend to the display part.
According to another aspect of the present disclosure, there is provided an electronic device including the display device described above.
The beneficial effects brought by the technical scheme provided by the embodiment of the disclosure at least comprise:
the display part of the display panel is carried on the first back plate, and the first back plate can provide stable support for the display part. The connecting part of the display panel is clamped between the heat dissipation layer and the driving chip, and the heat dissipation layer can dissipate heat of the display panel and the driving chip in the working process of the display device, so that the display device is prevented from being separated due to overhigh temperature of the display panel and the driving chip, and the reliability of the display device is improved.
That is to say, this display device that this disclosure embodiment provided sets up the heat dissipation layer in the one side that deviates from the driver chip of connecting portion, can utilize the heat dissipation layer to distribute away the heat of display panel and driver chip, has avoided breaking away from because of the two high temperature to display device's reliability has been improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a display device provided in an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a display device provided in an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of an electronic device provided in an embodiment of the present disclosure.
The symbols in the drawings represent the following meanings:
10. a display panel;
110. a display unit; 120. a connecting portion; 121. a first portion; 122. a second portion;
20. a first back plate;
30. a heat dissipation layer;
310. a heat dissipation plate; 320. a support plate;
40. a driving chip;
50. a second back plate;
60. a buffer layer;
70. a cover plate;
80. a polarizer;
90. optical cement;
100. a display device.
Detailed Description
To make the objects, technical solutions and advantages of the present disclosure more apparent, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," "third," and similar terms in the description and claims of the present disclosure are not intended to indicate any order, quantity, or importance, but rather are used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprise" or "comprises", and the like, means that the element or item listed before "comprises" or "comprising" covers the element or item listed after "comprising" or "comprises" and its equivalents, and does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, which may also change accordingly when the absolute position of the object being described changes.
The display device is often disposed in the electronic device, so that the electronic device can have a display function.
In the related art, a display device mainly includes a display panel and a driving chip, the display panel and the driving chip are attached together, and the driving chip drives and controls the display panel.
However, the display device generates heat during operation, and particularly, in the case of high temperature and high humidity, the display panel and the driving chip are separated from each other, so that the display device cannot operate normally.
In order to solve the above technical problem, an embodiment of the present disclosure provides a display device, fig. 1 is a schematic structural diagram of the display device, referring to fig. 1, in this embodiment, the display device includes a display panel 10, a first backplane 20, a heat dissipation layer 30 and a driving chip 40, the display panel 10 includes a display portion 110 and a connecting portion 120 connected to each other, the first backplane 20 is attached to one side of the display portion 110, one side of the heat dissipation layer 30 is attached to one side of the first backplane 20 away from the display portion 110, the other side of the heat dissipation layer 30 is attached to one side of the connecting portion 120, and the driving chip 40 is located on one side of the connecting portion 120 away from the heat dissipation layer 30 and connected to the connecting portion 120.
The display portion 110 of the display panel 10 is carried on the first back plate 20, and the first back plate 20 can provide a stable support for the display portion 110. The connecting portion 120 of the display panel 10 is sandwiched between the heat dissipation layer 30 and the driving chip 40, and in the working process of the display device, the heat dissipation layer 30 can dissipate the heat of the display panel 10 and the driving chip 40, so as to avoid the separation of the display panel 10 and the driving chip 40 due to the over-high temperature, thereby improving the reliability of the display device.
That is to say, the display device provided by the embodiment of the present disclosure has the heat dissipation layer 30 disposed on the side of the connection portion 120 away from the driving chip 40, and the heat dissipation layer 30 can be used to dissipate the heat of the display panel 10 and the driving chip 40, so as to avoid the separation of the display panel 10 and the driving chip 40 due to the over-high temperature, thereby improving the reliability of the display device.
As can be seen from the foregoing, the heat dissipation layer 30 is a key component for improving the reliability of the display device, and the heat dissipation layer 30 is described below.
With continued reference to fig. 1, in the present embodiment, the heat dissipation layer 30 includes a heat dissipation plate 310. The heat dissipation plate 310 is a graphite structure, and the heat dissipation plate 310 is sandwiched between the first back plate 20 and the connection portion 120.
In the above implementation, since graphite has excellent heat-conducting property, the heat dissipation plate 310 can quickly dissipate heat generated by the display panel 10 and the driving chip 40 to the outside, thereby achieving efficient heat dissipation.
Of course, in other embodiments, the heat dissipation plate 310 can be other structural members with better thermal conductivity, such as copper foil.
In addition to the case where the heat dissipation layer 30 includes only the heat dissipation plate 310 as described above, the heat dissipation layer 30 can be composed of the heat dissipation plate 310 together with the support plate 320.
Fig. 2 is a schematic structural diagram of a display device, and fig. 2 differs from fig. 1 mainly in the heat dissipation layer 30, in this embodiment, the heat dissipation layer 30 further includes a supporting plate 320, the supporting plate 320 is attached to the heat dissipation plate 310, and the supporting plate 320 is located at least one of the following positions:
the support plate 320 is positioned between the first back plate 20 and the heat dissipation plate 310; the support plate 320 is positioned between the heat dissipation plate 310 and the connection part 120.
In the above implementation, the heat dissipation plate 310 is used for heat dissipation, and the support plate 320 is used for support and load bearing. The support plate 320 can be located between both the first back plate 20 and the heat dissipation plate 310 and between the heat dissipation plate 310 and the connection part 120. The support plate 320 can ensure the functionality of the heat dissipation plate 310, i.e., the heat dissipation of the heat dissipation plate 310 to the display panel 10 and the driving chip 40, regardless of the position.
Illustratively, the support plate 320 is foam cotton. By the design, the supporting energy absorption performance of the supporting plate 320 can be ensured, and the heat dissipation plate 310 can be tightly attached to other parts, so that the functionality of the heat dissipation plate 310 is ensured.
Of course, in other embodiments, the heat dissipation plate 310 may be a pressure-sensitive adhesive tape or the like, and the heat dissipation plate 310 may be attached to other members in a similar manner.
In order to further improve the adhesion effect between the heat dissipation plate 310 and other components, in the present embodiment, the heat dissipation layer 30 includes two support plates 320. One of the two support plates 320 is positioned between the first back plate 20 and the heat dissipation plate 310, and the other of the two support plates 320 is positioned between the heat dissipation plate 310 and the connection part 120.
In the above implementation, the support plates 320 are disposed on both sides of the heat dissipation plate 310, one support plate 320 can achieve adhesion between the heat dissipation plate 310 and the first back plate 20, and the other support plate 320 can achieve adhesion between the heat dissipation plate 310 and the connecting portion 120, which corresponds to firmly sandwiching the support plate 320 between the first back plate 20 and the connecting portion 120.
In the present embodiment, the outer size of the heat dissipation layer 30 is slightly smaller than the outer size of the first back plate 20, so that the heat dissipation layer 30 can be effectively prevented from being overstressed by external force and deformed to protrude from the outer edge of the first back plate 20.
Illustratively, the outer dimension of the heat dissipation layer 30 is 2mm-5mm smaller than the outer dimension of the first back plate 20.
In the operation of the display device, heat is generated from both the display panel 10 and the driving chip 40. Since the heat dissipation layer 30 is directly attached to the connection portion 120 of the display panel 10, heat dissipation to the connection portion 120 can be ensured. In order to ensure the heat dissipation of the driver chip 40, in the present embodiment, the orthographic projection of the driver chip 40 on the plane where the heat dissipation layer 30 is located in the heat dissipation layer 30.
In the implementation manner, it is ensured that the driving chip 40 can be directly opposite to the heat dissipation layer 30, so that the driving chip 40 is as close to the heat dissipation layer 30 as possible, and thus the heat generated by the driving chip 40 can be quickly dissipated by the heat dissipation layer 30.
With continued reference to fig. 1, in the present embodiment, the display device further includes a second back plate 50, and the second back plate 50 is located between the heat dissipation layer 30 and the connection portion 120.
The second back plate 50 has a function similar to that of the first back plate 20, the first back plate 20 is used for supporting the display part 110, and the second back plate 50 is used for supporting the connecting part 120, so that the overall structural stability of the display panel 10 can be effectively improved through the first back plate 20 and the second back plate 50.
In the present embodiment, the display device further includes a buffer layer 60, and the buffer layer 60 is located between the first back sheet 20 and the heat dissipation layer 30.
In the above implementation, the buffer layer 60 is disposed between the first back plate 20 and the heat dissipation layer 30, so that vibration can be effectively absorbed, and the reliability of the display device is further improved.
Illustratively, the cushioning layer 60 is a Super Clean Foam (SCF).
In the embodiment, the outer dimension of the buffer layer 60 is slightly smaller than the outer dimension of the first back plate 20, so that the buffer layer 60 can be effectively prevented from being overstressed by an external force and being deformed to protrude from the outer edge of the first back plate 20.
Illustratively, the outer contour dimension of the buffer layer 60 is 2mm-5mm smaller than the outer contour dimension of the first back plate 20.
For the same reason, the outer size of the heat dissipation layer 30 and the outer size of the buffer layer 60 are both slightly smaller than the outer size of the second back plate 50 by 2mm-5 mm.
In the present embodiment, the display panel 10 includes a display portion 110 and a connection portion 120, wherein the display portion 110 is used for displaying an image, and the connection portion 120 is used for electrically connecting with the driving chip 40. For the connection portion 120, the connection portion 120 includes a first portion 121 and a second portion 122, the first portion 121 is located between the heat dissipation layer 30 and the driving chip 40, one end of the second portion 122 is connected to the first portion 121, and the other end of the second portion 122 is away from the first portion 121 and bends to extend to the display portion 110 in an arc shape.
In the above implementation, the display part 110 and the first portion 121 are spaced apart from each other and are oppositely disposed. The second portion 122 is positioned at one side of the display part 110 and the first portion 121, and is connected to the display part 110 and the first portion 121, respectively, thereby achieving electrical connection between the display panel 10 and the driving chip 40. In addition, since the second portion 122 is arc-shaped, the display portion 110 can smoothly transit to the first portion 121, thereby effectively avoiding the connecting portion 120 from being damaged due to excessive bending.
In this embodiment, since the second portion 122 is arc-shaped, a certain gap is formed between the display portion 110 and the first portion 121, and the gap can be well filled and supported by the thickness of the heat dissipation layer 30, so as to prevent the second portion 122 from being excessively bent and damaged. If the heat dissipation layer 30 only includes the heat dissipation plate 310, the thickness of the heat dissipation plate 310 may be adjusted as needed so that only the thickness of the heat dissipation plate 310 may satisfy the need. If the heat dissipation layer 30 includes the heat dissipation plate 310 and the support plate 320, the thicknesses of the heat dissipation plate 310 and the support plate 320 are adjusted as needed so that the sum of the thicknesses of the heat dissipation plate 310 and the support plate 320 can satisfy the need.
Illustratively, the display panel 10 is an Organic Light-Emitting Diode (OLED) panel.
In this embodiment, the display device further includes a cover plate 70, and the cover plate 70 is located on a side of the display portion 110 away from the first back plate 20 and is attached to the display portion 110.
In the above embodiment, the cover plate 70 is a transparent member, and can effectively protect the display unit 110 without affecting the display effect of the display unit 110.
In this embodiment, the display device further includes a polarizer 80, and the polarizer 80 is located on a side of the display portion 110 away from the first back plate 20 and is attached to the display portion 110.
In this embodiment, the polarizer 80 is located between the cover plate 70 and the display part 110, and the polarizer 80 and the cover plate 70 are adhered together by the optical adhesive 90.
Fig. 3 is a schematic structural diagram of an electronic device provided in an embodiment of the present disclosure, and referring to fig. 3, the electronic device includes the display apparatus 100 shown in fig. 1 and 2.
Since the electronic device includes the display apparatus 100 shown in fig. 1 and 2, all the advantages of the display apparatus 100 shown in fig. 1 and 2 are achieved, and are not described herein again.
In this embodiment, the electronic device is a mobile phone, a tablet computer, a vehicle-mounted computer, and the like, which is not limited in this disclosure.
The above description is meant to be illustrative of the principles of the present disclosure and not to be taken in a limiting sense, and any modifications, equivalents, improvements and the like that are within the spirit and scope of the present disclosure are intended to be included therein.

Claims (10)

1. A display device, characterized in that the display device comprises:
a display panel (10) including a display section (110) and a connection section (120) connected to each other;
a first back plate (20) attached to one side surface of the display unit (110);
the heat dissipation layer (30) is attached to one side surface, which is far away from the display part (110), of the first back plate (20), and the other side surface of the heat dissipation layer is attached to one side surface of the connecting part (120);
and the driving chip (40) is positioned on one side of the connecting part (120) departing from the heat dissipation layer (30), and is connected with the connecting part (120).
2. The display device according to claim 1, wherein the heat dissipation layer (30) includes a heat dissipation plate (310);
the heat dissipation plate (310) is a graphite structure, and the heat dissipation plate (310) is clamped between the first back plate (20) and the connecting portion (120).
3. The display device according to claim 2, wherein the heat dissipation layer (30) further comprises a support plate (320);
the supporting plate (320) is attached to the heat dissipation plate (310), and the supporting plate (320) is located at least one of the following positions:
the support plate (320) is located between the first back plate (20) and the heat dissipation plate (310);
the support plate (320) is located between the heat dissipation plate (310) and the connection part (120).
4. The display device according to claim 3, wherein the heat dissipation layer (30) comprises two support plates (320);
one of the two support plates (320) is located between the first back plate (20) and the heat dissipation plate (310), and the other of the two support plates (320) is located between the heat dissipation plate (310) and the connection portion (120).
5. The display device according to claim 3, wherein the support plate (320) is foam rubber.
6. The display device according to any one of claims 1 to 5, wherein an orthographic projection of the driving chip (40) on a plane on which the heat dissipation layer (30) is located within the heat dissipation layer (30).
7. The display device according to any one of claims 1 to 5, further comprising a second back plate (50);
the second back sheet (50) is located between the heat dissipation layer (30) and the connection portion (120).
8. The display device according to any one of claims 1 to 5, further comprising a buffer layer (60);
the buffer layer (60) is located between the first backsheet (20) and the heat dissipation layer (30).
9. The display device according to any one of claims 1 to 5, wherein the connecting portion (120) comprises:
a first portion (121) located between the heat dissipation layer (30) and the driving chip (40);
and a second part (122) which is connected with the first part (121) at one end and deviates from the first part (121) at the other end, and is bent and extends to the display part (110) in an arc shape.
10. An electronic device characterized by comprising the display device according to any one of claims 1 to 9.
CN202221090118.4U 2022-05-07 2022-05-07 Display device and electronic apparatus Active CN217426333U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221090118.4U CN217426333U (en) 2022-05-07 2022-05-07 Display device and electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221090118.4U CN217426333U (en) 2022-05-07 2022-05-07 Display device and electronic apparatus

Publications (1)

Publication Number Publication Date
CN217426333U true CN217426333U (en) 2022-09-13

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ID=83185198

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202221090118.4U Active CN217426333U (en) 2022-05-07 2022-05-07 Display device and electronic apparatus

Country Status (1)

Country Link
CN (1) CN217426333U (en)

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