CN215528631U - Wireless charging circuit board and wireless charger based on SOC - Google Patents

Abstract

The utility model provides a wireless charging circuit board and a wireless charger based on an SOC. The SOC-based wireless charging board comprises: the system comprises a mainboard, wherein a functional circuit and an SOC unit are integrated on the mainboard, and at least one driving module for driving at least part of the functional circuit is integrated on the SOC unit; the whole main board is of a C-shaped structure, and the area of one end of the main board is larger than that of the other end of the main board; the connecting wire for connect function circuit, wherein the connecting wire is including the logic connecting wire that is used for the power connecting wire of transmission power and transmission signal, wherein, the power connecting wire set up in the surface of mainboard the superiors, the logic connecting wire set up in on the intermediate level of mainboard. The utility model discloses well brand-new SOC unit has integrateed the most function of original discrete device to saved the use quantity of components and parts, through optimizing circuit layout, improved PCB's utilization ratio, reached the optimization of cost and performance, made the product have more market competition.

Description

Wireless charging circuit board and wireless charger based on SOC

Technical Field

The utility model relates to the technical field of charging, in particular to a splicing structure of a wireless charging circuit board based on SOC (chip on system), the wireless charging circuit board based on SOC and a wireless charger.

Background

With the continuous update of consumer electronics, small-sized high power density chargers are becoming the development trend in the future. In the wireless mobile phone accessory market, under the condition that the transmission power and the number of electronic devices are not changed greatly, how to use a smaller PCB size to save the cost becomes the key of market competition.

The number of components and parts of an old discrete device scheme is large, the space utilization rate is low, the size of a PCB is difficult to design to be small, and the structure of the existing wireless charging circuit board needs to be improved in order to reduce the cost of wireless charging.

SUMMERY OF THE UTILITY MODEL

According to the present invention, in order to solve the existing problems, an SOC-based wireless charging circuit board is provided, which includes:

the system comprises a mainboard, wherein a functional circuit and an SOC unit are integrated on the mainboard, and at least one driving module for driving at least part of the functional circuit is integrated on the SOC unit; the whole main board is of a C-shaped structure, and the area of one end of the main board is larger than that of the other end of the main board;

the connecting wire for connect function circuit, wherein the connecting wire is including the logic connecting wire that is used for the power connecting wire of transmission power and transmission signal, wherein, the power connecting wire set up in the surface of mainboard the superiors, the logic connecting wire set up in on the intermediate level of mainboard.

Optionally, all and/or part of the curve of the outer side of one end of the main plate is the same as all and/or part of the curve of the inner side of the other end.

Optionally, one end of the main board is annular, and the other end of the main board is strip-shaped.

Optionally, a circuit layout design is provided on one end of the motherboard.

Optionally, the other end of the main board is provided with an LED indicating circuit.

Optionally, the main boards each include a first end, a second end, and a middle portion connecting the first end and the second end, wherein an outer frame of the middle portion is a linear structure.

Optionally, the SOC unit is disposed in a central region of the first end.

Optionally, the spacing between the heat generating source devices in the functional circuit is 8mm or more.

Optionally, the functional circuit includes a power and driving circuit, and is disposed at the first end of the main board;

the SOC unit comprises a driving module matched with the power and driving circuit and is configured to control the power and driving circuit to transfer energy from the wireless charging circuit board to a device to be charged and control the power and driving circuit to emit power; and/or

The SOC unit comprises a main control circuit, and the main control circuit is used for controlling the transmitting power through the power and driving circuit according to the information fed back by the voltage demodulation circuit and the requirement of the device to be charged.

The present invention also provides a wireless charger, including:

the wireless charging circuit board based on the SOC;

the main board is positioned in the edge area of the inner part of the shell.

According to the wireless charging circuit board based on the SOC provided by the utility model, each functional circuit and an SOC unit are integrated on the main board of the wireless charging circuit board, and at least a driving module for driving part of the functional circuits is integrated on the SOC unit, wherein the arrangement of the SOC unit can replace a driving chip which is independently arranged on each functional circuit, and the driving modules (peripheral devices) of each functional module are reasonably distributed by utilizing the advantage of high integration degree of the SOC, so that the devices of the whole system are in high-density layout, the utilization rate of the PCB is improved, the effect of reducing the size is achieved, and the purpose of optimizing the cost is achieved.

The brand new SOC unit integrates most functions of the original discrete device, so that the using quantity of components is saved, the utilization rate of the PCB is improved by optimizing the circuit layout, the cost and the performance are optimized, the product has more market competitiveness, the size of a single PCB is reduced by 37% by the design of a novel SOC scheme, and the cost of the single PCB is further reduced.

Drawings

The above and other objects, features and advantages of the present invention will become more apparent by describing in more detail embodiments of the present invention with reference to the attached drawings. The accompanying drawings are included to provide a further understanding of the embodiments of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model and not to limit the utility model. In the drawings, like reference numbers generally represent like parts or steps.

Fig. 1 is a schematic structural diagram of a main board in a splicing structure of a wireless charging circuit board in a current scheme;

fig. 2 is a schematic structural diagram of a motherboard in a splicing structure of the SOC-based wireless charging circuit board according to an embodiment of the present invention;

fig. 3 is a schematic diagram illustrating the structure of each functional circuit on the motherboard of the SOC-based wireless charging circuit board according to an embodiment;

fig. 4 is a structural schematic diagram of the spliced structures of the wireless charging circuit board based on the SOC after being spliced with each other.

Reference symbols of the drawings

1. Voltage demodulation circuit

2. SOC unit

3. Power and drive circuit

4. D2D crystal oscillator and Q value detection circuit

5. Current demodulation circuit

6. Input filtering and BUCK voltage regulating circuit

7. LED indicator light

Detailed Description

In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art, that the present invention may be practiced without one or more of these specific details. In other instances, well-known features have not been described in order to avoid obscuring the utility model.

In the following description, for purposes of explanation, specific details are set forth in order to provide a thorough understanding of the present invention. It is apparent that the practice of the utility model is not limited to the specific details set forth herein as are known to those of skill in the art. The following detailed description of the preferred embodiments of the utility model, however, the utility model is capable of other embodiments in addition to the detailed description and should not be construed as limited to the embodiments set forth herein.

It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model, as the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. When the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The terms "upper", "lower", "front", "rear", "left", "right" and the like as used herein are for purposes of illustration only and are not limiting.

Ordinal words such as "first" and "second" are referred to herein merely as labels, and do not have any other meaning, such as a particular order, etc. Also, for example, the term "first component" does not itself imply the presence of "second component", and the term "second component" does not itself imply the presence of "first component".

Specific embodiments of the present invention will now be described in more detail with reference to the accompanying drawings, which illustrate representative embodiments of the utility model and do not limit the utility model.

In the wireless mobile phone accessory market, under the condition that the transmission power and the number of electronic devices are not changed greatly, how to use a smaller PCB size to save the cost becomes the key of market competition. Common mainboard is as shown in fig. 1, and its structure can cause the leftover bits waste between the mainboard seriously, directly leads to the rising of cost, moreover on the mainboard discrete device scheme components and parts of a functional circuit are many, and space utilization is low, and the PCB size is hardly designed very little.

In order to solve the above problems, the present invention provides a wireless charging circuit board based on SOC, including:

the system comprises a mainboard, wherein a functional circuit and an SOC unit are integrated on the mainboard, and at least one driving module for driving at least part of the functional circuit is integrated on the SOC unit; the whole main board is of a C-shaped structure, and the area of one end of the main board is larger than that of the other end of the main board;

the connecting wire for connect function circuit, wherein the connecting wire is including the logic connecting wire that is used for the power connecting wire of transmission power and transmission signal, wherein, the power connecting wire set up in the surface of mainboard the superiors, the logic connecting wire set up in on the intermediate level of mainboard.

According to the wireless charging circuit board based on the SOC provided by the utility model, each functional circuit and an SOC unit are integrated on the main board of the wireless charging circuit board, and at least a driving module for driving part of the functional circuits is integrated on the SOC unit, wherein the arrangement of the SOC unit can replace a driving chip which is independently arranged on each functional circuit, and the driving modules (peripheral devices) of each functional module are reasonably distributed by utilizing the advantage of high integration degree of the SOC, so that the devices of the whole system are in high-density layout, the utilization rate of the PCB is improved, the effect of reducing the size is achieved, and the purpose of optimizing the cost is achieved.

The brand new SOC unit integrates most functions of the original discrete device, so that the using quantity of components is saved, the utilization rate of the PCB is improved by optimizing the circuit layout, the cost and the performance are optimized, the product has more market competitiveness, the size of a single PCB is reduced by 37% by the design of a novel SOC scheme, and the cost of the single PCB is further reduced.

The SOC-based wireless charging board according to the embodiment of the present invention is described in detail below with reference to the accompanying drawings.

The functional circuit comprises functional devices, wherein the interval between the heating source devices in the functional devices is more than 8mm, so that the heating devices are prevented from influencing other functional devices.

Specifically, the mainboard includes the multilayer, for example can be 4 layers of structure in the four-layer structure, power connecting wire set up in the surface of mainboard the superiors, logic connecting wire set up in the intermediate level of four layers of mainboard layer, and the SOC unit set up in the surface of mainboard the superiors, through set up can make all heat sources all keep away from the SOC chip, the stability of system is very good.

In an embodiment of the present invention, as shown in fig. 3, the functional circuit includes: the device comprises a voltage demodulation circuit 1, a power and driving circuit 3, a D2D crystal oscillator, a Q value detection circuit 4, a current demodulation circuit 5, an input filtering and BUCK voltage regulation circuit 6 and an LED indicator lamp 7.

Wherein, LED pilot lamp 7 is used for showing the position and/or the reason of trouble when the mainboard breaks down, is convenient for overhaul.

The power and driving circuit is used for generating a magnetic coupling electric field which can be received by a device to be charged, transmitting energy to the device to be charged from the SOC-based wireless charging circuit board and is arranged at one end of the fan ring; in one embodiment, the power and transmit circuitry includes the following components: the QI specification for the transmitter coil allows the use of any coil type, such as A11, MP-A11, A28, MP-A2, and the like. The full-bridge circuit is formed by combining two groups of MOS which are not conducted at the same time. The resonant cavity circuit is provided with LC series connection to form resonance, and is used for converting a digital control signal output by the main control circuit into an analog control signal which can be identified by the power transmitting circuit and controlling the transmitting power of the power transmitting circuit; in one embodiment, the driving circuit includes the following components: 1. a bleed and drive circuit that controls the MOS drive signal strength to the power and transmit circuit; 2. the circuit can sample the midpoint voltage of the same bridge arm.

The voltage demodulation circuit 1 is used for decoding a signal fed back to the wireless charging device by the power and driving circuit to convert the signal into a digital signal which can be identified by the main control module; in one embodiment, the voltage demodulation circuit 1 includes the following components: the multistage filter circuit comprises a first-order RC filter circuit and a second-order RC filter circuit and is used for providing effective feedback signals for the MCU; the current sampling circuit is connected with a high-power resistor in series, and the MCU can identify the current according to the voltage of the sampling resistor; and the voltage sampling circuit is a resistance voltage division network and is used for weakening a voltage signal and then sending the weakened voltage signal to the MCU.

The current demodulation circuit is used for amplifying, filtering and reshaping the to-be-charged device through a weak voltage signal on the current sampling circuit to form a digital signal which can be identified by the main control module, and when the voltage demodulation signal is abnormal, the digital signal is used as a standby demodulation signal to be processed.

And the main control circuit is used for controlling the transmitting power of the power transmitting circuit through the power and driving circuit according to the information fed back by the voltage demodulating circuit 1 and the requirement of the device to be charged. In one embodiment, the method comprises the following steps: the operational amplifier circuit is an analog amplifier circuit, and the signal amplification factor can be adjusted through a peripheral resistor; the AD sampling circuit is an 8-bit AD sampling circuit; and the logic output circuit is 16 IO ports built in the MCU and controls the operation logic of the whole system.

The functional circuit further comprises:

the D2D circuit is used for converting unstable input voltage into stable voltage and supplying power to the main control circuit;

the crystal oscillator circuit is used for delaying the power supply time of the first power-on, so that the system is prevented from being interfered by voltage spikes caused by hot plugging, and the crystal oscillator circuit is used for providing stable PWM signals for the main control module. In one embodiment, the D2D, soft start, and crystal oscillator circuits include the following components: the slow starting circuit is a high-order control switch designed by utilizing the PMOS (P-channel metal oxide semiconductor) conduction characteristic; the D2D circuit is fully called a DC to DC circuit and is a Buck type voltage reduction power supply circuit; the crystal oscillator circuit is a passive crystal oscillator circuit and can try to meet PWM signals required by system time sequence.

And a Q value detection circuit for detecting whether foreign matter exists or not and sending a signal capable of charging when the foreign matter does not exist.

Taking mobile phone charging as an example, the working principle of the SOC-based wireless charging board of the present invention is explained: firstly, a user accesses the power supply of an adapter into a wireless charging system (generally 5V, if higher transmitting power is needed, a QC adapter is needed to be accessed) through a Micro USB, the D2D of the wireless charging system, a crystal oscillator module starts to work to provide stable power supply and time sequence PWM signals for a main control circuit, the main control circuit starts to work, the main control circuit firstly generates a detection signal and sends the detection signal to a power and driving circuit through a driving circuit, whether a mobile phone is placed on the wireless charging circuit board or not is detected, if the mobile phone is not placed on an SOC-based wireless charging circuit board, the power and driving circuit transmits the signal transmitted by the mobile phone to the main control circuit through a voltage demodulation circuit 1, then the SOC-based wireless charging circuit board and the main control circuit start to communicate, the power size needing to be transmitted is negotiated, and the circuit receives the information, the transmitting power of the power transmitting circuit is adjusted through the power and driving circuit, and therefore the mobile phone is charged.

The input filtering and BUCK voltage regulating circuit 6 is used for realizing fixed-frequency voltage regulation so as to ensure that power and the driving circuit output certain voltage.

In addition, the bottom of the heating source device in the functional device is pasted on the mainboard through a heat conducting adhesive and a metal aluminum piece, so that the heat dissipation efficiency of the heating source device is improved, the surface temperature of the shell of a product is ensured to be not more than 45 ℃, and the temperature of all devices can be below 65 ℃ when the device is fully loaded at the normal temperature of 25 ℃.

Furthermore, all the heating source devices in the functional devices are arranged on the right side of the main board, such as the power and driving circuit 3 and the input filter and BUCK voltage regulating circuit 6 shown in fig. 3, so as to conveniently and intensively heat the heat conducting silica gel for heat dissipation.

The following describes the main boards in the SOC-based wireless charging board according to the embodiment of the present invention with reference to fig. 3, wherein, as shown in fig. 3, each of the main boards is integrated with a respective functional circuit and an SOC unit 2, and the SOC unit 2 is integrated with at least a driving module for driving part of the functional circuit;

optionally, all and/or part of the curve of the outer side of one end of the main plate is substantially the same as all/part of the curve of the inner side of the other end.

Optionally, one end of the main board is annular, and the other end of the main board is strip-shaped.

Optionally, a circuit layout design is arranged on one end of the main board; and the other end of the mainboard is provided with an LED indicating circuit.

The main boards are obtained after being divided by a splicing structure, as shown in fig. 4, wherein the splicing structure includes a first main board 10 and a second main board 11, the first main board 10 and the second main board 11 are arranged oppositely, the first main board and the second main board are arranged in a staggered manner in the extending direction, and the first main board and the second main board are buckled with each other.

In the present invention, the arrangement of the first motherboard 10 and the second motherboard is improved, and the first motherboard 10 and the second motherboard 11 are arranged in a relative arrangement manner, that is, the first motherboard 10 and the second motherboard are arranged face to face, as shown in fig. 4, by arranging the first motherboard 10 and the second motherboard 11 in a relative manner, the effective space can be more fully utilized, and the occupied area of the first motherboard 10 and the second motherboard 11 after being spliced is reduced.

In order to further reduce the occupied area of the first main board 10 and the second main board 11 after being spliced, the first main board 10 and the second main board 11 are not completely opposite to each other, but the first main board 10 and the second main board 11 are arranged in a staggered manner in the extending direction, as shown in fig. 4, that is, two ends of the first main board 10 and the second main board 11 are not completely overlapped, but are staggered with each other in the upper and lower positions, so that the first main board and the second main board are arranged in a buckled manner, and further the first main board 10 and the second main board 11 form a structure similar to mutual meshing, and the occupied area can be further saved through the improvement.

It should be noted that the first main board 10 and the second main board 11 do not contact with each other, and the first main board 10 and the second main board 11 are disposed in a spaced manner, but in order to ensure that the area occupied by the first main board 10 and the second main board 11 is smaller, improve the utilization rate of the substrate, and avoid the situation of difficult separation, the minimum distance between all possible contact positions of the first main board 10 and the second main board 11 should reach 0.4 mm.

Further, this practicality has still improved the shape of mainboard, for example the outline design after the mainboard concatenation is for the radian is littleer with the outline, more approaches square structure, through improve can further reduce the area of mainboard.

In a specific embodiment, as shown in fig. 2 and 3, the first main board and the second main board are integrally C-shaped, the sides of the first main board and the second main board having the opening are disposed opposite to each other, and the first main board and the second main board are fastened to each other end to end, specifically, one end of the first main board is fastened to a concave space surrounded by the C-shaped structure in the second main board, and one end of the second main board is fastened to a concave space surrounded by the C-shaped structure in the first main board, as shown in fig. 4.

More specifically, the first main board and the second main board each include a first end, a second end, and a middle portion connecting the first end and the second end, wherein the first ends of the first main board and the second main board are fastened to each other in the concave space, for example, the first end of the first main board is fastened to the concave space of the second main board, and the first end of the second main board is fastened to the concave space of the first main board.

For example, the first terminal and the second terminal are reduced in size, and both the length and the width of the second terminal are greatly reduced, as shown in fig. 2. And the second end is used for integrating an indicator light circuit. For example, in an embodiment of the present invention, an indicator light circuit is integrated on the second end to display the location and/or cause of the fault when the main board fails, so as to facilitate the repair.

Furthermore, the inner frame and the outer frame of the middle part are both in a substantially linear structure, so that the utilization rate of the PCB is improved.

In addition, the outer frame of the second end of first mainboard with the second mainboard is linear structure, the outer frame of first mainboard with the second mainboard at opening side and opening side offside also is linear structure to improve the utilization ratio of PCB board.

The first motherboard 10 and the second motherboard 11 are used to integrate functional devices and/or modules, wherein in an embodiment of the present invention, the first motherboard 10 and the second motherboard 11 may be a Printed Circuit Board (PCB) motherboard, a ceramic motherboard, a Pre-injection molding (Pre-mold) motherboard, or the like.

In order to solve the problems that peripheral circuits of each functional circuit, such as a driving module device scheme, are large in number of components, low in space utilization rate and difficult to design a PCB to be small in size, drive chips corresponding to each functional circuit are not arranged on the peripheries of the first main board and the second main board, SOC units are arranged on the first main board and the second main board, and at least driving modules for driving part of the functional circuits are integrated on the SOC units (System on Chip, SOC, Chip on System), wherein the driving chips which are arranged independently before are replaced by the driving modules which are integrated on the SOC units, and after the driving modules are connected with a control unit, the driving modules play the role of the driving chips before and control each functional circuit. The SOC unit integrates peripheral devices of all functional devices, and no separate chip is arranged, so that the using number of components is saved, and the devices of the whole system are in high-density layout by utilizing the advantage of high integration of the SOC unit, so that the utilization rate of a PCB is improved, and the effect of reducing the size is achieved.

The driving module in the SOC unit may be set according to actual needs, and is not limited to a specific one.

In an embodiment of the present invention, as shown in fig. 3, for example, the SOC unit includes a driving module matched with the power and driving circuit 3, and configured to control the power and driving circuit to transfer energy from the SOC-based wireless charging board to the device to be charged and control the magnitude of the power emitted by the power and driving circuit 3.

In another embodiment of the present invention, as shown in fig. 3, the SOC unit includes a main control circuit, and the main control circuit is configured to control the transmission power of the power transmission circuit through the power and driving circuit 3 according to the information fed back by the voltage demodulation circuit 1 and the requirement of the device to be charged.

In addition to integrating the driving module and the main control circuit matched with the power and driving circuit 3, the SOC unit of the present invention may also integrate other separately arranged peripheral devices, such as an operational amplifier module. Through the design of a novel SOC scheme, the size of a single PCB is reduced by 37%, and then special PCB splicing is carried out, so that the cost of the single PCB is further reduced.

In a central region where the SOC unit is disposed at the first end, individual driving modules, circuits, and the like in the SOC unit are connected to respective functional circuits disposed at the periphery of the SOC unit so as to minimize a route of wiring.

In a specific embodiment, the motherboard is a Printed Circuit Board (PCB) motherboard. The PCB is manufactured by processing different components and various complex process technologies, and the like, wherein the PCB circuit board has a single-layer structure, a double-layer structure and a multi-layer structure, and different hierarchical structures have different manufacturing modes.

Alternatively, the printed circuit board is primarily comprised of pads, vias, mounting holes, wires, components, connectors, fills, electrical boundaries, and the like.

Further, common board Layer structures of printed circuit boards include three types, namely a Single Layer board (Single Layer PCB), a Double Layer board (Double Layer PCB) and a Multi Layer board (Multi Layer PCB), and specific structures thereof are as follows:

(1) Single-Sided Boards (Single-Sided Boards) are on the most basic PCB with parts concentrated on one side and wires concentrated on the other side (same side as the wires when the patch elements are present, and the package devices on the other side). Such a PCB is called a Single-sided (Single-sided) board because the conductors are present on only one side thereof. Since single panels have many stringent constraints on the design of the circuitry (since only one side, the wires cannot cross and must be routed around individual paths), only early circuits used such panels.

(2) Double-Sided Boards (Double-Sided Boards) are Boards that have wiring on both sides, but use wires on both sides and require appropriate electrical connections between the sides. The "bridge" between circuits is called a via (via). The via hole is a small hole filled or coated with metal on the PCB, and can be connected with the wires on both sides. Because the area of the double-sided board is twice larger than that of the single-sided board, the double-sided board solves the difficulty of wiring staggering (conducting to the other side through holes) in the single-sided board, and the double-sided board is more suitable for being used on a circuit which is more complex than the single-sided board.

(3) Multilayer board: Multi-Layer Boards (Multi-Layer Boards) to increase the area over which wiring can be routed, more single or double sided wiring Boards are used. A printed circuit board with two inner layers and two outer layers or two inner layers and two outer layers is made up through alternative arrangement of positioning system and insulating adhesive material, and interconnection of conducting patterns according to design requirement. The number of layers of the board does not represent that there are several independent wiring layers, and in special cases, empty layers are added to control the board thickness, and the number of layers is usually even and includes two outermost layers. Most motherboards are 4 to 8-layer structures, but technically, it is theoretically possible to make a PCB with nearly 100 layers.

The printed circuit board includes many types of working layers, such as a signal layer, a protective layer, a silk-screen layer, an internal layer, and so on, which are not described herein again.

In order to reduce the cost, in the embodiment of the present invention, the main board is a multilayer board, in a specific embodiment, the main board is a four-layer board, each layer is a double-sided board, the layers are insulated from each other, and the connection between the layers is usually realized through a via hole.

For example, the first main board 10 and the second main board 11 each include a first circuit board and a second circuit board, wherein the first circuit board and the second circuit board each include two oppositely disposed surfaces, and the first circuit board and the second circuit board are separated by an insulating layer, for example, by a material layer such as glass fiber, which is spaced and insulated from each other.

Further, the first main board 10 and the second main board 11 may be Pre-injection molded (Pre-mold) main boards, wherein the Pre-injection molded main boards have injection molding wires and pins, the injection molding wires are embedded in the main body structure of the main boards, and the pins are located on the surface of the main body structure of the main boards, such as an inner surface and/or an outer surface, so as to electrically connect the main boards with a circuit board, respectively.

The preparation method of the Pre-injection (Pre-mold) mainboard can be formed by a conventional injection molding process, a planer tool digging process and a mold stamping forming process in sequence, and is not repeated herein.

The injection molding material of the Pre-injection molded (Pre-mold) main board may be a conventional material, such as a conductive thermoplastic material, and is not limited to a certain material, wherein the shape of the Pre-injection molded (Pre-mold) main board is defined by an injection molding frame, and is not limited to a certain material.

In one embodiment, the first main board 10 and the second main board 11 are placed on a PCB main board within an injection molding frame, and then an annular groove structure is formed on the PCB main board by injection molding. Or arranging the injection molding lead and the pins in the injection molding frame, and then performing injection molding on the injection molding frame.

In the present invention, the first motherboard 10 and the second motherboard 11 are connected by a stamp hole, and two types of technologies, through-hole (THT) and Surface Mount (SMT), are generally used in the PCB assembly process. Another technique, board-to-board soldering, is becoming common when it is desired to mount a single module board on top of another PCB. With the increasing demand for circuit board modules, the edge of the PCB circuit board is graphitized by electroplating through holes or vias. The stamp hole forms a series of half holes after the board edge is cut.

According to the wireless charging circuit board based on the SOC provided by the utility model, each functional circuit and an SOC unit are integrated on the main board of the wireless charging circuit board, and at least a driving module for driving part of the functional circuits is integrated on the SOC unit, wherein the arrangement of the SOC unit can replace a driving chip which is independently arranged on each functional circuit, and the driving modules (peripheral devices) of each functional module are reasonably distributed by utilizing the advantage of high integration degree of the SOC, so that the devices of the whole system are in high-density layout, the utilization rate of the PCB is improved, the effect of reducing the size is achieved, and the purpose of optimizing the cost is achieved.

The brand new SOC unit integrates most functions of the original discrete device, so that the using quantity of components is saved, the utilization rate of the PCB is improved by optimizing the circuit layout, the cost and the performance are optimized, the product has more market competitiveness, the size of a single PCB is reduced by 37% by the design of a novel SOC scheme, and the cost of the single PCB is further reduced.

The utility model also provides a wireless charger, which comprises a wireless charging circuit board based on the SOC, wherein the wireless charging circuit board based on the SOC at least comprises:

the SOC-based wireless charging patch panel described above;

a case for forming a space for accommodating the main board, wherein an outer circumference of the main board is disposed at an edge area of the case.

The structure included in the SOC-based wireless charging circuit board can refer to the description of the second embodiment, and is not described herein again, and only other components included in the wireless charger are further described below.

In one embodiment, the wireless charger includes at least a housing for forming a space for accommodating the SOC-based wireless charging circuit board and the outer circumference of the main board is disposed in an edge area of the inside of the housing to prevent the stamp hole on the inner circumference of the main board from affecting the package.

Alternatively, the housing may be composed of an upper housing and a lower housing, and the outer shapes of the upper housing and the lower housing may be overlapped, the upper housing and the lower housing being engaged with each other to form a receiving space.

Optionally, the upper shell and the lower shell are made of the same material, so that the upper shell and the lower shell have the same shrinkage rate, and the upper shell and the lower shell are prevented from being completely clamped and sealed after being processed.

Alternatively, the plastic material generally selected for the housing is Polycarbonate (PC) and Acrylonitrile Butadiene Styrene (ABS) copolymer and mixture, it should be noted that the material of the housing is not limited to one, and any housing material commonly used in the art can be applied to the embodiment of the present invention, and is not listed here.

Alternatively, the housing needs to have a certain strength to satisfy the ability of various drop, twist, and seat pressure tests without being damaged.

Illustratively, the thickness of the shell is 0.5-4mm, and for the shell of the injection molding plastic part, the wall thickness of the shell is related to factors such as the size, the structure, the plastic raw material, the position of a mold gate, the injection molding process and the like of the part, and the approximate range is 0.5-4 mm; the thin part is poor in strength and difficult to be injection molded; too thick, causes material waste, long forming period, easy shrinkage and poor surface quality.

For the wireless charger structure, under the condition of adopting PC material, the front wall thickness of the shell is selected to be in the range of 1.0-1.2mm, and the currently common thickness is 1.0mm (if the product is larger, 1.2mm is selected, such as mobile phones).

Of course, besides the above components, the wireless charger may further include a USB interface and other conventional structures, which are not described herein again.

The brand new SOC unit integrates most functions of the original discrete device, so that the using quantity of components is saved, the utilization rate of the PCB is improved by optimizing the circuit layout, the cost and the performance are optimized, the product has more market competitiveness, the size of the PCB single chip is reduced by 37% by the novel design of the SOC scheme, and then the cost of the PCB single chip is further reduced by splicing the special PCB. The wireless charger adopting the SOC unit also has the advantages.

The terms are used in the same sense as those commonly understood by those skilled in the art of the present invention. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. Terms such as "part," "member," and the like, when used herein, can refer to either a single part or a combination of parts. Terms such as "mounted," "disposed," and the like, as used herein, may refer to one component as being directly attached to another component or one component as being attached to another component through intervening components. Features described herein in one embodiment may be applied to another embodiment, either alone or in combination with other features, unless the feature is otherwise inapplicable or otherwise stated in the other embodiment.

The present invention has been illustrated by the above embodiments, but it should be understood that the above embodiments are for illustrative and descriptive purposes only and are not intended to limit the utility model to the scope of the described embodiments. Furthermore, it will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that many variations and modifications may be made in accordance with the teachings of the present invention, which variations and modifications are within the scope of the present invention as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims (10)

1. A wireless charging patch panel based on SOC, comprising:

the system comprises a mainboard, wherein a functional circuit and an SOC unit are integrated on the mainboard, and at least one driving module for driving at least part of the functional circuit is integrated on the SOC unit; the whole main board is of a C-shaped structure, and the area of one end of the main board is larger than that of the other end of the main board;

the connecting wire for connect function circuit, wherein the connecting wire is including the logic connecting wire that is used for the power connecting wire of transmission power and transmission signal, wherein, the power connecting wire set up in the surface of mainboard the superiors, the logic connecting wire set up in on the intermediate level of mainboard.

2. The SOC-based wireless charging patch panel of claim 1, wherein all and/or part of the curve of the outer side of one end of said main board is the same as all and/or part of the curve of the inner side of the other end.

3. The SOC-based wireless charging circuit board of claim 2, wherein one end of the main board is ring-shaped and the other end of the main board is bar-shaped.

4. The SOC-based wireless charging patch panel of claim 2, wherein a circuit layout design is provided on one end of the motherboard.

5. The SOC-based wireless charging circuit board according to claim 4, wherein the other end of the main board is provided with an LED indicating circuit.

6. The SOC-based wireless charging circuit board of claim 5, wherein the motherboard includes a first end, a second end, and a middle portion connecting the first end and the second end, wherein an outer frame of the middle portion is a straight structure.

7. The wireless charging patch panel for a SOC of claim 6, wherein the SOC unit is disposed in a center region of the first end.

8. The SOC-based wireless charging board according to claim 6, wherein a spacing between heat generating source devices in the functional circuit is 8mm or more.

9. The SOC-based wireless charging patch panel of claim 8, wherein said functional circuitry comprises power and drive circuitry disposed at a first end of said motherboard;

the SOC unit comprises a driving module matched with the power and driving circuit and is configured to control the power and driving circuit to transfer energy from the wireless charging circuit board to a device to be charged and control the power and driving circuit to emit power; and/or

The SOC unit comprises a main control circuit, and the main control circuit is used for controlling the transmitting power through the power and driving circuit according to the information fed back by the voltage demodulation circuit and the requirement of the device to be charged.

10. A wireless charger, comprising:

the SOC-based wireless charging patch panel of one of claims 1-9;

the main board is positioned in the edge area of the inner part of the shell.

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