CN215587205U - Wafer frequency sorting machine based on automatic detection - Google Patents

Abstract

The utility model discloses a wafer frequency sorting machine based on automatic detection, which comprises a box body, wherein a linear feeding module, a hopper feeding module, a suction head feeding module, a circular table mechanism, a frequency measurement module, a sorting module and a storage module are arranged on the top surface of the box body, wafers are scattered to the linear feeding module through the hopper feeding module, the suction head feeding module sucks the wafers on the linear feeding module to the circular table mechanism, frequency measurement is carried out through the frequency measurement module, and then the wafers are distributed to the storage module through the sorting module, so that the frequency measurement and sorting efficiency of the wafers are improved. The utility model has simple and compact structure, is convenient for automatic feeding and scattering of the wafer, can realize automatic frequency measurement and sorting, and greatly improves the frequency measurement speed and the sorting efficiency.

Description

Wafer frequency sorting machine based on automatic detection

Technical Field

The utility model relates to a wafer frequency sorting machine based on automatic detection.

Background

For a long time, the quartz wafers in China are mainly sorted manually, and the sorting method has the defects of low sorting speed, high error and the like; however, in recent years, with the large demand for quartz wafers in the market, automatic quartz wafer sorting apparatuses have been widely used, particularly, fully automatic quartz wafer sorting apparatuses are used. However, the full-automatic quartz wafer sorting machine has the problems of low sorting production efficiency and sorting precision, and the equipment has the problems of poor stability, low reliability and poor repeatability.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a technical scheme of a wafer frequency sorting machine based on automatic detection aiming at the defects in the prior art, the sorting machine has a simple and compact structure, is convenient for automatic feeding and scattering of wafers, can realize automatic frequency measurement and sorting, and greatly improves the frequency measurement speed and the sorting efficiency.

In order to solve the technical problems, the utility model adopts the following technical scheme:

the utility model provides a wafer frequency sorter based on automated inspection, includes the box, its characterized in that: the top surface of the box body is provided with a linear feeding module, a hopper feeding module, a suction head feeding module, a circular table mechanism, a frequency measuring module, a sorting module and a receiving module, wafers are scattered to the linear feeding module through the hopper feeding module, the suction head feeding module sucks the wafers on the linear feeding module to the circular table mechanism, frequency measurement is carried out through the frequency measuring module, and then the wafers are distributed to the receiving module through the sorting module, so that the frequency measuring and sorting efficiency of the wafers is improved; the sorting machine is simple and compact in structure, automatic feeding and scattering of wafers are facilitated, automatic frequency measurement and sorting can be achieved, and frequency measurement speed and sorting efficiency are greatly improved.

Further, the linear feeding module comprises a first slide rail, a first motor and a feeding material box, the first slide rail is arranged on the box body, the first motor is connected to one end of the first slide rail, the feeding material box is connected with the first slide rail through a first slide block, the first motor drives the first slide block to move back and forth along the first slide rail through a screw rod, the screw rod can be driven to rotate through the first motor, the feeding material box can be driven to move along the first slide rail through the first slide block, wafers are automatically scattered onto the feeding material box without overlapping, the feeding speed is increased, and meanwhile the working efficiency of the suction head feeding module can be improved.

Further, hopper feeding module includes first support frame, the second motor, feeder hopper and feeding section of thick bamboo, the second motor passes through first support frame fixed connection on the box, be equipped with the horizontal plate on the first support frame, the feeder hopper is located on the horizontal plate, the output shaft of second motor connects the feeding section of thick bamboo, the feeding section of thick bamboo is supported to the feeder hopper, first support frame has improved the stability and the reliability of second motor installation, it is rotatory to drive the feeding section of thick bamboo through the second motor, make the wafer in the feeding section of thick bamboo get into the feeder hopper, through feeder hopper input material loading magazine, the horizontal plate has improved the stability and the reliability of feeder hopper installation.

Further, the sucker feeding module comprises a second slide rail, a third motor, a camera, a CCD light source fixing block and a movable adsorption mechanism, the second slide rail is fixed on the box body through a second support frame, the third motor is arranged at the end part of the second slide rail, the third motor drives the movable adsorption mechanism to move left and right along the second slide rail through a screw rod, a first fixing plate is arranged on the rear side surface of the second slide rail, a second fixing plate is arranged on the first fixing plate, the camera is connected with the second fixing plate through a first lifting block, the CCD light source fixing block is arranged on the second fixing block and positioned below the camera, a wafer in the feeding box can be imaged through the camera and a light source on the CCD light source fixing block, the position of the wafer is determined, then the movable adsorption mechanism can be driven to move to the upper part of the feeding box through the screw rod through the third motor, the corresponding wafer is absorbed, and the wafer is conveyed to the round platform mechanism for frequency measurement detection, the first fixing block and the second fixing block improve the stability and the reliability of the installation of the camera and the CCD light source fixing block, and meanwhile, the camera can be subjected to height adjustment through the first lifting block according to the actual processing requirement.

Further, the movable adsorption mechanism comprises a movable plate, a positioning plate, clamping arms and a vacuum suction nozzle, the movable plate is connected with a second slide rail through a boosting plate, the clamping arms are connected with the movable plate through the positioning plate, the vacuum suction nozzle is arranged on the clamping arms, a second motor drives a screw to rotate, and then the boosting plate drives the movable plate to move back and forth along the second slide rail, so that conveying of wafers is achieved, and the vacuum suction nozzle is connected with external compressed air equipment and is convenient for sucking the wafers.

Further, round platform mechanism includes fourth motor and carousel, and the carousel is connected on the fourth motor, evenly is provided with the measurement bottom electrode on the top surface of carousel, can drive the carousel rotation through the fourth motor, and then can make and measure the bottom electrode and remove to required position, after removing adsorption apparatus and put into the wafer and measure the bottom electrode on, rotate to the below of frequency measurement module through the carousel, carry out the frequency measurement and detect.

Further, the frequency measuring module comprises a third fixing plate, an upper motor module, a lower motor module, a differential head, a digital display dial indicator and a measuring upper electrode, the third fixing plate is fixed on the box body through a second upright post, the upper motor module and the lower motor module are connected on the third fixing plate, the differential head is connected with the upper motor module and the lower motor module, the differential head is connected with a second lifting block through a connecting arm, the digital display dial indicator is arranged on the second lifting block, the bottom end of the digital display dial indicator is connected with the measuring upper electrode, the second lifting block is movably connected on the third fixing plate, the second lifting block can be driven to move up and down through the upper motor module and the lower motor module through the differential head, the measuring upper electrode is contacted with the wafer, the thickness of the wafer is detected through the measuring upper electrode and the measuring lower electrode on the rotating disc, the measured thickness data are transmitted to a frequency-thickness signal converter in the display screen, and the second upright post improves the stability and the reliability of the installation of the third fixing plate, the frequency measurement precision is further improved.

Further, select separately the module including selecting separately the motor, swing arm and sorting mechanical arm, select separately the motor and locate to accomodate on the module, the swing arm through the output shaft of positioning sleeve connection sorting motor, select separately the mechanical arm and connect the swing arm, the wafer after the frequency measurement passes through round platform mechanism and rotates to the below of selecting separately the module, snatchs the wafer through selecting separately the mechanical arm, moves the wafer to corresponding frequency measurement box top under the effect of selecting separately the motor to put into corresponding frequency measurement box.

Furthermore, the accommodating module comprises a limiting plate, a supporting plate and a frequency measurement box, the limiting plate is located above the supporting plate, the frequency measurement box is distributed between the limiting plate and the supporting plate, the limiting plate and the supporting plate are convenient for installation and positioning of the frequency measurement box and the sorting module, and the wafer accommodating efficiency is improved.

Further, the top of box is equipped with the display screen, and the display screen has improved the stability of display screen installation through first stand fixed connection box greatly through first stand, and the display screen is used for showing the data of frequency measurement.

Due to the adoption of the technical scheme, the utility model has the following beneficial effects:

1. the sorting machine is simple and compact in structure, automatic feeding and scattering of wafers are facilitated, automatic frequency measurement and sorting can be achieved, and frequency measurement speed and sorting efficiency are greatly improved.

2. Can drive the screw rod through first motor rotatory, and then can drive material loading magazine through first slider and remove along first slide rail, make the automatic non-overlapping ground of wafer scatter to the material loading magazine on, improve the speed of material loading, can improve suction head material loading module's work efficiency simultaneously.

3. Can drive the carousel rotation through the third motor, and then can make and measure the bottom electrode and remove to required position, after removing adsorption apparatus and put into the wafer and measure the bottom electrode on, rotate the below to the frequency measurement module through the carousel, carry out the frequency measurement and detect.

4. Can move the second elevator through upper and lower motor module via the differential area and reciprocate, make and measure the upper electrode contact wafer, carry out the frequency measurement through measuring the lower electrode of measuring on upper electrode and the carousel and detect the wafer to transmit the signal of telecommunication who will survey to the display screen, the second stand has improved the stability and the reliability of third fixed plate installation, further improves the precision of frequency measurement.

Description of the drawings:

the utility model will be further described with reference to the accompanying drawings in which:

FIG. 1 is a diagram illustrating the effect of an automatic wafer frequency sorter according to the present invention;

FIG. 2 is a schematic structural view of a linear feeding module according to the present invention;

FIG. 3 is a schematic overview of the structure of a hopper feed module according to the present invention;

FIG. 4 is a schematic structural view of a tip feeding module according to the present invention;

FIG. 5 is a schematic structural view of a mobile adsorption mechanism according to the present invention;

FIG. 6 is a schematic structural view of a circular table mechanism according to the present invention;

FIG. 7 is a schematic structural diagram of a frequency measurement mechanism according to the present invention;

FIG. 8 is a schematic view of the connection between the sorting module and the receiving module of the present invention;

fig. 9 is a schematic diagram of the structure of the sorting module of the present invention.

In the figure: 1-a linear feeding module; 2-a hopper feed module; 3-a suction head feeding module; 4-a circular table mechanism; 5-a frequency measurement module; 6-a sorting module; 7-a storage module; 8-a display screen; 9-a first upright; 10-a box body; 11-a first slide rail; 12-a first electric machine; 13-a first slider; 14-feeding material box; 15-a first support frame; 16-a second electric machine; 17-a feeding cylinder; 18-a feed hopper; 19-a horizontal plate; 20-a second slide rail; 21-a third motor; 22-a second support; 23-a first fixing plate; 24-a second fixing plate; 25-a first lifting block; 26-a camera; 27-CCD light source fixed block; 28-moving the adsorption mechanism; 29-moving the plate; 30-a boosting plate; 31-a positioning plate; 32-a vacuum nozzle; 33-a clamping arm; 34-a fourth motor; 35-a turntable; 36-measuring the lower electrode; 37-a second upright; 38-a third fixing plate; 39-upper and lower motor modules; 40-differential head; 41-a linker arm; 42-digital display dial gauge; 43-a second lifting block; 44-measuring the upper electrode; 45-limiting plate; 46-a pallet; 47-a frequency measurement box; 48-a sorting motor; 49-swing arm; 50-a sorting manipulator; 51-positioning sleeve.

Detailed Description

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.

In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.

It is noted that the terms first, second and the like in the description and in the claims, and in the drawings, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. Furthermore, the terms "comprising" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions.

As shown in fig. 1 to 9, a wafer frequency sorting machine based on automatic detection according to the present invention includes a box 10, a linear feeding module 1, a hopper feeding module 2, a suction head feeding module 3, a circular table mechanism 4, a frequency measuring module 5, a sorting module 6 and a receiving module 7 are disposed on a top surface of the box 10, the linear feeding module 1, the hopper feeding module 2, the suction head feeding module 3, the circular table mechanism 4, the frequency measuring module 5, the sorting module 6 and the receiving module 7 are all fixedly connected to the top surface of the box 10, a wafer is scattered to the linear feeding module 1 through the hopper feeding module 2, the linear feeding module 1 includes a first slide rail 11, a first motor 12 and a feeding box 14, the first slide rail 11 is disposed on the box 10, the first motor 12 is connected to one end of the first slide rail 11, the feeding box 14 is connected to the first slide rail 11 through a first slide block 13, the first motor 12 drives the first slide block 13 to move back and forth along the first slide rail 11 through a screw rod, can drive the screw rod rotation through first motor 12, and then can drive material loading magazine 14 through first slider 13 and remove along first slide rail 11, make the automatic non-overlapping ground of wafer scatter to material loading magazine 14 on, improve the speed of material loading, can improve suction head material loading module 3's work efficiency simultaneously.

Hopper feeding module 2 includes first support frame 15, second motor 16, feeder hopper 18 and feeding section of thick bamboo 17, second motor 16 is through first support frame 15 fixed connection on box 10, be equipped with horizontal plate 19 on the first support frame 15, feeder hopper 18 is located on horizontal plate 19, the output shaft feeding section of thick bamboo 17 of second motor 16, feeder hopper 18 supports feeding section of thick bamboo 17, first support frame 15 has improved the stability and the reliability of second motor 16 installation, it is rotatory to drive feeding section of thick bamboo 17 through second motor 16, make the wafer in the feeding section of thick bamboo 17 get into feeder hopper 18, input material loading magazine 14 through feeder hopper 18, horizontal plate 19 has improved the stability and the reliability of feeder hopper 18 installation.

The suction head feeding module 3 sucks the wafer on the linear feeding module 1 to the circular table mechanism 4, the suction head feeding module 3 comprises a second slide rail 20, a third motor 21, a camera 26, a CCD light source fixing block 27 and a movable adsorption mechanism 28, the second slide rail 20 is fixed on the box body 10 through a second support frame 22, the third motor 21 is arranged at the end part of the second slide rail 20, the third motor 21 drives the movable adsorption mechanism 28 to move left and right along the second slide rail 20 through a screw rod, a first fixing plate 23 is arranged on the rear side surface of the second slide rail 20, a second fixing plate 24 is arranged on the first fixing plate 23, the camera 26 is connected with the second fixing plate 24 through a first lifting block 25, a CCD light source fixing block 27 is arranged on the second fixing block and positioned below the camera 26, the wafer in the feeding box 14 can be imaged through light sources on the camera 26 and the CCD light source fixing block 27, and the position of the wafer is determined, then, the third motor 21 can drive the movable adsorption mechanism 28 to move above the material feeding box 14 through a screw rod, corresponding wafers are adsorbed, the wafers are conveyed to the circular table mechanism 4 to be used for frequency measurement detection, the first fixing block and the second fixing block improve the stability and the reliability of installation of the camera 26 and the CCD light source fixing block 27, and meanwhile, the camera 26 can be adjusted in height through the first lifting block 25 according to the actual processing requirement. The movable adsorption mechanism 28 comprises a movable plate 29, a positioning plate 31, clamping arms 33 and a vacuum suction nozzle 32, the movable plate 29 is connected with the second slide rail 20 through a boosting plate 30, the clamping arms 33 are connected with the movable plate 29 through the positioning plate 31, the vacuum suction nozzle 32 is arranged on the clamping arms 33, the second motor 16 drives a screw to rotate, the movable plate 29 is driven by the boosting plate 30 to move back and forth along the second slide rail 20, conveying of wafers is achieved, and the vacuum suction nozzle 32 is connected with external compressed air equipment so that the wafers can be sucked conveniently.

The circular table mechanism 4 comprises a fourth motor 34 and a turntable 35, the turntable 35 is connected to the fourth motor 34, the measuring lower electrode 36 is uniformly arranged on the top surface of the turntable 35, the turntable 35 can be driven to rotate through the fourth motor 34, the measuring lower electrode 36 can be moved to a required position, and after the wafer is placed on the measuring lower electrode 36 by the movable adsorption mechanism 28, the wafer is rotated to the position below the frequency measurement module 5 through the turntable 35 to perform frequency measurement detection.

The frequency measurement is carried out through the frequency measurement module 5, the frequency measurement module 5 comprises a third fixing plate 38, an upper and lower motor module 39, a differential head 40, a digital display dial indicator 42 and a measurement upper electrode 44, the third fixing plate 38 is fixed on the box body 10 through a second upright post 37, the upper and lower motor module 39 is connected on the third fixing plate 38, the differential head 40 is connected with the upper and lower motor module 39, the differential head 40 is connected with a second lifting block 43 through a connecting arm 41, the digital display dial indicator 42 is arranged on the second lifting block 43, the bottom end of the digital display dial indicator 42 is connected with the measurement upper electrode 44, the second lifting block 43 is movably connected on the third fixing plate 38, the second lifting block 43 can be driven by the upper and lower motor module 39 through the differential head 40 to move up and down, the measurement upper electrode 44 is contacted with the wafer, the thickness measurement upper electrode 44 and the measurement lower electrode 36 on the turntable 35 are used for thickness detection of the wafer, and the measured thickness data are transmitted to a frequency-thickness signal converter in the display screen 8, the second upright post 37 improves the stability and reliability of the third fixing plate 38, and further improves the frequency measurement precision.

Divide the material to accomodating module 7 by sorting module 6 again, improve the frequency measurement and the sorting efficiency of wafer, sorting module 6 is including selecting separately motor 48, swing arm 49 and sorting manipulator 50, sorting motor 48 locates and accomodates on the module 7, swing arm 49 connect sorting motor 48's output shaft through location sleeve 51, sorting manipulator 50 connects swing arm 49, the wafer after the frequency measurement passes through round platform mechanism 4 and rotates to sorting module 6's below, snatch the wafer through sorting manipulator 50, move the wafer to corresponding frequency measurement box 47 top under sorting motor 48's effect, and put into corresponding frequency measurement box 47. Accomodate module 7 and include limiting plate 45, layer board 46 and frequency measurement box 47, limiting plate 45 is located layer board 46's top, and frequency measurement box 47 distributes between limiting plate 45 and layer board 46, and limiting plate 45 and layer board 46 are convenient for frequency measurement box 47 and select separately module 6's installation location, improve the efficiency that the wafer was accomodate. The sorting machine is simple and compact in structure, automatic feeding and scattering of wafers are facilitated, automatic frequency measurement and sorting can be achieved, and frequency measurement speed and sorting efficiency are greatly improved.

The top of box 10 is equipped with display screen 8, and display screen 8 has improved the stability of 8 installations of display screen through first stand 9 fixed connection box 10 greatly through first stand 9, and display screen 8 is used for showing the data of frequency measurement.

When the utility model is used, firstly, a wafer to be detected is put into a feeding cylinder, the feeding cylinder is driven to rotate by a second motor, the wafer falls into a linear feeding module through a feeding hopper, a feeding material box is driven by a first motor to move back and forth by a first slide block, the wafer is automatically scattered on the feeding material box without overlapping, then the wafer is imaged by a camera and a light source, a moving adsorption mechanism is driven by a third motor to move to the upper part of the feeding material box, the corresponding wafer is absorbed and moved to the upper part of a circular platform mechanism, the wafer is put on a lower measuring electrode, a rotating disc is driven to rotate by a fourth electrode, the wafer is transferred to the lower part of a frequency measuring module, frequency measurement detection is carried out by the frequency measuring module, the wafer is transferred to one side close to a sorting module by the circular platform mechanism after detection, the wafer is grabbed by a sorting manipulator, and then the wafer is rotated to the upper part of the corresponding frequency measuring box, and the wafer falls into a frequency measurement box to carry out frequency measurement sorting on the next wafer.

The above is only a specific embodiment of the present invention, but the technical features of the present invention are not limited thereto. Any simple variations, equivalent substitutions or modifications based on the present invention to achieve substantially the same technical effects are within the scope of the present invention.

Claims (10)

1. The utility model provides a wafer frequency sorter based on automated inspection, includes the box, its characterized in that: the wafer conveying device is characterized in that a linear feeding module, a hopper feeding module, a suction head feeding module, a round platform mechanism, a frequency measurement module, a sorting module and a storage module are arranged on the top surface of the box body, wafers pass through the hopper feeding module and scatter to the linear feeding module, the suction head feeding module sucks the wafers on the linear feeding module to the round platform mechanism, frequency measurement is carried out through the frequency measurement module, and then the sorting module divides the materials to the storage module, so that the frequency measurement and sorting efficiency of the wafers are improved.

2. An automated inspection based wafer frequency sorter as claimed in claim 1 wherein: the linear feeding module comprises a first slide rail, a first motor and a feeding material box, the first slide rail is arranged on the box body, the first motor is connected to one end of the first slide rail, the feeding material box is connected with the first slide rail through a first slide block, and the first motor drives the first slide block to move back and forth along the first slide rail through a screw rod.

3. An automated inspection based wafer frequency sorter as claimed in claim 1 wherein: the hopper feeding module comprises a first support frame, a second motor, a feeding hopper and a feeding cylinder, wherein the second motor passes through the first support frame and is fixedly connected to the box body, a horizontal plate is arranged on the first support frame, the feeding hopper is arranged on the horizontal plate, an output shaft of the second motor is connected with the feeding cylinder, and the feeding hopper supports the feeding cylinder.

4. An automated inspection based wafer frequency sorter as claimed in claim 1 wherein: suction head feed module includes second slide rail, third motor, camera, CCD light source fixed block and removes adsorption apparatus, the second slide rail is fixed in through the second support frame on the box, the third motor is located the tip of second slide rail, the third motor drives through the screw rod remove adsorption apparatus and follow the second slide rail is removed the removal, be provided with first fixed plate on the trailing flank of second slide rail, be provided with the second fixed plate on the first fixed plate, the camera is connected through first lifting block the second fixed plate, be located on the second fixed block the below of camera is provided with CCD light source fixed block.

5. An automated inspection based wafer frequency sorter as claimed in claim 4 wherein: the movable adsorption mechanism comprises a movable plate, a positioning plate, clamping arms and a vacuum suction nozzle, the movable plate is connected with the second slide rail through a boosting plate, the clamping arms are connected with the movable plate through the positioning plate, and the vacuum suction nozzle is arranged on the clamping arms.

6. An automated inspection based wafer frequency sorter as claimed in claim 1 wherein: the round platform mechanism comprises a fourth motor and a rotary table, the rotary table is connected to the fourth motor, and measuring lower electrodes are uniformly arranged on the top surface of the rotary table.

7. An automated inspection based wafer frequency sorter as claimed in claim 1 wherein: the frequency measurement module comprises a third fixing plate, an upper motor module, a lower motor module, a differential head, a digital display dial indicator and a measurement upper electrode, the third fixing plate is fixed on the box body through a second upright post, the upper motor module and the lower motor module are connected onto the third fixing plate, the differential head is connected with the upper motor module and the lower motor module, the differential head is connected with a second lifting block through a connecting arm, the digital display dial indicator is arranged on the second lifting block, the bottom end of the digital display dial indicator is connected with the measurement upper electrode, and the second lifting block is movably connected onto the third fixing plate.

8. An automated inspection based wafer frequency sorter as claimed in claim 1 wherein: the sorting module comprises a sorting motor, a swing arm and a sorting manipulator, the sorting motor is arranged on the storage module, the swing arm is connected with an output shaft of the sorting motor through a positioning sleeve, and the sorting manipulator is connected with the swing arm.

9. An automated inspection based wafer frequency sorter as claimed in claim 1 wherein: the storage module comprises a limiting plate, a supporting plate and a frequency measurement box, wherein the limiting plate is positioned above the supporting plate, and the frequency measurement box is distributed between the limiting plate and the supporting plate.

10. An automated inspection based wafer frequency sorter as claimed in claim 1 wherein: the display screen is arranged above the box body and fixedly connected with the box body through a first stand column.

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