CN112996216B - Stack-based module and manufacturing method thereof and terminal - Google Patents
Stack-based module and manufacturing method thereof and terminal Download PDFInfo
- Publication number
- CN112996216B CN112996216B CN201911271920.6A CN201911271920A CN112996216B CN 112996216 B CN112996216 B CN 112996216B CN 201911271920 A CN201911271920 A CN 201911271920A CN 112996216 B CN112996216 B CN 112996216B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- type
- electronic element
- stacked module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention provides a stacked module, a manufacturing method thereof and a terminal, comprising a first printed circuit board and a second printed circuit board; the first printed circuit board and the second printed circuit board are arranged in a stacked mode; a first type of electronic element is arranged on the first printed circuit board; a second type of electronic element is arranged on the second printed circuit board; the second printed circuit board is provided with a first radiating hole, and the opening position of the first radiating hole corresponds to the position of the first type of electronic element on the first printed circuit board; the first type electronic element is electrically connected with the second printed circuit board, and the first type electronic element and the second type electronic element perform data transmission through the position where the first type electronic element is electrically connected with the second printed circuit board. The stacked module provided by the invention can effectively improve the heat dissipation performance of each electronic element so as to improve the performance of the terminal.
Description
Technical Field
The application relates to the technical field of electronics, in particular to a stacked module and a manufacturing method and a terminal thereof.
Background
The "packaging technology" is a technology for packaging an integrated circuit with an insulating material, and the normal operation of a terminal device needs to depend on various electronic components, such as a System on Chip (SoC), a dynamic random access memory (dram), a flash memory Chip (flash memory), and the like. If each electronic component is uniformly distributed on a Printed Circuit Board (PCB) for electrical connection, the footprint of the formed module is large.
In order to solve the problem of large occupied area of the module, a Package-on-Package (PoP) technology is used for packaging all electronic elements, and two adjacent layers of electronic elements are electrically connected to obtain the packaged module. The module generates heat during operation, which can degrade the performance of the module if the heat buildup is not well dispersed. In order to improve the heat dissipation efficiency of the module, a module structure as shown in fig. 1 is generally adopted, and fig. 1 shows a module having two electronic components, wherein a first type of electronic component is mounted on a printed circuit board, and a second type of electronic component is stacked on the first type of electronic component and is soldered to the first type of electronic component to achieve electrical connection. In order to improve the heat dissipation efficiency of the module, a piece of heat conducting metal is attached to the second type of electronic element, a heat pipe is added to the heat conducting metal, and the heat generated by the module is conducted out by utilizing the heat conducting metal and the heat pipe.
However, the heat conducting metal is only in contact with the second type of electronic component, and the generated heat conducting effect mainly aims at the second type of electronic component, but the heat generated by the first type of electronic component is difficult to be transferred to the heat conducting metal through the second type of electronic component to be dissipated, so that the heat generated by the first type of electronic component cannot be effectively dissipated, and the performance of the first type of electronic component is affected.
Disclosure of Invention
The application provides a stacked module to improve the heat dissipation performance of each electronic element.
The embodiment of the invention provides a stacked module, which comprises a first printed circuit board and a second printed circuit board; the first printed circuit board and the second printed circuit board are arranged in a stacked mode; the first printed circuit board comprises a first surface and a second surface, and the first surface is opposite to the second surface in direction; the first surface is a surface facing the second printed circuit board, and a first type of electronic element is arranged on the first surface; the second printed circuit board comprises a third surface and a fourth surface, the third surface is opposite to the fourth surface in direction, and the fourth surface is a surface facing the first printed circuit board; a second type of electronic element is arranged on the third surface or the fourth surface; the second printed circuit board is provided with a first radiating hole, and the opening position of the first radiating hole corresponds to the position of the first type of electronic element on the first printed circuit board; the first electronic component and the second electronic component are electrically connected with the second printed circuit board, and data transmission is carried out at the position where the first electronic component and the second electronic component are electrically connected with each other.
In the stacked module provided by the embodiment of the invention, the printed circuit boards are utilized to separate the adjacent two layers of electronic components, and meanwhile, in order to improve the heat dissipation effect of the first type of electronic components positioned between the two layers of printed circuit boards, the first heat dissipation holes are formed in the corresponding positions of the second printed circuit board above the first type of electronic components, so that the heat generated by the first type of electronic components can be dissipated from the corresponding first heat dissipation holes, and the working performance of the first type of electronic components is ensured.
Meanwhile, the whole thickness of the stacked module can be reduced by arranging the second type of electronic element on the fourth surface.
In one implementation, the first heat dissipation holes are filled with heat dissipation glue.
The heat dissipation effect of the first type of electronic element can be improved by filling the first heat dissipation hole with heat dissipation glue.
In one implementation, a heat conductive metal is disposed in the first heat dissipation hole, and the heat conductive metal is in contact with the first type of electronic component on the first printed circuit board.
The heat dissipation effect of the first type of electronic element can be improved by adding the heat conducting metal in each first heat dissipation hole.
In one implementation, a heat pipe is disposed in the first heat dissipation hole.
The heat pipe arranged in the first heat dissipation hole can further conduct out the heat generated by the first type of electronic elements, so that the heat dissipation effect of the first type of electronic elements is improved.
In one implementation manner, the step of electrically connecting the first type of electronic component to the second circuit board is to solder the first type of electronic component to the first printed circuit board and the second printed circuit board respectively through solder balls to form electrical connections, where a collapse coefficient of the solder balls is less than or equal to a preset collapse coefficient threshold, and the collapse coefficient is used to represent a height difference between before solder ball soldering and after solder ball soldering is shaped.
The solder balls are used for welding, so that errors generated in the welding process of each layer of printed circuit board can be effectively reduced, and the welding precision of each layer of printed circuit board is improved.
In one implementation mode, the solder balls are provided with soldering flux, and the soldering flux is used for reducing the melting temperature of the solder balls.
The soldering flux is added on the solder ball, so that the soldering temperature can be effectively reduced, and the damage of high temperature to an electronic element is reduced.
In one implementation manner, a first elastic sheet and a second elastic sheet are arranged on one side, facing the fourth surface, of the first type of electronic element on the first printed circuit board; a first jack and a second jack are arranged on the fourth surface, the position of the first jack corresponds to the first elastic sheet, and the position of the second jack corresponds to the second elastic sheet; the first type of electronic element is electrically connected with the second circuit board, specifically, the first type of electronic element is electrically connected with the first printed circuit board by inserting the first elastic sheet into the first socket and inserting the second elastic sheet into the second socket.
The first type of electronic elements on the first printed circuit board can be electrically connected with the second printed circuit board through the insertion and matching between the elastic sheet and the socket, so that signals can be transmitted between the first type of electronic elements on the first printed circuit board and the second type of electronic elements on the second printed circuit board in the stacked module, and the effectiveness of the stacked module is ensured.
In one implementation, the second type of electronic component includes symmetrically arranged electronic components.
The pressure can be brought to the printed circuit board by the dead weight of each electronic element, the pressure distribution generated by each electronic element on the same layer of printed circuit board is balanced, and the stress of the layer of printed circuit board can be balanced, so that the structural stability of the layer of printed circuit board can be ensured, and further, the structural stability of the stacked module can be ensured.
Furthermore, the stacked module further comprises a balance member, so that the pressure generated by the second type of electronic element and the balance member is uniformly distributed on the second printed circuit board.
In order to avoid that the second type of electronic components cannot realize uniform pressure distribution due to distribution rules and the like, the first printed circuit board can be uniformly stressed by arranging the balance component on the third surface.
Further, the second printed circuit board is a flexible circuit board.
The flexible circuit board can adopt laser welding to realize the welding between first type of electronic component and the second printed circuit board, and the flexible circuit board can effectively transmit the produced heat of laser welding to make the tin ball melt and realize connecting, laser welding has stronger precision simultaneously, can further improve welding accuracy.
In one implementation, the first type of electronic component is a system on chip and the second type of electronic component is a ddr sdram.
Therefore, the heat dissipation of the system chip can be effectively ensured, and meanwhile, the system chip can be directly and electrically connected with the second printed circuit board so as to ensure the information transmission efficiency between the system chip and the electronic element on the second printed circuit board.
In one implementation, a frame plate is disposed between the first printed circuit board and the second printed circuit board.
This allows the support of the second printed circuit board by the frame plate while protecting the first type of electronic components located between the second printed circuit board and the first printed circuit board.
In one implementation, the frame plate is a hollow cylindrical structure in a shape of a Chinese character 'hui', and the electronic components between the first printed circuit board and the second printed circuit board are located inside the frame plate.
The size of the frame plate can be freely adjusted according to actual needs, and the frame plate can be freely disassembled and assembled according to actual needs.
In one implementation, the frame plate is a first groove structure integrally formed with the first printed circuit board, an opening of the first groove faces the second printed circuit board, and electronic components between the first printed circuit board and the second printed circuit board are located inside the first groove; or the frame plate is of a second groove structure integrally formed with the second printed circuit board, the opening of the second groove faces the first printed circuit board, and electronic elements between the first printed circuit board and the second printed circuit board are located inside the second groove.
Therefore, the steps required for manufacturing the stacked module can be effectively simplified while the function of the frame plate is ensured.
In one implementation, the stacked module further includes a third printed circuit board; the third printed circuit board is arranged above the second printed circuit board and comprises a fifth surface and a sixth surface, the sixth surface faces the second printed circuit board, and a third type of electronic element is arranged on the fifth surface or the sixth surface; the second type electronic element is electrically connected with the third printed circuit board, and the second type electronic element and the third type electronic element perform data transmission through the position where the second type electronic element is electrically connected with the third printed circuit board.
Therefore, the number of the electronic elements can be increased, and meanwhile, the data transmission among the first type of electronic elements, the second type of electronic elements and the third type of electronic elements can be effectively ensured.
In one implementation, the third printed circuit board is further provided with a second heat dissipation hole.
In order to ensure the heat dissipation effect of the first type of electronic components and the second type of electronic components, the third printed circuit board may be provided with a second heat dissipation hole for dissipating heat generated by the first type of electronic components and the second type of electronic components.
In one implementation, the third printed circuit board is disposed close to the first printed circuit board, the third printed circuit board includes a fifth surface and a sixth surface that are disposed oppositely, the fifth surface is a surface facing the first printed circuit board, and a third type of electronic component is disposed on the fifth surface; the third type of electronic element is electrically connected with the first printed circuit board, and the third type of electronic element and the first type of electronic element perform signal transmission through the position where the third type of electronic element is electrically connected with the first printed circuit board.
Therefore, the requirements on different electrical connection relations of the electronic element can be met.
The embodiment of the invention also provides a manufacturing method of the stacked module, which comprises the steps of mounting the first type of electronic element on the first surface of the first printed circuit board, and mounting the second type of electronic element on the third surface or the fourth surface of the second printed circuit board; removing materials on the second printed circuit board to form a first heat dissipation hole, wherein the opening position of the first heat dissipation hole corresponds to the position of the first type of electronic element on the first printed circuit board; and placing a second printed circuit board above the first printed circuit board, and electrically connecting the first electronic element on the first printed circuit board with the second printed circuit board to realize data transmission between the first electronic element and the second electronic element so as to form the stacked module.
The stacked module manufactured by the manufacturing method separates the adjacent two layers of electronic elements by utilizing the printed circuit boards, and simultaneously, in order to improve the heat dissipation effect of the first type of electronic elements positioned between the two layers of printed circuit boards, the first heat dissipation holes are arranged at the corresponding positions of the second printed circuit board above the first type of electronic elements, so that the heat generated by the first type of electronic elements can be dissipated from the corresponding first heat dissipation holes, and the working performance of the first type of electronic elements is ensured.
In one implementation, the first heat dissipation hole is filled with heat dissipation glue.
In one implementation, a heat conductive metal is disposed within the first heat dissipation via such that the heat conductive metal contacts the first type of electronic component on the first printed circuit board.
In one implementation, a heat pipe is disposed within the first louvers.
In one implementation manner, solder balls are arranged on two end surfaces of the first type of electronic component on the first printed circuit board, and the first type of electronic component is electrically connected with the first printed circuit board and the second printed circuit board through a welding manner.
In one implementation mode, a first elastic sheet and a second elastic sheet are arranged on one side, facing the fourth surface, of the first type electronic element on the first printed circuit board; arranging a first jack and a second jack on a second printed circuit board at positions corresponding to the first elastic sheet and the second elastic sheet; and the first elastic sheet is inserted into the first jack, and the second elastic sheet is inserted into the second jack, so that the first type of electronic element is electrically connected with the second printed circuit board.
In one implementation, the second type of electronic components on the second printed circuit board are symmetrically arranged.
In one implementation, a balance member is disposed on the second printed circuit board, so that the pressure generated by the second type of electronic component and the balance member is uniformly distributed on the second printed circuit board.
In one implementation, a frame plate is disposed between a first printed circuit board and a second printed circuit board.
In one implementation, a third layer of printed circuit board is disposed over the second printed circuit board; mounting a third type of electronic component on the fifth surface or the sixth surface of the third printed circuit board; removing materials of a third printed circuit board to obtain a second heat dissipation hole, wherein the position of the second heat dissipation hole corresponds to the position of a second type of electronic element on the second printed circuit board; and the third printed circuit board is arranged above the second printed circuit board and is electrically connected with the third printed circuit board through the second electronic element on the second printed circuit board so as to realize data transmission between the second electronic element and the third electronic element and form the stacked module.
Furthermore, material removing processing is carried out on the third printed circuit board in the area except the third type of electronic elements and the second heat dissipation hole to obtain a third heat dissipation hole so as to dissipate heat gathered between the second printed circuit board and the third printed circuit board.
The embodiment of the invention also provides a terminal which comprises the stacked module. The stacked module provided by the invention can effectively save the occupied area of the module in the terminal, and can be used for planning a larger space in the terminal to arrange components such as a battery with larger capacity and the like, so that the performance of the terminal is improved, and the terminal is also beneficial to miniaturization. In addition, because the stacked module provided by the embodiment of the invention has better heat dissipation performance, when the terminal needs to be operated at high speed, high concurrency and the like, the stacked module can still ensure higher performance, so that the service performance of the terminal provided by the invention is improved.
The embodiment of the invention also provides a terminal, which comprises a display screen, a battery, a shell and a stacked module; the stacked module comprises a first printed circuit board and a second printed circuit board; the first printed circuit board and the second printed circuit board are arranged in a stacked mode; the first printed circuit board comprises a first surface and a second surface, and the first surface is opposite to the second surface in direction; the first surface is a surface facing the second printed circuit board, and a first type of electronic element is arranged on the first surface; the second printed circuit board comprises a third surface and a fourth surface, the third surface is opposite to the fourth surface in direction, and the fourth surface is a surface facing the first printed circuit board; a second type of electronic element is arranged on the third surface or the fourth surface; the second printed circuit board is provided with a first radiating hole, and the opening position of the first radiating hole corresponds to the position of the first type of electronic element on the first printed circuit board; the first electronic component and the second electronic component are electrically connected with the second printed circuit board, and signal transmission is carried out at the position where the first electronic component and the second electronic component are electrically connected with the second printed circuit board; the display screen and the shell form an external structure of the terminal, and the battery and the stacked module are both positioned in the external structure of the terminal; the display screen and the battery are respectively and electrically connected with the stacked module; the battery is provided with a fourth printed circuit board, the stacked module is provided with a first interface, and the battery and the stacked module are inserted into the first interface through the fourth printed circuit board to realize electric connection; the display screen is provided with a fifth printed circuit board, the stacked module is provided with a second interface, and the display screen and the stacked module are inserted into the second interface through the fifth printed circuit board to realize electric connection.
Drawings
In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without any creative effort.
Fig. 1 is a schematic structural diagram of a conventional module provided in the present application;
fig. 2 is an exploded schematic view of a mobile phone according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a stacked module according to an embodiment of the present invention;
fig. 4 is an exploded view of a two-layer stacked module according to an embodiment of the present invention;
fig. 5 is a flowchart illustrating a manufacturing process of a stacked module according to the present embodiment;
fig. 6 is a front view of a stacked module according to the present embodiment;
fig. 7 is a schematic view illustrating filling of a heat dissipation glue according to the present embodiment;
fig. 8 is a schematic view illustrating filling of a heat conductive metal according to the present embodiment;
FIG. 9 is a schematic view of a welding process according to the present embodiment;
fig. 10 is a schematic distribution diagram of second pads provided in this embodiment;
fig. 11 is a schematic distribution diagram of the first pads provided in this embodiment;
fig. 12 is a schematic diagram of a plugging process provided in this embodiment;
fig. 13 is a schematic distribution diagram of a first elastic sheet and a second elastic sheet according to this embodiment;
fig. 14 is a schematic distribution diagram of a first jack and a second jack provided in this embodiment;
fig. 15 is a schematic distribution diagram of an electronic component according to this embodiment;
fig. 16 is a schematic distribution diagram of an electronic component according to this embodiment;
fig. 17 is a schematic structural view of a first frame plate provided in this embodiment;
fig. 18 is a schematic structural view of a second frame plate provided in this embodiment;
fig. 19 is a schematic structural view of a third frame plate according to the present embodiment;
fig. 20 is an exploded view of a three-layer stacked module according to the present embodiment;
fig. 21 is a front view of a three-layer stacked module according to the present embodiment;
FIG. 22 is an exploded view of a three-layered stacked module with second heat dissipation holes according to the present embodiment;
FIG. 23 is an exploded view of another three-layered stacked module according to the present embodiment;
FIG. 24 is a front view of another three-layer stacked module provided in this embodiment;
fig. 25 is an exploded view of a multi-layered stacked module according to the present embodiment;
fig. 26 is a schematic internal structure diagram of a terminal according to this embodiment.
Illustration of the drawings:
wherein, 01-the first surface, 02-the second surface, 03-the third surface, 04-the fourth surface, 05-the fifth surface, 06-the sixth surface, 001-the first printed circuit board, 002-the third printed circuit board, 003-the second printed circuit board, 004-the first electronic component, 005-the second electronic component, 006-the first heat dissipation hole, 007-the second heat dissipation hole, 008-the frame plate, 009-the heat dissipation glue, 010-the heat conduction metal, 011-the heat pipe, 012-the third electronic component, 1-the first pad, 2-the second pad, 3-the first groove, 4-the second groove, 5-balance part, 100-back shell, 101-first module, 1011-first interface, 1012-second interface, 1013-third interface, 1014-fourth interface, 102-second module, 103-earphone hole, 104-earphone, 105-camera, 106-printed circuit board, 1061-fourth printed circuit board, 1062-fifth printed circuit board, 1063-sixth printed circuit board, 1064-seventh printed circuit board, 107-battery, 108-mainboard, 109-display screen, 201-first shrapnel, 202-second shrapnel, 203-first jack, 204-second jack.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The normal operation of a terminal, such as a mobile phone, an iPad, a smart watch, and the like, depends on the mutual cooperation among various components, taking the mobile phone as an example, as shown in fig. 2, which is an exploded schematic view of a structure of the mobile phone provided by the embodiment of the present invention, the mobile phone is composed of a display screen 109, a rear case 100, and internal components, where the internal components at least include a first module 101, a second module 102, an earphone hole 103, an earphone 104, a camera 105, a plurality of printed circuit boards 106, a battery 107, and a motherboard 108. The main board 108 is disposed between the display screen 109 and the rear housing 100, and the rest of the internal components are disposed on the main board 108. Specifically, the earphone hole 103 and the earphone 104 are electrically connected to the first module 101, and the camera 105, the battery 107, the second module 102, and the display screen 109 are electrically connected to the first module 101 through the corresponding flexible circuit board 106.
Usually, a plurality of electronic components are packaged in the first module 101 and the second module 102 to provide a plurality of data processing functions such as logic operation and data storage for the mobile phone, and these electronic components may be a system on a chip (SoC) 041, a dynamic random access memory (e.g., double data rate synchronous dynamic random access memory (DDR SDRAM)) 042, a power management unit 043, a flash memory chip (e.g., an embedded multimedia card 044, a universal flash memory (UFS), etc.) 044, a radio frequency chip (RF) 045, and a power amplifier (power amplifier) 046.
In one embodiment, the SoC may include one or more processing units, such as: the SoC may include an Application Processor (AP), a modem processor, a Graphics Processing Unit (GPU), an Image Signal Processor (ISP), a controller, a video codec, a Digital Signal Processor (DSP), a baseband processor, and/or a neural-Network Processing Unit (NPU), among others. Wherein the different processing units may be separate devices or may be integrated in one or more units.
In order to make terminals such as mobile phones have richer functions, more components need to be added to implement the corresponding functions, and more components mean that more space inside the terminal needs to be occupied. As shown in fig. 2, the internal space of the terminal, especially a small terminal, such as a mobile phone is limited, and therefore, in order to achieve the above effect, the occupied area of the module can be reduced, that is, each electronic component in the module is designed to be stacked by using PoP package.
These electronic components can be classified into a first type electronic component and a second type electronic component according to power consumption, i.e., heat generated during operation. The power consumption of the first type of electronic element is greater than or equal to a preset power consumption threshold, for example, soC, the heat generated by the first type of electronic element during working is relatively high, and if the heat is not dissipated in time, the performance of the first type of electronic element is greatly influenced; the power consumption of the second type of electronic component is less than a preset power consumption threshold, for example, DDR, the amount of heat generated by the electronic component during operation is relatively low, and the influence of the generated heat on the performance of the electronic component is generally within a specified range. For the first type of electronic components, in the stacked module, if the first type of electronic components are located in the middle, the heat generated by the first type of electronic components is more difficult to dissipate, which may further affect the performance of the first type of electronic components.
Example 1
The present embodiment provides a stacked module, which can effectively solve the above problems, as shown in fig. 3, which is a schematic structural diagram of the stacked module according to the embodiment of the present invention, and as shown in fig. 4, which is an exploded schematic diagram of a two-layer stacked module according to the embodiment of the present invention, the stacked module provided by the present embodiment includes a second printed circuit board 003 and a first printed circuit board 001. The first printed circuit board 001 has a first surface 01 and a second surface 02, the first surface 01 is opposite to the second surface 02, and a first type electronic component 004 is mounted on the first surface 01 of the first printed circuit board. The second printed circuit board 003 has a third surface 03 and a fourth surface 04, the third surface 03 and the fourth surface 04 are opposite, and a second type of electronic component 005 is disposed on the third surface, and two second type of electronic components 005 are illustrated in this embodiment as an example. The first electronic component 004 is electrically connected to the first printed circuit board 001 and the second printed circuit board 003, respectively, so as to ensure that data can be transmitted between the first electronic component 004 and the second electronic component 005. The number of the first type electronic element 004 and the second type electronic element 005 can be set by self according to actual requirements.
In order to ensure the heat dissipation of the first electronic component 004, the second printed circuit board 003 is provided with a first heat dissipation hole 006 for dissipating heat generated by the first electronic component 004 on the first circuit board 001.
In one embodiment, each of the first printed circuit board 001 and the second printed circuit board 003 can have a single-layer board structure or a multi-layer board structure according to actual needs.
The stacked module provided by the embodiment utilizes the printed circuit boards to separate the adjacent two layers of electronic components, and meanwhile, in order to improve the heat dissipation effect of the first type of electronic components positioned between the two layers of printed circuit boards, the first heat dissipation holes are formed in the corresponding positions of the second printed circuit board above the first type of electronic components, so that the heat generated by the first type of electronic components can be dissipated from the corresponding first heat dissipation holes, and the working performance of the first type of electronic components is ensured.
Example 2
As shown in fig. 5, a flow chart of a manufacturing method of a stacked module according to the present embodiment includes:
s1, mounting a first type of electronic element on a first surface of a first printed circuit board, and mounting a second type of electronic element on a third surface or a fourth surface of a second printed circuit board;
s2, performing material removing processing on the second printed circuit board to form a first heat dissipation hole;
and S3, placing a second printed circuit board above the first printed circuit board, and electrically connecting the first type of electronic elements on the first printed circuit board with the second printed circuit board to form the stacked module.
In accordance with the stacked module shown in embodiment 1, first, one first electronic component 004 is mounted on the first surface 01 of the first printed circuit board 001, and two second electronic components 005 are mounted on the third surface 03 of the second printed circuit board 003 according to actual design requirements. Then, a first heat dissipation hole 006 is formed at a position of the second printed circuit board 003 corresponding to the first electronic component 004. Finally, the second printed circuit board 003 is placed on the first printed circuit board 001 in the order of connection set between the printed circuit boards. Meanwhile, the first type of electronic component 004 on the first printed circuit board 001 needs to be electrically connected to the second printed circuit board 003, and data transmission between the first type of electronic component 004 and the second type of electronic component 005 is realized through the electrical connection position of the first type of electronic component 004 and the second printed circuit board, so as to finally obtain the stacked module structure shown in embodiment 1.
Example 3
In one implementation, two electronic components of the second type 005 may be disposed on the fourth surface 04 of the second printed circuit board 003, as shown in fig. 6.
The second type of electronic component 005 can thereby be arranged between the first printed circuit board 001 and the second printed circuit board 003. Compared with the two-layer stacked module structure shown in fig. 4, in which the two second electronic elements 005 are exposed outside the stacked module, the stacked module provided in this embodiment effectively reduces the overall thickness of the stacked module by placing the two second electronic elements 005 inside the stacked module, thereby effectively reducing the thickness of the device in which the stacked module is located.
Example 4
In order to further improve the heat dissipation effect on the first type of electronic component 004, as shown in fig. 7, the first heat dissipation hole 006 is filled with a heat dissipation glue 009, wherein a filling ratio of the heat dissipation glue 009 in the first heat dissipation hole 006 affects thermal resistance, and the higher the filling ratio is, the lower the thermal resistance is, the better the heat dissipation effect is, for example, the maximum heat dissipation can be supported to be 5.1W by complete filling. Specifically, the filling ratio of the heat dissipation glue 009 can be selected by self-definition according to actual needs. Example 5
Also, in order to further enhance the heat dissipation effect of the first type of electronic component 004, as shown in fig. 8, a heat conductive metal 010 is disposed in each of the first heat dissipation holes 006 near the first printed circuit board 001, and the heat conductive metal 010 contacts with the first type of electronic component 004.
Further, a heat pipe 011 is disposed on the first heat dissipation hole 006, for example, as shown in fig. 8, the heat pipe 011 is connected to the heat conductive metal 010 in the first heat dissipation hole 006.
Wherein, the heat conduction metal can adopt the higher metal of coefficient of heat conductivity such as copper, silver to can derive the heat through first louvre 006 fast, furtherly, utilize the heat pipe to make the heat of gathering in the heap module discharge fast, and then effectively guarantee the radiating effect of heap module, wherein, the heat pipe can adopt the higher metal of coefficient of heat conductivity such as copper, silver to make.
Example 6
In order to realize the electrical connection between the first type of electronic component 004 and the second printed circuit board 003, a soldering method may be adopted, as shown in fig. 9, which is a schematic diagram of a soldering process provided in this embodiment, and the soldering process includes:
s101, arranging a second pad on a fourth surface of a second printed circuit board;
s102, arranging a solder ball on the second pad, wherein the collapse coefficient of the solder ball is smaller than or equal to a preset collapse coefficient threshold value, and the collapse coefficient is used for representing the height difference between the solder ball before being welded and the solder ball after being welded and shaped;
s103, staining a soldering flux on the solder balls, wherein the soldering flux is used for reducing the melting temperature of the solder balls;
s104, arranging a first bonding pad on one side of the first type of electronic element close to the second printed circuit board;
and S105, welding the first bonding pad and the second bonding pad through the solder ball according to the connection sequence among the printed circuit boards to form a signal path.
As shown in fig. 10, a schematic distribution diagram of the second pads provided in this embodiment is provided, and as shown in fig. 11, a schematic distribution diagram of the first pads provided in this embodiment is provided. Specifically, a first pad 1 is disposed on a side of the first type of electronic component 004 close to the second printed circuit board 003, and a second pad 2 is disposed on the fourth surface 04 of the second printed circuit board 003, wherein the second pad 2 is disposed at an edge of the first heat dissipation hole 006, and a position of the second pad 2 corresponds to a position of the first pad 1 of the first type of electronic component 004.
Solder balls are arranged on the second bonding pads 2, and then the second bonding pads 2 of the second printed circuit board 003 are correspondingly arranged on the first bonding pads 1 of the first type electronic component 004 according to the stacking sequence of the printed circuit boards.
The solder balls are melted by heating the solder balls, and the first pads 1 are electrically connected to the corresponding second pads 2 by a solidification force generated by re-solidification of the melted solder balls.
It should be noted that the position of the solder ball on the pad can be set according to the actual electrical relationship to be realized. Or may be determined from an actual structural model.
Therefore, the electrical connection relationship between the electronic components on different printed circuit boards can be realized through welding, so that a data transmission path between the electronic components is formed.
Further, in one implementation, the second printed circuit board 003 is a printed circuit board, and soldering may be performed by low temperature reflow soldering.
For example, solder balls are provided on the fourth surface 04 of the printed circuit board, and after the printed circuit board with the solder balls is stacked on the first printed circuit board 001, the solder balls are melted by low-temperature reflow soldering on the third surface of the printed circuit board, and heat is transferred to the solder balls by penetrating the printed circuit board. Because the printed circuit board has poor heat conductivity, the low-temperature reflow soldering is adopted, so that the high soldering power can be achieved, the heat can effectively penetrate through the printed circuit board, the solder balls on the printed circuit board are melted, and meanwhile, the soldering temperature adopted by the low-temperature reflow soldering is low, and the electronic elements can be prevented from being damaged due to overhigh soldering temperature.
In another implementation, the second printed circuit board 003 is a flexible circuit board, and laser welding can be used for welding.
For example, solder balls are provided on the fourth surface 04 of a Flexible Printed Circuit (FPC), and after the Flexible Circuit board with the solder balls is stacked on the first Printed Circuit board 001, the solder balls are melted by laser welding on the third surface 03 of the Flexible Circuit board, and heat is transferred to the solder balls through penetrating the Flexible Circuit board. Because the heat conductivity of flexible circuit board is better, consequently, adopt the laser welding that has lower welding power can make the heat effectively pierce through flexible circuit board, make the tin ball on the flexible circuit board melt, simultaneously, the laser welding has the advantage of energy concentration, can make welding position control more accurate to can effectively reduce the structural error of the heap module after the welding shaping.
Example 7
The present embodiment provides another way to achieve electrical connection between the first type of electronic component 004 and the second printed circuit board 003, that is, the electrical connection is achieved by plugging a spring sheet into a socket.
As shown in fig. 12, a schematic diagram of an insertion process provided in this embodiment is shown, where the insertion process includes:
s201, arranging a first elastic sheet and a second elastic sheet on one side of the first type of electronic element close to the second printed circuit board;
s202, arranging a first jack and a second jack on a third surface or a fourth surface of a second printed circuit board, wherein the arrangement position of the first jack corresponds to that of a first elastic sheet, and the arrangement position of the second jack corresponds to that of a second elastic sheet;
s203, according to the connection sequence of the printed circuit boards, the first elastic sheet is sequentially inserted into the first jack to form a signal path, and the second elastic sheet is sequentially inserted into the second jack to form a signal path.
Fig. 13 is a schematic distribution diagram of a first elastic piece and a second elastic piece provided in this embodiment, and fig. 14 is a schematic distribution diagram of a first socket and a second socket provided in this embodiment. Specifically, a first elastic sheet 201 and a second elastic sheet 202 are arranged on one side of the first electronic component 004 close to the second printed circuit board 003, and a first socket 203 and a second socket 204 are arranged on a fourth surface 04 of the second printed circuit board 003, wherein the first socket 203 and the second socket 204 are both arranged at the edge of the first heat dissipation hole 006, and the position of the first socket 203 corresponds to the position of the first elastic sheet 201; the second socket 204 corresponds to the second spring plate 202.
According to the stacking sequence of the printed circuit boards, the first jack 203 is correspondingly placed on the first elastic sheet 201, and the second jack 204 is correspondingly placed on the second elastic sheet 202. By applying pressure, the first elastic sheet 201 is inserted into the first jack 203, the second elastic sheet 202 is inserted into the second jack 204, and the electric connection is realized through pins arranged in the first elastic sheet 201, the second elastic sheet 202, the first jack 203 and the second jack 204.
Therefore, the electrical connection relationship between the electronic elements on different printed circuit boards can be realized through the insertion of the elastic sheet and the socket, so that a signal transmission path between the electronic elements is formed.
Example 8
In the process of welding or inserting the stacked module, the printed circuit board needs to be stacked, and in the process of stacking, the printed circuit board needs to be spatially transferred, and if the pressure distribution generated by the electronic element arranged on the printed circuit board is unbalanced, the printed circuit board is easy to deflect in the process of transferring, so that the overall error of the finally formed stacked module is larger.
In order to balance the pressure distribution generated on the second printed circuit board 003 based on the second electronic components on the second printed circuit board 003 conforming to the design positions, the second electronic components need to be mounted in such a distribution, and as shown in fig. 3, two second electronic components 005 can be symmetrically disposed on the second printed circuit board 003.
If the pressure distribution generated on the printed circuit board cannot be balanced based on the second type of electronic components on the second printed circuit board 003 conforming to the design position, the effect of pressure distribution balance needs to be achieved by adding the balance member 5.
As shown in fig. 15, in the distribution diagram of an electronic component provided in this embodiment, only one second type electronic component 005 is disposed on the second printed circuit board 003, and obviously, the pressure distribution balance cannot be achieved, in this case, a balance member 5 with the same weight as that of the second type electronic component 005 needs to be added at a symmetrical position to achieve the pressure distribution balance, or a balance member 5 with an appropriate weight needs to be added at an appropriate position to achieve the pressure distribution balance.
As shown in fig. 16, a distribution diagram of electronic components provided in this embodiment is shown, wherein two second type electronic components 005 are disposed on the second printed circuit board 003, but the weight difference between the two second type electronic components 005 is large, and pressure distribution balance cannot be achieved, and in this case, a balance member 5 with an appropriate weight may be added at an appropriate position to achieve pressure distribution balance.
Therefore, the stability of the second printed circuit board 003 in the transfer process can be ensured, and the formed stacked module can be prevented from deflection, toppling and the like due to unbalanced gravity distribution in the subsequent use process, so that the use stability of the stacked module can be ensured.
Example 9
In this embodiment, the first electronic component 004 is an SoC, and the second electronic component 005 is a DDR.
Therefore, the heat dissipation of the SoC can be effectively guaranteed, and meanwhile, the SoC can be directly electrically connected with the second printed circuit board 003, so that the information transmission efficiency between the SoC and the DDR on the second printed circuit board 003 is guaranteed.
Example 10
In this embodiment, three structures of the frame plate 008 are provided, and in an implementation manner, as shown in fig. 17, the frame plate 008 is a separate structure and has a hollow cylindrical structure in a shape of a Chinese character 'hui'.
In another implementation manner, as shown in fig. 18, in a schematic structural diagram of a frame plate provided in this embodiment, a first groove 3 is formed in a first surface 01 of a first printed circuit board 001, an opening of the first groove 3 faces a second printed circuit board 003, and the first groove 3 is integrally formed with the first printed circuit board 001.
In another implementation manner, as shown in fig. 19, in a schematic structural diagram of a frame plate provided in this embodiment, a second groove 4 is formed on a fourth surface 04 of a second printed circuit board 003, an opening of the second groove 4 faces the first printed circuit board 001, and the second groove 4 is integrally formed with the upper printed circuit board 003.
If a plurality of layers of frame plates 008 are required in the stacked module, one of the frame plate 008 structures may be selected, or several of the frame plate 008 structures may be selected for use.
Example 11
Based on the above-described embodiment, the third printed circuit board 002 may be disposed above the second printed circuit board 003 as necessary.
Specifically, as shown in fig. 20, an exploded view of a three-layer stacked module according to the present embodiment is provided, and as shown in fig. 21, a front view of a three-layer stacked module according to the present embodiment is provided. The third printed circuit board 002 is disposed above the second printed circuit board 003, the third printed circuit board 002 includes a fifth surface 05 and a sixth surface 06, the sixth surface 06 is a surface facing the second printed circuit board 003, and a third type of electronic element 012 is disposed on the fifth surface 05 or the sixth surface 06; the second type electronic element 005 is electrically connected to the third printed circuit board 002, and the second type electronic element 005 and the third type electronic element 012 perform data transmission through the position where the second type electronic element 005 is electrically connected to the third printed circuit board 002.
In the stacked module provided in this embodiment, since the second type of electronic element 005 exists on the second printed circuit board 003, as shown in fig. 22, a second heat dissipation hole 007 for providing heat dissipation function to the second type of electronic element 005 needs to be formed on the third printed circuit board 002 adjacent to the second type of electronic element 005 to ensure the heat dissipation effect of each second type of electronic element 005. Further, on the basis of embodiment 11, since the distance between the printed circuit boards is small, which is not favorable for heat dissipation, in order to further improve the heat dissipation effect of the stacked module, heat dissipation holes can be added on the third printed circuit board 002 except for the third type electronic element 012 and the aforementioned third heat dissipation hole 013, so that the heat gathered between the second printed circuit board 003 and the third printed circuit board 002 can be effectively dissipated through the heat dissipation holes.
Example 12
Based on embodiment 11, as shown in fig. 23, an exploded view of a three-layer stacked module according to this embodiment is provided, and as shown in fig. 24, a front view of a three-layer stacked module according to this embodiment is provided. The third printed circuit board 002 is disposed at a side close to the first printed circuit board 001, the third printed circuit board 002 includes a fifth surface 05 and a sixth surface 06 disposed oppositely, the fifth surface 05 is a surface facing the first printed circuit board 001, and a third type electronic element 012 is disposed on the fifth surface 05; the third type electronic element 012 is electrically connected to the first printed circuit board 001, and the third type electronic element 012 and the first type electronic element 004 transmit signals through the position where the third type electronic element 012 is electrically connected to the first printed circuit board 001.
The structure of the stacked module disclosed in this embodiment can be adopted to dispose the third pcb 002 on the side close to the first pcb 001 according to the requirement of the electrical connection relationship between the electronic components.
Meanwhile, in order to ensure the heat dissipation effect of the third type of electronic component 012, heat dissipation holes may be formed in the first printed circuit board 001 and the third type of electronic component 012 at positions corresponding to each other. Further, in order to enhance the heat dissipation effect of the stacked module, heat dissipation holes may be formed in the second printed circuit board 003 in regions other than the second type of electronic component 005 and the currently formed first heat dissipation hole 006, so as to dissipate heat accumulated between the first printed circuit board 001 and the second printed circuit board 003.
Example 13
Based on the above-described embodiments, a stacked module composed of any number of printed circuit boards can be formed as shown in fig. 25 according to actual needs. Wherein any number of electronic components may be provided on each layer of the printed circuit board. The multi-layer stacked module provided in this embodiment may be based on the two-layer stacked module described in any of embodiments 1 to 11, and any number of printed circuit boards are added above the two-layer stacked module, or any number of printed circuit boards are added below the two-layer stacked module, or any number of printed circuit boards are added above and below the two-layer stacked module at the same time, so as to form the multi-layer stacked module. Fig. 25 is a multi-layered stacked module formed by adding any number of printed circuit boards simultaneously above and below the two-layered stacked module. The hole-forming rule of the added printed circuit board can refer to the hole-forming rule of the third printed circuit board 002 disclosed in embodiments 11 and 12, and is not described herein again. Meanwhile, for other structural features of the multi-layer stacked module provided in this embodiment, reference may be made to the above embodiments, which are not described herein again.
Example 14
Carry out the capability test to the heap module that this application provided, put into imitative terminal model with the heap module to make this heap module carry out the maximum operation, so that each electronic component in the heap module produces higher heat, obtain the test result as follows:
therefore, compared with the higher-level packaging module in the industry, the stacked module provided by the invention has the leading test scores, and by using the stacked module provided by the invention, the problem of heat accumulation of each electronic element in the module can be ensured through high-efficiency heat dissipation performance, so that the temperature of the electronic element is not greatly increased, and the performance of the electronic element is not influenced by self heat generation.
Example 15
Fig. 26 is a schematic internal structure diagram of a terminal according to this embodiment.
As shown in fig. 26, the electronic device includes a display screen 109, a battery 107, and a first module 101 provided in an embodiment of the present invention; the battery 107 and the first module 101 are disposed in a housing of the terminal, wherein the first module 101 is the stacked module provided in embodiments 1 to 13, and a plurality of electronic components are packaged in the stacked module and used for providing various data processing functions such as logic operation and data storage for the terminal, and the electronic components may be SoC, DDR, flash memory, UFS, RF, power amplifier, and the like.
In one embodiment, the SoC may include one or more processing units, such as: the SoC may include an Application Processor (AP), a modem processor, a Graphics Processing Unit (GPU), an Image Signal Processor (ISP), a controller, a video codec, a Digital Signal Processor (DSP), a baseband processor, and/or a neural-Network Processing Unit (NPU), among others. Wherein the different processing units may be separate devices or may be integrated in one or more units.
In one implementation, a fourth printed circuit board 1061 is disposed on the battery 107, a first interface 1011 corresponding to the fourth printed circuit board 1061 is disposed on the first module 101, and the fourth printed circuit board 1061 is inserted into the first interface 1011, so that the battery 107 is electrically connected to the first module 101 to supply power to the electronic components mounted on the first module 101.
Wherein the electronic device further comprises a display screen 109.
In one implementation, the display screen 109 may be mounted on the terminal housing, the display screen is provided with a fifth printed circuit board 1062, the first module 101 is provided with a second interface 1012 corresponding to the fifth printed circuit board 1062, and the fifth printed circuit board 1062 is inserted into the second interface 1012, so that the display screen 109 and the first module 101 are electrically connected. The display screen 109 is used for displaying images, videos, and the like, and the display screen 109 includes a display panel, and the display panel may adopt a Liquid Crystal Display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode (AMOLED) or an active-matrix organic light-emitting diode (OLED), a flexible light-emitting diode (FLED), a miniature, a Micro-electro, a quantum dot light-emitting diode (QLED), and the like. In some embodiments, the terminal may include 1 or N display screens, N being a positive integer greater than 1.
Wherein the electronic device further comprises a camera 105.
In one implementation manner, the camera 105 is disposed at one side of the first module 101, the camera 105 is provided with a sixth printed circuit board 1063, the first module 101 is provided with a third interface 1013 corresponding to the sixth printed circuit board 1063, and the sixth printed circuit board 1063 is inserted into the third interface 1013, so that the camera 105 is electrically connected to the first module 101. The camera 105 is used to capture still images or video, and the object generates an optical image through a lens and projects the optical image onto a photosensitive element, which may be a Charge Coupled Device (CCD) or a complementary metal-oxide-semiconductor (CMOS) phototransistor. The photosensitive element converts the optical signal into an electrical signal, and then transfers the electrical signal to an Image Signal Processor (ISP) to be converted into a digital image signal. The ISP outputs the digital image signal to a Digital Signal Processor (DSP) for processing. Both ISP and DSP are installed on the first module 101. The DSP converts the digital image signal into image signal in standard RGB, YUV and other formats. In some embodiments, the terminal may include 1 or N cameras 105, N being a positive integer greater than 1.
The terminal further comprises an earpiece 104, among other things. The earpiece 104 is soldered to the first module 101 through a solder pad, and is electrically connected to the first module 101. The earpiece 104 is used to convert electrical audio signals into acoustic signals. When the electronic device is listening to a phone call or voice message, the voice can be heard by placing the handset 104 close to the ear of the person.
Wherein the terminal further comprises an earphone hole 103.
In one implementation, one end of the earphone hole 103 is located on the housing for a user to insert an earphone, and the other end is soldered on the first module 101 through a pad on the first module 101 to be electrically connected to the first module 101. The headset interface 103 may be a USB interface, or may be an open mobile electronic device platform (OMTP) standard interface of 3.5mm, or a cellular telecommunications industry association (cellular telecommunications industry association of the USA, CTIA) standard interface.
The terminal is provided with a first module 101 provided by the embodiment of the invention.
In one implementation, for example, the electronic device shown in fig. 26 further includes a second module 102, the first module 101 is disposed at the top of the housing, the battery 107 is disposed in the middle of the housing, the second module 102 is disposed at the bottom of the housing, the first module 101 and the second module 102 are provided with a fourth interface 1014, and are electrically connected through the plugging of a seventh printed circuit board 1064 and the fourth interface 1014, wherein the second module 102 may adopt the stacked modules provided in embodiments 1 to 13.
The fourth pcb 1061, the fifth pcb 1062, the sixth pcb 1063, and the seventh pcb 1064 may be the same as or different from the first pcb 001, the second pcb 003, and the third pcb 002.
The electronic equipment can be mobile phones, flat panels, display screens, wearable equipment, glasses and other electronic equipment with circuit boards.
The electronic device provided by the embodiment of the invention uses the printed circuit board with the stacked structure, so that the projection area occupied by the printed circuit board in the electronic device can be saved, a larger space can be planned in the electronic device, and a larger-capacity battery 107 can be arranged, so that the endurance of the electronic device is improved, and the miniaturization of the electronic device is facilitated. In addition, the printed circuit board of the printed circuit board provided by the embodiment of the invention has higher welding reliability, and when the electronic equipment encounters external forces such as falling, vibration, impact or cold and heat change, the printed circuit board is not easy to be damaged by open welding and the like, so that the service life and the reliability of the electronic equipment provided by the embodiment of the invention are improved.
Claims (17)
1. A stacked module, comprising: a first printed circuit board and a second printed circuit board; the first printed circuit board and the second printed circuit board are arranged in a stacked mode;
the first printed circuit board comprises a first surface and a second surface, and the first surface is opposite to the second surface in direction; the first surface is a surface facing the second printed circuit board, and a first type of electronic element is arranged on the first surface;
the second printed circuit board comprises a third surface and a fourth surface, the third surface is opposite to the fourth surface in direction, and the fourth surface is a surface facing the first printed circuit board; a second type of electronic element is arranged on the third surface or the fourth surface; the second printed circuit board is provided with a first radiating hole, and the opening position of the first radiating hole corresponds to the position of the first type of electronic element on the first printed circuit board;
the first type electronic element is electrically connected with the second printed circuit board, and the first type electronic element and the second type electronic element carry out signal transmission through the position where the first type electronic element is electrically connected with the second printed circuit board;
the first radiating hole is internally filled with radiating glue, or the first radiating hole is internally provided with heat conducting metal which is in contact with the first type of electronic elements on the first printed circuit board.
2. The stacked module as claimed in claim 1, wherein a heat pipe is disposed in the first heat dissipation hole.
3. The stacked module as claimed in claim 1 or 2, wherein the first type of electronic component is electrically connected to the second printed circuit board by soldering the first type of electronic component to the first printed circuit board and the second printed circuit board respectively via solder balls, and a collapse coefficient of the solder balls is less than or equal to a predetermined collapse coefficient threshold, the collapse coefficient representing a height difference between before and after the solder balls are soldered.
4. The stacked module defined in claim 3 wherein the solder balls are provided with a flux, the flux being effective to lower the melting temperature of the solder balls.
5. The stacked module according to claim 1 or 2, wherein a first spring piece and a second spring piece are arranged on a side of the first type of electronic element on the first printed circuit board facing the fourth surface;
a first jack and a second jack are arranged on the fourth surface, the position of the first jack corresponds to the first elastic sheet, and the position of the second jack corresponds to the second elastic sheet;
the first type of electronic element is electrically connected with the second printed circuit board, specifically, the first type of electronic element is electrically connected with the first printed circuit board by inserting the first elastic sheet into the first socket and inserting the second elastic sheet into the second socket.
6. The stacked module as claimed in claim 1 or 2, wherein the second type of electronic components comprises symmetrically arranged electronic components.
7. The stacked module as claimed in claim 1 or 2, further comprising a balance member to uniformly distribute a pressure generated by the second type of electronic component and the balance member on the second printed circuit board.
8. The stacked module according to claim 1 or 2, wherein the second printed circuit board is a flexible circuit board.
9. The stacked module as claimed in claim 1 or 2, wherein the first type of electronic component is a system on chip (SoC) and the second type of electronic component is a double data rate synchronous dynamic random access memory (DDR SDRAM).
10. The stacked module according to claim 1 or 2, wherein a frame plate is disposed between the first printed circuit board and the second printed circuit board.
11. The stacked module as claimed in claim 10, wherein the frame plate is a hollow cylindrical structure with a square-shaped cross-section, and the electronic components between the first printed circuit board and the second printed circuit board are located inside the frame plate.
12. The stacked module as claimed in claim 10, wherein the frame plate is a first groove structure integrally formed with the first pcb, the first groove opening to the second pcb, and the electronic components between the first pcb and the second pcb are located inside the first groove;
or the frame plate is of a second groove structure integrally formed with the second printed circuit board, an opening of the second groove faces the first printed circuit board, and electronic components between the first printed circuit board and the second printed circuit board are located inside the second groove.
13. The stacked module according to claim 1 or 2, further comprising a third printed circuit board stacked with the first printed circuit board and the second printed circuit board;
the third printed circuit board is arranged close to the second printed circuit board and comprises a fifth surface and a sixth surface which are arranged oppositely, the sixth surface is a surface facing the second printed circuit board, and a third type of electronic element is arranged on the fifth surface or the sixth surface;
the second type electronic element is electrically connected with the third printed circuit board, and the second type electronic element and the third type electronic element carry out signal transmission through the position where the second type electronic element is electrically connected with the third printed circuit board.
14. The stacked module as claimed in claim 13, wherein the third pcb is further formed with a second heat via.
15. The stacked module according to claim 1 or 2, further comprising a third printed circuit board disposed in a stack with the first printed circuit board and the second printed circuit board;
the third printed circuit board is arranged close to the first printed circuit board and comprises a fifth surface and a sixth surface which are arranged oppositely, the fifth surface is a surface facing the first printed circuit board, and a third type of electronic element is arranged on the fifth surface;
the third type electronic element is electrically connected with the first printed circuit board, and the third type electronic element and the first type electronic element perform signal transmission through the position where the third type electronic element is electrically connected with the first printed circuit board.
16. A terminal comprising a stacked module according to any of claims 1-15.
17. A terminal is characterized by comprising a display screen, a battery, a shell and a stacked module;
the stacked module comprises a first printed circuit board and a second printed circuit board; the first printed circuit board and the second printed circuit board are arranged in a stacked mode;
the first printed circuit board comprises a first surface and a second surface, and the first surface is opposite to the second surface in direction; the first surface is a surface facing the second printed circuit board, and a first type of electronic element is arranged on the first surface;
the second printed circuit board comprises a third surface and a fourth surface, the third surface is opposite to the fourth surface in direction, and the fourth surface is a surface facing the first printed circuit board; a second type of electronic element is arranged on the third surface or the fourth surface; the second printed circuit board is provided with a first radiating hole, and the opening position of the first radiating hole corresponds to the position of the first type of electronic element on the first printed circuit board;
the first type electronic element is electrically connected with the second printed circuit board, and the first type electronic element and the second type electronic element carry out signal transmission through the position where the first type electronic element is electrically connected with the second printed circuit board; the first radiating hole is internally filled with radiating glue, or the first radiating hole is internally provided with heat conducting metal which is in contact with the first type of electronic elements on the first printed circuit board;
the display screen and the shell form an external structure of the terminal, and the battery and the stacked module are both positioned in the external structure of the terminal;
the display screen and the battery are respectively and electrically connected with the stacked module;
the battery is provided with a fourth printed circuit board, the stacked module is provided with a first interface, and the battery and the stacked module are inserted into the first interface through the fourth printed circuit board to realize electric connection;
the display screen is provided with a fifth printed circuit board, the stacked module is provided with a second interface, and the display screen and the stacked module are inserted into the second interface through the fifth printed circuit board to realize electric connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911271920.6A CN112996216B (en) | 2019-12-12 | 2019-12-12 | Stack-based module and manufacturing method thereof and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911271920.6A CN112996216B (en) | 2019-12-12 | 2019-12-12 | Stack-based module and manufacturing method thereof and terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112996216A CN112996216A (en) | 2021-06-18 |
| CN112996216B true CN112996216B (en) | 2023-04-04 |
Family
ID=76331578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911271920.6A Active CN112996216B (en) | 2019-12-12 | 2019-12-12 | Stack-based module and manufacturing method thereof and terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112996216B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117135823A (en) * | 2022-05-20 | 2023-11-28 | 华为技术有限公司 | Packaging structure, packaging method and electronic equipment |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11112174A (en) * | 1997-09-30 | 1999-04-23 | Toshiba Corp | Circuit module having heat dissipating means of circuit component and portable type information apparatus mounting the same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100643935B1 (en) * | 2005-06-30 | 2006-11-10 | 삼성전기주식회사 | Parallel-type chip embedded pcb and method of the same |
| KR101941024B1 (en) * | 2014-03-27 | 2019-01-22 | 삼성전자주식회사 | Shield can assembly and electronic device having it |
| CN208386999U (en) * | 2018-06-14 | 2019-01-15 | Oppo（重庆）智能科技有限公司 | Circuit board assemblies and electronic device with it |
-
2019
- 2019-12-12 CN CN201911271920.6A patent/CN112996216B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11112174A (en) * | 1997-09-30 | 1999-04-23 | Toshiba Corp | Circuit module having heat dissipating means of circuit component and portable type information apparatus mounting the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112996216A (en) | 2021-06-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2020221051A1 (en) | Printed circuit board and manufacturing method therefor, and electronic device | |
| US10622289B2 (en) | Stacked chip-on-board module with edge connector | |
| CN214256758U (en) | Electronic component, circuit board assembly and electronic equipment | |
| CN104576557A (en) | Semiconductor package devices including interposer openings | |
| KR20150033133A (en) | A semiconductor package and method of fabricating the same | |
| JP2007318761A (en) | Camera module and camera module assembly | |
| US9119320B2 (en) | System in package assembly | |
| CN104885217A (en) | Multiple die stacking for two or more die | |
| WO2021147676A1 (en) | Electronic assembly and electronic device | |
| AU2017403198B2 (en) | Mainboard for consumer electronic product, and terminal | |
| CN112243314A (en) | Circuit board assembly, manufacturing method of circuit board assembly and electronic equipment | |
| CN102668067A (en) | Patch on interposer assembly and structures formed thereby | |
| EP2311089B1 (en) | Optical communication in a semiconductor package-on-package stack | |
| CN112996216B (en) | Stack-based module and manufacturing method thereof and terminal | |
| US9451699B2 (en) | Circuit board, electronic device, and method of manufacturing circuit board | |
| CN110730561A (en) | Circuit board structure and electronic equipment | |
| TW201347120A (en) | Semiconductor chip, semiconductor package having the same, and stacked semiconductor package using the semiconductor package | |
| WO2021083056A1 (en) | Circuit board device and electronic apparatus | |
| KR101169662B1 (en) | Compact photographing apparatus for stereo image | |
| CN108650353B (en) | Mobile terminal | |
| US8508044B2 (en) | Semiconductor package, semiconductor device, and semiconductor module | |
| US20140015126A1 (en) | Semiconductor package and stacked semiconductor package using the same | |
| KR20130044050A (en) | Semiconductor package and stacked semiconductor package | |
| CN214592157U (en) | Bending circuit board, circuit board assembly and terminal | |
| CN216600298U (en) | Circuit assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |