CN116896824B - Battery protection plate module, method and device, battery module and electronic equipment - Google Patents

Abstract

The embodiment of the application provides a battery protection board module, a method, a device, a battery module and electronic equipment, wherein the battery protection board is divided into a plurality of sub boards and flexible connecting pieces from a whole hard board, the sub boards are arranged at different heights, electronic elements with higher thickness are fixed on a relatively low-position sub circuit board, electronic elements with thinner thickness are fixed on the relatively high-position sub circuit board, so that the thickness of a battery is not limited by the thickness of the thickest electronic element any more, and compared with the thickness of the battery which is higher than the current battery protection board, the height of the battery protection board can be limited within the thickness of the battery due to the fact that the sub circuit board is arranged at the low position, and the whole thickness of the product is thinned.

Description

Battery protection board module, method, device, battery module and electronic device

Technical field

This application relates to the field of display technology, and specifically to a battery protection panel module, method, device, battery module and electronic equipment.

Background technique

As mobile terminal devices such as mobile phones and wearable electronic products continue to develop in the direction of thinness and lightness, the thickness and reliability of the battery protection board have gradually become key factors restricting the continued thinning of the entire machine. In the current battery protection board module design, due to the battery core Due to process reasons, there is a certain height step between the battery tab and the back of the battery. This step, the bending thickness of the tab connector, and the height of the thickest electronic component in the battery protection plate module jointly affect the overall stacking height of the battery, thus limiting the battery Continued thinning, and because the height of the thickest electronic components is too high, the height of the battery protection plate will be higher than the thickness of the battery, resulting in an increase in the overall thickness of the product.

Contents of the invention

In order to solve the problem in the current battery protection plate module design, the battery thickness is limited by the step height, the bending thickness of the tab connector and the thickness of the thickest electronic component, which limits the continued thinning of the battery. At the same time, the height of the battery protection plate It will be higher than the thickness of the battery, which will lead to the problem of increasing the overall thickness of the product. The embodiments of the present application provide a battery protection plate module, method, device, battery module and electronic equipment. The battery protection plate is divided into a whole hard plate. It is composed of several sub-boards and flexible connectors, and the sub-boards are arranged at different heights. The electronic components with higher thickness are fixed on the relatively low sub-circuit board, and the electronic components with thin thickness are fixed on the relatively high sub-circuit board. Therefore, the battery thickness is no longer limited by the thickness of the thickest electronic component. In addition, compared with the current battery protection plate, which is higher than the battery thickness, since the sub-circuit board is set at a low position, the height of the battery protection plate can be limited to Within the thickness of the battery, the overall thickness of the product is reduced.

A first embodiment of the present application provides a battery protection board module, including: a plurality of first sub-circuit boards and a plurality of second sub-circuit boards arranged alternately, and connecting adjacent first sub-circuit boards and second sub-circuit boards. The first flexible connector of the sub-circuit board, the first electronic component is fixed on the first sub-circuit board, and the second electronic component is fixed on the second sub-circuit board;

In the thickness direction of the battery, the height of the first electronic component is higher than the height of the second electronic component, and the height of the first sub-circuit board is lower than the height of the second sub-circuit board.

In the embodiment of the present application, by creatively replacing the current battery protection board with an integral hard board, multiple first sub-circuit boards and multiple second sub-circuit boards are connected through flexible connectors. The height of the sub-circuit board is lower than that of the second sub-circuit board, that is, by sinking the first sub-circuit board during production, while the second sub-circuit board remains in the same position, the higher-height electronic components can be Assigned to the first sub-circuit board, the battery protection board will not appear to be higher than the battery thickness when the taller electronic components are placed on the same circuit board as other electronic components. In addition, due to the sinking of the taller electronic components, the battery thickness It can also continue to be thinned, breaking the current limitations of battery thickness.

In an optional embodiment, at least one second sub-circuit board is disposed between any two adjacent first sub-circuit boards, and the battery protection board module further includes connecting two adjacent first sub-circuit boards. The second flexible connector of the second sub-circuit board. Higher-height electronic components tend to consume relatively more power. In this way, the higher-height electronic components can be dispersed throughout the battery protection plate to ensure that the distance between two higher electronic components is not too close, thus making the battery The protective board dissipates heat evenly to avoid performance degradation caused by local overheating.

Specifically, any two adjacent first sub-circuit boards can be separated by 1, 2, 3 or more second sub-circuit boards, and the lower height fixed on the second sub-circuit board The heat dissipation of electronic components is low, and due to the lower height, more heat dissipation space can be provided for the first sub-circuit board, which is beneficial to the heat conduction of the overall circuit board structure.

In an optional implementation, the first sub-circuit boards and the second sub-circuit boards are arranged alternately. Also based on the heat dissipation characteristics, the first sub-circuit board and the second sub-circuit board are alternately arranged. Each higher electronic component is flanked by lower electronic components, thereby expanding the heat dissipation area, which is conducive to heat conduction of the overall circuit board structure and heat dissipation at the same time. more even.

In an optional embodiment, at least one first sub-circuit board is disposed between any two adjacent second sub-circuit boards, and the battery protection board module further includes connecting two adjacent second sub-circuit boards. The third flexible connector of the first sub-circuit board. Although arranging the first sub-circuit boards separately is the preferred solution of this application, it can be understood that this application can also adopt the method of arranging two or at least three first sub-circuit boards continuously, and then use the second sub-circuit board to separate them. Open, this implementation is more suitable for battery protection boards with higher electronic components. In addition, heat dissipation patches such as graphene patches can be attached to the dense area of the first sub-circuit board to better diffuse heat. .

That is to say, it can be known from the above embodiments that in this application, the first sub-circuit board and the second sub-circuit board are preferably arranged at intervals, but the first sub-circuit board can also have at least two consecutive arrangements, and the second sub-circuit board can also have at least two A continuous setting, this application does not limit this.

In an optional embodiment, a plurality of first electronic components are fixed on each first sub-circuit board, and/or a plurality of second electronic components are fixed on each second sub-circuit board. That is to say, this application does not limit the number of electronic components fixed on the first sub-circuit board and the second sub-circuit board. Generally speaking, in order to solve the process, more electronic components can be fixed on the same sub-circuit board. However, the heat dissipation problem of electronic components also needs to be considered during production. Therefore, it is generally preferred that the number of electronic components on each sub-circuit board is one or two, thereby simplifying the process and providing heat dissipation guarantee.

In an optional embodiment, the flexible connector is a flexible circuit board. Flexible connectors need to have circuit routing functions, that is, they need to ensure the signal input and signal output of electronic components on the sub-circuit board. On the one hand, the thickness of the flexible circuit board is thin, and on the other hand, any desired content can be printed on the flexible circuit board. The circuit structure or circuit connection relationship allows the first sub-circuit board and the second sub-circuit board to be connected to form a complete circuit board.

Of course, this application can also use other materials to make flexible connectors. As an example, a thinner metal guide wire can be used to connect the first sub-circuit board and the second sub-circuit board. In this embodiment, in order to avoid the interaction between the metal guide wires, To avoid voltage interference between wires, the metal guide wire can be covered with insulating material.

In an optional embodiment, the first sub-circuit board and/or the second sub-circuit board is a flexible circuit board or a rigid circuit board. It should be understood that the first sub-circuit board and the second sub-circuit board of this application are independently flexible circuit boards or rigid circuit boards, that is, the first sub-circuit board can be a flexible circuit board or a rigid circuit board, and the second sub-circuit board can be a flexible circuit board or a rigid circuit board. It can also be a flexible circuit board or a rigid circuit board. Generally speaking, based on process considerations, the first sub-circuit board and the second sub-circuit board will be set to the same board material, that is, both are flexible circuit boards or both are rigid. Circuit boards, and based on cost considerations, can all be rigid circuit boards if permitted.

However, in a preferred embodiment, if the height of the highest electronic component approaches the thickness of the battery, considering that the thickness of the rigid circuit board is higher than that of the flexible circuit board, at this time, the first sub-circuit board under the highest electronic component can be specially Set as flexible circuit board, other first sub-circuit board is set as rigid circuit board.

That is to say, in this application, each first sub-circuit board and each second sub-circuit board are independent and can be independently configured as flexible or rigid circuit boards. This application will not go into details.

In an optional embodiment, the battery protection board module further includes: a plurality of electronic connectors for welding and fixing with the tabs of the battery, and each electronic connector is provided on the second sub-circuit board away from the One side surface of the second electronic component. In this embodiment, the electronic connector can be a nickel sheet. The nickel sheet is welded to the tab of the battery and fixed on the back of the battery protection plate. Since the electronic connector has a certain thickness, it is preferred that the electronic connector is fixed on the second sub-assembly. The back of the circuit board. In this way, due to the sinking of the first sub-circuit board, a certain space is formed below the second sub-circuit board. Electronic connectors are placed in this space, thereby rationally utilizing this part of the space, so that the thickness of the battery can be reduced. to a thinner level.

In an optional embodiment, the bottom surface of the electronic connector is flush with or not flush with the bottom surface of the first sub-circuit board. In this way, the bottom of the first sub-circuit board and the bottom of the electronic connector are both set at the bottom within the allowable range, thereby leaving maximum room for the height of the electronic components and adapting to electronic components with higher thickness.

In an optional embodiment, the battery protection board module further includes: a board-to-board connector connected to the nearest sub-circuit board through a flexible circuit board. In this embodiment, the board-to-board connector is flush with the second sub-circuit board, so that a straight circuit board can be used to connect the board-to-board connector and the second sub-circuit board, that is, a flexible circuit can be used. The board can also be a rigid circuit board. Both are acceptable in this application. Of course, in the preferred embodiment, the sub-circuit board closest to the board-to-board connector can be either the first sub-circuit board or the second sub-circuit board. circuit board, so when manufacturing, it is preferred to connect the board-to-board connector to the flexible circuit board, so that whether it is connected to the first sub-circuit board or the second sub-circuit board, it can be directly connected, and when the board-to-board connection When the connector is connected to a rigid circuit board, the board-to-board connector needs to be adaptively adjusted according to the height of the closest sub-circuit board, which will not be described in detail.

In an optional embodiment, the battery protection board module further includes: a third sub-circuit board, a third electronic component is fixed on the third sub-circuit board, and the third sub-circuit board is located at a high height At the height of the first sub-circuit board, the height of the third electronic component is lower than the height of the second electronic component. This embodiment further provides a third sub-circuit board based on a similar concept. That is, in the embodiment of the present application, in fact, more than or equal to three sub-circuit boards with different heights can be provided as needed. In a more special embodiment, Each sub-circuit board is at a different height. Correspondingly, the height of the electronic components on each sub-circuit board is different. This application does not limit this. Obviously, this embodiment can be adapted to each electronic component. The optimal height of the sub-circuit board will help reduce the amount of injection molding during subsequent injection molding.

In an optional embodiment, at least one third sub-circuit board is inserted between each two adjacent first sub-circuit boards and second sub-circuit boards, or the first sub-circuit board, the The second sub-circuit board and the third sub-circuit board are arranged in sequence. Similarly, the third sub-circuit board can be disposed between the first sub-circuit board and the second sub-circuit board, thereby facilitating heat dissipation. The first sub-circuit board, the second sub-circuit board and all the other sub-circuit boards can also be disposed in sequence. The third sub-circuit board is not limited in this application. Furthermore, this application can set it arbitrarily based on needs.

In some embodiments, at least one first sub-circuit board is disposed between any two adjacent second sub-circuit boards, and the battery protection board module further includes connecting two adjacent first sub-circuit boards. The third flexible connector of the sub-circuit board. Although arranging the first sub-circuit boards separately is the preferred solution of this application, it can be understood that this application can also adopt the method of arranging two or at least three first sub-circuit boards continuously, and then use the second sub-circuit board to separate them. Open, this implementation is more suitable for battery protection boards with higher electronic components. In addition, heat dissipation patches such as graphene patches can be attached to the dense area of the first sub-circuit board to better diffuse heat. .

That is to say, it can be known from the above embodiments that in this application, the first sub-circuit board and the second sub-circuit board are preferably arranged at intervals, but the first sub-circuit board can also have at least two consecutive arrangements, and the second sub-circuit board can also have at least two A continuous setting, this application does not limit this.

It can be seen from the above embodiments that the degree of freedom of the arrangement of the sub-circuit boards and the arrangement of electronic components of the present application is much higher than the degree of freedom of the current whole hard board. That is, the degree of freedom of the first sub-circuit board and the second sub-circuit of the present application is There is no limit to the number of electronic components fixed on the board. Generally speaking, in order to solve the process, more electronic components can be fixed on the same sub-circuit board. However, the heat dissipation of electronic components also needs to be considered during production, so generally It is preferred that the number of electronic components on each sub-circuit board is one or two, thereby simplifying the process while ensuring heat dissipation.

In some embodiments, the flexible connector is a flexible circuit board. Flexible connectors need to have circuit routing functions, that is, they need to ensure the signal input and signal output of electronic components on the sub-circuit board. On the one hand, the thickness of the flexible circuit board is thin, and on the other hand, any desired content can be printed on the flexible circuit board. The circuit structure or circuit connection relationship allows the first sub-circuit board and the second sub-circuit board to be connected to form a complete circuit board.

In alternative embodiments, each flexible connector is of equal or unequal length. If the flexible connectors are of equal length, it means that the spacing between the sub-circuit boards is equal. If the flexible connectors are of unequal length, it means that the spacing between the sub-circuit boards is unequal. According to the above implementation, it can be seen that the spacing between the sub-circuit boards can be adjusted based on heat dissipation. The spacing, that is, the flexible connectors can be configured with different lengths.

In an optional implementation, multiple electronic components are provided on each sub-circuit board, and the spacing between two adjacent electronic components on the same sub-circuit board is the same or different. In the same way, the spacing between each electronic component can be adjusted according to heat dissipation, so that the heat dissipation can be distributed more evenly.

In some embodiments, at least one first sub-circuit board is disposed between any two adjacent second sub-circuit boards, and the battery protection board module further includes connecting two adjacent first sub-circuit boards. The third flexible connector of the sub-circuit board. Although arranging the first sub-circuit boards separately is the preferred solution of this application, it can be understood that this application can also adopt the method of arranging two or at least three first sub-circuit boards continuously, and then use the second sub-circuit board to separate them. Open, this implementation is more suitable for battery protection boards with higher electronic components. In addition, heat dissipation patches such as graphene patches can be attached to the dense area of the first sub-circuit board to better diffuse heat. .

That is to say, it can be known from the above embodiments that in this application, the first sub-circuit board and the second sub-circuit board are preferably arranged at intervals, but the first sub-circuit board can also have at least two consecutive arrangements, and the second sub-circuit board can also have at least two A continuous setting, this application does not limit this.

It can be seen from the above embodiments that the degree of freedom of the arrangement of the sub-circuit boards and the arrangement of electronic components of the present application is much higher than the degree of freedom of the current whole hard board. That is, the degree of freedom of the first sub-circuit board and the second sub-circuit of the present application is There is no limit to the number of electronic components fixed on the board. Generally speaking, in order to solve the process, more electronic components can be fixed on the same sub-circuit board. However, the heat dissipation of electronic components also needs to be considered during production, so generally It is preferred that the number of electronic components on each sub-circuit board is one or two, thereby simplifying the process while ensuring heat dissipation.

In some embodiments, the flexible connector is a flexible circuit board. Flexible connectors need to have circuit routing functions, that is, they need to ensure the signal input and signal output of electronic components on the sub-circuit board. On the one hand, the thickness of the flexible circuit board is thin, and on the other hand, any desired content can be printed on the flexible circuit board. The circuit structure or circuit connection relationship allows the first sub-circuit board and the second sub-circuit board to be connected to form a complete circuit board.

A second embodiment of the present application provides a method for manufacturing a battery protection plate module, including:

A plurality of first sub-circuit boards, a plurality of second sub-circuit boards and a profiling mold are provided, wherein the profiling mold includes a first recess corresponding to the first sub-circuit board and a first recess corresponding to the second sub-circuit board. Corresponding second depression, the first depression is used to accommodate the first sub-circuit board, the second depression is used to accommodate the second sub-circuit board, the bottom height of the first depression is lower than The height of the bottom surface of the second depression, the first electronic component is fixed on the first sub-circuit board, the second electronic component is fixed on the second sub-circuit board, the height of the first electronic component is higher than the second electronic component The height of the component;

According to the positions of the first recess and the second recess, each first sub-circuit board and each second sub-circuit board are connected through flexible connectors to form a combined circuit board;

Press the combined circuit board into the copying mold through the mold top cover installed in conjunction with the copying mold, and cover it with the copying mold;

The closed copy mold is filled with a packaging medium to encapsulate the combined circuit board to obtain a battery protection board module.

This embodiment provides a method for manufacturing a battery protection board module. By first configuring the combined circuit of the first sub-circuit board and the second sub-circuit board, the combined circuit is then pressed into the mold, and the first sub-circuit is sealed with the top cover of the mold. The circuit board and the second sub-circuit board are fixed at different heights. Finally, the injection molding packaging medium is filled to fix the first sub-circuit board, the second sub-circuit board and the flexible connectors connecting each sub-circuit board. After fixation, the mold and the top of the mold are removed. cover, the above-mentioned battery protection plate module of the present application can be obtained. The thickness of the battery protection plate obtained by this method is thinner and does not protrude from the thickness of the battery. At the same time, the manufacturing method of this embodiment is simple and does not require complex processes such as etching. The battery protection plate module of the present application can be obtained by injection molding by closing the bottom mold and the top cover of the mold. The process is simple, the production cost is low, the production speed is fast, and the structural stability is good.

In an optional embodiment, the mold top cover is equipped with at least two elastic ejector pins corresponding to the gaps of each first sub-circuit board, and the combination is combined with the mold top cover installed in conjunction with the profiling mold. Pressing the circuit board into the profiling mold includes: pressing down the top cover of the mold on the combined circuit, so that each elastic ejector pin is inserted into the corresponding gap of the first sub-circuit board to form abutment. In this embodiment, an elastic ejector pin is used to press the first sub-circuit board to a lower height position, causing the first sub-circuit board to sink. The elastic ejector pin has a certain elasticity and can protect the first sub-circuit board and prevent the first sub-circuit board from sinking. Circuit damage and other phenomena may occur during the pressing process. In addition, the cost of the elastic ejector pin in the profiling mold is low, and the length can be replaced as needed, so that it can be adapted to any battery protection plate structure and has high adaptability.

A third embodiment of the present application provides a mold device for making the battery protection plate module as described above, including: a copy mold and a mold top cover; wherein the copy mold includes a A first depression corresponding to the circuit board and a second depression corresponding to the second sub-circuit board, the first depression is used to accommodate the first sub-circuit board, and the second depression is used to accommodate the The second sub-circuit board, the bottom surface height of the first depression is lower than the bottom surface height of the second depression; the mold top cover is used to cover the copy mold, so that the combined circuit package forms the desired shape Described battery protection board module.

The mold device provided in this embodiment, on the one hand, provides a more portable manufacturing method for the battery protection plate. The battery protection plate produced by the mold is thinner and does not protrude the thickness of the battery.

In an optional embodiment, at least two elastic ejector pins corresponding to the gaps of each first sub-circuit board are disposed in the mold top cover. In this way, the elastic ejector pin is used to press the first sub-circuit board to a lower height position, causing the first sub-circuit board to sink. The elastic ejector pin has a certain elasticity, which can protect the first sub-circuit board and prevent the first sub-circuit board from sinking. Circuit damage and other phenomena occur during the pressing process. In addition, the cost of the elastic ejector pin in the profiling mold is low, and the length can be replaced as needed, so that it can be adapted to any battery protection plate structure and has high adaptability.

In an optional embodiment, when the mold top cover presses the profiling mold, the elastic ejector pin can swing in the horizontal direction. In this way, the spring-loaded ejector pin first contacts the veneer to ensure that all the hard and soft boards of the veneer are in close contact with the bottom mold, and then the upper mold is pressed tightly to avoid tightening or locking the length of the veneer, resulting in printing. If the board production fails, the ejector pin can swing within a certain range in the xy direction to avoid scratching and damaging the surface of the veneer when the veneer is pressed down.

A fourth embodiment of the present application provides a battery module, including a battery and a battery protection plate module as described above. The battery and the battery protection plate module are each disposed in a housing of an electronic device, and the The battery protection plate module is within a height range limited by the thickness of the battery. Since the battery protection board module of the present application adopts the above-mentioned configuration of several first sub-circuit boards and second sub-circuit boards with different heights, the battery protection board module can be limited to the battery thickness range, so the overall battery module The thickness is thinner than before.

A fifth embodiment of the present application provides an electronic device, including an electronic device housing; at least one functional device module provided in the electronic device housing and the battery module as described above; wherein the pole of the battery The ears are coupled to the voltage input terminal of each functional device module. In the electronic device provided by this embodiment, since the circuit protection board in the battery module does not exceed the limited range of the battery, and the thickness of the battery is no longer limited to the thickness of the thickest electronic component, the thickness of the electronic device can be Thinner, breaking the thickness limit of current ultra-thin electronic devices.

Description of drawings

Figure 1 is a perspective view of an electronic device provided by an embodiment of the present application;

Figure 2 is an exploded schematic diagram of the electronic device shown in Figure 1;

Figure 3 is a perspective view of a battery provided by some embodiments of the present application;

Figure 4 is an exploded schematic diagram of the battery shown in Figure 3;

Figure 5 is a partial cross-sectional structural diagram of the battery shown in Figure 3 at line A1-A1;

Figure 6 is a partial structural diagram of the battery protection plate shown in Figure 5;

Figure 7 is a schematic structural diagram of the current battery protection board module in the example technology;

Figure 8 is a schematic structural diagram of the battery protection plate module provided by the embodiment of the present application;

Figure 9 is a schematic flow chart of the preparation method of the battery protection plate module provided by the embodiment of the present application;

Figure 10 is one of the structural schematic diagrams of the battery protection plate module provided by the embodiment of the present application in each preparation stage;

Figure 11 is the second structural schematic diagram of the battery protection plate module provided by the embodiment of the present application in each preparation stage;

Figure 12 is the third structural schematic diagram of the battery protection plate module in each preparation stage according to the embodiment of the present application;

Figure 13 is the fourth structural schematic diagram of the battery protection plate module in various preparation stages provided by the embodiment of the present application;

Reference signs: 10-casing, 100-electronic equipment, 20-battery, 21-battery core, 22-battery protection board, 30-device main board, 40-device sub-board, 50-display screen, 11-front cover , 12-frame, 13-back cover, 15-middle plate, D-first connector, E-second connector, 2121-pole lug, 212-bare cell, 211-cell shell, 221-hard Circuit board, 222-electronic components, 223-board-to-board connection module, 2231-second flexible circuit board, 2232-board-to-board connector, 224-nickel sheet, 2234-fixed part, 2235-connection part, F1-bearing Surface, F2-connection surface, 2211-first sub-circuit board, 2212-second sub-circuit board, 2213-flexible connector, 2215-soldering pad; L1-battery thickness, L2-current protection board thickness, L3-this application Thickness of battery protection plate, 231-Profiling mold, 232-Mold top cover, 233-Elastic ejector pin, 24-Encapsulation medium.

Detailed ways

In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the specific technical solutions of the present application will be further described in detail below in conjunction with the drawings in the embodiments of the present application. The following embodiments are used to illustrate the present application, but are not used to limit the scope of the present application.

This application provides an electronic device. Specifically, the electronic device may be a portable electronic device or other suitable electronic device. For example, the electronic device may be a mobile phone, a tablet personal computer, a notebook computer, a laptop computer, a personal digital assistant (PDA), and a wearable device (such as a watch or glasses) and other electronic equipment.

Please refer to Figures 1 and 2. Figure 1 is a perspective view of an electronic device 100 provided by some embodiments of the present application, and Figure 2 is an exploded schematic view of the electronic device 100 shown in Figure 1. In this embodiment, the electronic device 100 is a mobile phone. The electronic device 100 includes a housing 10 , a device main board 30 , a device secondary board 40 , a display screen 50 and a battery 20 .

It should be noted that FIG. 1 and FIG. 2 and the relevant drawings below only schematically illustrate some components included in the electronic device 100 , and the actual shapes, actual sizes, actual positions and actual structures of these components are not affected by FIG. 1 and the limitations of Figure 2 and the Figures below.

In order to facilitate the description of each embodiment below, an XYZ coordinate system is established for the electronic device 100 . Specifically, the width direction of the electronic device 100 is defined as the X-axis direction (that is, the second direction), the length direction of the electronic device 100 (that is, the first direction) is defined as the Y-axis direction, and the thickness direction of the electronic device 100 is defined as the Z-axis direction. . It can be understood that the coordinate system setting of the electronic device 100 can be flexibly set according to actual needs, and is not specifically limited here.

The housing 10 is used to protect the internal circuit components of the electronic device 100 . Please continue to refer to FIG. 2 . The housing 10 includes a front cover 11 , a frame 12 and a back cover 13 .

Specifically, the front cover 11 is flat. The front cover 11 is a light-transmitting part. The material of the front cover 11 includes but is not limited to glass, plastic and ceramics.

The back cover 13 and the front cover 11 are stacked and spaced apart. The back cover 13 is flat. The material of the back cover 13 includes but is not limited to metal and plastic.

The frame 12 is located between the front cover 11 and the back cover 13 and is arranged around the edges of the front cover 11 and the back cover 13 . For example, the frame 12 can be fixedly connected to the back cover 13 through adhesive. The frame 12 can also be an integrally formed structure with the back cover 13, that is, the frame 12 and the back cover 13 are an integral structure. The front cover 11 is fixed on the frame 12 . In some embodiments, the front cover 11 can be fixed on the frame 12 by adhesive. The material of the frame 12 includes but is not limited to metal and plastic.

The front cover 11 , the back cover 13 and the frame 12 form an internal accommodation space of the electronic device 100 . The internal accommodation space accommodates the display screen 50 , the device main board 30 , the device secondary board 40 and the battery 20 .

The display screen 50 is located between the front cover 11 and the rear cover 13 and is fixed to the front cover 11 . Exemplarily, the display screen 50 is fixed to the front cover 11 through adhesive. The display screen 50 is used to display images, videos, etc.

The device mainboard 30 is used to integrate the control chip. For example, the device mainboard 30 can be fixed to the display screen through threaded connection, clamping, etc. Specifically, the device mainboard 30 may be fixed on the surface of the display screen 50 facing the rear cover 13 . In other embodiments, please refer to FIG. 2 , the electronic device 100 further includes a midplane 15 . The middle panel 15 is fixed on the inner surface of the frame 12 and is located between the display screen 50 and the back cover 13 . For example, the middle panel 15 can be fixed on the frame 12 by welding, snapping or gluing. The middle panel 15 can also be an integrally formed structure with the frame 12 . The middle plate 15 serves as the structural "skeleton" of the electronic device 100 , and the device mainboard 30 can be fixed on the side surface of the middle plate 15 facing the back cover 13 through threaded connection, clamping, welding, etc.

The control chip can be, for example, an application processor (AP), a double data rate synchronous dynamic random access memory (DDR), a universal memory (universal flash storage, UFS), etc. In some embodiments, the device mainboard 30 is electrically connected to the display screen 50 , and the device mainboard 30 is used to control the display screen 50 to display images or videos.

The device sub-board 40 is used to integrate antennas (such as 5G antennas) radio frequency front-ends, universal serial bus (universalserial bus, USB) devices, vibrators and other electronic components. The device secondary board 40 and the device main board 30 are arranged in the Y-axis direction. The device sub-board 40 may be fixed on the surface of the middle board 15 facing the rear cover 13 . Specifically, the device sub-board 40 can be fixed to the surface of the middle plate 15 facing the rear cover 13 through threaded connection, clamping, gluing or welding. In other examples, when the electronic device 100 does not include the middle panel 15 , the device sub-panel 40 may also be fixed on the surface of the display screen 50 facing the rear cover 13 .

The device secondary board 40 is electrically connected to the device main board 30 through a connection structure (not shown) to realize data and signal transmission between the device secondary board 40 and the device main board 30 . Of course, it can be understood that in other examples, the device main board 30 and the device secondary board 40 can also be integrated into one body.

Please continue to refer to Figure 2. A battery compartment a is provided in the housing 10. The battery compartment a is used to accommodate the battery 20 . The battery compartment a is located between the device main board 30 and the device secondary board 40 . Specifically, the battery compartment a is a groove provided on the surface of the middle plate 15 facing the rear cover 13 . In some embodiments, when the middle panel 15 is not provided in the electronic device 100, the display screen 50 in Figure 2 is used to form the bottom wall of the battery compartment a, and the device mainboard 30, the device secondary board 40 and the frame 12 form the battery compartment a. side wall. There are no specific limitations here.

The battery 20 is installed in the battery compartment a, and the battery 20 is used to provide power to the display screen 50 , the device main board 30 and the device secondary board 40 in the electronic device 100 .

Please continue to refer to Figure 2 and combine it with Figure 3. Figure 3 is a perspective view of the battery 20 provided by some embodiments of the present application. The battery 20 includes a battery core 21 and a battery protection plate 22 electrically connected to the battery core 21 .

It can be understood that FIG. 3 and the following accompanying drawings only schematically illustrate some components included in the battery 20 , and the actual shapes, actual sizes, actual positions and actual structures of these components are not limited by FIG. 3 and the following accompanying drawings. .

Please refer to FIG. 4 , which is an exploded schematic diagram of the battery 20 shown in FIG. 3 . The battery core 21 includes a battery core casing 211 and a bare battery core 212 .

The cell shell 211 is used to encapsulate and protect the bare cell 212. The battery shell 211 includes but is not limited to a steel shell and an aluminum-plastic film. Aluminum-plastic film, also known as aluminum-plastic packaging film, consists of at least three layers of materials. The middle layer is an aluminum layer, which serves to isolate moisture. The outer layer is a nylon glue layer, which prevents the penetration of air, especially oxygen. The inner layer is a polypropylene (PP) layer, which seals and prevents the electrolyte from corroding the aluminum layer.

The battery cell casing 211 is filled with electrolyte. The bare battery core 212 is located in the battery core housing 211 and immersed in the electrolyte. The electrolyte exists in each gap of the bare cell 212 inside the cell casing 211 and is used as a carrier to transport lithium ions in the battery 20 . The electrolyte is generally prepared from high-purity organic solvents, electrolyte lithium salts, necessary additives and other raw materials under certain conditions and in certain proportions.

The bare cell 212 generally includes a positive electrode piece, a negative electrode piece and a separator. Both the positive electrode piece and the negative electrode piece include a current collector and an electrode material coated on the current collector. The current collector of the positive electrode is usually aluminum foil. The current collector of the negative electrode is usually copper foil. The separator, also called an isolation film, is disposed between the positive electrode piece and the negative electrode piece, and is used to separate the positive electrode piece and the negative electrode piece of the bare cell 212 to prevent the two electrode pieces from being in direct contact and causing a short circuit. The material of the separator is usually a polyolefin porous membrane.

In order to facilitate the electrical connection of the battery core 21 to the circuit, the bare battery core 212 is provided with two tabs 2121 . The tabs 2121 are used to lead the electrodes of the bare battery core 212 out of the battery core shell 211 . Specifically, the tab 2121 used to draw out the positive electrode of the bare battery core 212 is a positive electrode tab, and the tab 2121 used to draw out the negative electrode of the bare battery core 212 is a negative electrode tab. The positive tab can be connected to the current collector of the positive electrode piece in the bare cell by welding, or can be formed by directly extending from the current collector of the positive electrode piece. Similarly, the negative electrode tab can be connected to the current collector of the negative electrode piece of the bare cell 212 by welding, or can be formed by directly extending from the current collector of the negative electrode piece. The positive tab is usually made of aluminum. The negative electrode tab is usually made of nickel material or copper-plated nickel (Ni-Cu) material. In order to avoid a short circuit between the tab 2121 and the metal in the battery case 211 (such as the aluminum layer in the aluminum-plastic film), the portion of the tab 2121 that penetrates the battery case 211 is usually covered with tab glue. Play the role of insulation and isolation.

The battery protection plate 22 is disposed outside the battery cell casing 211 and is electrically connected to the tabs 2121 of the battery core 21 . The battery protection board 22 is provided with a connector. The connector can be inserted into the connector interface on the device mainboard 30 , so that the battery protection board 22 can be electrically connected to the device mainboard 30 . The battery protection board 22 may be used to provide overcharge protection and short circuit protection. When the current and voltage in the battery core 21 are too high or too low, the battery protection board 22 can be electrically disconnected from the device mainboard 30 . Therefore, connecting the device mainboard 30 and the battery core 21 through the battery protection plate 22 can prevent the battery 20 from problems such as overvoltage, overcharge, overcurrent, and overdischarge.

Specifically, the battery protection board 22 is provided with two connectors, namely the first connector D and the second connector E. For example, the first connector D can be electrically connected to the positive voltage terminal and the negative voltage terminal of the device mainboard 30 through a connector interface on the device mainboard 30 to form an electrical signal loop; the second connector E can be Another connector interface on the device mainboard 30 is electrically connected to the positive voltage terminal and the negative voltage terminal in the device mainboard 30 at the same time to form an electrical signal loop. This is beneficial to improving the charging and discharging efficiency of the battery 20 . As another example, the first connector D can be connected to the positive voltage terminal of the device mainboard 30 through a connector interface on the device mainboard 30 , and the second connector E can be connected to the positive voltage terminal of the device mainboard 30 through another connector interface on the device mainboard 30 . The negative voltage terminal in the device mainboard 30 is electrically connected to form an electrical signal loop. In other examples, when the battery protection board 22 assembly includes a connector, the connector can be electrically connected to the positive voltage terminal and the negative voltage terminal in the device mainboard 30 through the connector interface on the device mainboard 30 to form a electrical signal circuit.

On this basis, in order to facilitate the electrical connection between the battery protection plate 22 and the device mainboard 30 , the battery protection plate 22 is located at one end of the battery core 21 adjacent to the device mainboard.

In order to facilitate the thinning design of the electronic device 100 , the thickness direction of the battery protection plate 22 and the thickness direction of the battery 20 are consistent with the thickness direction of the electronic device 100 (ie, the Z-axis direction).

Please refer to Figures 5, 6 and 7. Figure 5 is a partial cross-sectional structural diagram of the battery 20 shown in Figure 3 at the line A1-A1. Figure 6 is a partial structure of the battery protection plate 22 shown in Figure 5. Schematic diagram. FIG. 7 is a schematic diagram of the layer structure of the battery protection board 22 shown in FIG. 5 . The battery protection board 22 includes an entire hard circuit board 221 and electronic components 222 fixed on the hard circuit board 221 .

As shown in FIG. 7 , the rigid circuit board 221 has a bearing surface F1 and a connection surface F2 that are opposite to each other in the thickness direction (ie, the Z-axis direction). Specifically, the hard circuit board 221 is a printed circuit board (PCB). Multiple electronic components 222 may be disposed on the carrying surface F1.

The board-to-board connection module 223 is fixedly connected to the hard circuit board 221, and the two are electrically connected. The battery protection board 22 is electrically connected to the device mainboard 30 via a board-to-board connection module 223 . Specifically, please continue to refer to FIGS. 5 and 6 . The board-to-board connection module 223 includes a fixing part 2234 and two connection parts 2235 . The fixing portion 2234 is stacked on the side of the hard circuit board 221 facing the connection surface F2 and is fixed to the connection surface F2. The board-to-board connection module 223 is fixed to the tab 2121 of the battery core 21 via the fixing portion 2234, and is electrically connected to the tab 2121. For example, please continue to refer to FIG. 5 . Two nickel sheets 224 are provided on the surface of the fixing part 2234 away from the hard circuit board 221 , which are respectively a positive nickel sheet and a negative nickel sheet. The positive nickel piece is welded to the positive tab of the battery core 21 . The negative nickel piece is welded to the negative tab of the battery core 21 .

The two connecting parts 2235 are respectively connected to both ends of the fixing part 2234 in the length direction (that is, in the X-axis direction). The two connecting parts 2235 are bent around the side of the hard circuit board 221 to the side facing the carrying surface F1. One of the connecting parts 2235 is provided with the above-mentioned first connector D, and the other connecting part 2235 is provided with the above-mentioned second connector E.

What is not shown in Figure 7 is that there is a step of 0.8-1.2mm from the battery tab to the back of the battery. In addition, the bending thickness of the nickel sheet is about 0.45mm. The total thickness is 1.25-1.65mm, which cannot be used to lay out the battery protection plate device. Affects the overall stacking height of the battery.

At the same time, please refer to FIGS. 5 and 7 . In the battery 20 , in order to prevent the electronic components 222 on the hard circuit board 221 from colliding with other structures, causing damage to the electronic components 222 . A certain safety distance needs to be reserved between the electronic component 222 and the edge of the hard circuit board 221, so that the distance between the orthographic projection of the electronic component 222 on the bearing surface F1 and the edge of the hard circuit board 221 is generally relatively large. This makes the overall circumferential size of the battery protection plate 22 relatively large. Referring to FIG. 7 , the battery protection plate 22 also includes: a packaging medium 24 . The packaging medium 24 is packaged on the carrying surface F1 and wraps the electronic component 222 . In this way, the packaging medium 24 can be used to protect the electronic components 222 on the hard circuit board 221, so that there is no need to reserve an excessive safety distance between the electronic components 222 and the edges of the hard circuit board 221, which can help reduce The distance between the orthographic projection of the electronic component 222 on the bearing surface F1 and the edge of the hard circuit board 221 is beneficial to reducing the circumferential size of the battery protection plate 22 and optimizing the internal structural layout of the electronic device 100 .

Although it may be advantageous to reduce the circumferential size of the battery protection plate 22 . However, on the one hand, the arrangement of the packaging medium 24 increases the thickness of the entire battery protection plate 22; on the other hand, the stacked arrangement of the fixing portion 2234 and the hard circuit board 221 also causes the thickness of the battery protection plate 22 to increase. In addition, the fixed part 2234 and the hard circuit board 221 are welded together through solder joints. The solder joints between the fixed part 2234 and the hard circuit board 221 also occupy a certain height, so that the fixed part 2234 and the hard circuit board are There are welds between 221, which also increases the thickness of the battery protection plate 22. In addition, the thickness of the hard circuit board 221 itself is relatively thick (the thickness of the hard circuit board 221 is about 0.85 mm). The combination of the two restricts the continued thinning of electronic equipment.

As the electronic device 100 needs to implement more and more functions, more and more electronic components are arranged on the device mainboard 30 inside the electronic device 100 . Correspondingly, the device motherboard 30 occupies an increasingly larger space in the electronic device 100 , and the power consumption of the electronic device 100 increases and the standby time is shortened. In an electronic device 100 where space is at a premium, if the battery protection plate 22 is to be made thin, it is extremely important to save space to increase the capacity of the battery 20 or to increase the layout area of the device mainboard 30 .

Based on this, in order to solve the above technical problems, this application creatively splits the current entire hard board into multiple sub-boards, and then sinks some of the sub-boards. The sunken sub-boards are used to fix higher-height electronic components. Thereby breaking the current limitation of continued thinning of electronic equipment, a battery protection plate 22 as shown in Figures 8 to 12 is provided to achieve the purpose of reducing the thickness of the electronic equipment and increasing the battery capacity under the current thickness. Reducing the thickness of the battery protection plate is beneficial to saving space inside the electronic device 100 , which is beneficial to increasing the capacity of the battery 20 and/or increasing the layout area of the device mainboard 30 . Among them, FIG. 8 is the first schematic cross-sectional structural diagram of the battery protection plate 22 provided by some other embodiments of the present application. FIG. 9 is the second schematic cross-sectional structural diagram of the battery protective plate 22 provided by some further embodiments of the present application. The third schematic diagram of the cross-sectional structure of the battery protection plate 22 provided in some embodiments of the application is shown in Figure 11. The fourth schematic diagram of the cross-sectional structure of the battery protection plate 22 provided in some embodiments of the application is shown in Figure 12. The third diagram is provided in some embodiments of the application. The fifth cross-sectional structural diagram of the battery protection plate 22.

Specifically, in the above embodiment, the battery protection board includes: a plurality of first sub-circuit boards 2211 and a plurality of second sub-circuit boards 2212 arranged alternately, and connecting adjacent first sub-circuit boards 2211 and second sub-circuit boards 2212. The first flexible connector 2213 of the sub-circuit board 2212, the first electronic component 222 is fixed on the first sub-circuit board 2211, and the second electronic component 222 is fixed on the second sub-circuit board 2212; in the thickness direction of the battery , the height of the first electronic component 222 is higher than the height of the second electronic component 222 , and the height of the first sub-circuit board 2211 is lower than the height of the second sub-circuit board 2212 .

This application creatively replaces the current battery protection board with an integral hard board by using multiple first sub-circuit boards 2211 and multiple second sub-circuit boards 2212. Each sub-circuit board is connected through a flexible connector 2213. The first sub-circuit board The height of the circuit board 2211 is lower than the second sub-circuit board 2212. That is, by sinking the first sub-circuit board 2211 during production, while the second sub-circuit board 2212 remains in the same position, the height can be higher. The electronic components 222 are allocated to the first sub-circuit board 2211. The battery protection board will not be higher than the thickness of the battery when the higher electronic components 222 and other electronic components 222 are placed on the same circuit board. In addition, due to the higher As the electronic component 222 sinks, the thickness of the battery can continue to be reduced, breaking the current limitations of battery thickness.

Specifically, there are multiple electronic components 222 . The plurality of electronic components 222 include a control chip (not shown), a metal-oxide semiconductor field effect transistor (not shown), a thermistor (not shown), a capacitor (not shown) and a memory. (not shown), etc. any one or more.

The control chip is electrically connected to the metal-oxide semiconductor field effect transistor, thermistor, capacitor, memory, etc.

Thermistors can be divided into positive temperature coefficient thermistors (PositiveTemperature Coefficient, PTC) and negative temperature coefficient thermistors (Negative TemperatureCoefficient, NTC) according to different temperature coefficients. The thermistor is characterized by its sensitivity to temperature. , can show different resistance values at different temperatures. Among them, the positive temperature coefficient thermistor has a greater resistance value when the temperature is higher, and the negative temperature coefficient thermistor (NTC) has a resistance value when the temperature is higher. The lower. The temperature change coefficient of a negative temperature coefficient thermistor (NTC) is generally expressed in ppm/℃, that is, a change in temperature of 1 degree corresponds to a change in resistance of several parts per million. 100ppm/℃ is 0.01%/℃.

Metal Oxide Semiconductor Field Effect Transistor (MOSFET), referred to as Metal Oxide Semiconductor Field Effect Transistor, is a field effect transistor that can be widely used in analog circuits and digital circuits. When a large enough potential difference is applied between the gate and source of a MOSFET, the electric field will form an induced charge on the semiconductor surface under the oxide layer, and an "inversion channel" will be formed. (inversion channel). The polarity of the inverted channel is the same as its drain and source. Assuming that the drain and source are n-type, the channel will also be n-type. After the channel is formed, the MOSFET can allow current to pass through it. Depending on the voltage applied to the gate, the amount of current that can flow through the channel of the MOSFET will also be controlled by it. .

The control chip can be used to control the MOSFET to maintain or disconnect the electrical connection between the battery core 21 and the device mainboard 30 . When the voltage or loop current of the battery core 21 does not exceed the specified value stored in the memory, the control chip controls the metal oxide semiconductor field effect transistor to turn on, and the battery core 21 is electrically connected to the device mainboard 30 . When the voltage or circuit current of the battery core 21 exceeds a specified value, the control chip controls the metal oxide semiconductor field effect transistor to turn off to protect the safety of the battery core 21.

Capacitors, such as ceramic capacitors (ceramic condensers), are used in circuits to perform functions such as DC blocking, filtering, and energy storage.

Please continue to refer to Figures 8 to 12. The battery protection board module includes a first sub-circuit board 2211, a second sub-circuit board 2212, and a flexible connector 2213 connecting each sub-circuit board.

The first sub-circuit board 2211 and the second sub-circuit board 2212 are used to fix the electronic components 222 . That is, the electronic component 222 is fixed on the first sub-circuit board 2211 and the second sub-circuit board 2212, and is electrically connected to the first sub-circuit board 2211 and the second sub-circuit board 2212. For example, please continue to refer to Figure 8. The first sub-circuit board 2211 and the second sub-circuit board 2212 have soldering pads 2215, and the electronic components 222 and the soldering pads 2215 can be connected through solder joints. In some specific examples, the electronic component 222 may be soldered on the pads 2215 of the first sub-circuit board 2211 and the second sub-circuit board 2212 through a surface mount device (SMD) process.

In some embodiments, each second sub-circuit board 2212 is arranged with equal length, and at least one second sub-circuit board 2212 is disposed between any two adjacent first sub-circuit boards 2211. The battery protection The board module also includes a second flexible connector 2213 connecting two adjacent second sub-circuit boards 2212.

The higher electronic components 222 tend to consume relatively more power. In this way, the higher electronic components 222 can be dispersed throughout the battery protection plate to ensure that the two higher electronic components 222 are not too close. This allows the battery protection plate to dissipate heat evenly and avoid performance degradation caused by local overheating.

Specifically, any two adjacent first sub-circuit boards 2211 may be separated by 1, 2, 3 or more second sub-circuit boards 2212. Due to the fixed position of the first sub-circuit board 2211, There are thicker electronic components 222, thereby dissipating greater heat during use. By arranging the second sub-circuit board 2212 on both sides of the first sub-circuit board 2211, the lower-height electronic components fixed on the second sub-circuit board 2212 are The component 222 has lower heat dissipation, and due to its lower height, it can provide more heat dissipation space for the first sub-circuit board 2211, which is beneficial to the heat conduction of the overall circuit board structure.

In the embodiment of the present application, at least one electronic component 222 may be disposed on each sub-circuit board.

For example, it can be set according to the area of the electronic component 222 on each sub-circuit board. For example, for MOS tubes, since the MOS tube occupies a certain area, one MOS tube can be set on one sub-circuit board, and other MOS tubes occupy a smaller area. It’s just a device, and multiple ones can be configured on a sub-circuit board, such as 2 or three.

Of course, the actual layout can be comprehensively based on the position, height and area of each electronic component 222 .

In a preferred embodiment, the number of electronic components 222 on each sub-circuit board can be set according to the heat dissipation conditions and the area of the electronic components 222. For example, if some of the electronic components 222 are used frequently, for example, in When the battery needs to be protected, it needs to be in continuous use. At this time, only one electronic component 222 can be installed on the sub-circuit board corresponding to the electronic component 222, and the distance between the sub-circuit board and other sub-circuit boards can be expanded, that is, Longer flexible connectors 2213 are used instead to connect the sub-circuit board and adjacent sub-circuit boards. For electronic components 222 that do not dissipate much heat, the sub-circuit board and its surrounding electronic components 222 can be arranged more densely, for example A plurality of electronic components 222 that dissipate little heat are densely arranged on a sub-circuit board.

It can be seen that this application uses the flexible connector 2213 to cooperate with the first sub-circuit board 2211 and the second sub-circuit board 2212 to replace the current entire hard board. The technical advantage it brings also lies in the design of the electronic components 222 on the circuit board. and layout provide a higher degree of freedom.

As a scenario, the battery protection board module includes multiple of the above electronic components 222. One of the first sub-circuit boards 2211 is only configured with one electronic component a. This electronic component a belongs to the electronic component 222 that dissipates huge heat. It is necessary to maintain power during the standby phase and the use phase, and the height of the electronic component 222 is relatively high, which belongs to the first electronic component 222 in the embodiment of the present application. At this time, the two sides of the corresponding first sub-circuit board 2211 are connected. The circuit board may be a second sub-circuit board 2212, and the layout of the second sub-circuit board 2212 may be such that the electronic components 222 on the second sub-circuit board 2212 are disposed slightly away from the electronic components 222 instead of being disposed in the center of the second sub-circuit board 2212. , and the distance between the first sub-circuit board 2211 and the second sub-circuit boards 2212 on both sides is larger than the distance between other sub-circuit boards, so that the electronic component a on the first sub-circuit board 2211 is provided There is sufficient space for heat dissipation.

As another scenario, the battery protection board module includes multiple of the above electronic components 222, and only one electronic component b is configured on one of the first sub-circuit boards 2211. This electronic component b is an electronic component with small heat dissipation. 222, therefore multiple other electronic components 222 can be arranged on the sub-circuit board of the electronic component b, and the electronic component b and the other electronic components 222 are preferably both electronic components 222 with small heat dissipation, so that the electronic component can be The distance between b and other electronic components 222 is set smaller, and the distance between the sub-circuit board of electronic component b and the sub-circuit boards on both sides is relatively reduced. In this way, electronic component b does not require too much space for heat dissipation. A concession space for heat dissipation is provided for other electronic components 222 that dissipate large amounts of heat, such as electronic component a. The space around electronic component b can be sacrificed to provide electronic component a, so that electronic component a has more space for heat dissipation.

In some embodiments, the first sub-circuit boards 2211 and the second sub-circuit boards 2212 are arranged alternately. It can be seen from the above embodiments that the arrangement of the sub-circuit boards and the arrangement of the electronic components 222 can have greater freedom. Therefore, in some scenarios, the heat dissipation of each electronic component 222 can be simply proportional to the volume. The first sub-circuit board 2211 Alternately arranged with the second sub-circuit board 2212, each higher electronic component 222 is flanked by lower electronic components 222, thereby enlarging the heat dissipation area. This makes it easy to standardize the manufacturing process during production and is conducive to the overall circuit board structure. It conducts heat while dissipating heat more evenly.

In some embodiments, each first sub-circuit board 2211 is arranged at the same length, and at least one first sub-circuit board 2211 is disposed between any two adjacent second sub-circuit boards 2212. The battery The protection board module also includes a third flexible connector 2213 connecting two adjacent first sub-circuit boards 2211. Although arranging the first sub-circuit boards 2211 separately is the preferred solution of this application, it can be understood that this application can also adopt the method of arranging two or at least three first sub-circuit boards 2211 continuously, and then use the second sub-circuit. separated by boards 2212. This implementation is more suitable for battery protection boards with higher electronic components 222. In addition, heat dissipation patches such as graphene patches can be attached to the dense area of the first sub-circuit board 2211 for more Distributes heat well.

That is to say, it can be known from the above embodiments that in this application, the first sub-circuit board 2211 and the second sub-circuit board 2212 are preferably arranged at intervals. However, the first sub-circuit board 2211 can also have at least two consecutive arrangements, and the second sub-circuit board 2212 can also be arranged at intervals. There may be at least two consecutive settings, and this application does not limit this.

It can be seen from the above embodiments that the degree of freedom of the arrangement of the sub-circuit boards and the electronic components 222 of the present application is much higher than the current degree of freedom of the entire hard board. That is, the present application provides the first sub-circuit board 2211 and the second The number of electronic components 222 fixed on the sub-circuit board 2212 is not limited. Generally speaking, in order to solve the process, more electronic components 222 can be fixed on the same sub-circuit board. However, the electronic components 222 also need to be considered during production. To solve the problem of heat dissipation, it is generally preferred that the number of electronic components 222 on each sub-circuit board be one or two, thereby simplifying the process while ensuring heat dissipation.

In some embodiments, the flexible connector 2213 is a flexible circuit board. The flexible connector 2213 needs to have a circuit routing function, that is, it needs to ensure the signal input and signal output of the electronic components 222 on the sub-circuit board. On the one hand, the flexible circuit board is thin, and on the other hand, any idea can be printed on the flexible circuit board. The first sub-circuit board 2211 and the second sub-circuit board 2212 can be connected to form a complete circuit board.

Of course, this application can also use other materials to make the flexible connector 2213. As an example, multiple thin metal guide wires can be used to connect the first sub-circuit board 2211 and the second sub-circuit board 2212. In this embodiment, for To avoid voltage interference between metal guide wires, the metal guide wires can be covered with insulating material.

In other embodiments, a flexible circuit board and multiple thin metal guide wires can be used in combination, for example, a flexible circuit board is arranged between two sub-circuit boards, and metal guide wires are arranged between the other two sub-circuit boards. This application does not place a limitation on this. It can be understood that the configuration of the metal guide wire and the flexible circuit board can be freely selected based on actual needs, such as cost considerations or circuit layout considerations. This application does not place a limitation on this.

While describing the flexible connector 2213, it should be noted that if there is no limit on the length of the first sub-circuit board 2211 and the second sub-circuit board 2212, that is, each first sub-circuit board 2211 is not equal in length, And each second sub-circuit board 2212 is not of equal length, then in the embodiment of the present application, there is no situation where two first sub-circuit boards 2211 are adjacent or two second sub-circuit boards 2212 are adjacent, because two adjacent The first sub-circuit board 2211 of equal length can be replaced by a longer first sub-circuit board 2211. Similarly, two adjacent second sub-circuit boards 2212 of equal length can also be replaced by a longer second sub-circuit. board 2212 instead, which will not be described in detail in this application.

In some embodiments, the first sub-circuit board 2211 and/or the second sub-circuit board 2212 are flexible circuit boards or rigid circuit boards. It should be understood that the first sub-circuit board 2211 and the second sub-circuit board 2212 of this application are independently flexible circuit boards or rigid circuit boards, that is, the first sub-circuit board 2211 can be a flexible circuit board or a rigid circuit board, and the second sub-circuit board 2211 can be a flexible circuit board or a rigid circuit board. The sub-circuit board 2212 can also be a flexible circuit board or a rigid circuit board. Generally speaking, based on process considerations, the first sub-circuit board 2211 and the second sub-circuit board 2212 are set to the same board material, that is, both are flexible circuit boards. Or both can be rigid circuit boards, and based on cost considerations, both can be rigid circuit boards if permitted.

Of course, as a preference, both the first sub-circuit board 2211 and the second sub-circuit board 2212 are rigid circuit boards, which on the one hand has a lower cost, and on the other hand, since the first sub-circuit board 2211 is sunk, although the rigid circuit boards are relatively Thick, but in some scenarios, the final thickness difference between flexible circuit boards and rigid circuit boards is not much different in the finished product. In this case, a lower-cost rigid circuit board can be selected, which can also enhance the reliability of the circuit.

In a preferred embodiment, if the height of the highest electronic component 222 has approached the thickness of the battery, considering that the thickness of the rigid circuit board is higher than that of the flexible circuit board, the first sub-circuit under the highest electronic component 222 can be specifically placed at this time. The board 2211 is configured as a flexible circuit board, and the other first sub-circuit boards 2211 are configured as rigid circuit boards.

As an example, for example, the thickness of the electronic component c is close to the thickness of the battery. At this time, the first sub-circuit board 2211 corresponding to the electronic component 222 can use a flexible circuit board, while the circuit boards corresponding to the other electronic components 222 all use rigid circuits. At this time, with the help of the thinner characteristics of flexible circuit boards, it provides a higher degree of freedom for the overall structure, thereby being able to greatly reduce the thickness of electronic equipment, breaking the current limitations of continued thinning of electronic equipment.

It can be seen from the above embodiments that in this application, each first sub-circuit board 2211 and each second sub-circuit board 2212 are independent and can be independently configured as flexible or rigid circuit boards. This application does not Do continue to elaborate.

In some embodiments, the battery protection plate module further includes: a plurality of electronic connectors for welding and fixing with the tabs 2121 of the battery, and each electronic connector is provided on the second sub-circuit board 2212 away from the One side surface of the second electronic component 222 . In this embodiment, the electronic connector can be a nickel sheet 224. The nickel sheet 224 is welded to the tab 2121 of the battery and fixed on the back of the battery protection plate. Since the electronic connector has a certain thickness, it is preferred that the electronic connector is fixed on On the back of the second sub-circuit board 2212, due to the sinking of the first sub-circuit board 2211, a certain space is formed below the second sub-circuit board 2212. Electronic connectors are placed in this space, thereby rationally utilizing this part of the space. , so that the battery thickness can be made thinner.

In some embodiments, the bottom surface of the electronic connector is flush with the bottom surface of the first sub-circuit board 2211 . In this way, the bottom of the first sub-circuit board 2211 and the bottom of the electronic connector are both set at the bottom within the allowable range, thereby leaving maximum room for the height of the electronic component 222 and adapting to electronic components with higher thickness. 222.

It should be understood that in the embodiment of the present application, the electronic connector may be a nickel piece 224. Specifically, please continue to refer to Figures 5 and 6. In the embodiment of the present application, the second sub-circuit board 2212 is fixed on the second sub-circuit. The soldering pad 2215 on the back of the board 2212 is fixed to the tab 2121 of the battery core 21 and is electrically connected to the tab 2121 .

For example, please continue to refer to Figure 5. The electronic connector may be two nickel sheets 224, which are a positive nickel sheet 224 and a negative nickel sheet 224. The positive nickel sheet 224 is welded to the positive electrode tab 2121 of the battery core 21, and the negative nickel sheet 224 is welded to the positive electrode tab 2121 of the battery core 21. The piece 224 is welded to the negative electrode tab 2121 of the battery core 21 .

It should be noted that the nickel piece 224 is welded to the two tabs 2121 of the battery core 21 and maintains an electrical connection. It can be understood that in other examples, the nickel piece 224 may not be provided, but the two tabs 2121 are directly welded to the soldering pad 2215 through solder joints.

In some embodiments, the battery protection board module further includes: a board-to-board connector 2232, which is connected to the nearest sub-circuit board through the second flexible circuit board 2231, and the board-to-board connector 2232 is connected to the nearest sub-circuit board. The second sub-circuit board 2212 is arranged flush. It can be known that in this embodiment, the board-to-board connector 2232 and the second flexible circuit board 2231 together form the board-to-board connection module 223. In this embodiment, the board-to-board connector is flush with the second sub-circuit board 2212, so that a straight circuit board can be used to connect the board-to-board connector and the second sub-circuit board 2212. That is, either The flexible circuit board can also be a rigid circuit board. Both are acceptable in this application. Of course, in the preferred embodiment, the sub-circuit board closest to the board-to-board connector can be either the first sub-circuit board 2211 or the first sub-circuit board 2211. The second sub-circuit board 2212, therefore, during production, it is preferred to connect the board-to-board connector to the flexible circuit board, so that whether it is connected to the first sub-circuit board 2211 or to the second sub-circuit board 2212, it can be directly connected. When the board-to-board connector is connected to a rigid circuit board, the board-to-board connector needs to be adaptively adjusted to the height of the closest sub-circuit board, which will not be described in detail.

In addition, it can be seen from the above embodiments that the arrangement of the sub-circuit boards of the present application has a high degree of freedom. In order to further improve the degree of freedom, in some embodiments, the battery protection board module also includes: a third sub-circuit board, a third electronic component 222 is fixed on the third sub-circuit board, the height of the third sub-circuit board is higher than the height of the first sub-circuit board 2211, and the third electronic component 222 The height is lower than the height of the second electronic component 222 . This embodiment further provides a third sub-circuit board based on a similar concept. That is, in the embodiment of the present application, in fact, more than or equal to three sub-circuit boards with different heights can be provided as needed. In a more special embodiment, Each sub-circuit board is at a different height. Correspondingly, the height of the electronic components 222 on each sub-circuit board is different. This application does not limit this. Obviously, this embodiment can be implemented for each electronic component 222 Adapt to the optimal height of the sub-circuit board, which will help reduce the amount of injection molding during subsequent injection molding.

In some embodiments, at least one third sub-circuit board is inserted between each two adjacent first sub-circuit boards 2211 and second sub-circuit boards 2212, or the first sub-circuit board 2211, the The second sub-circuit board 2212 and the third sub-circuit board are arranged in sequence.

Similarly, based on the above description of degrees of freedom, it can be seen that the third sub-circuit board can also be arranged according to factors such as heat dissipation and spatial arrangement of the actual electronic components 222. For example, the third sub-circuit board can be arranged between the first sub-circuit board 2211 and the third sub-circuit board 2211. Between the two sub-circuit boards 2212, which is beneficial to heat dissipation, the first sub-circuit board 2211, the second sub-circuit board 2212 and the third sub-circuit board can also be arranged in sequence. This application does not limit this .

Based on the above embodiments, the present application can inject an insulating packaging medium 24 on the electronic components 222 of the battery protection plate module. The material of the insulating packaging medium 24 can include but is not limited to resin, such as polyimide. Amine (Polyimide, PI). Generally speaking, the insulating packaging medium 24 can cover all the electronic components 222 on all the first sub-circuit boards 2211 and the second sub-circuit board 2212, thereby on the one hand serving the function of electrical insulation for the electronic components 222, and on the other hand. A certain buffering protection is provided to prevent the internal electronic components 222 from being damaged when the battery protection plate module is collided. In addition, the insulating packaging medium 24 further provides a certain mechanical strength to support the battery protection plate module.

The manufacturing method of the above-mentioned battery protection plate module will be described below. Please refer to the manufacturing method of the battery protection plate module shown in Figure 9. Figures 10 to 13 show schematic structural diagrams of each stage of processing in the manufacturing method.

Specifically, as shown in Figure 9, the embodiment of the present application provides a method for manufacturing a battery protection plate module, including:

S1: Provide a plurality of first sub-circuit boards 2211, a plurality of second sub-circuit boards 2212 and a profiling mold 231, wherein the profiling mold 231 includes a first depression corresponding to the first sub-circuit board 2211 and a profiling mold 231. The second recess corresponding to the second sub-circuit board 2212, the first recess is used to accommodate the first sub-circuit board 2211, the second recess is used to accommodate the second sub-circuit board 2212, The bottom height of the first recess is lower than the bottom height of the second recess. A first electronic component 222 is fixed on the first sub-circuit board 2211, and a second electronic component 222 is fixed on the second sub-circuit board 2212. , the height of the first electronic component 222 is higher than the height of the second electronic component 222;

S2: Connect each first sub-circuit board 2211 and each second sub-circuit board 2212 through flexible connectors 2213 according to the positions of the first recess and the second recess to form a combined circuit board;

S3: Press the combined circuit board into the copying mold 231 through the mold top cover 232 installed in conjunction with the copying mold 231, and cover it with the copying mold 231;

S4: Fill the closed profiling mold 231 with the packaging medium 24 to encapsulate the combined circuit board to obtain a battery protection board module.

The above steps are explained in detail below.

As shown in Figure 10, in step S1, firstly set the copy mold 231 according to the circuit structure that needs to be set. Specifically, the first sub-circuit board 2211-the first flexible connector can be produced for the battery circuit board module. 2213-Second sub-circuit board 2212-First flexible connector 2213-The overall structure of the first sub-circuit board 2211, and then on each first sub-circuit board 2211 and second sub-circuit board 2212 through the pad 2215 or soldering Each electronic component 222 is spot welded, as shown in Figure 10, in order from left to right, the electronic component RLC and the electronic component IC are welded on the first first sub-circuit board 2211, and on the first second sub-circuit board 2211 The MOS tube is welded on the board 2212, and the nickel sheet 224 is welded on the back of the second sub-circuit board 2212. The electronic component IC and the electronic component RS are welded on the second first sub-circuit board 2211. On the second second sub-circuit board 2211, the MOS tube is welded. The electronic components MOS tube and RLC are welded on the circuit board 2212, and the nickel sheet 224 is welded on the back of the second sub-circuit board.

After that, step S2 is performed according to the sequence in Figure 11, that is, connecting the first flexible connector 2213 between the two adjacent sub-circuit boards, and welding the flexible connector 2213 on the rightmost side of the second sub-circuit board 2212. The flexible connector 2213 is coupled to the board-to-board connector for electrical connection with the device mainboard.

The profiling mold 231 includes a bottom mold and a mold top cover 232. The bottom mold forms recesses and protrusions according to the layout of the first sub-circuit board 2211 and the second sub-circuit board 2212. The recessed portion corresponds to the first sub-circuit board 2211 and is used to accommodate the first sub-circuit board 2211. The sunken first sub-circuit board 2211 has a convex part corresponding to the second sub-circuit board 2212. After that, the battery protection plate module is placed on the bottom mold of the mold, and the entire battery protection plate module is fixed through the mold top cover 232. At this time, the first flexible connector 2213 is bent due to force, the first sub-circuit board 2211 sinks into the depression of the bottom mold, and the second sub-circuit board 2212 does not sink due to the support of the protrusions, and then the copy mold 231 is The mold top cover 232 is closed and pressed tightly.

As shown in Figure 13, step S4 is finally performed. At this time, the insulating packaging medium 24 is injected into the mold cavity in the mold through the specific holes of the grinding tool. The insulating packaging medium 24 is injection molded to form the insulating packaging medium 24 in the above embodiment. . After the mold is removed, the battery protection plate module in the embodiment of the present application is formed.

This embodiment provides a method for manufacturing a battery protection board module. By first configuring the combined circuit of the first sub-circuit board 2211 and the second sub-circuit board 2212, the combined circuit is then pressed into the mold, and the mold top cover 232 is used to seal the combined circuit. The first sub-circuit board 2211 and the second sub-circuit board 2212 are fixed at different heights, and finally the injection molding packaging medium 24 is filled to fix the first sub-circuit board 2211, the second sub-circuit board 2212 and the flexible connectors 2213 connecting each sub-circuit board. After fixation, the mold and the mold top cover 232 are removed to obtain the battery protection plate module of the present application. The battery protection plate obtained by this method is thinner and does not protrude from the thickness of the battery. At the same time, the manufacturing method of this embodiment Simple, no complicated process is required, the battery protection plate module of the present application can be obtained by injection molding by simply closing the bottom mold and the top cover 232 of the mold. The process is simple, the production cost is low, the production speed is fast, and the structural stability is good. .

As shown in Figure 12, the mold top cover 232 is equipped with at least two elastic ejector pins 233 corresponding to the gaps of each first sub-circuit board 2211. The elastic ejector pins 233 can be pressed on the non-circuit traces of the electronic device or sub-circuit board. Line area is pressed by the elastic ejector pin 233. When the mold top cover 232 is closed, the elastic ejector pin 233 presses and compresses the first sub-circuit board 2211, causing the first sub-circuit board 2211 to sink. At this time, the elastic ejector pin 233 is in contact with the first sub-circuit board 2211. The board surface of the circuit board 2211 is in contact, that is, the above-mentioned step S3 specifically includes: pressing the mold top cover 232 down on the combined circuit, so that each elastic ejector pin 233 is inserted into the corresponding gap of the first sub-circuit board 2211 to form a Abut. In this embodiment, the elastic ejector pin 233 is used to press the first sub-circuit board 2211 to a lower height position, so that the first sub-circuit board 2211 sinks. The elastic ejector pin 233 has a certain elasticity and can protect the first sub-circuit board 2211 from the second sub-circuit board 2211. When a sub-circuit board 2211 is pressed down, circuit damage and other phenomena occur. In addition, the elastic ejector pin 233 in the copy mold 231 has a low cost, and the length can be replaced as needed, so that it can adapt to any battery protection plate structure and has high adaptability. Matching nature.

In some embodiments, the elastic ejector pin 233 can be set with a certain degree of freedom in the horizontal xy direction, that is, the elastic ejector pin 233 can swing in the horizontal direction. In this way, the spring-loaded ejector pin first contacts the veneer to ensure that the veneer After all the hard and soft boards are in close contact with the bottom mold, the upper mold is then pressed tightly to prevent the veneer from tightening or locking the length redundancy, which may lead to the failure of the printed board. The ejector pin can swing within a certain range in the xy direction to prevent the veneer from being When pressing down, the surface of the veneer will be scratched and damaged.

Furthermore, the head of the elastic ejector pin 233 can be made of a softer material. In this way, the elastic ejector pin 233 of the softer material can exert a certain pressing force on the first sub-circuit board 2211 when pressed, but it will not cause the first sub-circuit board 2211 to press. Excessive hardness will cause damage to the first sub-circuit board 2211, thereby helping to protect the single board surface of the first sub-circuit board 2211 from being scratched.

It can be seen that based on the above embodiments, the present application can also provide a mold device for making the battery protection plate module as described above. Please continue to refer to Figure 12. The mold device includes: a copying mold 231 and a mold. Top cover 232; wherein, the profiling mold 231 includes a first recess corresponding to the first sub-circuit board 2211 and a second recess corresponding to the second sub-circuit board 2212, the first recess is used for The first sub-circuit board 2211 is accommodated, the second recess is used to accommodate the second sub-circuit board 2212, and the bottom surface height of the first recess is lower than the bottom surface height of the second recess; The mold top cover 232 is used to cover the profiling mold 231 so that the combined circuit package forms the battery protection plate module. The mold device provided in this embodiment, on the one hand, provides a more portable manufacturing method for the battery protection plate. The battery protection plate produced by the mold is thinner and does not protrude the thickness of the battery. In this way, the battery protection plate module of the present application can be prepared by simply pressing the mold, thereby enabling mass production.

In some embodiments, in order to press the first sub-circuit board 2211 tightly, at least two elastic ejector pins 233 corresponding to the gaps of each first sub-circuit board 2211 are disposed in the mold top cover 232 . In this way, the elastic ejector pin 233 is used to press the first sub-circuit board 2211 to a lower height position, causing the first sub-circuit board 2211 to sink. The elastic ejector pin 233 has a certain elasticity and can protect the first sub-circuit board 2211 to avoid Circuit damage and other phenomena may occur during the pressing process of the first sub-circuit board 2211. In addition, the elastic ejector pin 233 has a low cost in the copy mold 231, and the length can be replaced as needed, so that it can be adapted to any battery protection plate structure and has a high Adaptability.

In some embodiments, in order to avoid scratching and damaging the first sub-circuit board 2211 by the elastic ejector pin 233, when the mold top cover 232 presses the copy mold 231, the elastic ejector pin 233 can swing in the horizontal direction. . In this way, the spring-loaded ejector pin first contacts the veneer to ensure that all the hard and soft boards of the veneer are in close contact with the bottom mold, and then the upper mold is pressed tightly to avoid tightening or locking the length of the veneer, resulting in printing. If the board production fails, the ejector pin can swing within a certain range in the xy direction to avoid scratching and damaging the surface of the veneer when the veneer is pressed down.

Furthermore, in order to further avoid damage to the first sub-circuit board 2211 by the elastic ejector pin 233, the head of the elastic ejector pin 233 can be made of a softer material. In this way, the elastic ejector pin 233 of a softer material can be pressed against the first sub-circuit board 2211 when pressed. The first sub-circuit board 2211 forms a certain pressing force, but does not cause damage to the first sub-circuit board 2211 due to excessive force, thereby protecting the single board surface of the first sub-circuit board 2211 from scratches.

Embodiments of the present application further provide a battery module, including a battery and a battery protection plate module as described above. The battery and the battery protection plate module are each disposed in a housing of an electronic device, and the battery protection plate module The plate module is within a height range defined by the battery thickness. Since the battery protection board module of the present application adopts the above-mentioned configuration of several first sub-circuit boards 2211 and second sub-circuit boards 2212 with different heights, the battery protection board module can be limited to the battery thickness range. Therefore, the overall battery module The thickness of the group is thinner than before, so I won’t go into details here.

This application uses specific embodiments to illustrate the principles and implementation methods of this application. The above description of the implementation methods is only used to help understand the method and its core idea of this application; at the same time, for those of ordinary skill in the field, based on this application The idea of the application may change in the specific implementation mode and application scope. In summary, the contents of this description should not be understood as limiting the application.

Claims (17)

1. A method for manufacturing a battery protection plate module, which is characterized by comprising: A plurality of first sub-circuit boards, a plurality of second sub-circuit boards and a profiling mold are provided, wherein the profiling mold includes a first recess corresponding to the first sub-circuit board and a first recess corresponding to the second sub-circuit board. Corresponding second depression, the first depression is used to accommodate the first sub-circuit board, the second depression is used to accommodate the second sub-circuit board, the bottom height of the first depression is lower than The height of the bottom surface of the second depression, the first electronic component is fixed on the first sub-circuit board, the second electronic component is fixed on the second sub-circuit board, the height of the first electronic component is higher than the second electronic component The height of the component; According to the positions of the first recess and the second recess, each first sub-circuit board and each second sub-circuit board are connected through flexible connectors to form a combined circuit board; Press the combined circuit board into the copying mold through the mold top cover installed in conjunction with the copying mold, and cover it with the copying mold; Fill the closed copy mold with a packaging medium to encapsulate the combined circuit board to obtain a battery protection board module; The mold top cover is equipped with at least two elastic ejector pins corresponding to the gaps of each first sub-circuit board. The combined circuit board is pressed into the profiling mold through the mold top cover installed in conjunction with the profiling mold. Molds, including: The mold top cover is pressed down on the combined circuit board, so that each elastic ejector pin is inserted into the corresponding gap of the first sub-circuit board to form abutment. 2. A battery protection panel module produced by the production method of claim 1, characterized in that it includes: a plurality of first sub-circuit boards and a plurality of second sub-circuit boards arranged alternately, and connecting adjacent third sub-circuit boards. A first flexible connector of a sub-circuit board and a second sub-circuit board, where a first electronic component is fixed on the first sub-circuit board, and a second electronic component is fixed on the second sub-circuit board; In the thickness direction of the battery, the height of the first electronic component is higher than the height of the second electronic component, and the height of the first sub-circuit board is lower than the height of the second sub-circuit board; The battery protection board module also includes: A plurality of electronic connectors for welding and fixing with the tabs of the battery, and each electronic connector is provided on a side surface of the second sub-circuit board facing away from the second electronic component; Wherein, the profiling mold for making the battery protection plate module includes a first recess corresponding to the first sub-circuit board and a second recess corresponding to the second sub-circuit board, and the profiling mold cover The closed mold top cover is equipped with at least two elastic ejector pins corresponding to the gaps of each first sub-circuit board. The battery protection board module presses down the mold top cover so that each elastic ejector pin is inserted into the corresponding first sub-circuit board. A contact is formed at the gap between one sub-circuit board. 3. The battery protection board module according to claim 2, wherein at least one second sub-circuit board is disposed between any two adjacent first sub-circuit boards. The board module also includes a second flexible connector connecting two adjacent second sub-circuit boards. 4. The battery protection board module according to claim 2, wherein the first sub-circuit boards and the second sub-circuit boards are arranged alternately. 5. The battery protection board module according to claim 3, wherein at least one first sub-circuit board is disposed between any two adjacent second sub-circuit boards, and the battery protection board module The board module also includes a third flexible connector connecting two adjacent first sub-circuit boards. 6. The battery protection board module according to claim 3, wherein a plurality of first electronic components are fixed on each first sub-circuit board, and/or a plurality of first electronic components are fixed on each second sub-circuit board. Second electronic component. 7. The battery protection board module according to claim 2, wherein the flexible connector is a flexible circuit board. 8. The battery protection board module according to claim 2, wherein the first sub-circuit board and/or the second sub-circuit board is a flexible circuit board or a rigid circuit board. 9. The battery protection board module according to claim 2, wherein the bottom surface of the electronic connector is flush with or not flush with the bottom surface of the first sub-circuit board. 10. The battery protection panel module according to claim 2, characterized in that the battery protection panel module further includes: Board-to-board connector, connected to the nearest sub-circuit board through a flexible circuit board. 11. The battery protection panel module according to claim 2, wherein each flexible connector is of equal or unequal length. 12. The battery protection board module according to claim 2, characterized in that multiple electronic components are provided on each sub-circuit board, and the spacing between two adjacent electronic components on the same sub-circuit board is the same or different. 13. A mold device used in the manufacturing method of a battery protection plate module according to claim 2, characterized in that it includes: a copy mold and a mold top cover; wherein, The profiling mold includes a first depression corresponding to the first sub-circuit board and a second depression corresponding to the second sub-circuit board. The first depression is used to accommodate the first sub-circuit board. , the second depression is used to accommodate the second sub-circuit board, and the bottom height of the first depression is lower than the bottom height of the second depression; The mold top cover is used to cover the profiling mold so that the combined circuit board is packaged to form the battery protection board module. 14. The mold device according to claim 13, wherein at least two elastic ejector pins corresponding to the gaps of each first sub-circuit board are disposed in the mold top cover. 15. The mold device according to claim 14, wherein when the mold top cover presses the profiling mold, the elastic ejector pin can swing in the horizontal direction. 16. A battery module, characterized in that it includes a battery and the battery protection plate module according to any one of claims 2 to 12, the battery and the battery protection plate module are respectively arranged on an electronic device. Inside the casing, the battery protection plate module is within a height range limited by the thickness of the battery. 17. An electronic device, characterized in that it includes Electronic equipment casings; At least one functional device module provided in the electronic equipment housing and the battery module as claimed in claim 16; wherein, The tabs of the battery are coupled to the voltage input terminals of each functional device module.