CN215343937U

CN215343937U - Wireless charging circuit board splicing structure, wireless charging circuit structure and charger

Info

Publication number: CN215343937U
Application number: CN202023342094.0U
Authority: CN
Inventors: 黄伯明; 江甫
Original assignee: Anker Innovations Co Ltd
Current assignee: Anker Innovations Co Ltd
Priority date: 2020-12-31
Filing date: 2020-12-31
Publication date: 2021-12-28
Anticipated expiration: 2030-12-31

Abstract

The utility model provides a wireless charging circuit board splicing structure, a wireless charging circuit structure and a charger. The splicing structure comprises a first main board and a second main board; the first main board and the second main board are both in a fan-ring shape and are used for integrating all functional circuits; the inner circumference of the fan ring of the first main plate is adjacent to and opposite to the inner circumference of the fan ring of the second main plate; the first main board and the second main board are arranged in a staggered mode in the extending direction of the fan ring, so that the first main board and the second main board are arranged in a buckled mode. The optimized splicing mode directly reduces the cost of the PCB single chip by 6.8 percent, the straight-through rate of SMT production reaches 99.9 percent, residual burrs of the split boards after splicing do not influence assembly, the split boards can be directly compatible with the existing shell, the utilization rate of the raw materials of the substrate is improved, good effects are achieved on reducing industrial waste products, and energy conservation and environmental protection are promoted.

Description

Wireless charging circuit board splicing structure, wireless charging circuit structure and charger

Technical Field

The utility model relates to the technical field of charging, in particular to a wireless charging circuit board splicing structure, a wireless charging circuit structure and a charger.

Background

With the continuous update of consumer electronics, small-sized high power density chargers are becoming the development trend in the future. In the wireless mobile phone accessory market, under the condition that the transmission power and the number of electronic devices are not changed greatly, how to use a smaller PCB size to save the cost becomes the key of market competition.

In order to reduce the cost of wireless charging, the structure of the current wireless charging circuit board needs to be improved.

SUMMERY OF THE UTILITY MODEL

According to the utility model, in order to solve the existing problems, the utility model provides a splicing structure of a wireless charging circuit board, which comprises a first main board and a second main board;

the first main board and the second main board are both in a fan-ring shape and are used for integrating all functional circuits;

the inner circumference of the fan ring of the first main plate is adjacent to and opposite to the inner circumference of the fan ring of the second main plate;

the first main board and the second main board are arranged in a staggered mode in the extending direction of the fan ring, so that the first main board and the second main board are arranged in a buckled mode.

Optionally, the first main board and the second main board are spaced apart from each other and are connected to each other by a stamp hole.

Optionally, a first extending plate is disposed on an end surface of the first end of the fan ring of the first main plate, and a second extending plate is disposed on an end surface of the first end of the fan ring of the second main plate.

Optionally, the first extending plate is buckled at an inner circumference of the second end of the second main plate, and the second extending plate is buckled at an inner circumference of the second end of the first main plate.

Optionally, the stamp hole is provided in a peripheral area of the first main plate and the second main plate that is opposite to the first main plate and the second main plate outside the first extension plate and the second extension plate.

Optionally, the stamp hole is provided at a position opposite to the inner circumference of the first end of the fan ring of the second main plate.

Optionally, the first extension plate and the second extension plate are both rectangular structures and used for integrating the indicator light circuit.

Optionally, the smallest distance between the first main plate and the second main plate is greater than 0.4 mm.

The utility model also provides a wireless charging circuit structure, which comprises:

the main board is an independent first main board or an independent second main board obtained after the board splitting is carried out on the splicing structure.

The present invention also provides a charger, including:

the wireless charging circuit structure;

and a case for forming a space for accommodating the main board, wherein an outer circumference of the main board is disposed at an edge area inside the case.

According to the embodiment of the utility model, a cost-saving special-shaped makeup mode is provided, so that the cost of a single PCB after being spliced is reduced, and the first main board and the second main board in the splicing structure are both in a fan-ring shape and used for integrating various functional circuits; the inner circumference of the fan ring of the first main plate is adjacent to and opposite to the inner circumference of the fan ring of the second main plate; the first main board and the second main board are arranged in a staggered mode in the extending direction of the fan ring, so that the first main board and the second main board are arranged in a buckled mode. The improved PCB splicing structure fully utilizes the effective space, so that the spliced size is 93.2 percent of the original size

The optimized splicing mode directly reduces the cost of the PCB single chip by 6.8%, the first pass rate of SMT production reaches 99.9%, the assembly is not affected by the residual burrs of the spliced board, the PCB single chip can be directly compatible with the existing shell, the problems of insufficient splicing strength and interference of the residual burrs of the spliced board with the shell are solved by the proper position of the spliced board and the number of stamp holes, the utilization rate of the raw materials of the substrate is improved, the industrial waste products are reduced, and energy conservation and environmental protection are promoted.

Drawings

The above and other objects, features and advantages of the present invention will become more apparent by describing in more detail embodiments of the present invention with reference to the attached drawings. The accompanying drawings are included to provide a further understanding of the embodiments of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model and not to limit the utility model. In the drawings, like reference numbers generally represent like parts or steps.

Fig. 1 is a schematic structural diagram of a splicing structure of a wireless charging circuit board in a current scheme;

fig. 2 is a schematic structural diagram of a splicing structure of a wireless charging circuit board according to an embodiment of the present invention;

FIG. 3 is an enlarged view of a portion of the right-side box of FIG. 2;

fig. 4 is an enlarged schematic view of a partial structure in the left-side block of fig. 2.

Reference symbols of the drawings

10. First main board

11. Second main board

101. Stamp hole

102. First extension board

103. Second extension plate

Detailed Description

In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art, that the present invention may be practiced without one or more of these specific details. In other instances, well-known features have not been described in order to avoid obscuring the utility model.

In the following description, for purposes of explanation, specific details are set forth in order to provide a thorough understanding of the present invention. It is apparent that the practice of the utility model is not limited to the specific details set forth herein as are known to those of skill in the art. The following detailed description of the preferred embodiments of the utility model, however, the utility model is capable of other embodiments in addition to the detailed description and should not be construed as limited to the embodiments set forth herein.

It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model, as the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. When the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The terms "upper", "lower", "front", "rear", "left", "right" and the like as used herein are for purposes of illustration only and are not limiting.

Ordinal words such as "first" and "second" are referred to herein merely as labels, and do not have any other meaning, such as a particular order, etc. Also, for example, the term "first component" does not itself imply the presence of "second component", and the term "second component" does not itself imply the presence of "first component".

Specific embodiments of the present invention will now be described in more detail with reference to the accompanying drawings, which illustrate representative embodiments of the utility model and do not limit the utility model.

In the wireless mobile phone accessory market, under the condition that the transmission power and the number of electronic devices are not changed greatly, how to use a smaller PCB size to save the cost becomes the key of market competition. The common PCB splicing mode is that the PCB is translated upwards or rightwards according to the axis and spliced, as shown in figure 1, leftover materials between boards are seriously wasted, and the cost is directly increased.

In order to solve the above problems, the present invention provides a splicing structure of a wireless charging circuit board, where the splicing structure includes a first main board and a second main board;

The wireless charging circuit structure in the embodiment of the utility model is described in detail below with reference to the accompanying drawings.

Example one

First, a wireless charging circuit structure according to an embodiment of the present invention is described with reference to fig. 2, and fig. 2 is a schematic structural diagram of a splicing structure of a wireless charging circuit board according to an embodiment of the present invention.

As shown in fig. 2, the splicing structure includes a first main board 10 and a second main board 11;

the first main board 10 and the second main board 11 are both in a fan-ring shape and used for integrating various functional circuits;

the inner circumference of the fan ring of the first main plate 10 is adjacent to and opposite to the inner circumference of the fan ring of the second main plate 11;

the first main board 10 and the second main board 11 are arranged in a staggered manner in the extending direction of the fan ring, so that the first main board 10 and the second main board 11 are arranged in a buckled manner.

In the present invention, the relative position of the first main plate 10 and the second main plate is improved, and the first main plate 10 and the second main plate 11 are arranged oppositely, that is, the first main plate 10 and the second main plate are arranged face to face, wherein the face to face arrangement means that the inner circumferences of the first main plate 10 and the second main plate are arranged oppositely, and are not arranged oppositely, as shown in fig. 2, the effective space can be more fully utilized by arranging the first main plate 10 and the second main plate 11 oppositely, and the area occupied by the first main plate 10 and the second main plate 11 after being spliced is reduced.

In order to further reduce the occupied area of the first main board 10 and the second main board 11 after being spliced, the first main board 10 and the second main board 11 are not arranged completely opposite to each other, instead, the first main plate 10 and the second main plate 11 are arranged in a staggered manner in the extension direction of the fan ring, as shown in figure 2, that is, the two ends of the first main plate 10 and the second main plate 11 are not completely overlapped, but are staggered from each other in the upper and lower positions, so that the first main board and the second main board are buckled with each other, so that the first end of the first main board 10 enters the radian of the fan ring of the second main board 11, and similarly, the first end of the second main board 11 enters the radian of the fan ring of the first main board 10, the first main board 10 and the second main board 11 are formed into a similar mutual engagement structure, and the occupied area can be further saved through the improvement.

It should be noted that the first main board 10 and the second main board 11 do not contact with each other, and the first main board 10 and the second main board 11 are disposed in a spaced manner, but in order to ensure that the area occupied by the first main board 10 and the second main board 11 is smaller, improve the utilization rate of the substrate, and avoid the situation of difficult separation, the minimum distance between all possible contact positions of the first main board 10 and the second main board 11 should reach 0.4 mm.

The first motherboard 10 and the second motherboard 11 are used to integrate functional devices and/or modules, wherein in an embodiment of the present invention, the first motherboard 10 and the second motherboard 11 may be a Printed Circuit Board (PCB) motherboard, a ceramic motherboard, a Pre-injection molding (Pre-mold) motherboard, or the like.

In a specific embodiment, the first motherboard 10 and the second motherboard 11 are Printed Circuit Board (PCB) motherboards. The PCB is manufactured by processing different components and various complex process technologies, and the like, wherein the PCB circuit board has a single-layer structure, a double-layer structure and a multi-layer structure, and different hierarchical structures have different manufacturing modes.

Alternatively, the printed circuit board is primarily comprised of pads, vias, mounting holes, wires, components, connectors, fills, electrical boundaries, and the like.

Further, common board Layer structures of printed circuit boards include three types, namely a Single Layer board (Single Layer PCB), a Double Layer board (Double Layer PCB) and a Multi Layer board (Multi Layer PCB), and specific structures thereof are as follows:

(1) Single-Sided Boards (Single-Sided Boards) are on the most basic PCB with parts concentrated on one side and wires concentrated on the other side (same side as the wires when the patch elements are present, and the package devices on the other side). Such a PCB is called a Single-sided (Single-sided) board because the conductors are present on only one side thereof. Since single panels have many stringent constraints on the design of the circuitry (since only one side, the wires cannot cross and must be routed around individual paths), only early circuits used such panels.

(2) Double-Sided Boards (Double-Sided Boards) are Boards that have wiring on both sides, but use wires on both sides and require appropriate electrical connections between the sides. The "bridge" between circuits is called a via (via). The via hole is a small hole filled or coated with metal on the PCB, and can be connected with the wires on both sides. Because the area of the double-sided board is twice larger than that of the single-sided board, the double-sided board solves the difficulty of wiring staggering (conducting to the other side through holes) in the single-sided board, and the double-sided board is more suitable for being used on a circuit which is more complex than the single-sided board.

(3) Multilayer board: Multi-Layer Boards (Multi-Layer Boards) to increase the area over which wiring can be routed, more single or double sided wiring Boards are used. A printed circuit board with two inner layers and two outer layers or two inner layers and two outer layers is made up through alternative arrangement of positioning system and insulating adhesive material, and interconnection of conducting patterns according to design requirement. The number of layers of the board does not represent that there are several independent wiring layers, and in special cases, empty layers are added to control the board thickness, and the number of layers is usually even and includes two outermost layers. Most motherboards are 4 to 8-layer structures, but technically, it is theoretically possible to make a PCB with nearly 100 layers.

The printed circuit board includes many types of working layers, such as a signal layer, a protective layer, a silk-screen layer, an internal layer, and so on, which are not described herein again.

In order to reduce the cost, in the embodiment of the present invention, the main board is a multilayer board, in a specific embodiment, the first main board 10 and the second main board 11 are two-layer boards, each layer is a double-sided board, the layers are insulated from each other, and the layer-to-layer connection is usually realized through a via hole.

For example, the first main board 10 and the second main board 11 each include a first circuit board and a second circuit board, wherein the first circuit board and the second circuit board each include two oppositely disposed surfaces, and the first circuit board and the second circuit board are separated by an insulating layer, for example, by a material layer such as glass fiber, which is spaced and insulated from each other.

Further, the first main board 10 and the second main board 11 may be Pre-injection molded (Pre-mold) main boards, wherein the Pre-injection molded main boards have injection molding wires and pins, the injection molding wires are embedded in the main structure of the main board, and the pins are located on the surface of the main structure of the main board, such as an inner surface and/or an outer surface, so as to electrically connect the main board with the laser diode chip, the driver chip, and the circuit board, respectively.

The preparation method of the Pre-injection (Pre-mold) mainboard can be formed by a conventional injection molding process, a planer tool digging process and a mold stamping forming process in sequence, and is not repeated herein.

The injection molding material of the Pre-injection molded (Pre-mold) main board may be a conventional material, such as a conductive thermoplastic material, and is not limited to a certain material, wherein the shape of the Pre-injection molded (Pre-mold) main board is defined by an injection molding frame, and is not limited to a certain material.

In one embodiment, the first main board 10 and the second main board 11 are placed on a PCB main board within an injection molding frame, and then an annular groove structure is formed on the PCB main board by injection molding. Or arranging the injection molding lead and the pins in the injection molding frame, and then performing injection molding on the injection molding frame.

The first main board 10 and the second main board 11 are in the shape of a part of a circular ring, that is, in the shape of a fan ring, for example, the size of the single PCB is about 35.7% of the size of the original complete circular ring, as shown in fig. 2, for the improved main board structure, the improved size is greatly reduced, the packaging space is saved, and the cost is further reduced.

In the present invention, the first motherboard 10 and the second motherboard 11 are connected by a stamp hole, and two types of technologies, through-hole (THT) and Surface Mount (SMT), are generally used in the PCB assembly process. Another technique, board-to-board soldering, is becoming common when it is desired to mount a single module board on top of another PCB. With the increasing demand for circuit board modules, the edge of the PCB circuit board is graphitized by electroplating through holes or vias. The stamp hole forms a series of half holes after the board edge is cut.

In order to avoid the problem that the half hole burrs left after the first main plate 10 and the second main plate 11 are divided interfere with the shell, and the splicing stamp hole interferes with the upper cover to cause the gap between the upper cover and the lower cover to be enlarged, the arrangement position of the stamp hole 101 is improved in the utility model, as shown in fig. 3 and 4.

The stamp hole will be described in detail with reference to the drawings, wherein the first main plate 10 and the second main plate 11 are each in a fan-ring structure, and the first main plate 10 and the second main plate 11 each include a first end and a second end.

As shown in fig. 2, a first extension plate 102 is disposed on an end surface of a first end of the fan ring of the first main plate, and a second extension plate 103 is disposed on an end surface of a first end of the fan ring of the second main plate.

The first extension plate 102 and the second extension plate 103 are both rectangular structures and are used for integrating indicator light circuits. For example, in an embodiment of the present invention, indicator light circuits are integrated on the first extension board 102 and the second extension board 103, so as to indicate the location and/or cause of a fault when the main board fails, thereby facilitating the maintenance.

The stamp hole is provided on an outer end surface of the first extending plate 102 at the first end of the first main plate 10, wherein the end surface is a surface on which the first extending plate 102 is provided as shown in fig. 2.

And/or

The stamp hole is provided at the inner circumference of the second end of the second main plate 11 outside the first extension plate 10, as shown in fig. 2.

Similarly, as shown in fig. 3, the stamp hole is provided on the outer end surface of the second extending plate 103 at the first end of the second main plate 11, wherein the end surface is the surface on which the second extending plate 103 is provided as shown in fig. 2.

And/or

The stamp hole is formed at the inner circumference of the second end of the first main plate 10 outside the second extension plate 103, as shown in fig. 3.

The stamp holes are formed in the inner circumferences of the first main board 10 and the second main board 11, that is, the stamp holes are not formed in the outer circumferences of the first main board 10 and the second main board 11, and when the package is performed, the stamp holes are formed in the inner circumferences of the first main board 10 and the second main board 11, so that the peripheral edge of the package shell is not affected, and therefore, the assembly is not affected by the residual burrs after the split of the splicing structure, and the package can be directly compatible with the existing shell.

Furthermore, because the stamp holes are all arranged on the inner circumferences of the first main plate 10 and the second main plate 11, and stamp holes are not arranged around the first extension plate 102 and the second extension plate 103, the first extension plate 102 and the second extension plate 103 are not affected during plate splitting, so that the phenomenon that the first extension plate 102 and the second extension plate 103 are damaged is avoided, and the problems of insufficient splicing strength and interference of residual burrs on the shell after plate splitting are solved through the proper plate splicing edge positions and the number of stamp holes.

Further, as shown in fig. 2, the stamp hole is provided at a position where the inner circumference of the first end of the fan ring of the first main plate is opposite to the inner circumference of the first end of the fan ring of the second main plate.

Example two

the main board is an independent first main board or a second main board obtained after the split board of the split joint structure in the first embodiment.

For the shapes of the first main board and the second main board, please refer to embodiment one, which is described herein in detail.

In an embodiment of the present invention, the first motherboard and the second motherboard are provided with various functional circuits, and the functional circuits include:

the power transmitting circuit is used for generating a magnetic coupling electric field which can be received by a device to be charged, transmitting energy to the device to be charged from the wireless charging circuit structure and is arranged at one end of the fan ring; in one embodiment, the power and transmit circuitry includes the following components: 1. the QI specification for the transmitter coil allows the use of any coil type, such as A11, MP-A11, A28, MP-A2, etc. 2, full bridge circuit, composed of two sets of non-simultaneously conducting MOS. And 3, a resonant cavity circuit which is connected with LC in series to form resonance.

The driving circuit is used for converting a digital control signal output by the main control circuit into an analog control signal which can be identified by the power transmitting circuit and controlling the transmitting power of the power transmitting circuit; in one embodiment, the driving circuit includes the following components: a bleed and drive circuit which controls the MOS drive signal strength to the power and transmit circuit; and 2, a moving point sampling circuit which can sample the midpoint voltage of the same bridge arm.

The demodulation and sampling circuit is used for decoding a signal fed back to the wireless charging device by the to-be-charged device through the power transmitting circuit, so that the signal is converted into a digital signal which can be identified by the main control module; in one embodiment, the demodulation and sampling circuit includes the following components: the circuit comprises a first-order RC filter circuit and a second-order RC filter circuit, and provides effective feedback signals for the MCU; 2, a current sampling circuit which is a series high-power resistor and allows the MCU to identify the current according to the voltage of the sampling resistor; and 3, a voltage sampling circuit which is a resistance voltage division network and gives the voltage signal to the MCU after weakening the voltage signal.

And the main control circuit is used for controlling the transmitting power of the power transmitting circuit through the driving circuit according to the information fed back by the demodulation and sampling circuit and the requirement of the device to be charged, and is arranged at the other end of the fan ring. In one embodiment, 1, an operational amplifier circuit is an analog amplifier circuit, and the signal amplification factor can be adjusted by a peripheral resistor; 2, an AD sampling circuit which is an 8-bit AD sampling circuit; and 3, a logic output circuit which is 16 IO ports arranged in the MCU and controls the operation logic of the whole system.

The functional circuit further comprises:

the D2D circuit is used for converting unstable input voltage into stable voltage and supplying power to the main control circuit;

the system comprises a slow start circuit and a crystal oscillator circuit, wherein the slow start circuit is used for delaying the power supply time of first power-on, so that the system is prevented from being interfered by voltage spikes caused by hot plugging, and the crystal oscillator circuit is used for providing stable PWM signals for the main control module. In one embodiment, the D2D, soft start, and crystal oscillator circuits include the following components: 1, a slow starting circuit which is a high-order control switch designed by utilizing the conduction characteristic of a PMOS (P-channel metal oxide semiconductor); 2, a D2D circuit which is a DC to DC circuit and is a Buck type voltage reduction power supply circuit; and 3, a crystal oscillator circuit which is a passive crystal oscillator circuit and can try to meet the PWM signal required by the system time sequence.

Taking mobile phone charging as an example, the working principle of the wireless charging circuit structure of the utility model is explained: firstly, a user accesses the power supply of an adapter into a wireless charging system (generally 5V, if higher transmitting power is needed, a QC adapter is needed to be accessed) through a Micro USB, the D2D of the wireless charging system is started slowly, a crystal oscillator module starts to work to provide stable power supply and timing sequence PWM signals for a main control circuit, the main control circuit starts to work, the main control circuit firstly generates a detection signal and sends the detection signal to a power transmitting circuit through a driving circuit, whether a mobile phone is placed on a wireless charger or not is detected, if the mobile phone is not placed on a wireless charging circuit structure, the detection signal is continuously transmitted, if the mobile phone is placed on the wireless charging circuit structure, the power transmitting circuit transmits the signal transmitted by the mobile phone to the main control circuit through a demodulation and sampling circuit, then the wireless charging circuit structure and the mobile phone start to communicate, the power size needed to be transmitted is negotiated mutually, and the main control circuit receives the information, the transmitting power of the power transmitting circuit is adjusted through the driving module, so that the mobile phone is charged.

EXAMPLE III

The utility model also provides a charger, which comprises a wireless charging circuit structure, wherein the wireless charging circuit structure at least comprises:

the wireless charging circuit structure of the second embodiment.

A case for forming a space for accommodating the main board, wherein an outer circumference of the main board is disposed at an edge area of an inside of the case.

The structures included in the wireless charging circuit structure can refer to the description of the second embodiment, and are not described herein again, and only other components included in the charger are further described below.

In one embodiment, the charger includes at least a housing for forming a space for accommodating the wireless charging circuit structure and the outer circumference of the main board is disposed in an edge area of the inside of the housing to prevent the stamp hole on the inner circumference of the main board from affecting the package.

Alternatively, the housing may be composed of an upper housing and a lower housing, and the outer shapes of the upper housing and the lower housing may be overlapped, the upper housing and the lower housing being engaged with each other to form a receiving space.

Optionally, the upper shell and the lower shell are made of the same material, so that the upper shell and the lower shell have the same shrinkage rate, and the upper shell and the lower shell are prevented from being completely clamped and sealed after being processed.

Alternatively, the plastic material generally selected for the housing is Polycarbonate (PC) and Acrylonitrile Butadiene Styrene (ABS) copolymer and mixture, it should be noted that the material of the housing is not limited to one, and any housing material commonly used in the art can be applied to the embodiment of the present invention, and is not listed here.

Alternatively, the housing needs to have a certain strength to satisfy the ability of various drop, twist, and seat pressure tests without being damaged.

Illustratively, the thickness of the shell is 0.5-4mm, and for the shell of the injection molding plastic part, the wall thickness of the shell is related to factors such as the size, the structure, the plastic raw material, the position of a mold gate, the injection molding process and the like of the part, and the approximate range is 0.5-4 mm; the thin part is poor in strength and difficult to be injection molded; too thick, causes material waste, long forming period, easy shrinkage and poor surface quality.

For the charger structure, in case of using PC material, the wall thickness of the front surface of the housing is selected to be in the range of 1.0-1.2mm, and the currently commonly used thickness is 1.0mm (if the product is larger, 1.2mm should be selected, such as mobile phones).

Of course, besides the above components, the charger may also include other conventional structures such as a USB interface, and details thereof are not described herein.

The optimized splicing mode directly reduces the cost of the PCB single chip by 6.8%, the first pass rate of SMT production reaches 99.9%, the assembly is not affected by the residual burrs of the spliced board, the PCB single chip can be directly compatible with the existing shell, the problems of insufficient splicing strength and interference of the residual burrs of the spliced board with the shell are solved by the proper position of the spliced board and the number of stamp holes, the utilization rate of the raw materials of the substrate is improved, the industrial waste products are reduced, and energy conservation and environmental protection are promoted. The charger adopts the splicing structure, so that the charger has the advantages.

The terms are used in the same sense as those commonly understood by those skilled in the art of the present invention. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. Terms such as "part," "member," and the like, when used herein, can refer to either a single part or a combination of parts. Terms such as "mounted," "disposed," and the like, as used herein, may refer to one component as being directly attached to another component or one component as being attached to another component through intervening components. Features described herein in one embodiment may be applied to another embodiment, either alone or in combination with other features, unless the feature is otherwise inapplicable or otherwise stated in the other embodiment.

The present invention has been illustrated by the above embodiments, but it should be understood that the above embodiments are for illustrative and descriptive purposes only and are not intended to limit the utility model to the scope of the described embodiments. Furthermore, it will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that many variations and modifications may be made in accordance with the teachings of the present invention, which variations and modifications are within the scope of the present invention as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The splicing structure of the wireless charging circuit board is characterized by comprising a first main board and a second main board;

2. The splice structure of claim 1, wherein the first and second major boards are spaced apart from one another and are integrally connected to one another by a postage stamp aperture.

3. The splicing structure of claim 2, wherein the first end of the fan ring of the first main plate is provided with a first extension plate on an end surface thereof, and the second end of the fan ring of the second main plate is provided with a second extension plate on an end surface thereof.

4. The splicing structure of claim 3, wherein the first extension panel is snapped into place at an inner circumference of the second end of the second main panel, and wherein the second extension panel is snapped into place at an inner circumference of the second end of the first main panel.

5. The splice structure of claim 3, wherein the opposed perimeter areas of the first and second main panels outboard of the first and second extension panels are provided with the postage stamp apertures.

6. The splice structure of claim 3, wherein the postage stamp aperture is disposed at a location on an inner circumference of the first end of the fan ring of the first main plate opposite an inner circumference of the first end of the fan ring of the second main plate.

7. The splice structure of claim 3, wherein the first extension panel and the second extension panel each have a rectangular configuration for integrating an indicator light circuit.

8. The splice structure of claim 1, wherein the minimum distance between the first and second major sheets is greater than 0.4 mm.

9. The wireless charging path structure is characterized by comprising:

a main board, which is the independent first main board or the independent second main board obtained after the split structure of any one of claims 1 to 8 is split.

10. A charger, characterized in that the charger comprises:

the wireless charging circuit structure of claim 9;