CN116896824B

CN116896824B - Battery protection plate module, method and device, battery module and electronic equipment

Info

Publication number: CN116896824B
Application number: CN202311143118.5A
Authority: CN
Inventors: 黄秋育
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2023-09-06
Filing date: 2023-09-06
Publication date: 2023-12-05
Anticipated expiration: 2043-09-06
Also published as: CN116896824A

Abstract

The embodiment of the application provides a battery protection board module, a method, a device, a battery module and electronic equipment, wherein the battery protection board is divided into a plurality of sub boards and flexible connecting pieces from a whole hard board, the sub boards are arranged at different heights, electronic elements with higher thickness are fixed on a relatively low-position sub circuit board, electronic elements with thinner thickness are fixed on the relatively high-position sub circuit board, so that the thickness of a battery is not limited by the thickness of the thickest electronic element any more, and compared with the thickness of the battery which is higher than the current battery protection board, the height of the battery protection board can be limited within the thickness of the battery due to the fact that the sub circuit board is arranged at the low position, and the whole thickness of the product is thinned.

Description

Battery protection plate module, method and device, battery module and electronic equipment

Technical Field

The application relates to the technical field of display, in particular to a battery protection plate module, a method and a device, a battery module and electronic equipment.

Background

Along with the continuous trend of mobile terminal equipment such as cell-phone and wearing electronic product towards frivolous direction development, battery protection shield thickness and reliability become the key factor that restricts the complete machine to continue thinning gradually, in the current battery protection shield module design, because the battery core technology reason, battery tab has the step of certain height from the battery back, this step, tab connecting piece bending thickness and battery protection shield module in the height of thickest electronic component influences the whole height of stacking of battery jointly, consequently restricted the battery to continue thinning, simultaneously because thickest electronic component's height is too high, lead to battery protection shield's height can exceed battery thickness, thereby lead to product overall thickness to increase.

Disclosure of Invention

In order to solve the problem that in the current battery protection board module design, no matter how the thickness of a battery is limited by the height of a step, the bending thickness of a tab connecting piece and the thickness of the thickest electronic component, the battery is limited to be thinned continuously, and meanwhile, the height of a battery protection board is higher than the thickness of the battery, so that the whole thickness of a product is increased.

An embodiment of a first aspect of the present application provides a battery protection plate module, including: the circuit board comprises a plurality of first sub-circuit boards and a plurality of second sub-circuit boards which are alternately arranged, and a first flexible connecting piece for connecting the adjacent first sub-circuit boards and second sub-circuit boards, wherein a first electronic element is fixed on the first sub-circuit board, and a second electronic element is fixed on the second sub-circuit board;

In the thickness direction of the battery, the height of the first electronic element is higher than that of the second electronic element, and the height of the first sub-circuit board is lower than that of the second sub-circuit board.

In the embodiment of the application, the current battery protection board is creatively replaced by the integral hard board by adopting the plurality of first sub-circuit boards and the plurality of second sub-circuit boards, the sub-circuit boards are connected through the flexible connecting piece, the first sub-circuit board is lower than the second sub-circuit board in height, namely, the first sub-circuit board is sunk during manufacturing, and the second sub-circuit board keeps unchanged in position, so that the electronic components with higher heights can be distributed on the first sub-circuit board, the phenomenon that the battery protection board is higher than the battery thickness due to the fact that the higher electronic components and other electronic components are arranged on the same circuit board is avoided, in addition, the battery thickness can be continuously reduced due to the sunk higher electronic components, and the limitation of the current battery thickness is broken.

In an alternative embodiment, at least one second sub-circuit board is configured between any two adjacent first sub-circuit boards, and the battery protection board module further includes a second flexible connector connecting the two adjacent second sub-circuit boards. The power consumption of the electronic components with higher heights is relatively larger, so that the electronic components with higher heights can be dispersed on the whole battery protection plate, the distances between the two electronic components with higher heights are not too close, the heat dissipation of the battery protection plate is uniform, and the situation that the performance is reduced due to local overheating is avoided.

Specifically, 1, 2, 3 or more than 3 second sub-circuit boards can be spaced between any two adjacent first sub-circuit boards, the electronic components fixed on the second sub-circuit boards and having lower heights are lower in heat dissipation, and more heat dissipation spaces can be provided for the first sub-circuit boards due to lower heights, so that the heat conduction of the whole circuit board structure is facilitated.

In an alternative embodiment, the first and second sub-circuit boards are alternately arranged. Based on the heat dissipation characteristic, the first sub-circuit board and the second sub-circuit board are alternately arranged, and the two sides of each higher electronic element are lower electronic elements, so that the heat dissipation area is enlarged, and the heat dissipation is more uniform while the heat conduction of the whole circuit board structure is facilitated.

In an alternative embodiment, at least one first sub-circuit board is configured between any two adjacent second sub-circuit boards, and the battery protection board module further includes a third flexible connector connecting the two adjacent first sub-circuit boards. Although the first sub-circuit boards are arranged separately, it is understood that two or at least three first sub-circuit boards can be arranged continuously, and then the second sub-circuit boards are separated, so that the embodiment is more used for battery protection boards with more higher electronic components, and in addition, heat dissipation patches such as graphene patches can be attached to dense areas of the first sub-circuit boards for better heat dissipation.

That is, the above embodiment can be known that the first sub-circuit board and the second sub-circuit board are preferably arranged at intervals, but the first sub-circuit board may also have at least two continuous arrangements, and the second sub-circuit board may also have at least two continuous arrangements, which is not limited in this aspect of the application.

In an alternative embodiment, a plurality of first electronic components are mounted on each first sub-circuit board and/or a plurality of second electronic components are mounted on each second sub-circuit board. That is, the present application does not limit the number of electronic components fixed on the first sub-circuit board and the second sub-circuit board, in general, in order to solve the process, more electronic components may be fixed on the same sub-circuit board, but the heat dissipation problem of the electronic components needs to be considered during the manufacture, so that it is generally preferred that the number of electronic components on each sub-circuit board is one or two, thereby simplifying the process and simultaneously providing heat dissipation guarantee.

In an alternative embodiment, the flexible connection unit is a flexible circuit board. The flexible connecting piece needs to have a circuit wiring function, namely, needs to ensure signal input and signal output of electronic elements on the sub-circuit board, and is thinner on one hand, and on the other hand, any desired circuit structure or circuit connection relation can be printed on the flexible circuit board, so that the first sub-circuit board and the second sub-circuit board can be connected to form a complete circuit board.

Of course, other materials may be used to make the flexible connector of the present application, as an example, a thinner wire may be used to connect the first sub-circuit board and the second sub-circuit board, and in this embodiment, in order to avoid voltage interference between the wires, an insulating material may be coated around the wires.

In an alternative embodiment, the first sub-circuit board and/or the second sub-circuit board is a flexible circuit board or a rigid circuit board. It should be understood that the first sub-circuit board and the second sub-circuit board of the present application are each independently a flexible circuit board or a rigid circuit board, that is, the first sub-circuit board may be a flexible circuit board or a rigid circuit board, and the second sub-circuit board may also be a flexible circuit board or a rigid circuit board.

In a preferred embodiment, however, if the height of the highest electronic component has approached the thickness of the battery, the first sub-circuit board under the highest electronic component may be particularly provided as a flexible circuit board, while the other first sub-circuit boards are provided as rigid circuit boards, taking into account that the thickness of the rigid circuit board is higher than the flexible circuit board.

That is, each first sub-circuit board and each second sub-circuit board in the present application are independent, and each first sub-circuit board and each second sub-circuit board can be independently set as a flexible or hard circuit board, which will not be described in detail.

In an alternative embodiment, the battery protection plate module further includes: and the plurality of electronic connectors are used for being welded and fixed with the lugs of the battery, and each electronic connector is arranged on one side surface of the second sub-circuit board, which is away from the second electronic element. In this embodiment, the electronic connection piece may be a nickel piece, where the nickel piece is welded to the tab of the battery and is fixed on the back of the battery protection board, and because the electronic connection piece has a certain thickness, it is preferable that the electronic connection piece is fixed on the back of the second sub-circuit board, so that because the first sub-circuit board sinks, a certain space is formed below the second sub-circuit board, and the electronic connection piece is placed in the space, so that the space is reasonably utilized, and the thickness of the battery can be made thinner.

In alternative embodiments, the bottom surface of the electronic connection is flush or not flush with the bottom surface of the first sub-circuit board. In this way, the bottom of the first sub-circuit board and the bottom of the electronic connector are both arranged at the bottommost part in the allowable range, so that the maximum margin is reserved for the height of the electronic component, and the electronic component with higher thickness can be adapted.

In an alternative embodiment, the battery protection plate module further includes: the board-to-board connector is connected with the nearest sub-circuit board through the flexible circuit board. In the present embodiment, the board-to-board connector is flush with the second sub-circuit board, so that the board-to-board connector and the second sub-circuit board can be connected by adopting a flat circuit board, that is, a flexible circuit board and a hard circuit board, and in the preferred embodiment, the sub-circuit board closest to the board-to-board connector can be the first sub-circuit board and the second sub-circuit board, therefore, the board-to-board connector is preferably connected with the flexible circuit board during manufacturing, and thus, the board-to-board connector can be directly connected with the first sub-circuit board or the second sub-circuit board, and when the board-to-board connector is connected with the hard circuit board, the board-to-board connector needs to adaptively adjust the position corresponding to the height of the closest sub-circuit board, which is not described herein.

In an alternative embodiment, the battery protection plate module further includes: the third electronic component is fixed on the third sub-circuit board, the height of the third sub-circuit board is higher than that of the first sub-circuit board, and the height of the third electronic component is lower than that of the second electronic component. The third sub-circuit board is further provided based on a similar concept, that is, in the embodiment of the present application, three sub-circuit boards with different heights may be actually set according to needs, in a more specific embodiment, each sub-circuit board is located at a different height, and correspondingly, the heights of the electronic components on each sub-circuit board are different, which is not limited in the present application, and obviously, the embodiment may adapt to the height of the optimal sub-circuit board for each electronic component, thereby being beneficial to reducing the injection molding amount in the subsequent injection molding.

In an alternative embodiment, at least one third sub-circuit board is inserted between every two adjacent first sub-circuit boards and second sub-circuit boards, or the first sub-circuit boards, the second sub-circuit boards and the third sub-circuit boards are sequentially arranged in sequence. The third sub-circuit board can be arranged between the first sub-circuit board and the second sub-circuit board in the same way, so that heat dissipation is facilitated, the first sub-circuit board, the second sub-circuit board and the third sub-circuit board can be sequentially arranged, the application is not limited in this respect, and further, the application can be arranged at will based on requirements.

In some embodiments, at least one first sub-circuit board is disposed between any two adjacent second sub-circuit boards, and the battery protection board module further includes a third flexible connector connecting the two adjacent first sub-circuit boards. Although the first sub-circuit boards are arranged separately, it is understood that two or at least three first sub-circuit boards can be arranged continuously, and then the second sub-circuit boards are separated, so that the embodiment is more used for battery protection boards with more higher electronic components, and in addition, heat dissipation patches such as graphene patches can be attached to dense areas of the first sub-circuit boards for better heat dissipation.

As can be seen from the above embodiments, the degrees of freedom of the placement of the sub-circuit boards and the placement of the electronic components of the present application are far higher than those of the existing monolithic hard boards, i.e. the present application does not limit the number of electronic components fixed on the first sub-circuit board and the second sub-circuit board, in general, in order to solve the process, more electronic components can be fixed on the same sub-circuit board, but in order to solve the process, the heat dissipation problem of the electronic components needs to be considered during the manufacture, therefore, in general, it is preferable that the number of electronic components on each sub-circuit board is one or two, so that on one hand, the process is simplified and at the same time, the heat dissipation guarantee is provided.

In some embodiments, the flexible connector is a flexible circuit board. The flexible connecting piece needs to have a circuit wiring function, namely, needs to ensure signal input and signal output of electronic elements on the sub-circuit board, and is thinner on one hand, and on the other hand, any desired circuit structure or circuit connection relation can be printed on the flexible circuit board, so that the first sub-circuit board and the second sub-circuit board can be connected to form a complete circuit board.

In alternative embodiments, each flexible connection unit is of equal or unequal length. The equal length of the flexible connection parts indicates equal spacing between the sub-circuit boards, and the unequal length of the flexible connection parts indicates unequal spacing between the sub-circuit boards.

In an alternative embodiment, a plurality of electronic components are disposed on each sub-circuit board, and the spacing between two adjacent electronic components on the same sub-circuit board is the same or different. The distance between each two electronic components can be adjusted according to heat dissipation, so that heat dissipation distribution can be more uniform.

An embodiment of a second aspect of the present application provides a method for manufacturing a battery protection plate module, including:

providing a plurality of first sub-circuit boards, a plurality of second sub-circuit boards and a profiling mold, wherein the profiling mold comprises a first recess corresponding to the first sub-circuit boards and a second recess corresponding to the second sub-circuit boards, the first recess is used for accommodating the first sub-circuit boards, the second recess is used for accommodating the second sub-circuit boards, the bottom surface of the first recess is lower than the bottom surface of the second recess, a first electronic element is fixed on the first sub-circuit boards, a second electronic element is fixed on the second sub-circuit boards, and the height of the first electronic element is higher than that of the second electronic element;

according to the positions of the first concave and the second concave, connecting each first sub-circuit board and each second sub-circuit board through a flexible connecting piece to form a combined circuit board;

the combined circuit board is pressed into the profiling die through a die top cover which is matched with the profiling die, and is covered with the profiling die;

and filling a packaging medium in the covered profiling mold to package the combined circuit board, thereby obtaining the battery protection board module.

The battery protection board module can be obtained by firstly configuring the combined circuit of the first sub-circuit board and the second sub-circuit board, then pressing the combined circuit into a die, fixing the first sub-circuit board and the second sub-circuit board at different heights by using a die top cover, finally filling injection molding packaging media to fix the first sub-circuit board, the second sub-circuit board and flexible connecting pieces for connecting the sub-circuit boards, and removing the die and the die top cover after fixing.

In an alternative embodiment, at least two elastic ejector pins corresponding to the gaps of each first sub-circuit board are configured in the die top cover, and the combined circuit board is pressed into the profiling die through the die top cover mounted in a matched manner with the profiling die, and the die top cover comprises: and pressing down the die top cover on the combined circuit to enable each elastic thimble to be inserted into a gap of a corresponding first sub-circuit board to form abutting connection. According to the embodiment, the elastic ejector pin is used for pressing the first sub-circuit board to a lower height position, so that the first sub-circuit board is sunk, the elastic ejector pin has certain elasticity, the first sub-circuit board can be protected, circuit damage and other phenomena in the pressing process of the first sub-circuit board are avoided, in addition, the cost of the elastic ejector pin in the profiling die is lower, the length of the elastic ejector pin can be replaced according to needs, and therefore any battery protection board structure can be adapted, and the battery protection board structure has higher suitability.

An embodiment of the third aspect of the present application provides a mold apparatus for manufacturing the battery protection plate module as described above, comprising: profiling mold and mold top cover; the profiling mold comprises a first recess corresponding to the first sub-circuit board and a second recess corresponding to the second sub-circuit board, wherein the first recess is used for accommodating the first sub-circuit board, the second recess is used for accommodating the second sub-circuit board, and the bottom surface height of the first recess is lower than the bottom surface height of the second recess; the die top cover is used for being covered with the profiling die, so that the combined circuit is packaged to form the battery protection board module.

In the mold device provided by the embodiment, on one hand, the mold provides a more portable manufacturing mode for manufacturing the battery protection plate, and the battery protection plate manufactured by the mold is thinner and does not protrude out of the battery thickness.

In an alternative embodiment, at least two elastic ejector pins corresponding to the gaps of each first sub-circuit board are arranged in the top cover of the die. In this way, the elastic thimble is adopted to press the first sub-circuit board to a lower height position, so that the first sub-circuit board is sunk, the elastic thimble has certain elasticity, the first sub-circuit board can be protected, circuit damage and other phenomena in the pressing process of the first sub-circuit board are avoided, in addition, the cost of the elastic thimble in the profiling die is lower, the length of the elastic thimble can be replaced according to the requirement, and therefore any battery protection board structure can be adapted, and the elastic thimble has higher adaptability.

In an alternative embodiment, the elastic ejector pin is swingable in a horizontal direction when the die top cover presses the profiling die. Therefore, the thimble with the spring is firstly contacted with the single plate, the hard plate and the soft plate of the single plate are ensured to be tightly attached to the bottom die, then the upper die is pressed, the failure of the printed board caused by the redundancy of the tightening or locking length of the single plate is avoided, the thimble can swing in a certain range in the xy direction, and the damage to the surface of the single plate caused by scratch when the single plate is pressed down is avoided.

An embodiment of a fourth aspect of the present application provides a battery module, including a battery and a battery protection board module as described above, where the battery and the battery protection board module are respectively disposed in a housing of an electronic device, and the battery protection board module is located in a height range defined by a thickness of the battery. The battery protection board module adopts the modes of different heights of the first sub-circuit board and the second sub-circuit board, so that the battery protection board module can be limited within the range of the thickness of the battery, and the thickness of the whole battery module is thinner than that of the current battery module.

An embodiment of a fifth aspect of the present application provides an electronic device, including an electronic device housing; at least one functional device module provided in the electronic equipment case, and the battery module as described above; the lugs of the battery are coupled with the voltage input end of each functional device module. In the electronic device provided in this embodiment, the circuit protection board in the battery module does not exceed the range defined by the battery, and meanwhile, the thickness of the battery is not limited by the thickness of the thickest electronic element, so that the thickness of the electronic device can be made thinner, and the thickness limitation of the current ultrathin electronic device is broken.

Drawings

Fig. 1 is a perspective view of an electronic device according to an embodiment of the present application;

FIG. 2 is an exploded view of the electronic device shown in FIG. 1;

fig. 3 is a perspective view of a battery provided in some embodiments of the present application;

fig. 4 is an exploded view of the battery according to fig. 3;

FIG. 5 is a schematic view of a partial cross-sectional structure at line A1-A1 of the battery shown in FIG. 3;

fig. 6 is a partial schematic structural view of the battery protection plate according to fig. 5;

FIG. 7 is a schematic diagram illustrating a structure of a conventional battery protection plate module according to an exemplary technology;

fig. 8 is a schematic structural view of a battery protection plate module according to an embodiment of the present application;

fig. 9 is a schematic flow chart of a method for manufacturing a battery protection board module according to an embodiment of the present application;

fig. 10 is a schematic structural diagram of a battery protection plate module at each manufacturing stage according to an embodiment of the present application;

FIG. 11 is a second schematic view of a battery protection plate module according to an embodiment of the present application at each stage of manufacture;

fig. 12 is a third schematic structural view of the battery protection plate module according to the embodiment of the present application at each manufacturing stage;

fig. 13 is a schematic structural view of a battery protection plate module according to an embodiment of the present application at each manufacturing stage;

Reference numerals: 10-shell, 100-electronic equipment, 20-battery, 21-battery core, 22-battery protection board, 30-equipment main board, 40-equipment auxiliary board, 50-display screen, 11-front cover board, 12-frame, 13-back cover, 15-middle board, D-first connector, E-second connector, 2121-tab, 212-bare battery core, 211-battery shell, 221-hard circuit board, 222-electronic element, 223-board-to-board connection module, 2231-second flexible circuit board, 2232-board-to-board connector, 224-nickel sheet, 2234-fixing part, 2235-connection part, F1-bearing surface, F2-connection surface, 2211-first sub-circuit board, 2212-second sub-circuit board, 2213-flexible connection part, 2215-bonding pad; l1-battery thickness, L2-current protection board thickness, L3-battery protection board thickness, 231-profiling mold, 232-mold top cover, 233-elastic thimble and 24-packaging medium.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application more apparent, the specific technical solutions of the present application will be described in further detail with reference to the accompanying drawings in the embodiments of the present application. The following embodiments are illustrative of the present application, but are not intended to limit the scope of the application.

The application provides an electronic device. In particular, the electronic device may be a portable electronic device or other suitable electronic device. For example, the electronic device may be an electronic device such as a cell phone, a tablet (tablet personal computer), a notebook, a laptop (laptop computer), a personal digital assistant (personal digital assistant, PDA), and a wearable device (e.g., a wristwatch or glasses).

Referring to fig. 1 and fig. 2, fig. 1 is a perspective view of an electronic device 100 according to some embodiments of the present application, and fig. 2 is an exploded schematic view of the electronic device 100 shown in fig. 1. In this embodiment, the electronic device 100 is a mobile phone. The electronic device 100 includes a housing 10, a device main board 30, a device sub-board 40, a display screen 50, and a battery 20.

It should be noted that fig. 1 and 2 and the related drawings below only schematically illustrate some components included in the electronic device 100, and the actual shapes, the actual sizes, the actual positions, and the actual configurations of the components are not limited by fig. 1 and 2 and the drawings below.

For convenience of description of the embodiments below, an XYZ coordinate system is established for the electronic device 100. Specifically, the width direction of the electronic device 100 is defined as the X-axis direction (i.e., the second direction), the length direction (i.e., the first direction) of the electronic device 100 is defined as the Y-axis direction, and the thickness direction of the electronic device 100 is defined as the Z-axis direction. It is to be understood that the coordinate system of the electronic device 100 may be flexibly set according to actual needs, which is not specifically limited herein.

The housing 10 serves to protect the internal circuit elements of the electronic device 100. With continued reference to fig. 2, the housing 10 includes a front cover 11, a rim 12, and a rear cover 13.

Specifically, the front cover 11 has a flat plate shape. The front cover 11 is a light-transmitting member. Materials for the front cover 11 include, but are not limited to, glass, plastic, and ceramic.

The rear cover 13 is laminated with the front cover 11 and is disposed at a distance. The rear cover 13 has a flat plate shape. The material of the rear cover 13 includes, but is not limited to, metal and plastic.

The rim 12 is located between the front cover 11 and the rear cover 13, and is disposed around the edges of the front cover 11 and the rear cover 13. Illustratively, the bezel 12 may be fixedly attached to the back cover 13 by adhesive. The frame 12 and the rear cover 13 may be integrally formed, i.e., the frame 12 and the rear cover 13 are integrally formed. The front cover 11 is fixed to the rim 12. In some embodiments, the front cover 11 may be fixed to the bezel 12 by gluing. The material of the frame 12 includes, but is not limited to, metal and plastic.

The front cover 11, the rear cover 13, and the bezel 12 enclose an internal accommodating space of the electronic device 100. The internal accommodation space accommodates the display 50, the device main board 30, the device sub-board 40, and the battery 20.

The display screen 50 is located between the front cover 11 and the rear cover 13, and is fixed to the front cover 11. The display 50 is illustratively glued to the front cover 11. The display screen 50 is used to display images, videos, and the like.

The device motherboard 30 is used for integrating control chips. Illustratively, the device motherboard 30 may be secured to the display screen by threaded connection, snap-fit, or the like. Specifically, the device main board 30 may be fixed to a surface of the display screen 50 facing the rear cover 13. In other embodiments, referring to fig. 2, the electronic device 100 further includes a midplane 15. The middle plate 15 is fixed to the inner surface of the frame 12 for one circle and is located between the display 50 and the rear cover 13. Illustratively, midplane 15 may be secured to frame 12 by welding, clamping, or gluing. Middle plate 15 may also be integrally formed with frame 12. The middle plate 15 serves as a structural "skeleton" of the electronic device 100, and the device main board 30 may be fixed to a side surface of the middle plate 15 facing the rear cover 13 by screwing, clamping, welding, or the like.

The control chip may be, for example, an application processor (application processor, AP), double data rate synchronous dynamic random access memory (DDR), universal memory (universal flashstorage, UFS), etc. In some embodiments, the device motherboard 30 is electrically connected to the display 50, and the device motherboard 30 is used to control the display 50 to display images or videos.

The device sub-board 40 is used for integrating electronic components such as an antenna (e.g., a 5G antenna) rf front end, a universal serial bus (universalserial bus, USB) device, and a vibrator. The device sub-board 40 is arranged in the Y-axis direction with the device main board 30. The device sub-plate 40 may be fixed to a surface of the middle plate 15 facing the rear cover 13. Specifically, the auxiliary device board 40 may be fixed to the surface of the middle board 15 facing the rear cover 13 by screwing, clamping, gluing, welding, or the like. In other examples, when the electronic device 100 does not include the midplane 15, the device sub-panel 40 may also be secured to the surface of the display screen 50 facing the rear cover 13.

The device sub-board 40 is electrically connected to the device main board 30 through a connection structure (not shown) to realize data and signal transmission between the device sub-board 40 and the device main board 30. Of course, it will be appreciated that in other examples, the device motherboard 30 and the device sub-board 40 may also be integrated.

With continued reference to fig. 2, a battery compartment a is disposed in the housing 10. The battery compartment a is for accommodating the battery 20. The battery compartment a is located between the device main board 30 and the device sub-board 40. Specifically, the battery compartment a is a groove provided in the surface of the middle plate 15 facing the rear cover 13. In still other embodiments, when midplane 15 is not disposed within electronic device 100, display 50 of FIG. 2 is employed to form the bottom wall of battery compartment a, and device motherboard 30, device motherboard 40, and bezel 12 form the side walls of battery compartment a. The present application is not particularly limited herein.

The battery 20 is installed in the battery compartment a, and the battery 20 is used to supply power to the display 50, the device main board 30, and the device sub-board 40 in the electronic device 100.

With continued reference to fig. 2, and in conjunction with fig. 3, fig. 3 is a perspective view of a battery 20 according to some embodiments of the present application. The battery 20 includes a battery cell 21 and a battery protection plate 22 electrically connected to the battery cell 21.

It is to be understood that fig. 3 and the following related drawings only schematically illustrate some of the components comprised by the battery 20, and the actual shape, actual size, actual position and actual configuration of these components are not limited by fig. 3 and the following drawings.

Referring to fig. 4, fig. 4 is an exploded view of the battery 20 according to fig. 3. The cell 21 includes a cell housing 211 and a bare cell 212.

The cell housing 211 is used to encapsulate and protect the bare cell 212. The cell housing 211 includes, but is not limited to, a steel can and an aluminum plastic film. The aluminum plastic film, also called as aluminum plastic packaging film, at least comprises three layers of materials, wherein the middle layer is an aluminum layer, and plays a role in isolating moisture. The outer layer is nylon (nylon) adhesive layer, which has the function of preventing air, especially oxygen, from penetrating. The inner layer is a polypropylene (PP) layer, which seals and prevents the electrolyte from corroding the aluminum layer.

The cell housing 211 encloses an electrolyte. The bare cell 212 is located within the cell housing 211 and immersed in the electrolyte. Electrolyte is present at each void of the bare cell 212 inside the cell housing 211 and serves as a carrier for transporting lithium ions within the battery 20. The electrolyte is generally prepared from high-purity organic solvent, electrolyte lithium salt, necessary additives and other raw materials under certain conditions and in a certain proportion.

The bare cell 212 generally includes a positive pole piece, a negative pole piece, and a separator. The positive electrode plate and the negative electrode plate both comprise a current collector and electrode materials coated on the current collector. The current collector of the positive electrode sheet is typically aluminum foil. The current collector of the negative electrode tab is typically copper foil. The diaphragm, also called an isolating film, is disposed between the positive electrode plate and the negative electrode plate, and is used for separating the positive electrode plate and the negative electrode plate of the bare cell 212, so as to prevent the two plates from directly contacting to generate a short circuit. The material of the separator is typically a polyolefin porous membrane.

To facilitate electrical connection of the cell 21 into a circuit, two tabs 2121 are provided on the bare cell 212. The tab 2121 is used for extracting an electrode of the bare cell 212 to the outside of the cell case 211. Specifically, the tab 2121 for leading out the positive electrode of the bare cell 212 is a positive electrode tab, and the tab 2121 for leading out the negative electrode of the bare cell 212 is a negative electrode tab. The positive electrode tab can be connected to the current collector of the positive electrode plate in the bare cell in a welding mode, and can also be formed by directly extending the current collector of the positive electrode plate. Similarly, the negative electrode tab can be connected to the current collector of the negative electrode plate of the bare cell 212 in a welding manner, or can be formed by directly extending the current collector of the negative electrode plate. The positive electrode tab is typically an aluminum material. The negative electrode tab is typically a nickel material or a copper nickel (ni—cu) plated material. In order to avoid short circuit between the tab 2121 and the metal (such as an aluminum layer in an aluminum plastic film) in the battery cell housing 211, a tab adhesive is generally coated at a portion of the tab 2121 penetrating the battery cell housing 211 to perform an insulating function.

The battery protection plate 22 is provided outside the battery cell case 211 and is electrically connected to the tab 2121 of the battery cell 21. The battery protection plate 22 is provided with a connector. The connector can be inserted into the connector interface on the device main board 30 described above, thereby enabling the battery protection board 22 to be electrically connected with the device main board 30. Battery protection plate 22 may be used to provide overcharge protection and short circuit protection. When the current and voltage in the battery cell 21 are too high or too low, the battery protection plate 22 may be electrically disconnected from the device main board 30. Therefore, the battery protection plate 22 connects the device main board 30 and the battery cell 21, and thus, problems such as overvoltage, overcharge, overcurrent, overdischarge, and the like of the battery 20 can be prevented.

Specifically, two connectors, namely, a first connector D and a second connector E, are provided in the battery protection plate 22. Illustratively, the first connector D may be electrically connected to both the positive voltage terminal and the negative voltage terminal in the device motherboard 30 through a connector interface on the device motherboard 30 to form an electrical signal loop; the second connector E may be electrically connected to both the positive voltage terminal and the negative voltage terminal in the device motherboard 30 through another connector interface on the device motherboard 30 to form an electrical signal loop. This is advantageous in improving the charge/discharge efficiency of the battery 20. Also for example, the first connector D may be electrically connected to the positive voltage terminal in the device motherboard 30 through one connector interface on the device motherboard 30, and the second connector E may be electrically connected to the negative voltage terminal in the device motherboard 30 through another connector interface on the device motherboard 30 to form an electrical signal loop. In other examples, when battery protection plate 22 assembly includes a connector, the connector may be electrically connected to both the positive and negative voltage terminals in device motherboard 30 through a connector interface on device motherboard 30 to form an electrical signal loop.

On this basis, in order to facilitate the electrical connection of the battery protection plate 22 with the device motherboard 30, the battery protection plate 22 is located at one end of the battery cell 21 adjacent to the device motherboard.

In order to facilitate the thin design of the electronic device 100, the thickness direction of the battery protection plate 22 and the thickness direction of the battery 20 coincide with the thickness direction (i.e., Z-axis direction) of the electronic device 100.

Referring to fig. 5, 6 and 7, fig. 5 is a schematic view of a partial cross-sectional structure of the battery 20 at line A1-A1 according to fig. 3, fig. 6 is a schematic view of a partial structure of the battery protection plate 22 according to fig. 5, fig. 7 is a schematic view of a layer structure of the battery protection plate 22 according to fig. 5, and the battery protection plate 22 includes a monolithic hard circuit board 221 and an electronic component 222 fixed on the hard circuit board 221.

As shown in fig. 7, the hard circuit board 221 has a bearing surface F1 and a connection surface F2 facing each other in the thickness direction thereof (i.e., the Z-axis direction). Specifically, the hard circuit board 221 is a printed circuit board (printed circuit board, PCB). The carrying surface F1 may be provided with a plurality of electronic components 222.

The board-to-board connection module 223 is fixedly connected to the hard circuit board 221, and both are electrically connected. The battery protection board 22 is electrically connected to the device main board 30 via the board-to-board connection module 223. Specifically, with continued reference to fig. 5 and 6, the board-to-board connection module 223 includes a fixing portion 2234 and two connection portions 2235. The fixing portion 2234 is stacked on the side facing the connection surface F2 of the hard circuit board 221, and is fixed to the connection surface F2. The board-to-board connection module 223 is fixed to the tab 2121 of the cell 21 by the fixing portion 2234, and is electrically connected to the tab 2121. For example, with continued reference to fig. 5, two nickel plates 224, respectively, are disposed on the surface of the fixing portion 2234 facing away from the hard circuit board 221. The positive electrode nickel sheet is welded with the positive electrode tab of the battery core 21. The negative electrode nickel sheet is welded with the negative electrode tab of the cell 21.

The two connection portions 2235 are connected to both ends of the fixing portion 2234 in the longitudinal direction (i.e., the X-axis direction), respectively. The two connection portions 2235 are bent around the side of the hard circuit board 221 to the side facing the bearing surface F1. One of the connection portions 2235 is provided with the first connector D, and the other connection portion 2235 is provided with the second connector E.

Not shown in fig. 7 is that the battery tab has a 0.8-1.2mm step from the back of the battery, and the nickel plate bending thickness is about 0.45mm, and the total thickness of 1.25-1.65mm cannot be used for arranging the device of the battery protection plate, which affects the overall stacking height of the battery.

Meanwhile, referring to fig. 5 and 7, in the battery 20, in order to prevent collision between the electronic component 222 on the hard circuit board 221 and other structures, damage to the electronic component 222 is caused. A certain safety distance needs to be reserved between the electronic component 222 and the edge of the hard circuit board 221, so that the distance between the orthographic projection of the electronic component 222 on the bearing surface F1 and the edge of the hard circuit board 221 is generally larger, which makes the overall circumferential dimension of the battery protection board 22 larger. Referring to fig. 7, the battery protection plate 22 further includes: encapsulation medium 24. The encapsulation medium 24 encapsulates the electronic component 222 on the carrying surface F1. In this way, the encapsulation medium 24 can be used to protect the electronic component 222 on the hard circuit board 221, so that there is no need to reserve too much safety distance between the electronic component 222 and the edge of the hard circuit board 221, which is beneficial to reducing the distance between the orthographic projection of the electronic component 222 on the bearing surface F1 and the edge of the hard circuit board 221, further is beneficial to reducing the circumferential dimension of the battery protection board 22, and optimizing the structural layout inside the electronic device 100.

Although it may be advantageous to reduce the circumferential dimension of battery protection plate 22. However, on the one hand, the thickness of the entire battery protection plate 22 increases due to the provision of the encapsulation medium 24; on the other hand, the stacked arrangement of the fixing portion 2234 and the hard circuit board 221 also causes an increase in the thickness of the battery protection plate 22. In addition, the fixing portion 2234 and the hard circuit board 221 are welded together by welding, and the welding point between the fixing portion 2234 and the hard circuit board 221 occupies a certain height, so that there is a welding line between the fixing portion 2234 and the hard circuit board 221, and the thickness of the battery protection plate 22 is increased. In addition, the thickness of the hard circuit board 221 is relatively thick (the thickness of the hard circuit board 221 is about 0.85 mm), and the combination of the hard circuit board 221 and the hard circuit board restricts the continuous thinning of the electronic equipment.

As the electronic device 100 needs to perform more and more functions, more and more electronic components are disposed on the device motherboard 30 within the electronic device 100. Accordingly, the occupied space of the device motherboard 30 in the electronic device 100 is larger and larger, and the power consumption of the electronic device 100 is increased and the standby time is shortened. In the electronic device 100 having the size and the cost, if the battery protection plate 22 is thinned, it is extremely important to save space to increase the capacity of the battery 20 or to increase the layout area of the device main board 30.

Based on this, in order to solve the above technical problems, the present application creatively splits the current whole hard plate into a plurality of sub-plates, then sinks part of the sub-plates, and the sunk sub-plates are used for fixing electronic components with higher height, thereby breaking the limitation of continuous thinning of the current electronic equipment, and providing a battery protection plate 22 as shown in fig. 8 to 12, so as to achieve the purposes of reducing the thickness of the electronic equipment and improving the capacitance of the battery under the current thickness. Fig. 8 is a schematic cross-sectional structure of a battery protection plate 22 according to another embodiment of the present application, fig. 9 is a schematic cross-sectional structure of a battery protection plate 22 according to another embodiment of the present application, fig. 10 is a schematic cross-sectional structure of a battery protection plate 22 according to another embodiment of the present application, fig. 11 is a schematic cross-sectional structure of a battery protection plate 22 according to another embodiment of the present application, and fig. 12 is a schematic cross-sectional structure of a battery protection plate 22 according to another embodiment of the present application.

Specifically, in the above embodiment, the battery protection plate includes: a plurality of first sub-circuit boards 2211 and a plurality of second sub-circuit boards 2212 which are alternately arranged, and a first flexible connecting piece 2213 for connecting the adjacent first sub-circuit boards 2211 and second sub-circuit boards 2212, wherein a first electronic element 222 is fixed on the first sub-circuit board 2211, and a second electronic element 222 is fixed on the second sub-circuit board 2212; in the thickness direction of the battery, the height of the first electronic component 222 is higher than the height of the second electronic component 222, and the height of the first sub-circuit board 2211 is lower than the height of the second sub-circuit board 2212.

In the application, the prior battery protection board is creatively replaced by the integral hard board by adopting a plurality of first sub-circuit boards 2211 and a plurality of second sub-circuit boards 2212, the sub-circuit boards are connected through the flexible connecting piece 2213, the first sub-circuit board 2211 is positioned at a lower height than the second sub-circuit board 2212, namely, the first sub-circuit board 2211 is sunk during manufacturing, and the second sub-circuit board 2212 keeps unchanged in position, so that the electronic element 222 with higher height can be distributed on the first sub-circuit board 2211, the phenomenon that the battery protection board is higher than the battery thickness when the higher electronic element 222 and other electronic elements 222 are arranged on the same circuit board can not occur, in addition, the battery thickness can be continuously thinned due to the sinking of the higher electronic element 222, and the limitation of the prior battery thickness is broken.

Specifically, the electronic components 222 are plural. The plurality of electronic components 222 include any one or more of a control chip (not shown), a metal-oxide semiconductor field effect transistor (not shown), a thermistor (not shown), a capacitor (not shown), a memory (not shown), and the like.

The control chip is electrically connected with the metal-oxide semiconductor field effect transistor, the thermistor, the capacitor, the memory and the like.

The thermistors can be classified into positive temperature coefficient thermistors (Positive Temperature Coefficient, PTC) and negative temperature coefficient thermistors (Negative Temperature Coefficient, NTC) according to temperature coefficients, and are characterized in that they are sensitive to temperature and can exhibit different resistance values at different temperatures, wherein the positive temperature coefficient thermistors have a higher resistance value at higher temperatures and the negative temperature coefficient thermistors (NTC) have a lower resistance value at higher temperatures. Negative temperature coefficient thermistors (NTCs) typically have a temperature coefficient of variation expressed in ppm/. Degree.C.that is, a temperature change of 1 degree corresponds to a resistance change in parts per million. 100 ppm/. Degree.C.is 0.01%/degree.C.

A metal-oxide semiconductor field effect transistor (Metal Oxide Semiconductor Field Effect Transistor, MOSFET) is a field effect transistor that can be widely used in analog circuits and digital circuits. When a large enough potential difference is applied between the gate and source of the mosfet, the electric field will induce charges on the semiconductor surface under the oxide layer, which will form an "inversion channel" (inversion channel). The polarity of the inverted channel is the same as its drain (drain) and source, and assuming that the drain and source are n-type, the channel will also be n-type. After the channel is formed, the metal oxide semiconductor field effect transistor can pass current, and the current flowing through the channel of the metal oxide semiconductor field effect transistor can be controlled to be changed according to different voltage values applied to the grid electrode.

The control chip can be used for controlling the mosfet to electrically connect or disconnect the battery core 21 from the device motherboard 30. When the voltage or loop current of the battery core 21 does not exceed the specified value stored in the memory, the control chip controls the metal oxide semiconductor field effect transistor to be turned on, and the battery core 21 is electrically connected with the device main board 30. When the voltage or loop current of the battery core 21 exceeds a specified value, the control chip controls the metal oxide semiconductor field effect transistor to be turned off, so that the safety of the battery core 21 is protected.

The capacitor, for example, a ceramic capacitor (ceramic capacitor; ceramic condenser), can be used in a circuit to perform functions such as blocking, filtering, energy storage, etc.

With continued reference to fig. 8-12, the battery protection board module includes a first sub-circuit board 2211, a second sub-circuit board 2212, and a flexible connection member 2213 connecting each sub-circuit board.

The first sub-circuit board 2211 and the second sub-circuit board 2212 are used for fixing the electronic component 222. That is, the electronic component 222 is fixed to the first and second sub-circuit boards 2211 and 2212, and is electrically connected to the first and second sub-circuit boards 2211 and 2212. For example, with continued reference to fig. 8, the first sub-circuit board 2211 and the second sub-circuit board 2212 have pads 2215, and the electronic components 222 and the pads 2215 may be connected by solder joints. In some specific examples, the electronic components 222 may be soldered on the pads 2215 of the first and second sub-circuit boards 2211 and 2212 by a surface mount (Surface Mounted Device, SMD) process.

In some embodiments, each second sub-circuit board 2212 is disposed with any two adjacent first sub-circuit boards 2211 having equal length, at least one second sub-circuit board 2212 is disposed between the two adjacent first sub-circuit boards 2211, and the battery protection board module further includes a second flexible connection member 2213 connecting the two adjacent second sub-circuit boards 2212.

The power consumption of the electronic components 222 with higher heights is relatively larger, so that the electronic components 222 with higher heights can be dispersed on the whole battery protection board, the distance between the two electronic components 222 with higher heights is ensured not to be too close, the heat dissipation of the battery protection board is uniform, and the situation of performance degradation caused by local overheating is avoided.

Specifically, 1, 2, 3 or more than 3 second sub-circuit boards 2212 can be spaced between any two adjacent first sub-circuit boards 2211, and because thicker electronic components 222 are fixed on the first sub-circuit boards 2211, larger heat is emitted when the electronic boards 2211 are used, and the second sub-circuit boards 2212 are arranged on two sides of the first sub-circuit boards 2211, so that the electronic components 222 with lower heights fixed on the second sub-circuit boards 2212 dissipate heat less, and because the heights are lower, more heat dissipation space can be provided for the first sub-circuit boards 2211, thereby being beneficial to heat conduction of the whole circuit board structure.

At least one electronic component 222 may be provided on each sub-circuit board in embodiments of the present application.

For example, for a MOS transistor, one MOS transistor may be disposed on one sub-circuit board according to an area of the electronic element 222, and for other devices with smaller occupied areas, a plurality of, for example, 2 or three, may be disposed on one sub-circuit board.

Of course, the actual layout may be integrated according to the position, height and area of each electronic component 222.

In a preferred embodiment, the number of electronic components 222 on each sub-circuit board may be set according to the heat dissipation situation and the area of the electronic components 222, for example, for some electronic components 222, if the electronic components 222 are used frequently, for example, when the battery is protected, the electronic components 222 are required to be used continuously, at this time, only one electronic component 222 may be set on the corresponding sub-circuit board of the electronic components 222, and at the same time, the space between the sub-circuit board and other sub-circuit boards may be enlarged, that is, a longer flexible connection member 2213 may be used to replace the connection between the sub-circuit board and the adjacent sub-circuit board, for the electronic components 222 with low heat dissipation capacity, the sub-circuit boards and the surrounding electronic components 222 thereof may be set more densely, for example, the electronic components 222 with low heat dissipation capacity are densely arranged on one sub-circuit board.

It can be seen that the present application employs the flexible connection 2213 in combination with the first sub-circuit board 2211 and the second sub-circuit board 2212 instead of the existing monolithic hard plate, which provides technical advantages in that it provides a higher degree of freedom in designing and layout of the electronic components 222 on the circuit board.

As a scenario, the battery protection board module includes a plurality of electronic components 222, where only one electronic component a is configured on one first sub-circuit board 2211, where the electronic component a belongs to an electronic component 222 with huge heat dissipation, and needs to be kept energized in a standby stage and a use stage, and the height of the electronic component 222 is relatively higher, which belongs to the first electronic component 222 in the embodiment of the present application, where the circuit boards connected to two sides of the corresponding first sub-circuit board 2211 may be the second sub-circuit board 2212, and the layout of the second sub-circuit board 2212 may place the electronic component 222 thereon slightly far from the electronic component 222, instead of being disposed in the center of the second sub-circuit board 2212, and the distance between the first sub-circuit board 2211 and the second sub-circuit board 2212 on two sides is larger than that between the other sub-circuit boards, so as to provide sufficient heat dissipation space for the electronic component a on the first sub-circuit board 2211.

As another scenario, the battery protection board module includes a plurality of the above electronic components 222, where only one electronic component b is disposed on one first sub-circuit board 2211, where the electronic component b belongs to an electronic component 222 with smaller heat dissipation, so that a plurality of other electronic components 222 may be disposed on the sub-circuit board of the electronic component b, and the electronic component b is preferably an electronic component 222 with smaller heat dissipation with respect to the other electronic components 222, so that the distance between the electronic component b and the other electronic components 222 may be set smaller, and the distance between the sub-circuit board of the electronic component b and the sub-circuit boards on both sides may be relatively reduced, so that the electronic component b provides a heat dissipation yield space for other electronic components 222 with larger heat dissipation capacity, such as an electronic component a, and may be provided to the electronic component a with more heat dissipation space by sacrificing the space around the electronic component b.

In some embodiments, the first sub-circuit board 2211 and the second sub-circuit board 2212 are alternately arranged. As can be seen from the above embodiments, the arrangement of the sub-circuit boards and the arrangement of the electronic components 222 can have a larger degree of freedom, so in some scenarios, the heat dissipation of each electronic component 222 can be simply proportional to the volume, the first sub-circuit board 2211 and the second sub-circuit board 2212 are alternately arranged, and the two sides of each higher electronic component 222 are lower electronic components 222, so that the heat dissipation area is enlarged, and thus, on one hand, the manufacturing process is easily standardized during manufacturing, which is beneficial to the heat conduction of the whole circuit board structure and the heat dissipation is more uniform.

In some embodiments, each first sub-circuit board 2211 is disposed in equal length, at least one first sub-circuit board 2211 is disposed between any two adjacent second sub-circuit boards 2212, and the battery protection board module further includes a third flexible connection member 2213 connected to the two adjacent first sub-circuit boards 2211. Although it is a preferred embodiment of the present application to separate the first sub-circuit boards 2211, it is understood that the present application may also use two or at least three first sub-circuit boards 2211 arranged consecutively and then separated by a second sub-circuit board 2212, which is more battery protection boards for higher electronic components 222, and a heat dissipation patch such as a graphene patch may be attached to a dense area of the first sub-circuit boards 2211 for better heat dissipation.

That is, the above embodiment can be understood that the first sub-circuit board 2211 and the second sub-circuit board 2212 are preferably arranged at intervals, but the first sub-circuit board 2211 may have at least two continuous arrangements, and the second sub-circuit board 2212 may have at least two continuous arrangements, which is not limited by the present application.

As can be seen from the above embodiments, the degrees of freedom of the placement of the sub-circuit boards and the placement of the electronic components 222 of the present application are far higher than that of the existing whole hard board, i.e. the present application does not limit the number of the electronic components 222 fixed on the first sub-circuit board 2211 and the second sub-circuit board 2212, in general, in order to solve the process, more electronic components 222 may be fixed on the same sub-circuit board, but in order to solve the problem of heat dissipation of the electronic components 222 during the manufacture, it is generally preferable that the number of the electronic components 222 on each sub-circuit board is one or two, so that on one hand, the process is simplified and at the same time, the heat dissipation guarantee is provided.

In some implementations, the flexible connection 2213 is a flexible circuit board. The flexible connection element 2213 needs to have a circuit routing function, that is, needs to ensure signal input and signal output of the electronic component 222 on the sub-circuit board, and the flexible circuit board is thinner on one hand, and on the other hand, can print any desired circuit structure or circuit connection relationship on the flexible circuit board, so that the first sub-circuit board 2211 and the second sub-circuit board 2212 can be connected to form a complete circuit board.

Of course, other materials may be used to form the flexible connection member 2213, and as an example, a plurality of thin metal wires may be used to connect the first sub-circuit board 2211 and the second sub-circuit board 2212, and in this embodiment, in order to avoid voltage interference between the metal wires, an insulating material may be coated around the metal wires.

In other embodiments, a flexible circuit board and a plurality of finer metal wires may be used in combination, for example, a flexible circuit board is disposed between two of the sub-circuit boards, and a metal wire is disposed between the other two sub-circuit boards, which is not limited in the present application, and it is understood that the configurations of the metal wires and the flexible circuit boards may be freely selected based on actual needs, for example, cost considerations or circuit layout considerations, which is not limited in the present application.

While the flexible connection member 2213 is described, it should be noted that, if the lengths of the first sub-circuit board 2211 and the second sub-circuit board 2212 are not limited, that is, each first sub-circuit board 2211 is not equal in length, and each second sub-circuit board 2212 is not equal in length, the embodiment of the present application does not exist in the case that two first sub-circuit boards 2211 are adjacent or two second sub-circuit boards 2212 are adjacent, because two adjacent first sub-circuit boards 2211 with equal lengths can be replaced by one longer first sub-circuit board 2211, and two adjacent second sub-circuit boards 2212 with equal lengths can be replaced by one longer second sub-circuit board 2212, which is not described in detail herein.

In some implementations, the first sub-circuit board 2211 and/or the second sub-circuit board 2212 is a flexible circuit board or a rigid circuit board. It should be appreciated that the first sub-circuit board 2211 and the second sub-circuit board 2212 of the present application are each independently a flexible circuit board or a rigid circuit board, that is, the first sub-circuit board 2211 may be a flexible circuit board or a rigid circuit board, the second sub-circuit board 2212 may also be a flexible circuit board or a rigid circuit board, and generally, the first sub-circuit board 2211 and the second sub-circuit board 2212 are provided as the same board, that is, both are flexible circuit boards or both are rigid circuit boards, based on process consideration, and may be both rigid circuit boards, if allowed, based on cost consideration.

Of course, it is preferable that the first sub-circuit board 2211 and the second sub-circuit board 2212 are both hard circuit boards, so that on one hand, the cost is lower, and on the other hand, the first sub-circuit board 2211 is sunk, so that although the hard circuit boards are thicker, the thickness difference of finished products is not large due to the flexible circuit board and the hard circuit board in certain scenes, and at the moment, the hard circuit boards with lower cost can be selected, and the reliability of the circuit can be enhanced.

In a preferred embodiment, if the height of the highest electronic component 222 has approached the thickness of the battery, considering that the thickness of the rigid circuit board is higher than that of the flexible circuit board, the first sub-circuit board 2211 under the highest electronic component 222 may be particularly set as the flexible circuit board, and the other first sub-circuit boards 2211 may be set as the rigid circuit boards.

As an example, the thickness of the electronic component c is already close to the thickness of the battery, where the first sub-circuit board 2211 corresponding to the electronic component 222 may be a flexible circuit board, and the circuit boards corresponding to the other electronic components 222 are all hard circuit boards, where the flexible circuit boards provide a higher degree of freedom for the overall architecture, so that the electronic device can be greatly thinned, and the limitation that the current electronic device continues to be thinned is broken.

As can be seen from the above embodiments, each of the first sub-circuit board 2211 and each of the second sub-circuit board 2212 in the present application are independent, and can be configured as a flexible or rigid circuit board independently, which will not be further described in the present application.

In some embodiments, the battery protection plate module further includes: and a plurality of electronic connectors for being welded and fixed with the lugs 2121 of the battery, wherein each electronic connector is arranged on one side surface of the second sub-circuit board 2212 facing away from the second electronic element 222. In this embodiment, the electronic connection member may be a nickel sheet 224, where the nickel sheet 224 is welded to the tab 2121 of the battery and is fixed on the back of the battery protection board, and since the electronic connection member has a certain thickness, it is preferable that the electronic connection member is fixed on the back of the second sub-circuit board 2212, so that a certain space is formed under the second sub-circuit board 2212 due to the sinking of the first sub-circuit board 2211, and the electronic connection member is placed in the space, so that the space of the part is reasonably utilized, and the thickness of the battery can be made thinner.

In some implementations, the bottom surface of the electronic connection is disposed flush with the bottom surface of the first sub-circuit board 2211. In this way, the bottom of the first sub-circuit board 2211 and the bottom of the electronic connector are both disposed at the bottommost part within the allowable range, so as to leave the maximum room for the height of the electronic component 222, and the electronic component 222 with a higher thickness can be adapted.

It should be understood that in the embodiment of the present application, the electronic connection member may be a nickel sheet 224, and in particular, please refer to fig. 5 and 6, and in the embodiment of the present application, the second sub-circuit board 2212 is fixed to the tab 2121 of the electric core 21 by means of the bonding pad 2215 fixed on the back of the second sub-circuit board 2212, and is electrically connected to the tab 2121.

For example, with continued reference to fig. 5, the electronic connection member may be two nickel plates 224, namely a positive nickel plate 224 and a negative nickel plate 224, wherein the positive nickel plate 224 is welded with the positive tab 2121 of the cell 21, and the negative nickel plate 224 is welded with the negative tab 2121 of the cell 21.

Note that, the nickel tab 224 is welded to the two tabs 2121 of the cell 21, and maintains an electrical connection relationship. It will be appreciated that in other examples, the nickel tab 224 may not be provided, and the two tabs 2121 may be welded directly to the pads 2215 via respective welds.

In some embodiments, the battery protection plate module further includes: the board-to-board connector 2232 is connected to the closest sub-circuit board through the second flexible circuit board 2231, and the board-to-board connector 2232 is disposed flush with the second sub-circuit board 2212, so that it can be known that the board-to-board connector 2232 and the second flexible circuit board 2231 together form the board-to-board connection module 223 in the present embodiment. In the present embodiment, the board-to-board connector is flush with the second sub-circuit board 2212, so that the board-to-board connector and the second sub-circuit board 2212 can be connected by adopting a flat circuit board, that is, a flexible circuit board or a hard circuit board, and both of them can be adopted.

Furthermore, as can be seen from the above embodiments, the sub-circuit board of the present application has a high degree of freedom, and in order to further improve the degree of freedom, in some embodiments, the battery protection board module further includes: the third sub-circuit board is fixed with a third electronic component 222, the height of the third sub-circuit board is higher than that of the first sub-circuit board 2211, and the height of the third electronic component 222 is lower than that of the second electronic component 222. The third sub-circuit board is further provided based on a similar concept in this embodiment, that is, in this embodiment of the present application, three sub-circuit boards with different heights may be actually set according to needs, in a more specific embodiment, each sub-circuit board is located at a different height, and correspondingly, the heights of the electronic components 222 on each sub-circuit board are different, which is not limited in this application, and obviously, this embodiment may adapt to the height of the optimal sub-circuit board for each electronic component 222, so as to facilitate reducing the injection molding amount in the subsequent injection molding.

In some embodiments, at least one third sub-circuit board is interposed between each two adjacent first sub-circuit boards 2211 and second sub-circuit boards 2212, or the first sub-circuit boards 2211, the second sub-circuit boards 2212, and the third sub-circuit boards are sequentially arranged in sequence.

Similarly, as can be seen from the description about the above degrees of freedom, the third sub-circuit board may also be disposed according to the heat dissipation, the spatial arrangement, and other factors of the actual electronic component 222, for example, the third sub-circuit board may be disposed between the first sub-circuit board 2211 and the second sub-circuit board 2212, so as to facilitate heat dissipation, or the first sub-circuit board 2211, the second sub-circuit board 2212, and the third sub-circuit board may be sequentially disposed, which is not limited in the present application.

On the basis of the above embodiment, the present application may mold the insulating encapsulation medium 24 over the electronic element 222 of the battery protection plate module, and the material of the insulating encapsulation medium 24 may include, but is not limited to, resin or the like, such as Polyimide (PI). In general, the insulating packaging medium 24 can cover all the electronic components 222 on the first sub-circuit board 2211 and the second sub-circuit board 2212, so that on one hand, the electronic components 222 are electrically insulated, on the other hand, a certain buffer protection is provided, the internal electronic components 222 are prevented from being damaged when the battery protection board module collides, and in addition, the insulating packaging medium 24 further provides a certain mechanical strength, so as to support the battery protection board module.

Next, the method for manufacturing the battery protection board module is described, referring to the method for manufacturing the battery protection board module shown in fig. 9, and fig. 10 to 13 show schematic structural diagrams after processing at each stage in the manufacturing method.

Specifically, as shown in fig. 9, an embodiment of the present application provides a method for manufacturing a battery protection plate module, including:

s1, providing a plurality of first sub-circuit boards 2211, a plurality of second sub-circuit boards 2212 and a profiling mold 231, wherein the profiling mold 231 comprises a first recess corresponding to the first sub-circuit boards 2211 and a second recess corresponding to the second sub-circuit boards 2212, the first recess is used for accommodating the first sub-circuit boards 2211, the second recess is used for accommodating the second sub-circuit boards 2212, the bottom surface height of the first recess is lower than the bottom surface height of the second recess, a first electronic element 222 is fixed on the first sub-circuit boards 2211, a second electronic element 222 is fixed on the second sub-circuit boards 2212, and the height of the first electronic element 222 is higher than the height of the second electronic element 222;

s2, connecting each first sub-circuit board 2211 and each second sub-circuit board 2212 through a flexible connecting piece 2213 according to the positions of the first recess and the second recess to form a combined circuit board;

S3, pressing the combined circuit board into the profiling mold 231 through a mold top cover 232 matched with the profiling mold 231, and covering the combined circuit board with the profiling mold 231;

and S4, filling a packaging medium 24 in the covered profiling mold 231 to package the combined circuit board, so as to obtain the battery protection board module.

The above steps are respectively described in detail below.

As shown in fig. 10, in step S1, the profiling mold 231 is first provided according to the circuit structure that is required to be provided, specifically, the first sub-circuit board 2211-first flexible connection 2213-second sub-circuit board 2212-first flexible connection 2213-first sub-circuit board 2211 overall structure may be first manufactured for the battery circuit board module, then each electronic component 222 is soldered on each of the first sub-circuit board 2211 and the second sub-circuit board 2212 through a pad 2215 or a solder joint, as shown in fig. 10, the electronic component RLC and the electronic component IC are soldered on the first sub-circuit board 2211, the MOS tube is soldered on the first second sub-circuit board 2212, and the electronic component IC and the electronic component RS are soldered on the second first sub-circuit board 2211, and the electronic component MOS tube and the RLC are soldered on the second sub-circuit board 2212, and the back nickel sheet 224 of the second sub-circuit board 2212 are soldered in the order from left to right.

Thereafter, in the sequence of fig. 11, step S2 is performed, in which a first flexible connector 2213 is connected between two adjacent sub-circuit boards, and a flexible connector 2213 is soldered on the rightmost side of the second sub-circuit board 2212, and the flexible connector 2213 is coupled to the board-to-board connector for electrical connection with the device motherboard.

The profiling mold 231 comprises a bottom mold and a mold top cover 232, the bottom mold forms a recess and a protrusion according to the layout of the first sub-circuit board 2211 and the second sub-circuit board 2212, the recess corresponds to the first sub-circuit board 2211 and is used for accommodating the sunk first sub-circuit board 2211, the protrusion corresponds to the second sub-circuit board 2212, then the battery protection board module is placed in the bottom mold in the mold, the whole battery protection board module is fixed through the mold top cover 232, at this time, the first flexible connecting piece 2213 is bent due to stress, the first sub-circuit board 2211 sinks into the recess of the bottom mold, the second sub-circuit board 2212 is not sunk due to the support of the protrusion, and then the mold top cover 232 of the profiling mold 231 is tightly covered.

As shown in fig. 13, step S4 is finally performed, where the insulating encapsulation medium 24 is injected into the cavity of the mold through the specific hole of the grinding tool, and the insulating encapsulation medium 24 is injection-molded to form the insulating encapsulation medium 24 in the above embodiment. And then removing the die to form the battery protection board module in the embodiment of the application.

The present embodiment provides a method for manufacturing a battery protection board module, which comprises the steps of configuring a combined circuit of a first sub-circuit board 2211 and a second sub-circuit board 2212, pressing the combined circuit into a mold, fixing the first sub-circuit board 2211 and the second sub-circuit board 2212 at different heights by using a mold top cover 232, finally filling an injection molding packaging medium 24 to fix the first sub-circuit board 2211, the second sub-circuit board 2212 and a flexible connecting piece 2213 for connecting the sub-circuit boards, and removing the mold and the mold top cover 232 after fixing.

As shown in fig. 12, at least two elastic pins 233 corresponding to the space of each first sub-circuit board 2211 are disposed in the mold top cover 232, the elastic pins 233 may be pressed on the non-circuit routing area of the electronic device or the sub-circuit board, and when the mold top cover 232 is closed, the elastic pins 233 press the first sub-circuit board 2211, so that the first sub-circuit board 2211 sinks, and the elastic pins 233 are in contact with the board surface of the first sub-circuit board 2211 at this time, that is, the step S3 specifically includes: the mold top cover 232 is pressed down on the combined circuit, so that each elastic thimble 233 is inserted into the corresponding gap of the first sub-circuit board 2211 to form an abutting joint. In this embodiment, the elastic thimble 233 is used to press the first sub-circuit board 2211 to a lower height position, so that the first sub-circuit board 2211 is sunk, and the elastic thimble 233 has a certain elasticity, so that the first sub-circuit board 2211 can be protected, and circuit damage and other phenomena in the pressing process of the first sub-circuit board 2211 can be avoided.

In some embodiments, the elastic thimble 233 can be set with a certain degree of freedom in the horizontal xy direction, that is, the elastic thimble 233 can swing in the horizontal direction, so that the thimble with the spring contacts with the single board first, after the hard board and the soft board of the single board are all tightly attached to the bottom die, the upper die is pressed, the failure of the printed board caused by the tightening or locking length redundancy of the single board is avoided, the thimble can swing in a certain range in the xy direction, and the scratch and scratch damage to the surface of the single board is avoided when the single board is pressed down.

Further, the head of the elastic thimble 233 may be made of a soft material, so that the elastic thimble 233 of the soft material forms a certain pressing force on the first sub-circuit board 2211 when being pressed, but the first sub-circuit board 2211 is not damaged due to over-hardness, thereby being beneficial to protecting the single board surface of the first sub-circuit board 2211 from being scratched.

It can be seen that, based on the above embodiment, the present application can also provide a mold device for manufacturing the battery protection plate module as described above, and as further shown in fig. 12, the mold device includes: a profiling mold 231 and a mold top 232; wherein the profiling mold 231 includes a first recess corresponding to the first sub-circuit board 2211 and a second recess corresponding to the second sub-circuit board 2212, the first recess is used for accommodating the first sub-circuit board 2211, the second recess is used for accommodating the second sub-circuit board 2212, and a bottom surface height of the first recess is lower than a bottom surface height of the second recess; the mold top cover 232 is used for covering with the profiling mold 231, so that the combined circuit is packaged to form the battery protection board module. In the mold device provided by the embodiment, on one hand, the mold provides a more portable manufacturing mode for manufacturing the battery protection plate, and the battery protection plate manufactured by the mold is thinner and does not protrude out of the battery thickness. Therefore, the preparation of the battery protection board module can be realized through simple die pressing, so that the battery protection board module can be produced in batches.

In some embodiments, to compress the first sub-circuit boards 2211, at least two elastic pins 233 corresponding to the gaps of each of the first sub-circuit boards 2211 are disposed in the mold top 232. In this way, the elastic thimble 233 is used to press the first sub-circuit board 2211 to a lower height position, so that the first sub-circuit board 2211 is sunk, and the elastic thimble 233 has a certain elasticity, so that the first sub-circuit board 2211 can be protected, circuit damage and other phenomena in the pressing process of the first sub-circuit board 2211 can be avoided, in addition, the cost of the elastic thimble 233 in the profiling mold 231 is lower, the length can be replaced according to the requirement, and therefore any battery protection board structure can be adapted, and the high adaptability is achieved.

In some embodiments, in order to avoid scratch damage of the elastic ejector pins 233 on the first sub-circuit board 2211, the elastic ejector pins 233 may swing in a horizontal direction when the mold top cover 232 presses the profiling mold 231. Therefore, the thimble with the spring is firstly contacted with the single plate, the hard plate and the soft plate of the single plate are ensured to be tightly attached to the bottom die, then the upper die is pressed, the failure of the printed board caused by the redundancy of the tightening or locking length of the single plate is avoided, the thimble can swing in a certain range in the xy direction, and the damage to the surface of the single plate caused by scratch when the single plate is pressed down is avoided.

Further, in order to further avoid damage of the elastic ejector pins 233 to the first sub-circuit board 2211, the heads of the elastic ejector pins 233 may be made of a soft material, so that the elastic ejector pins 233 of the soft material form a certain pressing force on the first sub-circuit board 2211 when being pressed, but the first sub-circuit board 2211 is not damaged due to over-hard, thereby being beneficial to protecting the veneer surface of the first sub-circuit board 2211 from scratch.

The embodiment of the application further provides a battery module, which comprises a battery and the battery protection board module, wherein the battery and the battery protection board module are respectively arranged in a shell of electronic equipment, and the battery protection board module is positioned in a height range defined by the thickness of the battery. Because the battery protection board module of the present application adopts the above-mentioned configuration modes of the first sub-circuit board 2211 and the second sub-circuit board 2212 with different heights, the battery protection board module can be limited within the thickness range of the battery, so that the thickness of the whole battery module is thinner than the current thickness, and no description is given here.

The principles and embodiments of the present application have been described in detail with reference to specific embodiments thereof, the description of the above embodiments being only for aiding in the understanding of the method of the present application and its core ideas; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present application, the present description should not be construed as limiting the present application in view of the above.

Claims

1. A method for manufacturing a battery protection plate module, comprising:

filling a packaging medium in the covered profiling mold to package the combined circuit board, so as to obtain a battery protection board module;

At least two elastic ejector pins corresponding to the gaps of each first sub-circuit board are arranged in the die top cover, the combined circuit board is pressed into the profiling die through the die top cover matched with the profiling die, and the die top cover comprises:

and pressing down the die top cover on the combined circuit board so that each elastic thimble is inserted into a gap of the corresponding first sub circuit board to form abutting connection.

2. A battery protection plate module manufactured by the manufacturing method of claim 1, comprising: the circuit board comprises a plurality of first sub-circuit boards and a plurality of second sub-circuit boards which are alternately arranged, and a first flexible connecting piece for connecting the adjacent first sub-circuit boards and second sub-circuit boards, wherein a first electronic element is fixed on the first sub-circuit board, and a second electronic element is fixed on the second sub-circuit board;

in the thickness direction of the battery, the height of the first electronic element is higher than that of the second electronic element, and the height of the first sub-circuit board is lower than that of the second sub-circuit board;

the battery protection board module further includes:

the plurality of electronic connectors are used for being welded and fixed with the lugs of the battery, and each electronic connector is arranged on one side surface of the second sub-circuit board, which is away from the second electronic element;

The profiling mold for manufacturing the battery protection plate module comprises a first concave corresponding to the first sub-circuit board and a second concave corresponding to the second sub-circuit board, at least two elastic ejector pins corresponding to the gaps of each first sub-circuit board are arranged in a mold top cover covered by the profiling mold, and the battery protection plate module is pressed down by the mold top cover so that each elastic ejector pin is inserted into the corresponding gap of the first sub-circuit board to form abutting connection.

3. The battery protection board module of claim 2, wherein at least one of the second sub-circuit boards is disposed between any two adjacent first sub-circuit boards, and the battery protection board module further comprises a second flexible connection member connecting the two adjacent second sub-circuit boards.

4. The battery protection plate module according to claim 2, wherein the first and second sub-circuit boards are alternately arranged.

5. A battery protection plate module according to claim 3, wherein at least one of the first sub-circuit boards is disposed between any two adjacent second sub-circuit boards, and the battery protection plate module further comprises a third flexible connection member connecting the two adjacent first sub-circuit boards.

6. A battery protection plate module according to claim 3, wherein a plurality of first electronic components are fixed to each of the first sub-circuit boards, and/or a plurality of second electronic components are fixed to each of the second sub-circuit boards.

7. The battery protection plate module according to claim 2, wherein the flexible connection member is a flexible circuit board.

8. The battery protection board module according to claim 2, wherein the first sub-circuit board and/or the second sub-circuit board is a flexible circuit board or a hard circuit board.

9. The battery protection board module of claim 2, wherein a bottom surface of the electronic connection member is flush or not flush with a bottom surface of the first sub-circuit board.

10. The battery protection plate module according to claim 2, further comprising:

the board-to-board connector is connected with the nearest sub-circuit board through the flexible circuit board.

11. The battery protection plate module according to claim 2, wherein each of the flexible connection members is equal in length or unequal in length.

12. The battery protection board module according to claim 2, wherein a plurality of electronic components are provided on each sub-circuit board, and the pitches between two adjacent electronic components on the same sub-circuit board are the same or different.

13. A mold device for use in the method of manufacturing the battery protection plate module according to claim 2, comprising: profiling mold and mold top cover; wherein,

the profiling mold comprises a first recess corresponding to the first sub-circuit board and a second recess corresponding to the second sub-circuit board, wherein the first recess is used for accommodating the first sub-circuit board, the second recess is used for accommodating the second sub-circuit board, and the bottom surface height of the first recess is lower than the bottom surface height of the second recess;

the die top cover is used for being covered with the profiling die, so that the combined circuit board is packaged to form the battery protection board module.

14. The mold apparatus of claim 13, wherein at least two resilient pins are disposed in the mold top cover corresponding to each first sub-circuit board void.

15. The mold apparatus of claim 14 wherein said resilient ejector pins are swingable in a horizontal direction as said mold top cover compresses said profiling mold.

16. A battery module comprising a battery and a battery protection plate module according to any one of claims 2-12, the battery and the battery protection plate module each being disposed within a housing of an electronic device, and the battery protection plate module being within a height range defined by a thickness of the battery.

17. An electronic device, comprising

An electronic device housing;

at least one functional device module provided in the electronic equipment case, the battery module according to claim 16; wherein,

the tab of the battery is coupled to the voltage input of each functional device module.