CN216748775U

CN216748775U - COVER and electronic chip integral type integrated configuration

Info

Publication number: CN216748775U
Application number: CN202122594724.1U
Authority: CN
Inventors: 朱琪; 方宗元; 刘建胜
Original assignee: Jiaxing Liankong Auto Parts Co ltd
Current assignee: Jiaxing Liankong New Energy Technology Co ltd
Priority date: 2021-10-27
Filing date: 2021-10-27
Publication date: 2022-06-14
Anticipated expiration: 2031-10-27

Abstract

The utility model discloses a COVER and electronic chip integrated structure, which relates to the technical field of integration and comprises a shell and a chip main body, wherein the chip main body is arranged in the shell, a convex block is fixedly arranged at the top end of one side of the shell, a plurality of PIN needles are embedded in the middle of the convex block, one ends of the PIN needles pass through the interior of the shell and extend to the top end of the back of the chip main body, and terminals which correspond to the PIN needles one to one are arranged at the top end of the back of the chip main body. According to the utility model, the plurality of terminals on the chip main body are fixed with the plurality of PIN PINs in a resistance welding manner, the plurality of terminals on the chip main body are attached to the plurality of PIN PINs during assembly, direct resistance welding is performed, the assembly manner is simple, the cost is lower, the chip main body can be limited by arranging the second baffle and the two first baffles, the chip main body can be directly clamped during assembly conveniently, manual support of the chip main body is not needed, and the assembly is convenient and rapid.

Description

COVER and electronic chip integral type integrated structure

Technical Field

The utility model relates to the technical field of integration, in particular to a COVER and electronic chip integrated structure.

Background

The cover is actually a plastic shell of the actuator, the shell is a product which is formed by insert injection molding, terminals of a motor and a connector are embedded in the shell and used for connecting signals, the cover and the PCB are fixed on the product in a screw mode in the prior art, each electronic chip is assembled by screws, and PIN PINs are required to be connected with the terminals of the electronic chips subsequently, so that the assembly is slow and the cost is high; meanwhile, during installation in the prior art, the installation hole of the electronic chip is required to be kept aligned with the threaded hole of the cover, so that the assembly speed is influenced.

Therefore, it is necessary to invent a COVER and electronic chip integrated structure to solve the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide an integrated structure of a COVER and an electronic chip, so as to solve the problems in the background technology.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a COVER and electronic chip integral type integrated configuration, includes casing and chip main part, the inside of casing is provided with the chip main part, the fixed lug that is provided with in one side top of casing, the middle part of lug is inlayed and is provided with a plurality of PIN needles, and the one end of a plurality of PIN needles is through the inside back top that extends to the chip main part of casing, the back top of chip main part be provided with the terminal of a plurality of PIN needle one-to-ones, and the back of terminal is close to the one end laminating of chip main part with the PIN needle and is connected, the positive top of chip main part is inlayed and is provided with the welding plate, and the back of welding plate and the positive fixed connection of terminal.

Preferably, the fixed frame plate that is provided with of inside lower extreme of casing, and the inside wall middle part of fixed frame plate is the arc setting.

Preferably, the bottom end of the chip main body extends to the inside of the arc-shaped groove of the fixed frame plate, and the middle part of the shell is fixedly provided with a buckle.

Preferably, the two sides of the chip main body are both provided with first baffles, and the back surfaces of the first baffles are fixedly connected with the inner wall of the shell.

Preferably, the fixed second baffle that is provided with in inside wall middle part of fixed frame plate, one side that first baffle and second baffle are close to the chip main part all fixedly is provided with the spacing layer with the laminating of chip main part.

The utility model has the technical effects and advantages that:

1. according to the utility model, the plurality of terminals on the chip main body are fixed with the plurality of PIN PINs in a resistance welding manner, the plurality of terminals on the chip main body are attached to the plurality of PIN PINs during assembly, direct resistance welding is realized, the assembly manner is simple, the cost is lower, the chip main body can be limited by arranging the second baffle and the two first baffles, the chip main body can be directly clamped during assembly conveniently, manual support of the chip main body is not needed, and the assembly is convenient and rapid;

2. according to the utility model, the first baffle or the second baffle can be prevented from wearing the chip main body by arranging the limiting layer which is made of hard rubber.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention.

FIG. 2 is a schematic side sectional view of a portion of FIG. 1 in accordance with the present invention.

Fig. 3 is an enlarged view of the structure at a in fig. 1 according to the present invention.

In the figure: 1. a housing; 2. a chip body; 3. a bump; 4. a PIN needle; 5. a terminal; 6. welding the plate; 7. buckling; 8. a first baffle plate; 9. a second baffle; 10. a limiting layer; 11. and fixing the frame plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.

The utility model provides a COVER and electronic chip integrated structure as shown in fig. 1-3, comprising a shell 1 and a chip main body 2, wherein the chip main body 2 is arranged in the shell 1, a convex block 3 is fixedly arranged at the top end of one side of the shell 1, a plurality of PIN PINs 4 are embedded in the middle of the convex block 3, one ends of the PIN PINs 4 pass through the interior of the shell 1 and extend to the top end of the back surface of the chip main body 2, terminals 5 which correspond to the PIN PINs 4 one by one are arranged at the top end of the back surface of the chip main body 2, the back surfaces of the terminals 5 are connected with one ends of the PIN PINs 4 close to the chip main body 2 in an attaching manner, a welding plate 6 is embedded at the top end of the front surface of the chip main body 2, the back surface of the welding plate 6 is fixedly connected with the front surface of the terminals 5, and the terminals on the chip main body 2 are fixed with the PIN PINs 4 in a resistance welding manner, during the assembly, a plurality of terminals on the chip main body 2 are attached to a plurality of PIN needles 4, and direct resistance welding is adopted, so that the assembly mode is simple, and the cost is low.

Further, a fixed frame plate 11 is fixedly arranged at the lower end inside the shell 1, the middle part of the inner side wall of the fixed frame plate 11 is arranged in an arc shape, the bottom end of the chip main body 2 extends to the inside of an arc-shaped groove of the fixed frame plate 11, a buckle 7 is fixedly arranged at the middle part of the shell 1, first baffle plates 8 are arranged on two sides of the chip main body 2, the back surface of each first baffle plate 8 is fixedly connected with the inner wall of the shell 1, a second baffle plate 9 is fixedly arranged at the middle part of the inner side wall of the fixed frame plate 11, the chip main body 2 can be limited through the arrangement of the second baffle plate 9 and the two first baffle plates 8, the chip main body 2 is directly clamped during convenient assembly, the chip main body 2 does not need to be manually supported, the assembly is convenient and rapid, a limiting layer 10 which is attached to the chip main body 2 is fixedly arranged on one side of each first baffle plate 8 and the second baffle plate 9, which is close to the chip main body 2, through the setting of spacing layer 10, spacing layer 10 is the hard rubber, can prevent that first baffle 8 or second baffle 9 from wearing and tearing chip main part 2.

The working principle of the utility model is as follows:

during the use, it is fixed to adopt the mode of resistance welding between a plurality of terminals on the chip main part 2 and a plurality of PIN needles 4, during the assembly with a plurality of terminals on the chip main part 2 and a plurality of PIN needles 4 laminating, direct resistance welding welds, the assembly methods is simple, and the cost is lower, and through the setting of second baffle 9 and two first baffles 8, can carry on spacingly to the chip main part 2, directly block chip main part 2 when convenient assembly, need not artifical support chip main part 2, convenient assembling is swift.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the utility model.

Claims

1. The utility model provides a COVER and electronic chip integral type integrated structure which characterized in that: including casing (1) and chip main part (2), the inside of casing (1) is provided with chip main part (2), the fixed lug (3) that is provided with in one side top of casing (1), the middle part of lug (3) is inlayed and is provided with a plurality of PIN needles (4), and the one end of a plurality of PIN needles (4) is through casing (1) inside and extend to the back top of chip main part (2), the back top of chip main part (2) is provided with terminal (5) with a plurality of PIN needles (4) one-to-one, and the back of terminal (5) is connected with the one end laminating that PIN needle (4) are close to chip main part (2), the front top of chip main part (2) is inlayed and is provided with welding plate (6), and welds the back of plate (6) and the front fixed connection of terminal (5).

2. The COVER and electronic chip integrated structure as claimed in claim 1, wherein: the inside lower extreme of casing (1) is fixed to be provided with fixed frame plate (11), and the inside wall middle part of fixed frame plate (11) is the arc setting.

3. The COVER and electronic chip integrated structure as claimed in claim 2, wherein: the bottom of chip main part (2) extends to inside the arc wall of fixed frame board (11), the middle part fixed mounting of casing (1) is provided with buckle (7).

4. The COVER and electronic chip integrated structure as claimed in claim 3, wherein: the chip comprises a chip body (2) and is characterized in that first baffles (8) are arranged on two sides of the chip body (2), and the back surfaces of the first baffles (8) are fixedly connected with the inner wall of a shell (1).

5. The COVER and electronic chip integrated structure as claimed in claim 4, wherein: the fixed second baffle (9) that is provided with in inside wall middle part of fixed frame plate (11), one side that first baffle (8) and second baffle (9) are close to chip main part (2) all fixedly is provided with spacing layer (10) with chip main part (2) laminating.