CN101502082A - Sub-assembly for handset device - Google Patents

Sub-assembly for handset device Download PDF

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Publication number
CN101502082A
CN101502082A CN 200680055484 CN200680055484A CN101502082A CN 101502082 A CN101502082 A CN 101502082A CN 200680055484 CN200680055484 CN 200680055484 CN 200680055484 A CN200680055484 A CN 200680055484A CN 101502082 A CN101502082 A CN 101502082A
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CN
China
Prior art keywords
user interface
sheet
substrate
display
subassembly
Prior art date
Application number
CN 200680055484
Other languages
Chinese (zh)
Inventor
史蒂夫·埃默特
裴伊林
Original Assignee
摩托罗拉公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 摩托罗拉公司 filed Critical 摩托罗拉公司
Priority to PCT/CN2006/001820 priority Critical patent/WO2008017191A1/en
Publication of CN101502082A publication Critical patent/CN101502082A/en

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Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers; Analogous equipment at exchanges
    • H04M1/02Constructional features of telephone sets
    • H04M1/23Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers; Analogous equipment at exchanges
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers; Analogous equipment at exchanges
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0266Details of the structure or mounting of specific components for a display module assembly
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers; Analogous equipment at exchanges
    • H04M1/02Constructional features of telephone sets
    • H04M1/03Constructional features of telephone transmitters or receivers, e.g. telephone handsets, speakers or microphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers; Analogous equipment at exchanges
    • H04M1/02Constructional features of telephone sets
    • H04M1/03Constructional features of telephone transmitters or receivers, e.g. telephone handsets, speakers or microphones
    • H04M1/035Improving the acoustic characteristics by means of constructional features of the housing, e.g. ribs, walls, resonating chambers or cavities

Abstract

A sub-assembly (15) for a handset device (10) includes a sheet (36) having operative indicia (226) coupled therewith and a user interface substrate (56) operatively coupled to the sheet (36). In addition, in one example, the sub-assembly (15) may further include a keypad (48) operatively coupled between the user interface substrate (56) and the sheet (36). In addition, in another example, the sub-assembly (15) may further include a keypad (48) and a display (52) each operatively coupled between the user interface substrate (56) and the sheet (36).

Description

手机设备的子组件 Subassemblies mobile devices

技术领域 FIELD

本发明一般涉及移动设备,并且更具体地涉及采用显示器和其他用户接口的手机设备。 The present invention relates generally to mobile devices, and more particularly to a display using the user interface, and other mobile devices.

背景技术 Background technique

举例来说,新兴市场中蜂窝覆盖的扩展要求材料和加工成本都很低的电话设计。 For example, the materials and processing costs are very low telephone design in emerging markets expand cellular coverage requirements. 此外,这些巿场中的成功将要求在设计、比例和外观方面都引人注意且富有竞争力的电话设计。 In addition, these markets will be successful in the design, proportions and appearance are attractive and competitive phone design requirements. 现有的低成本电话设计典型地使用具有附加主壳体部件和内部部件层叠的设计方法,其导致厚度增加。 Conventional telephone designs typically use low cost design approach has the additional member inside the main housing member and the laminate, which leads to increase in thickness.

电话结构的通用方法典型地包括分离的显示模块组件以及印刷电路板组件,这些组件被装载到壳体组件中,该壳体组件包括后盖和前盖,且后盖和前盖典型地利用螺钉、卡扣零件或类似的联锁装置来紧固。 General Procedure phone architecture typically includes a separate display module assembly and a printed circuit board assembly, these components are loaded into the housing assembly, the housing assembly includes a back cover and a front cover and back cover and the front cover with screws typically , a snap interlock or similar parts are fastened. 使用多个分离的子模块组件和壳体结构,相较于消费者的低成本产品需求来说较为昂贵。 A plurality of separate sub-assembly and a module housing structure, demand for low-cost compared to the more expensive consumer.

并且,电话麦克风音频端口以及前后扬声器端口必须进行良好密封。 In addition, the phone microphone audio ports as well as front and rear speaker port must be well sealed. 如果密封被破坏,可能存在从扬声器到麦克风的不期望的路径, 该路径导致不期望的回声,或者可能影响响度和濒率响应。 If the seal is broken, there may not be a desired path from the speaker to the microphone, the echo path result in undesirable, endangered, or may affect the frequency response and loudness. 在传统的电话中,前壳体被用来密封电话,但是这种方法增加了电话的成本和尺寸。 In the conventional telephone, the front housing is sealed to the telephone, but this method increases the cost and size of the phone.

由此,需要改进的移动设备结构和制造这种结构的方法。 Thus, a need for improved methods of manufacturing such structures and mobile device configuration.

此外,对于键盘来说,公知键盘被用在很多类型的设备中,包括但是不局限于诸如蜂窝电话的手持设备、诸如桌上型电话的非手持设备、以及采用按键作为用户接口的一部分的任何其他设备。 Further, for the keyboard, the keyboard is well known to be used in many types of devices, including but not limited handheld device such as a cellular phone, a handheld device such as a desktop non-telephone, and the use of a key part of any user interface other devices. 在移动设备以及例如用户不看着键盘的其他设备中,能够发生键盘可用性的问 In mobile devices, and other devices such as a keyboard without looking at the user, the keyboard can ask availability occurrence

题。 question. 公知一些手机设备包括贝尔键盘布局(bell keypad layout),还包括触觉键分隔器(divider),所述贝尔键盘布局除了包括诸如"发送" 键的其他功能键之外,还包括数字0-9和其他功能键。 Some mobile devices include known Bell keyboard layout (bell keypad layout), further comprising a haptic key divider (Divider), the Bell keyboard layout including among other function keys such as "send" key, the numbers 0-9 and further comprising other function keys. 可以在由摩托罗拉公司出售的PEBLTM翻盖电话上找到一个示例。 An example can be found on the company's PEBLTM sold by Motorola flip phone. 这种电话可以包括隆起的硅树脂部分,该硅树脂部分成S曲线形状以及对应的镜像S曲线形状。 Such phone may include silicone raised portion, and a curved shape portion in an S-S curve shape image corresponding to the silicone resin. 这两个形状在键盘中心的下方分离,以便非水平的数字l、 5和3被多个S曲线和镜像S曲线隆起硅树脂突出所包围。 Both the shape of the keyboard beneath the center of the separation, so that the level of non-numeric l, 5, and a plurality of ridges 3 are S-curve S-curve and a mirror projection surrounded by silicone. 由此,隆起的突出可以在非水平的键盘数字1、 5和3的上方和下方处于平行取向,而在S部分和镜像S部分之间具有位于电话的中心数字,诸如数字2、 5、 8和0下方中心的空间。 Thereby, the raised projections may be 1, 3, and 5 above and below the horizontal in a non-parallel orientation of the digital keyboard, and a central telephone number located between the mirror portion and the S portion S, such as 2, 5, 8 0 and below the center of the space. 这种配置能够协助用户当他们没有看着电话时, 在垂直方向上的数字之间提供适当的垂直触觉分离。 This configuration can assist the user when they are not looking at the phone, to provide the appropriate haptic vertical separation between the digital in the vertical direction. 然而,在水平方向上,因为隆起的硅树脂部分是弯曲的,所以用户可能不经意地下滑到下一行数字,而不是在水平行中选择数字。 However, in the horizontal direction, because the silicone raised portion is curved, the user may inadvertently slide next underground line numbers rather than selecting numbers in a horizontal row. 例如,因为隆起的触觉分离向下且在水平行之间弯曲,所以潜在地能够不经意地相对于第二水平行中的数字4、 5和6选择水平行中的数字1、 2和3。 For example, because the raised tactile separation between the horizontal line downward and bent, so the potential capable of inadvertently with respect to the second horizontal row the numbers 4, 5 and 6, the horizontal line selection numbers 1, 2 and 3.

公知其他键盘设计,其使用,例如按键自身,诸如在直线上水平延伸的隆起的薄按钮。 Other well known keyboard, using, for example, the keys themselves, such as the raised button thin horizontally extending in a straight line. 然而,因为隆起部分用作按键,并且因为隆起部分是水平笔直交叉的,所以难以在不看着电话的情况下在水平方向上区分幵正在选择哪个数字。 However, since the raised portion is used as a key, and because the raised portions intersecting horizontal straight, it is difficult to distinguish in the horizontal direction, without looking at the telephone number which is being selected Jian. 还公知其他设计,其采用隆起的可下压的按钮,这些按钮在水平线配置中以"V"形配置。 Other designs are also known, which uses raised depressible button, the button "V" shaped configuration arranged in a horizontal line. 然而,如上述类型, 这些隆起部分是按键自身,并且要求分离部件用于每个按键,导致了多个分离件,潜在地增加了设备成本,增加了设备的制造复杂度,并且降低了设备的可靠性。 However, as the type described above, these raised portions are the key itself, and requires separate means for each key, resulting in a plurality of separate pieces, potentially increasing the cost of equipment, increases the manufacturing complexity of the device, and reduces equipment reliability.

因此,存在对于改进的键盘的需求。 Therefore, a need exists for an improved keyboard.

5附图说明 BRIEF DESCRIPTION OF 5

通过审阅下述结合以下附图对本发明进行的详细描述将更好地理解和认识本发明及其提供的相应的优点和特征,在这些附图中,相同 The present invention is performed by reviewing the following detailed description in conjunction with the following drawings will be better understood and appreciated that the present invention and its corresponding advantages and features provided, in these figures, the same

的附图标记表示相同的元件,其中: Reference numerals refer to like elements, wherein:

图1是描绘本发明一个实施例的手机设备的一个示例的、从前方所示的分解的组件视图; FIG 1 is a diagram depicting one example of a mobile phone device according to an embodiment of the present invention, shown in the exploded assembly view of the front;

图2是描绘本发明一个实施例的手机设备的一个示例的、从后方所示的分解的组件视图; FIG 2 is a graph depicting one example of the present invention, a mobile phone device according to the embodiment, shown in exploded component view from the rear;

图3是描绘本发明一个实施例的沿着图1中的线3-3得到的图1 的手机设备的组装版本的纵向截面图; FIG 3 is a graph depicting a longitudinal sectional view of an assembled version of the phone device of FIG. 1 along the line 3-3 of FIG. 1 according to one embodiment of the present invention;

图4是描绘本发明一个实施例的沿着图1中的线4-4得到的图1 的手机设备的组装版本的横向截面图; FIG 4 is a graph depicting a transverse sectional view of an assembled version of the phone device taken along line 4-4 in FIG. 1 illustrating an embodiment of the present invention is 1;

图5是描绘本发明一个实施例的图4中所示的截面图的一部分的放大图; FIG 5 is a graph depicting an embodiment of the present invention is an enlarged view of a portion of the sectional view shown in Figure 4;

图6是描绘本发明一个实施例的手机设备的一个示例的层压的前部子组件的部分示意图; FIG 6 is a partial schematic view of the front portion of the laminated sub-assembly of an exemplary embodiment of a mobile phone apparatus of the present invention is depicted;

图7是描绘本发明一个实施例的图1的手机设备的部分的、从前方所示的分解的组件视图; FIG 7 is a diagram depicting portions of the apparatus 1 of the embodiment of the phone of the present invention, shown in a view from the front of the assembly exploded;

图8是描绘本发明一个实施例的图2的手机设备的、从后方所示的分解的组件视图; FIG 8 is a graph depicting a handset device of FIG. 2 embodiment of the present invention, shown in an exploded assembly view from the rear;

图9是描绘本发明一个实施例的图1的手机设备的部分的、从前方所示的分解的组件视图; FIG 9 is a diagram depicting a portion of the embodiment of the mobile phone device 1 of the present invention, shown in exploded component view from the front;

图10是描绘本发明一个实施例的图2的手机设备的部分的、从后方所示的分解的组件视图; FIG 10 is a diagram depicting portions of apparatus 2 of the mobile phone of the embodiment of the present invention, shown from the rear view of the assembly exploded;

图11是描绘本发明一个实施例的沿着图8中线11-11得到的图8 的手机设备的组装版本的扬声器腔的横向截面图; FIG 11 is a diagram depicting a transverse cross-sectional view of the speaker chamber is assembled version 8 taken along line 11-11 of FIG phone apparatus according to one embodiment of the present invention of FIG. 8;

图12是根据本发明一个实施例的图1中所示的手机设备的一部分的透视图;以及 12 is a perspective view of a portion of the apparatus shown in Fig. Mobile phone of one embodiment of the present invention according to one; and

图13是说明根据本发明一个实施例的键盘的一个示例的组装的图1中的电话的前视图。 FIG 13 is a front view of an exemplary keypad assembly according to an embodiment of the present invention, FIG telephone.

6具体实施方式 6 DETAILED DESCRIPTION

简单说来,手机设备的子组件包括片和可操作地耦合到该片的用户接口基板,所述片具有与之耦合的操作标记。 Briefly, the apparatus comprises a handset sub-assembly and operatively coupled to the sheet of the user interface of the substrate sheet, said sheet having a tag coupled thereto operate. 此外,在一个示例中, 子组件可以进一步包括可操作地耦合在用户接口基板与所述片之间的键盘。 Further, in one example, the subassembly may further comprise operatively coupled between a keyboard and a user interface of the substrate sheet. 此外,在另一示例中,子组件可以进一步包括键盘和显示器, 所述键盘和显示器的每一个都可操作地耦合在用户接口基板与所述片之间。 Further, in another example, the subassembly may further include a keyboard and a display, each of which may operatively coupled to the keyboard and display of a user interface between the substrate and the sheet.

如此,手机设备的子组件将用户接口基板与片进行组合,以为手机设备的前部提供薄且成本有效的构造。 Thus, the sub-assembly apparatus mobile phone user interface with the substrate sheet are combined, the front portion of phone device that provides a thin and cost-effective construction. 诸如显示器和键盘的用户接口功能被集成到子组件中,同时该子组件的结构提供了刚性和外部保护。 Such as a display and a keyboard user interface functionality is integrated into a subassembly, the subassembly while the structural rigidity and provides external protection. 本领域技术人员将认识到其他优点。 Those skilled in the art will recognize other advantages.

图1是描绘本发明一个实施例的手机设备10的一个示例的、从前 FIG 1 is a diagram depicting one example of a mobile phone apparatus 10 of the embodiment of the present invention, the front

方所示的分解的组件视图。 Exploded view of the assembly shown in side. 相同手机设备10的后方视图在图2中示出。 10 is a rear view of the same Shouji apparatus shown in FIG. 手机设备10能够被具体化为具有任何适当功能性的任何适当的手机设 Mobile device 10 can be embodied as any suitable mobile phone provided with any suitable functionality

备,包括但是不局限于无线电话、因特网器具、手持式计算机、个人数字助手、数字娱乐设备、无线电通信设备、跟踪设备、个人训练设备、全球定位设备或它们的组合。 Equipment, including but not limited to, wireless phones, Internet appliances, hand-held computers, personal digital assistants, digital entertainment devices, wireless communication devices, tracking devices, personal training devices, global positioning devices, or combinations thereof. 仅仅出于说明的目的,例示了无线电话设备。 For purposes of illustration only, it illustrates a wireless telephone device.

手机设备IO包括层压的前部子组件15以及支持该层压的前部子组件15的后壳体20,其中,集成电路基板24、电池28和扬声器32 以非层叠的布置、彼此邻近地保持在后壳体20中。 IO mobile devices comprises a laminate of front portion 15 and a front subassembly support subassembly portion of the laminate 20 of the rear housing 15, wherein the integrated circuit substrate 24, a battery 28 and a speaker 32 in a non-stacked arrangement, adjacent to each other held in the rear housing 20. 在一个示例中,层压的前部子组件15包括片36和用户接口基板56。 In one example, the front portion 15 of the laminate subassembly 36 comprises a sheet substrate 56 and a user interface. 层压的前部子组件15还可以包括粘合剂片40。 The front portion of the laminated sub-assembly 15 may further include an adhesive sheet 40. 粘合剂片40可以是压敏粘合剂,并且可以有多个部分。 The adhesive sheet 40 may be a pressure sensitive adhesive, and may have a plurality of portions. 如所示出的,粘合剂片40被分成三个部分,顶部的小条、底部的小条、以及穿过中间的主"A"形部分。 As shown, the adhesive sheet 40 is divided into three parts, the top of the strip, the strip-shaped base portion, and a main through the middle "A". 在不同的区域中, 基于这些区域要粘附到的下层结构,可能需要不同厚度的粘合剂。 In various areas, based on the area to be adhered to the underlying structure, the adhesive may require different thicknesses. 层压的前部组件还可以包括键盘基板44 (例如,诸如硅树脂或其他适当 The front portion of the laminated assembly substrate 44 may further include a keypad (e.g., such as silicone or other suitable

材料的弹性体基板)、键盘接触阵列48、显示器52、支持显示器52 的用户接口基板56、用户接口基板粘合剂60以及金属底盘64。 Elastomeric substrate material), the contact array of the keyboard 48, display 52, user interface support substrate 56, a user interface board 60 and the metal chassis 64 adhesive display 52. 手机设备IO可以进一步包括麦克风68、充电插口72、顶部天线76、底部天线80、电池盖84、集成电路基板固定螺钉88、以及后壳体固定螺钉92。 Mobile IO device may further include a microphone 68, a charging jack 72, the antenna top 76, the bottom antenna 80, a battery cover 84, the integrated circuit substrate fixing screw 88, fixing screw 92 and a rear housing.

用户接口基板56包括顶部表面96和底部表面204 (见图2)。 The user interface board 56 includes a top surface 96 and bottom surface 204 (see FIG. 2). 用户接口基板56进一步包括上部100和下部104。 The user interface 56 further includes an upper substrate 100 and a lower portion 104. 显示器52可操作地耦合到用户接口基板56的上部100。 Display 52 is operatively coupled to the upper portion of the user interface 100 of the substrate 56. 显示器52耦合到显示电极图案604 (见下面讨论的图6),该显示电极图案604形成于用户接口基板56 的上部100的顶部表面96上。 Display 52 coupled to the display electrode pattern 604 (see FIG. 6 discussed below), the display electrode pattern 604 is formed on the top surface 96 of the upper portion of user interface 100 of the substrate 56. 在用户接口基板56的下部104中形成键盘接触阵列108。 Keyboard 108 is formed in a lower portion 104 contacts the array substrate 56 in the user interface. 键盘接触阵列108可以是构图的、导电的材料,诸如从用户接口基板56的一层暴露的铜或其他导电材料,用户接口基板56诸如印刷电路板。 The contact array 108 may be a keyboard patterned, electrically conductive material such as a layer exposed from the user interface substrate 56 of copper or other electrically conductive material, a user interface 56 such as a printed circuit board substrate. 用户接口基板56可以是包括诸如FR4的树脂基材料或任何其他适当材料的印刷电路板(PCB)。 The user interface substrate 56 can be a resin-based material such as FR4 or any other suitable material of a printed circuit board (PCB). 例如,用户接口基板56可以是在顶部表面96上具有构图的铜合金层的PCB。 For example, the user interface may be a PCB substrate 56 having a copper alloy layer is patterned on the top surface 96. 用户接口基板56可以在顶部表面96和底部表面204上都具有构图的导电材料。 The user interface 56 may be a substrate having an electrically conductive material patterned on the top surface 96 and bottom surface 204. 也可以使用其他基板材料,诸如树脂基复合材料、聚酯、柔性基板材料、 陶瓷或本领域公知的任何其他适当的基板材料。 Other substrate materials may also be used, such as any other suitable resin matrix composite substrate material, a polyester, a flexible substrate material, ceramic, or known in the art. 构图的导电材料可以可替代地包括导电油墨层。 Patterned conductive material may alternatively comprise a conductive ink layer. 用于用户接口基板56的其他材料包括由Hitachi Chemical公司制造的型号为MCL-E-67的FR4,或者由DuPont 制造的Pyralux®。 Other materials for the substrate 56 include a user interface manufactured by Hitachi Chemical Company Model MCL-E-67 of FR4, or Pyralux® manufactured by DuPont. 用于键盘接触阵列48的其他材料包括由松下公司制造的ESP-10触觉片,或由Alps Electric, Inc.制造的SK5AB系列接触片。 Other materials used for the contact array 48 includes a keyboard ESP-10 manufactured by Matsushita haptic plate or sheet by a series of contacts SK5AB Alps Electric, Inc. manufactured.

用户接口基板56可以进一步包括用于键盘和显示器52的信息照明。 The user interface board 56 may further include information for illuminating the display 52 and a keyboard. 例如,可以将两个LED (未示出)可操作地耦合到用户接口基板56上的光导507的端部(见图5)。 For example, the two may be an LED (not shown) operably coupled to the end portion of the light guide 507 on the user interface of the substrate 56 (see FIG. 5). 两个狭窄的光导507可以沿着用户接口基板56的顶部表面的右和左侧放置,并且由回绕用户接口基板56的边缘的冲压金属支架112来固定。 Two narrow light guide 507 may be placed along the right and left side of the user interface of the top surface of substrate 56, and a stamped metal bracket 56 wraps around the edge of the user interface of the substrate 112 is fixed. 光导507与LED对齐,从而在手机设备10的整个长度上传送光,并且将光分布到键盘以及显示器52 的顶上。 The light guide 507 is aligned with the LED, so as to transmit light over the entire length of the handset device 10 and the light distributed to the top of the keyboard and a display 52. 金属支架112还可以用作光反射器。 Metal bracket 112 may also function as a light reflector.

金属底盘64包括顶部表面116和底部表面208 (见图2)。 Metal chassis 64 includes a top surface 116 and bottom surface 208 (see FIG. 2). 金属底盘64可以是冲压金属片,诸如不锈钢或任何适当材料,诸如铝、铜、 钢或它们的合金,并且可以通过任何其他工艺来加工,诸如本领域中公知的铸造、锻造、钻、切割或模制。 Metal chassis 64 may be stamped sheet metal, such as stainless steel or any suitable material, such as aluminum, copper, steel, or alloys thereof, and can be processed by any other process, the present art is well known in the casting, such as forging, drilling, cutting, or molding.

在层压的前部子组件15组装的过程中,用户接口基板56可操作地耦合到金属底盘64。 In the process of the front portion of the laminated sub-assembly 15 is assembled, the user interface substrate 56 is operably coupled to the metal chassis 64. 例如,用户接口基板56的底部表面204可以经由用户接口基板粘合剂60被粘附到金属底盘64的顶部表面116。 For example, the bottom surface 204 of the user interface of the substrate 56 may be adhered to the substrate via the user interface adhesive 60 to the top surface 64 of the metal chassis 116. 用户接口基板粘合剂60可以是粘合剂片或者具有两侧粘合剂的复合膜,诸如3M制造的9495MP。 The user interface 60 may be an adhesive substrate sheet or an adhesive having a composite film with an adhesive on both sides, such as 9495MP 3M manufactured. 用户接口基板粘合剂60可以是本领域中公知的任何类型的粘合剂,诸如压敏粘合剂、热固粘合剂或者紫外线固化粘合剂。 The user interface 60 may be a substrate of the present adhesive known in the art that any type of adhesive, such as a pressure sensitive adhesive, a thermosetting adhesive or an ultraviolet curable adhesive. 可替代地,可以使用物理联锁的组合将用户接口基板56组装到金属底盘64,所述物理联锁诸如螺钉、成形钩、咬合插栓(snapcatch)、 软焊或焊接,代替用户接口基板粘合剂60或者与其组合。 Alternatively, it is possible to use a combination of physical interlock 56 is assembled to the metal base substrate 64 a user interface, such as the physical interlocking screws, hook shaped, snap plug (snapcatch), soldering or welding, instead of the user interface substrate adhesion 60 or in combination with cement.

金属底盘64可以为层压的前部子组件10提供结构强度和刚性。 Metal chassis 64 can provide structural strength and rigidity to the front portion of the laminated sub-assembly 10. 金属底盘64还提供下述功能部件,所述功能部件有利于方便手机设备的组装和拆卸,以及用于在后壳体中的部件与手机设备IO的前部之间的隔离结构,所述后壳体中的部件诸如顶部和底部天线76和80。 After the metal chassis 64 also provides a function member, the functional member facilitate easy assembly and disassembly of mobile devices, and an isolation structure between a front portion of the rear housing member IO with mobile devices, said a housing member such as the top and bottom 76 and antenna 80. 然而, 作为替代,可以除去金属底盘64。 However, as an alternative, a metal chassis 64 can be removed. 例如,金属层,诸如多层PCB中的内铜层,可以被添加到用户接口基板56,以用作接地平面/屏蔽,以及用于强化用户接口基板56。 For example, a metal layer, such as an inner copper layer of multilayer PCB, the user interface may be added to the substrate 56, to serve as a ground plane / shield, and a substrate 56 for enhanced user interface. 此外,机械耦合功能部件,诸如槽、突出部和螺钉孔座(screw boss),可以被形成、模制、切割或嵌入在用户接口基板56中,以便用户接口基板56可以操作为可移动地固定后壳体20的螺钉、突出部、槽或其他功能部件。 Further, the mechanical coupling features, such as a groove, protrusion and a screw hole seat (screw boss), may be formed, molded, cut or embedded in the user interface of the substrate 56, so that the user interface substrate 56 is removably secured may operate after the screw housing 20, the protruding portions, grooves or other features. 诸如通过导电层压粘合剂(见图6)或其他适当的附着技术,将显 Such as by laminating a conductive adhesive (see FIG. 6), or other suitable attachment technique, will significantly

示器52可操作地耦合到用户接口基板56的顶部表面96。 52 is shown operatively coupled to a top surface 56 of the substrate 96 of the user interface. 显示器52具有顶部表面136和底部表面702 (见图7)。 Display 52 has a top surface 136 and bottom surface 702 (see FIG. 7). 可以通过例如使用层压粘合剂将显示器52的背部粘附到用户接口基板56,来将作为子组件的显示器52耦合到用户接口基板56。 Back by display 52 may be, for example, using a lamination adhesive adhered to the substrate 56 to the user interface, coupled to the display 52 as a subassembly substrate 56 to the user interface. 在另一实施例中,可以使用导电粘合剂来将显示器52的底部表面702粘结到用户接口基板56的显示电极图案604。 In another embodiment, a conductive adhesive to the bottom surface 52 of the display electrode pattern 702 adhered to the display substrate 56 of the user interface 604. 显示器52的层可以被层压到用户接口基板56上。 Display layer 52 may be laminated to the substrate 56 on the user interface. 例如,在显示器52是电泳显示器的情况下,电泳显示器(EPD)的层可以直接顺序地被层压到用户接口基板56上,如图6所示以及如下所述。 For example, in the case where the display 52 is an electrophoretic display, an electrophoretic display (EPD) of the layer may be sequentially laminated directly to substrate 56 on the user interface, as described below and shown in Figure 6. 在EPD 显示器或类似层状显示器的情况下,在用户接口基板56的顶部表面上的显示电极图案604 (见图6和7)可以被用作背板电极来控制显示器52。 In the case of a display or the like layered EPD display, the display electrode pattern on the top surface of the substrate 56 of the user interface 604 (see FIGS. 6 and 7) may be used as backplate electrode 52 to control the display.

键盘接触阵列48被紧固到用户接口基板56的顶部表面96。 Contacting keyboard array 48 is secured to the top surface 56 of the substrate 96 of the user interface. 键盘接触阵列48具有顶部表面148和底部表面216,并且可以进一步包括拓扑功能部件,诸如本领域中公知的可下压圆顶(dome)。 Keyboard 48 has a top surface contacting the array 148 and a bottom surface 216, and may further comprise topological features, such as known in the art may be pressed dome (dome). 键盘接触阵列48可以包括例如本领域中公知的保持在柔性载体片中的金属圆顶152的阵列。 Contacting the array 48 may include a keyboard, for example, an array of well known in the art to maintain the flexible support sheet metal dome 152. 例如,键盘可以包括在塑料载体片中的不锈钢圆顶152。 For example, a dome keypad 152 may comprise a stainless steel sheet in a plastic carrier. 圆顶152不必是金属的,而是可以包括其他导电材料或诸如碳或石墨的材料的组合。 Dome 152 need not be metallic but may comprise a combination of materials, or other conductive materials such as carbon or graphite. 键盘接触阵列48可以被粘附到用户接口基板56的顶部表面96。 Contacting keyboard array 48 may be adhered to the top surface 56 of the substrate 96 of the user interface. 除了金属圆顶实际驻留的地方之外,塑料载体片被层压到PCB上遍及整个背部表面216。 Except where the metal dome actually resides in a plastic carrier sheet is laminated on the back surface 216 throughout the entire PCB. 典型地,这是经由已经应用到塑料载体膜的背部表面216的丝网印刷压敏粘合剂来实现的。 Typically, this is via the back surface of the plastic has been applied to the carrier film 216 screen printed pressure sensitive adhesive to achieve. 典型地,该粘合剂也用来实际上将金属圆顶保持在塑料载体片上的适当位置处。 Typically, the adhesive can also be used for actually holding the metal dome at an appropriate position on a plastic carrier sheet. 由此, 将圆顶152阵列悬置在用户接口基板56的键盘接触阵列108上方。 Thus, the array of dome 152 is suspended above the keyboard user interface in contact with the substrate 56 of the array 108. 当按下阵列48中的接触圆顶时,在圆顶的导电材料与键盘接触阵列108 的导电材料之间实现电连接。 When the dome is pressed into contact in the array 48, between the conductive material of the dome in contact with the keyboard is an array of electrically conductive material 108 is electrically connected.

键盘基板44可以用来为键盘1200的用户提供触觉提示(tactile cue)(见图12)。 Keyboard substrate 44 may be used to provide haptic feedback (tactile cue) (see FIG. 12) is a keyboard 1200 users. 键盘基板44可以由硅树脂材料或其他适当材料制成,键盘基板44可以被紧固到键盘圆顶阵列48或用户接口基板56。 Keyboard substrate 44 may be made of a silicone material or other suitable material, the substrate 44 may be a keyboard secured to the keyboard dome array substrate 56 or the user interface 48. 然而,优选地,将键盘硅树脂基板44的顶部表面120附着到片36的背部表面224。 However, preferably, the top surface of the silicone substrate 44 of the keyboard 120 is attached to the back surface 224 of the sheet 36. 键盘基板44包括顶部表面120和底部表面220(见图2)。 Keyboard substrate 44 includes a top surface 120 and bottom surface 220 (see FIG. 2). 键盘基板44的顶部表面120可以包括适当成形的键分隔器。 The top surface of the keyboard 44, the substrate 120 may comprise a suitably shaped key divider. 在该示例中,它们被示为从键盘硅树脂基板44的顶部表面120向外延伸的弧形键分隔器。 In this example, they are shown from a top surface of the silicone substrate 44 keyboard keys arcuate divider 120 extending outwardly. 这些弧形键分隔器可以延伸穿过组装的手机设备10中的片36中的弧形槽172,以为手机设备10的用户提供改进的触觉反馈。 The arcuate slot 10 in which arcuate keys spacer assembly may extend through the mobile device 36172, the user mobile devices 10 that provide improved tactile feedback.

片36经由粘合剂片40被紧固到用户接口基板56,以形成层压的前部子组件15。 Sheet 36 via an adhesive sheet 40 is secured to the user interface board 56, a front portion to form a laminate subassembly 15. 此外,该片能够被粘附到支架112。 Further, the film can be adhered to the bracket 112. 然而,能够使用非粘合剂片或任何适当的耦合机制。 However, a non-adhesive sheet can be used or any suitable coupling mechanism. 片36具有顶部表面156和底部表面224 (见图2)。 Sheet 36 has a top surface 156 and bottom surface 224 (see FIG. 2). 片36具有上部160和下部164。 Sheet 36 having an upper portion 160 and a lower portion 164. 片36是平面的, 且不具有向上或向下延伸的侧壁。 Sheet 36 is planar and does not have side walls extending upwardly or downwardly. 片36可以被紧固到用户接口基板56。 Sheet 36 may be secured to the user interface of the substrate 56. 例如,片36的底部表面224的周边可以通过粘合剂片40被粘附到用户接口基板56的顶部表面96。 For example, the periphery of the bottom surface 224 of the sheet 36 may be adhered to the top surface 96 of the substrate 56 a user interface 40 by an adhesive sheet. 例如,粘合剂片40粘结到用户接口基板56的上和下边缘,粘结到光导支架H2的右和左边缘,以及粘结到显示器52的整个周边。 For example, the adhesive sheet 40 is bonded to the substrate 56 of the user interface and the lower edge, bonded to the right and left edges of the light guide holder H2, and bonded to the entire periphery of the display 52. 结果是,粘合剂片40的整个周边可以被组装, 以大体上防止灰尘进入手机设备10,并且尤其防止灰尘进入显示器可视区域。 As a result, the entire periphery of the adhesive sheet 40 may be assembled to substantially prevent dust from entering the mobile phone device 10, and in particular prevent dust from entering the visual display region. 粘合剂片40可以是粘合剂片或具有两侧粘合剂的复合膜。 The adhesive sheet 40 may be an adhesive sheet or a composite film having adhesive on both sides. 粘合剂片40可以是本领域中公知的任何类型的粘合剂,诸如压敏粘合剂、 热固粘合剂或紫外线固化粘合剂。 The adhesive sheet 40 may be known in the art be any type of adhesive, such as a pressure sensitive adhesive, a thermosetting adhesive or an ultraviolet curable adhesive. 例如,粘合剂片40可以是诸如由3M 制造的9495MP的材料。 For example, the adhesive sheet 40 may be a material manufactured by 3M 9495MP such.

片36提供了能够承受与用户的直接接触以及暴露到环境中的凹凸不平的表面。 Providing the sheet 36 in direct contact with the user and can withstand rugged surface exposed to the environment. 片36可以是硬涂层的透明材料,诸如聚碳酸酯、丙烯酸或聚对苯二甲酸乙二醇酯。 Sheet 36 may be a hard coat layer of a transparent material, such as polycarbonate, acrylic or polyethylene terephthalate. 如果需要,也可以使用其他材料,诸如由Mitsubishi Engineering-Plastics公司制造的Iupilon NF2000,以及由GE Plastics制造的HP92S。 If desired, other materials may also be used, such as Iupilon NF2000 manufactured by Mitsubishi Engineering-Plastics Corporation, and HP92S manufactured by the GE Plastics. 片36可以用作用户与键盘32进行交互的外表面,以及作为显示器52的透明防护盖。 Sheet 36 may be used with a keyboard 32 for user interaction outer surface, and a display 52 as a transparent protective cover.

11为了有利于操作者使用手机设备10,片36可以包括操作标记226 (如下讨论见图2),诸如字母数字图形或其他图形,以有利于设备10的操作。 11 in order to facilitate the operator uses the mobile phone apparatus 10, the sheet 36 may include an operation flag 226 (see FIG. 2 as discussed below), such as a digital graphic letters or other graphics, to facilitate the operation of the device 10. 片36可以包括导航键168,用于例如在手机设备10上导航菜单。 Sheet 36 may include a navigation key 168, for example, the mobile devices 10 in the navigation menu. 导航键168可以被模制在片36中,或可以被机械地耦合到层压的前部子组件15。 The navigation key 168 may be molded in the sheet 36, or may be mechanically coupled to the front portion 15 of the laminate subassembly.

片36用作显示器52的保护透镜。 Protective sheet 36 is used as a display lens 52. 此外,片36与粘合剂片40的组合将灰尘和其他污染物密封在显示器52之外。 Further, the combination sheet 36 and the adhesive sheet 40 of dust and other contaminants in the seal 52 outside the display. 可以设定片36的尺寸以配合到显示器52或键盘或显示器52及键盘的之上。 Sheet 36 may be sized to fit onto the display 52 or a display 52 and a keyboard or keypad. 还可以设定片36的尺寸以配合到后壳体20之内。 Also you can set the size of sheet 36 to fit into the rear of the housing 20. 可以设定片36的尺寸以在后壳体20的外侧壁304 (见图3)上方延伸。 Sheet size may be set to 36 (see FIG. 3) above the rear outer side wall 304 of the housing 20 extends.

本领域技术人员将知道,在本发明的范围内,可以将没有示出的顶部片状物,诸如防刮擦膜或运输防护膜放置在片36的上面。 Those skilled in the art will recognize, the top sheet within the scope of the present invention may be not shown, such as a scratch or transport pellicle film placed over the sheet 36.

后壳体20被组装以支持层压的前部子组件15。 After the housing 20 is assembled to a front portion of the laminated support subassembly 15. 后壳体20包括: 基壁230 (见图2),其具有顶部表面176和底部表面228 (见图2); 向上延伸的外侧壁178;以及外侧壁上的脊180 (还参见图5),适于容纳层压的前部子组件15的片36。 After the housing 20 includes: a base wall 230 (see FIG. 2), having a top surface 176 and bottom surface 228 (see FIG. 2); upwardly extending outer wall 178; and the outer side wall ridge 180 (see also FIG. 5) , sub-assembly is adapted to receive the front portion of the laminated sheet 15 36. 后壳体20进一步包括内侧壁182, 其适于支持层压的前部子组件15的金属底盘64,或支持保持在后壳体20中的其他部件,诸如集成电路基板24、扬声器32、顶部和底部天线76和80、以及充电插口72。 After the housing 20 further includes an inner side wall 182, a front portion of the laminated sub-assembly adapted to support the metal chassis 15 64, or other support holding the rear housing member 20, such as an integrated circuit substrate 24, a speaker 32, a top and bottom antenna 76 and 80, and charging port 72. 内侧壁182还适于形成后壳体20内的电池隔间184,而无需在电池28下方的基壁230,以便在不将后壳体20 从层压的前部子组件15拆卸下的情况下就能够维护电池28。 After the inner side wall 182 is further adapted to form a battery compartment 20 in the housing 184 without the base wall 230 underneath the batteries 28, 20 so as not to laminate the case from the front portion of the rear detachable subassembly housing 15 under 28 will be able to maintain the battery. 后壳体20可以是树脂基材料,使用本领域中公知的喷射模制技术对其进行模制。 After the housing 20 may be a resin-based material, known in the art using injection molding techniques for molding thereof. 后壳体材料可以是单种材料或复合材料。 After the housing material may be a single material or a composite material. 例如,后壳体20可以包括由GE Plastics制造的Lexan EXL1414以及由Bayer制造的Bayblend For example, 20 may include those manufactured by GE Plastics and the housing rear Lexan EXL1414 manufactured by Bayer of Bayblend

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后壳体20适于容纳相对大的部件,诸如集成电路基板24、电池28和扬声器32,以便这些部件可以在后壳体20中以非层叠配置彼此邻近地保持在后壳体20中。 After the housing 20 is adapted to accommodate relatively large components, such as integrated circuit substrate 24, a battery 28 and a speaker 32, so that these members may be held adjacent to the non-stacked in the rear housing 20 in the rear housing 20 to each other. 也就是说,具有集成电路基板68、电池100和扬声器32的组中没有一个成员层叠在另一成员的任何部分上。 That is, an integrated circuit having a substrate 68, and a speaker 100 assembled battery 32 is not a member laminated on any portion of another member. 电池28在后壳体20内固定在扬声器32与集成电路基板24之间。 The battery 28 is fixed between the speaker 32 and the integrated circuit substrate 24 in the rear housing 20. 这些部件占用后壳体20中相对大量的容积。 These components occupy a relatively large volume 20 of the housing. 此外,由于层压的前部子组件15所获得的薄轮廓, 一旦组装了,则集成电路基板24、电池28和扬声器32的厚度,可以确定组装的手机设备10的相对高度。 Further, since the thin profile of the anterior portion 15 of the laminate subassembly obtained, once assembled, the IC substrate 24, the thickness of the battery 28 and the speaker 32, the relative height of the assembly can determine the mobile device 10. 通过以邻近且非层叠布置将集成电路基板24、电池28和扬声器32分布在后壳体20的长度上,最小化了组装的手机设备IO的厚度。 By non-laminated and disposed adjacent the integrated circuit substrate 24, the battery 28 and the speaker 32 distributed over the length of the rear housing 20, to minimize the thickness of the phone IO device assembled.

集成电路基板24经由螺钉88被组装到金属底盘64。 The integrated circuit substrate 24 are assembled to the metal chassis 88 via screws 64. 可替代地, 它能够经由螺钉、或咬合插栓、或类似机制被保持在后壳体20中。 Alternatively, it is possible via a screw plug, or occlusion, or similar mechanisms is held in the rear housing 20. 如上所述,集成电路基板24通过到金属底盘的螺钉进一步地可操作地耦合到层压的前部子组件15。 As described above, the metal chassis 24 by screws integrated circuit substrate further operatively coupled to a front portion of the laminated sub-assembly 15. 集成电路基板24具有顶部表面186和底部表面232 (见图2),并且适于承载多个集成电路插件、芯片或其他电子器件。 The integrated circuit substrate 24 has a top surface 186 and bottom surface 232 (see FIG. 2), and adapted to carry a plurality of plug-in integrated circuit, chip or other electronic devices. 集成电路基板24可以是包括诸如FR4的树脂基材料的印刷电路板(PCB),其上具有构图的、导电材料或任何适当材料。 The integrated circuit substrate 24 may be a resin-based material such as FR4 printed circuit board (the PCB), having patterned thereon, a conductive material or any suitable material. 例如,集成电路基板24可以是在顶部表面186上具有构图的铜层的PCB。 For example, an integrated circuit may be a PCB substrate 24 having a patterned copper layer on the top surface 186. 集成电路基板24可以在顶部表面186和底部表面232上均具有构图的导电材料,并且可以是多层印刷电路板,诸如由WUS和Unimicron Technology公司或任何其他适当制造商提供的多层印刷电路板。 The integrated circuit substrate 24 may each have a conductive material patterned on the top surface 186 and bottom surface 232, and may be a multilayer printed circuit board, a multilayer printed circuit board and provided by WUS or any other suitable manufacturer such Unimicron Technology Company . 可以使用其他基板材料,诸如本领域中公知的树脂基复合材料、柔性基板材料或陶瓷。 Other substrate materials may be used, known in the art such as a resin-based composite material, a ceramic material or a flexible substrate. 集成电路基板24可以承载和互连用于手机设备10的主要收发器芯片集或引擎。 The integrated circuit and the interconnect substrate 24 may carry a main engine transceiver chip set or a mobile phone device 10. 集成电路基板24可以承载电子器件的任何一个或组合,所述电子器件包括本领域中公知的中央处理单元、存储器、 调制器和解调器。 The integrated circuit substrate 24 may carry any one or combination of an electronic device, the electronic device comprises well known in the art a central processing unit, a memory, a modulator and a demodulator. 集成电路基板24可以经由集成电路基板24的顶部表面186上的连接器188电耦合到用户接口基板56。 The integrated circuit substrate 24 may be coupled to a user interface board 56 via the electrical connector 188 on the top surface 186 of the integrated circuit substrate 24. 可以使用被螺纹固定在金属底盘64上的螺钉孔座1020 (见图10)中的螺钉88,将集成电路基板24机械地耦合到金属底盘64。 Can be screwed to the metal chassis 64 of the seat screw hole 1020 (see FIG. 10) of the screw 88, the IC substrate 24 is mechanically coupled 64 to the metal chassis. 顶部天线76和整体连接器192可以位于音频腔1104中,并且以与扬声器32和电连接器238相似的方式,通过金属底盘64和基板粘合剂层60中的开口耦合到用户接 Top antenna 76 and the integral connector 192 may be located in the cavity 1104 the audio, and similar to the speaker 32 and the electrical connector embodiment 238, coupled to the user access through the substrate 64 and the metal chassis 60 opening in the adhesive layer

口基板56。 Port substrate 56. 螺钉孔座1020可以与金属底盘压配合,或者与底盘集成。 Block 1020 may be screw holes with a metal chassis with pressure, or integrated with the chassis. 通过移除后壳体20和电池28,可以触及集成电路基板24以进行维修或替换。 After removal of the battery 20 and through the housing 28, you can reach the integrated circuit substrate 24 for repair or replacement.

电池28保持在后壳体20内的电池隔间中。 The battery 28 in the battery compartment in the rear housing 20. 电池28通过本领域中公知的弹簧接触进一步被耦合到集成电路基板24。 Battery 28 is further coupled to the integrated circuit substrate 24 is well known in the art by spring contact. 电池28可以是本领域中公知的任何电存储单元。 Battery 28 may be any electric storage unit known in the art. 电池28能够是可再充电的。 Battery 28 can be rechargeable. 可以通过电池盖84上的插栓功能部件189,将电池盖84机械地耦合到后壳体20。 Features on the plug 189 may cover 84 through the battery, the battery cover 84 is mechanically coupled to the housing 20. 通过移除电池盖84,可以容易地移除电池28。 By removing the battery cover 84, the battery 28 can be easily removed.

扬声器32被保持在后壳体20中。 Speaker 32 is held in the rear housing 20. 使用电连接器238将扬声器32 进一步耦合到集成电路基板24,该电连接器238穿过金属底盘64和用户接口粘合剂60,并且与用户接口基板56底部上的导电焊盘相连。 238 speaker 32 is further coupled to the integrated circuit substrate 24, the electrical connector 238 through the metal chassis 64 and a user interface adhesive 60, and is connected to the conductive pads on the bottom substrate 56 with the user interface using the electrical connector. 导电焊盘耦合到导电迹线,该导电迹线通过连接器268和188与集成电路基板相连。 Conductive pad coupled to a conductive trace, the conductive trace connected to the integrated circuit substrate through the connectors 268 and 188. 朝向手机设备10的前方布置扬声器32的音频输出侧190, 而扬声器32的背侧236 (见图2)则由后壳体20保持住。 Mobile device 10 toward the front of the speaker arrangement of the audio output 32 of the side 190, 236 and the back side speaker 32 (see FIG. 2) of the housing 20 by holding the rear. 扬声器32 可以是本领域中公知的任何类型,诸如固态扬声器、陶瓷扬声器或环绕线圈扬声器。 Speaker 32 may be any type known in the art, such as solid state speaker, a surround speaker or a ceramic coil speaker. 扬声器32可以用于例如提供低音量电话音频、扩音器音频、铃音音频、或振动。 Speaker 32 may be used to provide low volume, for example, telephone audio, audio amplifier, audio tone or vibration. 扬声器32可以进一步包括电连接器238 (见图2),诸如弹簧连接器。 Speaker 32 may further include an electrical connector 238 (see FIG. 2), such as a spring connection.

顶部天线76和底部天线80可以被保持在后壳体20中。 Top antenna 76 and the bottom antenna 80 may be held in the rear housing 20. 顶部天线76可以以与扬声器类似的方式,通过用户接口基板56进一步耦合到集成电路基板24。 The antenna top 76 may be a speaker similar manner, the substrate 56 is further coupled to the integrated circuit substrate 24 through the user interface. 在用户接口基板56上到天线的耦合可以采取阻抗受控的传输线的形式,该形式通过采用共面波导传输线或者多层传输线结构来完成,所述共面波导传输线具有主要由单层上的导体迹线之间的间隔限定的阻抗,这适于低成本组件,所述多层传输线结构诸如带线或微带线。 On a user interface board 56 to the coupling antenna may take the form of a controlled impedance transmission lines, which form waveguide transmission line or a multilayered transmission line structure by employing coplanar to complete, the coplanar waveguide transmission line having a primary conductor on a single interval defined between the trace impedance, which is suitable for low-cost assembly, the multi-layer structure such as a stripline transmission line or microstrip line. 如果需要,底部天线可以以与扬声器和顶部天线类似的方式来耦合,或者以任何其他适当的方式来耦合。 If desired, the base of the antenna and the speaker may be top antenna coupled to a similar manner, or in any other suitable manner be coupled. 例如,底部天线80能够被直接耦合到集成电路基板24的底部上的电接触或其其他表面上。 For example, the bottom of the antenna 80 can be coupled directly to the other electrical contact or an integrated circuit on a bottom surface of the substrate 24.

所述两个天线元件76和80可以被附着到壳体20的底部表面176上的后壳体20。 The two antenna elements 76 and 80 may be attached to the rear housing 20 on the bottom surface 176 of the housing 20. 可替代地,可以使用单个天线。 Alternatively, a single antenna may be used. 天线76和80可以包括整体连接器192,用于将天线76和80可操作地耦合到层压的前部子组件15。 Antennas 76 and 80 may include integral connectors 192, 80 for the antenna 76 and operatively coupled to a front portion of the laminated sub-assembly 15. 连接器192可以为弹簧连接器的形式,其中,对冲压金属进行成形以在负载下弯曲。 The connector 192 may, in which, for shaping the stamped metal bent in the form of a spring load connector. 在组装的手机设备10中,连接器192穿过金属底盘64中的电端口246 (见图2)以接触用户接口基板56。 In the mobile device 10 is assembled, the connector 192 is electrically port 246 through the metal chassis 64 (see FIG. 2) to a user interface in contact with the substrate 56. 从后壳体20 施加在连接器192上的力将连接器192保持在适当的位置处,而弹簧连接器的弯曲或弹性行为确保电连接而无需软焊。 From the force exerted on the connector 192 of the rear housing 20 at a connector 192 held in place, and the spring connector is bent or elastic behavior of ensuring electrical connection without soldering. 虽然也可以使用本领域中公知的其他天线类型,但是双平面天线被示出作为顶部和底部天线76和80,并且由冲压金属制成。 Although other antenna types may be used it is well known in the art, but the two-plane antenna is shown as antenna top and bottom 76 and 80, and is made of stamped metal. 在具有如由金属底盘64限定的全长屏蔽的手机设备IO中,双平面天线可以是有用的。 Having a full-length 64 defined by the shield metal chassis phone IO device, the dual planar antenna may be useful.

麦克风68可以以任何适当方式保持在后壳体20中。 Microphone 68 may be maintained in the rear housing 20 in any suitable manner. 麦克风68可以耦合到集成电路基板24。 Microphone 68 may be coupled to the integrated circuit substrate 24. 例如,可以通过例如将来自麦克风68的引线直接软焊到集成电路基板24,来将麦克风68电耦合到集成电路基板24。 For example, 24 to the microphone 68 is electrically coupled to the integrated circuit substrate 24 by, for example, leads from the microphone 68 is directly soldered to the integrated circuit substrate. 可以通过后壳体20中的适于支持麦克风68的内侧壁182,来将麦克风68保持在后壳体20中。 After the housing 20 can be adapted to support the side wall 182 of the microphone 68, the microphone 68 to be held in the rear housing 20. 后壳体20中的内侧壁182可以进一步支持麦克风68紧靠用户接口基板粘合剂层60,其被紧固到用户接口基板56。 After the inner side wall 182 of the housing 20 may further support the microphone close to a user interface substrate 68 adhesive layer 60, which is fastened to the user interface of the substrate 56. 充电插口连接器72也被保持在后壳体20中,并且可以被紧固到集成电路基板68。 Charging port connector 72 also is maintained in the rear housing 20, and may be secured to the integrated circuit substrate 68. 麦克风主要通过将围绕麦克风的垫圈(grommet)压配合到在金属底盘64中形成的功能部件中而被保持住,所述功能部件如功能部件285所示。 Mainly through the microphone around a microphone gasket (Grommet) press-fitted into the functional member 64 is formed of metal and is held in the chassis, the functional member 285 as shown features. 壳体20中的功能部件施加压力到麦克风的背部, 以将其密封紧靠基板56的背部表面204。 Applying pressure in the housing member 20 function to the back of the microphone, to seal it against the back surface 56 of the substrate 204.

图2是描绘本发明一个实施例的手机设备的一个示例的、从后方所示的分解的组件视图。 FIG 2 is an exemplary embodiment of a mobile phone apparatus of the present invention is depicted an exploded view of the assembly shown from the rear. 除了上述的实施例之外,手机设备10的后方视图更好地说明了某些方面。 In addition to the above-described embodiment, the rear view of the mobile phone device 10 to better illustrate certain aspects.

可以在片36上应用操作标记226。 36 may be marked on the sheet 226 in the application operation. 例如,可以将装饰油墨应用到片36的底部表面224,以向手机前部提供颜色和装饰,并且提供操作标记226,诸如图形,来辅助手机设备IO的操作。 For example, decorative ink may be applied to the bottom surface 224 of the sheet 36, to provide color and decoration to the front portion of the mobile phone, and providing in-operation flag 226, such as a pattern, to assist the operator of mobile devices IO. 装饰油墨中的开口提供显示器52的可视窗口。 Decorative inks opening 52 to provide a visual display window. 可替代地,如本领域中公知的,可以使用贴花、嵌花、或其他图形膜、颜料、或涂层。 Alternatively, as is well known in the art, may be used decals, appliqués, or other graphic films, pigments, or coatings.

键盘硅树脂基板44的底部表面220可以包括延伸242或柱塞(plunger),当用户在键盘硅树脂基板44上施加力时,该延伸242或柱塞致动键盘圆顶阵列48的圆顶152。 The bottom surface of the resin substrate 44, a silicon keypad 220 may include an extension 242 or plunger (Plunger), when the user applies a force on the silicone matrix keyboard 44, the actuator extends the plunger 242 or the keyboard dome array of dome 152 48 .

为了在没有布线或软焊的情况下有利于部件或层之间的电信号的通路,可以在手机设备10中的结构中限定电端口。 In the absence of the wiring for soldering or circumstances favor the passage of electrical signals between the components or layers, may be defined in the structure of the electrical port 10 of the mobile devices. 例如,金属底盘64 可以限定电端口246,用于穿过顶部天线76的连接器192。 For example, a metal chassis 64 may define an electrical port 246, for antenna connector 76 through the top 192. 类似地, 用户接口基板粘合剂60可以限定电端口250,在将金属底盘64与用户接口基板粘合剂60进行组装后,该电端口250将天线电端口延伸到用户接口基板56。 Similarly, the user interface 60 may define a substrate adhesive power port 250, after the metal chassis 64 is assembled with the user interface substrate adhesive 60, the electric power port 250 extending antenna substrate 56 to the user interface port. 可以在用户接口基板56的底部表面204上包括电接触焊盘254,作为导电路径,并且该电接触焊盘254接受天线连接器192。 It may include an electrical contact pad 254, as the conductive paths, and the electrical contact pad 254 connected to the receiving antenna 192 on the bottom surface 204 of the user interface of the substrate 56. 通过在组装手机设备10时后壳体20接触天线76所施加的机械力,将天线连接器192紧靠接触焊盘254保持。 By mechanical force after the mobile phone apparatus 10 when assembling the contact housing 20 is applied to the antenna 76, the antenna connector 192 held against the contact pad 254.

类似地,金属底盘64可以限定电端口258,用于穿过扬声器32 的连接器238。 Similarly, the metal chassis 64 may define an electrical port 258, a speaker 238 through the connector 32. 用户接口基板粘合剂60可以限定电端口262,在将金属底盘64与用户接口基板粘合剂60进行组装后,该电端口262将扬声器电端口延伸到用户接口基板56。 The user interface 60 may define a substrate adhesive electrical port 262, after the metal chassis 64 is assembled with the user interface substrate adhesive 60, the electrical port 262 extending electrically speaker port substrate 56 to the user interface. 可以在用户接口基板56的底部表面204上包括接触焊盘266作为导电焊盘以接受扬声器连接器238。 May include contact pads 204 on the bottom surface 56 of the user interface of the substrate 266 as a conductive pad 238 is connected to receive the speaker. 通过在组装手机设备10时后壳体20接触扬声器32的底侧236所施加的机械力,将扬声器连接器238紧靠接触焊盘266保持。 By mechanical force after the mobile phone apparatus 10 when assembling the contact housing 20 bottom side 236 of the speaker 32 is applied to the speaker connector 238 held against the contact pad 266.

用于集成电路基板24的连接器268可以被紧固到用户接口基板56 的底部表面204。 IC 24 for the connector board 268 can be fastened to the bottom surface 204 of the user interface of the substrate 56. 可以在金属底盘64中限定用于穿过连接器268的电端口272。 It may define a port through the connector electrically 272,268 64 in the metal chassis. 在将金属底盘64与用户接口基板56进行组装之后,集成电 After the metal chassis 64 is assembled with the user interface of the substrate 56, integrated circuit

16路基板24的电连接器188可以被插入到用户接口设备连接器268中, 以可操作地连接基板。 The electrical connector 16 of the circuit board 24 may be inserted 188 into the user interface device 268 in order to operatively connect the substrate.

电部件1002 (见图10),包括用于显示器52的驱动器,可以被紧固到用户接口基板56的底部表面204的下部104。 Electrical component 1002 (see FIG. 10), includes a driver for the display 52, it may be fastened to the bottom surface of the user interface 56 of the lower portion 104 of the substrate 204. 然而,用户接口基板56的底部表面204的上部100 (与显示器52相对的侧)可以保持没有部件,以便有利于电泳显示膜52的层压。 However, 100 (opposite side of the display 52) the user interface to an upper surface of the base substrate 56 without holding member 204 may be, in order to facilitate the electrophoretic display film 52 is laminated.

还参考图3和图11,为了有利于在扬声器32与手机设备IO的外部之间以及在手机设备10的外部与麦克风68之间的声音的通路,可以通过在层压的前部子组件15、粘合剂片40和金属底盘(如果使用它们)的层中层叠的开口,来限定麦克风音频端口316和扬声器音频端口320。 Referring also to FIG. 3 and FIG. 11, as well as to facilitate passage between the external speaker 32 and the mobile devices in the sound between the IO and the external microphone 68 of the handset device 10 can be produced by laminating the front subassembly 15 , and the adhesive sheet metal chassis 40 (if they are used) opening stacked layers, to define the microphone port 316 and audio port 320 speaker audio. 例如,对于扬声器32,由金属底盘64限定音频端口部分274, 由用户接口基板粘合剂60限定音频端口部分276,由用户接口基板56 限定音频端口部分278,由粘合剂片40限定音频端口部分280,并且由片36限定音频端口部分282。 For example, a speaker 32, a metal chassis 64 defines a portion of the audio ports 274, 276, an audio port is defined by the user interface portion of the audio port defined adhesive substrate 60 substrate 56 by the user interface portion 278, an audio port defined by the adhesive sheet 40 section 280, and the audio portion is defined by the port plate 36282. 将知道,为了便于说明,图ll没有示出扬声器上方的所有层的细节。 Will know, for convenience of explanation, the details are not shown in FIG ll all the layers above the speaker. 例如,图ll没有示出形成端口的部分的显示器52和粘合剂片40。 For example, the display is not shown in FIG ll adhesive sheet 52 and the port portion 40 is formed. 手机设备10的组装通过在每一层中限定的音频端口部分的垂直层叠部,在扬声器32的音频输出侧190与片36 的顶部表面156之间创建了穿过手机设备的连续音频端口。 Mobile device 10 is assembled by laminating the vertical portion of the unit audio port defined in each layer, between the top surface 156 of the audio output from the speaker 32 of the sheet 36 and the side 190 of continuous audio port created through mobile devices. 以类似的方式,对于扬声器68,由金属底盘64限定音频端口部分285,由用户接口基板粘合剂60限定音频端口部分286,由用户接口基板56限定音频端口部分288,由粘合剂片40限定音频端口部分292,并且由片36 限定音频端口部分294。 In a similar manner, for the speaker 68, a metal chassis 64 defines an audio port sections 285, 286, an audio port defined by the user interface portion 288 substrate 56 is defined by the user interface portion of the audio ports substrate adhesive 60, the adhesive sheet 40 audio port defining portion 292, and an audio port 36 is defined by a sheet portion 294. 手机设备10的组装在麦克风68与片36的顶部表面156之间创建了穿过手机设备的连续麦克风音频端口。 Mobile device 10 is assembled between the top surface 156 and the microphone 68 through the sheet 36 creates a continuous mobile devices microphone audio port. 麦克风68被橡胶垫圈围绕,如图3所示。 Microphone 68 is surrounded by a rubber gasket, as shown in FIG. 垫圈经由过盈配合沿圆周密封到麦克风的主体,并且还经由在所形成的功能部件285中的过盈配合沿圆周密封到金属底盘64,还经由压力密封到基板56的背侧204,该压力由后壳体20中的肋壁182施加。 Via an interference fit washer circumferentially sealed to the microphone body and also via an interference fit features 285 formed in the mating circumferential seal to the metal chassis 64, 56 are also sealed to the backside of the substrate 204 via the pressure, the pressure applied by the rib walls 20 in the rear housing 182. 密封垫296密封扬声器32的音频输出侧190以防止在手机设备10 中的扬声器32与麦克风68之间的音频泄漏或回声,并且密封在底盘64到壳体20的界面处的音频腔。 A sealing gasket 296 speaker audio output 32 of the side 190 to prevent leakage or audio echo between a speaker 32 of the handset device 10 and the microphone 68, the audio and sealed in the cavity at the interface 64 to the housing 20 of the chassis. 当组装手机设备10时,在后壳体20 中的内侧壁182机械地支持扬声器32紧靠密封垫296。 When the phone is assembled device 10, the inner sidewall 182 to mechanically in the rear housing 20 supports the speaker 32 against the gasket 296. 环绕金属底盘64、用户接口基板56以及片36的整个周边的粘合剂层60和40,密封了音频端口282以防在端口孔中的泄漏。 Surrounding the metal chassis 64, a user interface board 56 and the sheet 60 surrounding the entire pressure-sensitive adhesive layer 36 and 40, sealed against leakage audio port 282 in the port hole.

图3是描绘本发明一个实施例的图1的手机设备的组装版本的纵向截面图。 FIG 3 is a graph depicting a longitudinal sectional view of an assembled version of the phone device of one embodiment of the present invention. 该截面图示出薄且、层压的前部子组件15,其包括金属底盘64、用户接口基板粘合剂60以及用户接口基板56的叠层,在手机设备10的下部304中键盘和键盘硅树脂基板44层压在用户接口基板56之上,并且在手机设备10的上部308中显示器52层压在用户接口基板56之上。 The thin and shown in section, the front portion of the laminated sub-assembly 15, which includes 64, 60, and a user interface board adhesive laminate substrate 56 of a user interface metal chassis, in the lower portion 10 of the mobile phone apparatus 304 keypad and keypad laminating the resin substrate 44 of silicon substrate 56 on the user interface, the mobile phone apparatus 10 and the upper portion of the display 308 on the user interface 52 laminated substrate 56. 粘合剂片40以及片36横跨下部304和上部308被层压, 以完成层压的前部子组件15。 Adhesive sheet 40 and a sheet 36 across the lower portion 304 and upper portion 308 are laminated to the front portion of the lamination of the subassembly 15. 除了其他的优点,层压的前部子组件15 提供了显示和键盘输入的用户接口功能,同时密封和保护手机的内含物并展现了非常薄的轮廓。 Among other advantages, the front portion of the laminated sub-assembly 15 provides a display and a user interface function keyboard input, while sealing and protecting the contents of the phone and exhibits a very thin profile.

截面图示出支持层压的前部子组件的后壳体20。 Shown in cross section to support the front portion of the laminated sub-assembly of the rear housing 20. 具体说来,外侧壁178支持片36,而内侧壁182支持层压的前部子组件的其他层,诸如金属底盘64和用户接口基板56。 Specifically, outer wall 178 to support plate 36 and the inner side wall 182 to support the front portion of the other layers of the laminate subassembly, such as a metal chassis 64 and a user interface board 56. 后壳体20保持大的部件,诸如集成电路基板24、电池28和扬声器32。 Maintaining a large rear housing member 20, such as integrated circuit substrate 24, a battery 28 and a speaker 32. 内侧壁182支持扬声器32和集成电路基板24。 Inner side wall 182 to support the integrated circuit substrate 24 and the speaker 32. 内侧壁182限定电池隔间184 (见图1),同时通过耦合到电池盖84间接地支持电池28。 The inner sidewall 182 defines a battery compartment 184 (see FIG. 1), while the cover 84 is indirectly supported by the battery 28 coupled to the battery. 此外,由内侧壁182支持麦克风68。 Further, the side walls 182 supported by the inner microphone 68. 由后壳体20的基壁230支持顶部天线76和底部天线80。 A rear wall 230 of the housing base 20 support the top and bottom of the antenna 80 of the antenna 76.

沿着手机设备10的长度邻近且不层叠地保持集成电路基板24、电池28和扬声器32。 Along the length of the device adjacent the handset 10 is not held stacked integrated circuit substrate 24, a battery 28 and a speaker 32. 这种布置最小化了手机设备10的厚度。 Such an arrangement of a minimum thickness of 10 mobile devices. 沿着手机设备10的底部保持顶部天线76和底部天线80,而金属底盘64被安置在手机设备10的天线76和80与片36之间。 Holding the top and bottom antenna 80 antenna 76 along the bottom 10 of the mobile devices, the metal chassis 64 is disposed between the antenna 76 and mobile devices 80 and 10 of sheet 36. 如前所述,由层压的前部子组件15的数个层中的端口,来限定扬声器音频端口320和麦克风 As described above, the number of laminated layers of the front portion 15 of the subassembly port, audio port 320 to define a speaker and microphone

18音频端口316。 18 audio port 316.

图4是描绘本发明一个实施例的图1的手机设备的组装版本的横 FIG 4 is a diagram depicting one embodiment of the present invention, the mobile phone device 1 is assembled version of the cross

向截面图。 The cross-sectional view. 图5是描绘本发明一个实施例的图4所示的截面图的一部分的放大图。 FIG 5 is a graph depicting an enlarged view of a portion of a cross-sectional view of the embodiment shown in FIG. 4 embodiment of the present invention. 详细示出在片36与后壳体20之间的界面。 It shows in detail the interface between the sheet 36 and the rear housing 20. 在该示例中, 沿着后壳体的侧壁设置支持表面,以支持片36。 In this example, the side walls along the rear surface of the housing support is provided to support sheet 36. 在该示例中,在后壳体20的外侧壁178中形成脊180以容纳片36,以便片36部分地在后壳体20的外侧壁178上方延伸同时配合到后壳体20内。 In this example, the ridges 180 formed in the outer side wall 20 of the rear housing 178 to accommodate the sheet 36 to sheet 36 partially over the rear outer side wall 178 of the housing 20 extends into the fitting 20 while the rear housing. 可替代地, 后壳体20可以简单呈现平坦的表面而没有凹口,这样,如果设定片36 的尺寸在外侧壁178上延伸,则片36将不配合到后壳体20内。 Alternatively, the housing 20 may simply present a flat surface without a recess, so that, if the sheet 36 extends over sizing of the outer sidewall 178, the sheet 36 will not fit into the rear housing 20. 可替代地,可以设定片36的尺寸以配合到后壳体20内而不在外侧壁178 上方延伸。 Alternatively, the sheet 36 may be sized to fit into the rear casing 20 and not the outer sidewall 178 extending upward. 此外,斜切片36的边缘504以提供平滑的界面边缘。 Further, the oblique sections of the edges 50 436 to provide a smooth interface edge. 本领域技术人员将知道,在本发明的范围内,在片36与后壳体20之间的界面的其他实施例也是可能的。 Those skilled in the art will recognize that, within the scope of the present invention, in other embodiments the interface between the 20 and the rear housing 36 are also possible.

电池盖84机械地耦合到后壳体20,以便后壳体20经由电池盖84 支持电池28。 The battery cover 84 is mechanically coupled to the housing 20, so that the housing 20 via the rear cover 84 to support the battery cell 28. 虽然描绘了后壳体20与电池盖84之间的闩锁布置506, 但是本领域技术人员将知道,在本发明的范围内,在后壳体20与电池盖84之间的界面的其他实施例也是可能的。 Although the housing 20 is depicted between the latch 84 and the battery cover 506 is disposed, those skilled in the art will recognize that, within the scope of the present invention, after the battery housing 20 and the interface between the lid 84 other embodiments cases also possible. 在所示示例中,门经由图4的极右侧所示的钩沿一侧钩住。 In the illustrated example, the door along one side of the hook via the hook shown in FIG. 4 the far right. 有三个这样的钩,并且能够在图1的很底部看到(未标记)。 There are three such hooks, and can be seen (not labeled) at the very bottom of FIG. 1. 门向下旋转,且图1所示的两个塑料插栓功能部件189与冲压金属叶片弹簧闩锁(未示出)啮合,该金属叶片弹簧闩锁被组装到壳体20。 The door is rotated downward, and the two plugs the plastic member function 1189 shown in FIG engagement with the stamped metal leaf spring latch (not shown), the metal leaf spring latch 20 is assembled to the housing. 功能部件506是简易掣子(detent),以协助闩锁并保持盖边缘平坦。 Feature 506 is a simple detent (detent), and to assist in holding the latch edges of the cover flat. 不是钩在一侧上且闩锁在另一侧上,将认识到能够将门钩在底部边缘上并闩锁在顶部边缘处,或者反之亦然,或可以使用任何适当的门配置。 Is not hooked on the one side and on the other side of the latch, the door can be appreciated on the bottom edge of the hook and the latch at the top edge, or vice versa, or may use any suitable door configuration.

通过光导支架112将光导507紧固到用户接口基板56。 The light guide 112 fastened by the light guide holder 507 to the user interface of the substrate 56. 示出了显示器52的数个附加的功能部件。 Illustrate several additional features of the display 52. 背部阻挡膜508被布置在用户接口基板56与用户接口基板粘合剂层60之间。 Back barrier film 508 is arranged between the user interface and the user interface board substrate 56 adhesive layer 60. 背部阻挡膜508防止湿气从 Back barrier film 508 prevents moisture from

19用户接口基板56的背侧进入显示器52。 The back side 19 of the substrate 56 into the user interface display 52. 将适当散布的密封剂512沿着显示器52的边缘应用到用户接口基板56。 Spreading an appropriate sealant 512 is applied along the edge of the display 52 to the user interface of the substrate 56. 散布的密封剂512防止湿气进入显示器52中。 The sealant 512 spread prevent moisture from entering the display 52. 在显示器52上布置前部阻挡膜516,以防止湿气进入显示器52中。 The front portion of the barrier film 516 disposed on the display 52, to prevent moisture entering the display 52.

图6是描绘显示器52的一个实施例的手机设备的一个示例的层压的前部子组件的一部分的示意图,该显示器52的一个实施例例如包括一类电泳显示器,诸如由美国马萨诸塞州、剑桥的EInk公司生产的基于EInk(商标)成像膜的显示器。 FIG 6 is a schematic diagram of a portion of the front portion of a sub-assembly of a lamination example of a mobile phone device according to an embodiment of the display 52 depicted in the embodiment 52 a display comprises, for example, a class of electrophoretic displays, such as the Massachusetts, Cambridge based on the company's EInk EInk (trademark) film image display. 如下所述,描绘了用户接口基板56 和显示器52的叠层的示例连同附加的粘合剂以及密封或阻挡层。 As described below, illustrates an example of the laminated substrate 56, and a user interface display 52, together with additional adhesive and a sealing or barrier layer. 在该示例中,显示器52包括导电层压粘合剂608、电泳油墨612、氧化铟锡涂层616以及前部电极片620。 In this example, the display 52 includes a conductive adhesive laminate 608, an electrophoretic ink 612, indium tin oxide coated electrode tab 616 and a front portion 620. 显示器52被层压到驻留在用户接口基板56上的显示电极图案604 (见图7)或者背部电极图案上。 Display 52 is laminated to the display electrode pattern resides on a user interface 604 of the substrate 56 (see FIG. 7) or on the back electrode pattern. 显示电极图案604可以包括,例如,被选择性蚀刻的金属层。 Display electrode pattern 604 may include, for example, the metal layer is selectively etched. 选择性蚀刻在从下面的用户接口基板56上移除金属层的地方,留下显示电极图案604和插入的空间606。 Selective etching where removal of the metal layer is a user interface from the underlying substrate 56, leaving a pattern of display electrodes 604 and 606 is inserted into the space.

显示器52的ITO涂层616可以通过导电环氧树脂连接到用户接口基板56上的显示电极图案604上的焊盘,该焊盘没有示出。 ITO coating 52 may be a display 616 connected to the pad electrode pattern 604 on a display on the user interface of the substrate 56 by a conductive epoxy, the pad is not shown. 如本领域中公知的,电泳油墨612中的微囊体包含带正电和负电的白和黑粒子。 As is known in the art, the microcapsule electrophoretic ink 612 contains positively and negatively charged black and white particles. 通常,当在显示器52和显示膜620上的ITO涂层616与显示(背部) 电极图案604之间施加适当的电压时,白粒子将被吸引到一个电极, 而黑粒子将被吸引到另一电极。 Typically, when the display 52 and the display 616 displays the ITO coating film 620 on the appropriate voltage is applied between the electrode pattern 604 (back), the white particles will be attracted to one electrode, and the black particles will be attracted to the other electrode. 该吸引力将移动粒子,从而引起显示器52的部分呈现黑或白。 This attraction force moves the particles, thereby causing the display portion 52 exhibits black or white. 可以包括紫外线过滤器的前部阻挡膜516被布置在显示器上方以防止湿气进入到显示器52中。 The front portion may include a UV filter blocking film 516 is disposed over the display to prevent moisture from entering into the display 52.

可替代地,如有源矩阵电泳显示器的情况,可以使用薄膜晶体管作为显示电极图案(背部电极)。 Alternatively, if the case of active matrix electrophoretic display, a thin film transistor can be used as a display electrode pattern (back electrode). 如上所描述的,可以布置背部阻挡片508、前部阻挡膜516和散布的密封剂512来防止湿气穿透进入显示器52中,其中所述前部阻挡膜516进一步包括前部阻挡片628和光学清晰的粘合剂624。 As described above, the barrier sheet 508 may be arranged in the back, the front portion of the barrier film 516 and the sealant 512 spread to prevent moisture from penetrating into the display 52, wherein the front portion 516 further comprises a barrier film substrate 628 and the front portion of the barrier 624 optically clear adhesive.

图7是描绘本发明一个实施例的图1的手机设备的部分的、从前方所示的分解的组件图。 , Exploded assembly of FIG. 7 is a diagram depicting one embodiment of the present invention, the mobile phone device 1 is shown from the front portion. 用户接口基板56的顶部表面96包括显示电极图案604。 The user interface top surface 96 of the substrate 56 includes a display electrode pattern 604. 当跨显示器52和显示电极616以及电极图案604 (前部和后部电极)施加合适的电压时,显示电极图案604限定将在显示器52上呈现的形状、数字和图片。 When the display across the display electrode 52 and the electrode patterns 604 and 616 (front and rear electrode) applying an appropriate voltage, the display electrode pattern 604 is defined to be presented on the display 52 in the shape, numbers and pictures. 显示器的"背景"自身是有源电极,所以它能够被驱动为白或黑。 Display "background" active electrode itself, so it can be driven to white or black. 更详细示出键盘接触阵列108。 It illustrates in more detail the contact array 108 keyboard. 由背部阻挡膜508限定扬声器音频端口276。 508 defined by the barrier film back speaker audio port 276. 图7中还有标记628和624。 FIG 7 also marks 628 and 624. 由用户接口基板56限定扬声器音频端口278。 The audio speaker port 278 is defined by the user interface board 56. 显示器52被组装到用户接口基板56。 Display 52 is assembled to the substrate 56 the user interface. 前部阻挡膜516被组装到显示器52。 The front portion of the barrier film 516 is assembled to the display 52. 散布的密封剂512被环绕显示器52的周边布置。 Scattered outside the sealant 512 is disposed around the display 52. 显示器的层中的切口708适于至少部分地围绕用户接口基板音频端口278的区域。 Layer of the display cutout 708 adapted to at least partially surround the user audio port 278 region of the substrate interface. 虽然示出了半圆(radius)切口708,但是本领域技术人员将认识到,可以使用多种切口形状,包括完全围绕音频端口278的形状。 Although a semicircle (RADIUS) notch 708, those skilled in the art will recognize that a variety of notch shapes may be used, including a shape completely surrounding the audio port 278. 电泳显示器52到显示电极图案604的叠层使得该设计特征成为可能。 The electrophoretic display 52 to the display electrode pattern of the laminate 604 so that the design features possible.

图8是描绘本发明一个实施例的图2的手机设备的、从后方所示的分解的组件视图。 FIG 8 is a diagram depicting one embodiment of the present invention, the mobile devices 2, an exploded view of the assembly shown from the rear. 如在前部层压子组件15中组装的,更详细示出了后壳体20的底部表面228和金属底盘64的底部表面208。 20 bottom surface of the housing 228 and a bottom surface 208 of the metallic chassis 64 as the front portion 15 of the laminate subassembly assembled, is shown in more detail. 由后壳体20限定电池隔间180。 A battery compartment 180 is defined by the rear housing 20. 后壳体20包括螺钉孔座812。 After the housing 20 includes a screw hole seat 812. 层压的前部子组件15包括螺钉孔座816以固定螺钉92,并且由此将后壳体20机械地耦合到前部层压子组件15。 The front portion 15 of the laminate subassembly holder 816 comprises a screw hole 92 to fix the screw, and thereby be coupled to the front portion of the laminate subassembly 15 after the housing 20 is mechanically. 集成电路基板24和麦克风68附着到金属底盘64。 The integrated circuit substrate 24 and a microphone 68 attached to the metal chassis 64. 虽然在图8中示出,充电插口72被组装到后壳体20,通过支持肋壁被保持在适当位置处,如图l所示。 Although shown in FIG. 8, a charging jack 72 is assembled to the rear housing 20, it is held by the holding rib wall in position, shown in Figure l. 在基板24和金属底盘64中的切口允许在充电插口上的弹簧接触与基板24上的接触焊盘紧密配合。 Mating contact pads on the substrate 24 in the notch 24 and the metal chassis 64 allows the charging jack spring contact with the substrate. 在后壳体20上限定的突出部804与金属底盘64上限定的槽808可操作地耦合,以将后壳体20与前部层压子组件15连接。 64 defined on the rear case 20 defines a projecting portion of the groove 804 and the metal chassis 808 is operatively coupled to the front portion of the laminate 20 is connected to the rear housing 15 subassembly. 本领域技术人员将知道,能够在前部层压子组件15或后壳体20中形成其他耦合形状。 Those skilled in the art will know, can be formed of other shapes Central coupling subassembly 15 or the laminate 20 after the front housing. 可操作用于密封扬声器音频端口274的密封垫296被紧固到金属底盘64。 Operable sealing port 274 for an audio loudspeaker of the sealing pad 296 is secured to the metal chassis 64. 密封垫296可以适于形成:围绕并密封音频端口274的第一环822;以及第二环826,其大于且围绕第一环822,并密封音频腔1104,密封在底盘64到后壳体20的界面处的音频腔(见下面讨论的图11)。 296 may be adapted to form a seal: about the audio port of the first ring and the seal 822 274; and a second ring 826, which is larger than and surrounding the first ring 822, and the audio sealed chamber 1104, sealing the chassis 64 to the rear housing 20 audio cavity at the interface (see FIG. 11 discussed below). 可替代地,第一和第二环能够由分离的密封垫来构建,其可能更适于音频端口274与底盘64到后壳体20的界面不在相同平面内的布置。 Alternatively, the first and second ring can be constructed from separate gasket, which may be more suitable audio port 274 disposed within the chassis and not in the same plane of the interface 20 to the rear housing 64.

图9是描绘本发明一个实施例的图1的手机设备的部分的、从前方所示的分解的组件视图。 9 is a partial view of a cell phone device 1 of the embodiment of the present invention is depicted, shown from the front view of the assembly exploded. 更详细地示出在层压的前部子组件15的金属底盘64和用户接口基板56的层压层中限定的音频端口274和278 的垂直层叠。 Shown in more detail defined in the front portion of the laminated metal chassis 15 of the subassembly 64 and the laminate substrate 56 in a user interface 274 and audio port 278 are vertically stacked. 显示器52部分地围绕用户接口基板56的音频端口278。 Display 52 partially surrounding the audio user interface port 278 of the substrate 56. 扬声器32被组装在音频端口层叠下方,电连接器238通过端口穿过金属底盘64的电端口258。 Below the speaker 32 is assembled in the laminated audio port, an electrical connector port 238 through the metal chassis 64 via the port 258 electrically. 具有网筛920的圆形牌(medallion) 916被组装到片36中。 A circular plate having a 920 mesh screen (medallion) 916 is assembled to the sheet 36. 当将片36组装到用户接口基板56时,网筛920形成用于扬声器32的最终音频端口。 When the sheet substrate 36 is assembled to the user interface 56, the mesh 920 to form the final audio ports for speaker 32.

图10是描绘本发明一个实施例的图2的手机设备的部分的、从后方所示的分解的组件视图。 FIG 10 is a diagram depicting a portion of the mobile device 2 of the present invention, an exploded assembly view from the rear of FIG. 更详细示出分别在层压的前部子组件15的金属底盘64、用户接口基板56和片36的层压层中限定的扬声器音频端口274、 278和282的垂直层叠。 64 shows in more respectively, the user interface layer laminated substrate 56 and the sheet 36 defined in the front portion of the laminated metal chassis sub-assembly 15 of vertically stacked speaker audio port 274, 278 and 282 in detail. 密封垫296密封用于扬声器32的音频端口274。 A sealing gasket 296 port 274 for an audio speaker 32. 更详细示出分别在层压的前部子组件15的金属底盘64、 和用户接口基板56的层压层中限定的麦克风音频端口部分286和288 以及292的垂直层叠。 More shown respectively defined in the front portion of the laminated metal chassis 15 of the subassembly 64, a user interface and a laminate layer 56 in the substrate portion 286 and the microphone audio ports 288 and 292 are vertically stacked in detail. 可以将粘合剂片40应用到片36的周边。 The adhesive sheet 40 may be applied to the periphery of the sheet 36. 可以将键盘基板44耦合到片36。 The keyboard 44 may be coupled to the substrate sheet 36. 可以将键盘阵列48耦合在键盘基板44与用户接口基板56之间。 Array may be coupled between the keyboard 48 in keyboard 44 and a user interface board substrate 56. 电部件1002,其包括用于显示器52的驱动器, 可以被紧固到用户接口基板56。 Electrical component 1002 that includes a driver display 52, the user interface may be secured to the substrate 56. 可以将麦克风68紧固到集成电路基板24。 Microphone 68 may be secured to the integrated circuit substrate 24. 在金属底盘64中限定螺钉孔座1020,以固定用于附连集成电路基板24的螺钉88。 Block 1020 defines a screw hole in the metal chassis 64, for attachment to fixing screws 88 attached integrated circuit substrate 24.

图ll是描绘本发明一个实施例的图8的手机设备的组装版本的扬声器腔的横向截面图。 Fig ll is a graph depicting a transverse cross-sectional view of the speaker chamber version of the phone device is assembled view of one embodiment of the present invention is 8. 该图示出在手机设备10中的音频出口和密封的 The figure shows an outlet and sealed in the audio device 10 of the mobile phone

功能部件。 Feature. 通过穿过组合电端口263的电连接器238,将扬声器32耦合到用户接口基板56的电接触266,所述组合电端口263包括由金属底盘64限定的电端口258以及由用户接口基板粘合剂层60限定的电端口。 , Through a combination of electrical coupling through the port 263 of the electrical connector 238 of the user interface speaker 32 to the electrical contacts 266 of substrate 56, the combined electrical port comprises a power port 263 defined by a metal chassis 64 258 by the user interface board and an adhesive layer 60 defines the electrical port. 电连接器238可以是如所示的弹簧接触,或另一类型的压力接触,或其他非压力连接器。 The electrical connector 238 may be a spring contact as shown, or another type of pressure contact, or other non-pressure connector. 可以使用螺旋形弹簧,可以使用杆形弹簧(beam spring)、弹性体接触、或任何适当的连接器。 Spiral springs may be used, may be used a rod-shaped spring (beam spring), the elastic body contact, or any suitable connector. 电连接器238 可以是金的或镀金的。 The electrical connector 238 may be gold or gold-plated.

扬声器32上方的扬声器音频端口320包括层叠的下面列出的音频端口部分:由金属底盘64限定的音频端口部分274;由用户接口基板粘合剂层60限定的音频端口部分;由用户接口基板56限定的音频端口部分278;以及由片36限定的音频端口部分。 Speaker audio speaker port 32,032 include those listed above stacked below an audio port sections: a metal chassis 64 is defined by a portion of the audio port 274; the substrate is defined by the user interface portion of the audio port of the adhesive layer 60; the substrate 56 by the user interface audio port defining portion 278; and a tab 36 defined by a portion of an audio port. 用户接口基板粘合剂层60可操作地用于将组合电端口263从组合音频端口320分离。 User interface substrate adhesive layer 60 electrically operable for combining audio port 263 port 320 is separated from the composition. 也就是说,粘合剂层60的存在防止来自扬声器32、通过组合音频端口320 传输的音频又通过组合电端口263泄漏返回到手机设备10中。 That is, the presence of the adhesive layer 60 is prevented from the speaker 32, the audio by the audio set 320 returns to the transmission port of the handset device 10 by a combination of electrical leakage port 263. 此外, 密封垫296被夹在扬声器32与金属底盘64之间。 Further, the gasket 296 is sandwiched between the speaker 32 and the metal chassis 64. 密封垫296也防止来自扬声器32、通过音频端口320传输的音频又通过组合电端口263 泄漏返回到手机设备10中。 Gasket 296 is prevented from the speaker 32, the audio by the audio transmission port 320 and returned to the handset device 10 by a combination of electrical leakage port 263.

后壳体20还可以适于提供在扬声器32下方的音频腔1104。 After the housing 20 may also be adapted to provide an audio speaker 32 below the chamber 1104. 例如, 后壳体20可以适于在后壳体20的内侧壁182上支持扬声器32,同时将基壁230的内表面1108和外侧壁178的内表面1112间隔远离扬声器32。 For example, the housing 20 may be adapted to support the speaker 32 on the rear side wall 182 of the housing 20, while the inner surfaces of the base wall 230 and outer sidewall 178 1108 1112 32 spaced away from the speaker. 音频腔1104可以增加扬声器32的低音响应(以及响度),这在将扬声器32用作扩音器时尤其有用。 The audio speaker chamber 1104 may be increased bass response (and loudness) 32, which is particularly useful when the speaker 32 is used as a microphone. 后壳体可以进一步适于提供槽口1116以在外侧壁178上支持密封垫296。 The housing may further be adapted to provide a notch 1116 on the gasket support 178 of the outer sidewall 296. 密封垫296可以适于形成: 第一环822,围绕并密封音频端口274;以及第二环826,其大于并围绕第一环822,密封音频腔1104。 Gasket 296 may be adapted to form: a first loop 822, surrounding and sealing the audio port 274; and a second ring 826, which is larger than and surrounds the first ring 822, seal chamber 1104 audio. 本领域技术人员将知道,后壳体和密封垫界面的其他实施例也是可行的。 Those skilled in the art will recognize that other embodiments and rear housing gasket interface are possible. 可替代地,能够在后壳体中形成分离的壁以封入音频腔1104,而不是将这些壁与壳体的侧壁集成到一起。 Alternatively, the housing can be formed in the rear wall of the separation chamber 1104 to enclose audio, rather than a sidewall of the housing walls integrated together. 或者,能够使用完全分离的构件来形成音频腔的侧壁U12和背壁1108,诸如模制的弹性体罩,其可以允许消除密封垫296的外部分826。 Alternatively, it is possible to use completely separate member to form the audio U12 cavity sidewall 1108 and a back wall, such as a molded elastomeric cover, which may allow the elimination of an outer portion of the gasket of 826,296. (c)能够使用分离的密封垫来密封扬声器和音频腔。 And an audio speaker seal chamber (c) can be used to separate the gasket. 密封垫296 Gasket 296

可以限定:第一环,环绕扬声器32进行密封;以及环绕该第一环的第 May be defined: a first ring seal 32 surround speakers; and surrounding the first ring section

二环,环绕音频腔1104 (见图ll)进行密封,例如如图8中所示。 Bicyclic, surround audio cavities 1104 (see FIG LL) for sealing, as shown in FIG. 8. 顶部天线76和整体连接器192可以位于音频腔1104中,并且以与扬声器32和电连接器238相似的方式,通过金属底盘64和基板粘合剂层60中的开口耦合到用户接口基板56。 Top antenna 76 and the integral connector 192 may be located in the cavity 1104 the audio, and similar to the speaker 32 and the electrical connector embodiment 238, a user interface coupled to the substrate 56 and the substrate 64 through the metal chassis opening in the adhesive layer 60.

参考图12和13,键盘1200包括多个键1202,在这里示出为贝尔键盘配置,如所示,除了"*" 、 "#"以及诸如电源键和其他键的功能键之外,还具有数字0-9。 Referring to Figure 12 and 13, a plurality of keys comprising keyboard 1200 1202, shown here as a Bell keyboard configuration, as shown, in addition to the "*", "#", and function keys such as a power key, and other keys, further comprising 0-9. 然而,将知道,可以使用任何适当的键盘配置。 However, we know that you can use any suitable keyboard configuration. 还参考图1,键盘1200包括多个键分隔器1204、 1206、 1208和1210,这些键分隔器相对于多个键1202安置,且在键盘基板44(见图1)上找到。 Referring also to FIG. 1, including a plurality of keypad keys divider 1200 1204, 1206, 1208 and 1210, these keys with respect to the separator 1202 is disposed a plurality of keys, and the keyboard found on substrate 44 (see FIG. 1). 多个键分隔器1204-1210的每一个包括隆起的引导部分1212、 1213和1214以及触觉提示部分1216以及1218,该触觉提示部分1216以及1218插在多个隆起的引导部分1212、 1213和1214之间。 A plurality of keys each separator comprises a raised portion of the guide 1204-1210 1212, 1213 and 1214 and the portions 1216 and 1218 haptic feedback, the haptic feedback portion 1216 and 1218 inserted in a plurality of raised guide portions 1212, 1213 and 1214 between. 然而,将知道,可以使用任何适当数目(更少或更多)的隆起引导部分和触觉提示部分。 However, it will be known, any suitable number (fewer or more) of the guide portion and the raised portion tactile cue. 在该示例中,数字键l-9被安置在水平行1220中, 并且在水平行中的键被安置在平行的弧形键分隔器之间,该平行的弧形键分隔器分别诸如键分隔器1206和1208,或者键分隔器1208和1210。 In this example, the numeric keys l-9 is arranged in a horizontal row 1220, and the key in a horizontal row are arranged in parallel between the arcuate divider key, the parallel arc delimited delimited respectively as 1206 and 1208, or 1208 and 1210 delimited.

在该示例中,键盘1200还包括分段的键分隔器1222,该分段的键分隔器1222被安置在多个键上方,在本示例中被安置在第一行数字键1、 2、 3上方。 In this example, the keypad 1200 further includes a key segment divider 1222, the segment key separator 1222 is positioned above the plurality of keys are arranged in a first row number keys 1, 2, 3 in the present example above. 分段的键分隔器1222示出两个分段部分1224和1226。 Key segment divider 1222 illustrates two segmented portions 1224 and 1226. 并且在该示例中,分段的键分隔器1222被邻近于导航键168安置。 And in this example, the segment key spacer 1222 is disposed adjacent to the navigation key 168. 还可以按照需要使用其他键分隔器1230和1232。 You may also be used as needed other keys 1232 and divider 1230.

触觉提示部分1218和1216在水平方向上为手指或其他对象提供横向触觉提示。 Tactile cues lateral portions 1218 and 1216 to provide tactile cues to fingers or other objects in the horizontal direction. 在所示示例中, 一组平行的弧形键分隔器还提供弧形轨道,在该弧形轨道之间可以引导手指。 In the illustrated example, a set of parallel arcuate divider also provides the key arcuate track between the arcuate track may guide the finger. 如该示例中所示,触觉提示 As shown in this example, the tactile cue

部分1216和1218相对于多个隆起引导部分凹进。 Portions 1216 and 1218 with respect to a plurality of raised portions of the guide recess. 然而,将知道,触觉提示部分1216和1218也可以相对于多个隆起引导部分1214、 1213 和1212隆起。 However, it will be known, the haptic feedback portion 1216 and 1218 may be raised with respect to a plurality of the guide portions 1214, 1213 and 1212 ridge. 如上面指出的,键盘1200可以以任何适当方式制造, 并且在该示例中,包括以有利于操作的方式紧固的片36、键盘基板44、 键盘阵列48和构图的接触108。 As noted above, the keyboard 1200 may be manufactured in any suitable manner, and in this example, comprises a sheet to facilitate the fastening operation of the embodiment 36, the substrate keyboard 44, the keyboard 48 and the patterned array of contacts 108. 片36包括在其上的键盘标记,还包括槽,可操作地设定该槽的尺寸以容纳多个弧形键分隔器。 Sheet 36 includes a keyboard on which the marker further comprises a slot, the slot operable to be sized to accommodate a plurality of arcuate divider keys. 虽然示出了弧形键分隔器,但是也可以使用直线键分隔器或其他适当成形的键分隔器。 Although a key arcuate divider, you may be used straight-delimited or other suitably shaped key divider.

还如所示,触觉提示部分1216和1218从键中心偏移。 As also shown, the haptic feedback portions 1216 and 1218 is offset from the center of the key. 例如,数字7连同与键相关联的字母"pqrs"相对于其相应的隆起引导部分居于中心,并且相应的触觉提示部分从该键的中心偏移。 For example, the letters associated with the numeric keys 7 together with the "pqrs" raised relative to its corresponding guide portion is centered, and a corresponding tactile cue offset from a center portion of the key.

由此,本领域技术人员将认识到上面图示描述的结构的很多优点。 Thus, those skilled in the art will recognize that many advantages of the structure described above illustration. 手机设备的子组件组合了用户接口基板和片,以为手机设备的前部提供薄且成本有效的构造。 Combination of mobile devices subassembly user interface substrate and the sheet, the front portion of phone device that provides a thin and cost-effective construction. 诸如显示器和键盘的用户接口功能被集成到子组件中,同时该子组件的结构提供了刚性和外部保护。 Such as a display and a keyboard user interface functionality is integrated into a subassembly, the subassembly while the structural rigidity and provides external protection.

上面对于本发明的详细描述以及这里描述的示例,是出于示例说明和描述的目的而提出的。 The above detailed description of the invention and examples described herein, are for purposes of illustration and description proposed. 虽然在上面结合特定设备描述了本发明的原理,但是将清楚地理解,该描述仅仅作为示例而不是对本发明范围的限制。 While the principles of the invention described in connection with specific apparatus in the above, it is to be clearly understood that this description is made only by way of example and not limitation on the scope of the present invention.

Claims (18)

1. 手机设备的子组件,包括:片,具有与之耦合的操作标记;以及用户接口基板,可操作地耦合到所述片。 1. subassembly phone apparatus, comprising: a sheet having operation flag coupled thereto; and a user interface board, operably coupled to the sheet.
2. 权利要求l所述的子组件,进一步包括显示器,所述显示器可操作地耦合在所述用户接口板与所述片之间。 2. The subassembly according to claim l, further comprising a display operatively coupled between the user interface board and the sheet.
3. 权利要求2所述的子组件,其中所述显示器是电泳显示器。 The subassembly of claim 2, wherein said display is an electrophoretic display.
4. 权利要求2所述的子组件,其中,设定所述片的尺寸以覆盖所述显示器,并且所述片包括透明的部分。 4. A sub-assembly according to claim 2, wherein said sheet is sized to cover the display, and the sheet comprises a transparent portion.
5. 权利要求2所述的子组件, 的阻挡层。 The subassembly of claim 2 barrier layer, the.
6. 权利要求l所述的子组件, 所述手机设备的后壳体内。 6. The subassembly according to claim l, said rear housing of the mobile devices.
7. 权利要求1所述的子组件, 手机设备的后壳体的侧壁耦合。 Sub-assembly of claim 1, sidewall coupled to the rear housing of claim mobile devices. 进一步包括在所述用户接口板下面其中,设定所述片的尺寸以配合在其中,设定所述片的尺寸以与所述 Further comprising a user interface board in the following wherein the sheet sized to fit therein, said sheet size is set to the
8. 权利要求l所述的基板,其中,所述用户接口基板被粘附到所述片。 8. The substrate according to claim l, wherein the user interface is adhered to the substrate sheet.
9. 手机设备的子组件,包括:片,具有与之耦合的操作标记;用户接口基板,可操作地耦合到所述片;以及键盘阵列,可操作地耦合在所述用户接口基板与所述片之间。 9. The subassembly of mobile devices, comprising: a sheet having operation flag coupled thereto; user interface board, operably coupled to said substrate; and a keyboard array, operably coupled to the user interface board and the between the sheets.
10. 权利要求9所述的子组件,其中,设定所述片的尺寸以覆盖所述键盘阵列。 10. The subassembly according to claim 9, wherein said sheet is sized to cover the keypad array.
11. 权利要求9所述的子组件,其中,设定所述片的尺寸以配合在所述手机设备的后壳体内。 11. The subassembly according to claim 9, wherein said sheet is sized to fit within the housing of the mobile phone apparatus.
12. 权利要求9所述的子组件,其中,设定所述片的尺寸以与所述手机设备的后壳体的侧壁耦合。 12. The subassembly according to claim 9, wherein the side wall coupling the housing to the size of the mobile phone device setting sheet.
13. 手机设备的子组件,包括-片,具有与之耦合的操作标记; 用户接口基板,可操作地耦合到所述片;显示器,可操作地耦合在所述用户接口板与所述片之间;以及键盘阵列,可操作地耦合在所述用户接口板与所述片之间。 13. The subassembly of mobile devices, comprising - a sheet having operation flag coupled thereto; user interface board, operably coupled to the sheet; a display operatively coupled to the user interface of the plate and the plate Room; array and a keyboard operatively coupled between the user interface board and the sheet.
14. 权利要求13所述的子组件,其中,设定所述片的尺寸以覆盖所述显示器和所述键盘阵列。 14. A subassembly according to claim 13, wherein said sheet is sized to cover the display and the keypad array.
15. 权利要求13所述的子组件,其中,所述片和所述用户接口基板限定至少一部分音频端口。 15. The subassembly according to claim 13, wherein said substrate sheet and said user interface defining at least a portion of the audio ports.
16. 权利要求13所述的子组件,其中,所述用户接口基板被粘附到所述片。 16. A subassembly according to claim 13, wherein the user interface is adhered to the substrate sheet.
17. 权利要求16所述的子组件,进一步包括可操作地耦合到所述用户接口基板的金属底盘。 17. The subassembly according to claim 16, further comprising a metal chassis operably coupled to the user interface board.
18. 权利要求17所述的子组件,其中,所述金属底盘被粘附到所述用户接口基板。 18. The subassembly according to claim 17, wherein said metal chassis is adhered to the user interface board.
CN 200680055484 2006-07-24 2006-07-24 Sub-assembly for handset device CN101502082A (en)

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