CN117135823A

CN117135823A - Packaging structure, packaging method and electronic equipment

Info

Publication number: CN117135823A
Application number: CN202210550660.1A
Authority: CN
Inventors: 何大鹏; 曹曦; 于超伟; 梁英; 彭开强
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2022-05-20
Filing date: 2022-05-20
Publication date: 2023-11-28
Also published as: WO2023221529A1

Abstract

The application discloses a packaging structure, a packaging method and electronic equipment, wherein the packaging structure comprises a high-density printed circuit board and a power supply printed circuit board, a first component is arranged on one side surface of the high-density printed circuit board, the power supply printed circuit board is arranged on the other side surface of the high-density printed circuit board, the first component is directly arranged on the surface of the high-density printed circuit board so as to reduce the thickness of the packaging structure, a second component can be arranged on one side surface of the power supply printed circuit board, the second component is used for supplying power to the first component, the first component and the second component are integrated in the same packaging structure, the integration level of the packaging structure is improved, and a first protection plate is arranged on one side of the high-density printed circuit board, provided with the first component, and used for protecting the first component on the surface of the high-density printed circuit board from damage and pollution. The fastening structure penetrates through the first protection plate and the high-density printed circuit board, so that the high-density printed circuit board provided with the first component is fixedly connected with the first protection plate, and the packaging strength of the packaging structure is enhanced.

Description

Packaging structure, packaging method and electronic equipment

Technical Field

The present application relates to the field of integrated circuit manufacturing, and in particular, to a packaging structure, a packaging method, and an electronic device.

Background

With the development of computers, semiconductors, and communication technologies, various chips may be disposed in electronic devices to implement functions such as computing or data communication of the electronic devices. Specifically, a plurality of chips are packaged to obtain a packaging structure, and the packaging structure is installed in the electronic equipment to finally realize the functions of the electronic equipment.

In a package structure, a semiconductor chip (die) may be mounted on a package substrate, and then a plurality of package substrates on which the semiconductor chip is mounted are soldered on a printed circuit board (printed circuit board, PCB) by a soldering process, and the semiconductor chips on different package substrates are electrically connected through the package substrates and the PCB, referring to fig. 1, which is a schematic structural diagram of a current package structure, the semiconductor chip on the left package substrate is electrically connected with the semiconductor chip on the right package substrate through the left package substrate, the lower PCB and the right package substrate. However, this package structure has a problem of low integration of the package structure.

Therefore, how to obtain a package structure with high integration is a problem to be solved by those skilled in the art.

Disclosure of Invention

In view of the above, the embodiments of the present application provide a packaging structure, a packaging method, and an electronic device, which can achieve high integration of the packaging structure.

According to the first aspect of the embodiment of the application, the packaging structure comprises the high-density printed circuit board and the power supply printed circuit board, the first component is arranged on one side surface of the high-density printed circuit board, the power supply printed circuit board is arranged on the other side surface of the high-density printed circuit board, the first component is directly arranged on the surface of the high-density printed circuit board to realize electric connection with the high-density printed circuit board, and the packaging substrate is not required to be arranged between the first component and the high-density printed circuit board to realize electric connection, so that the thickness of the packaging structure is reduced while the technological process is saved, and in addition, the distance between the adjacent first components in the packaging structure is far smaller than the distance between the adjacent packaging substrates in the packaging structure due to the different packaging technologies of the first component and the packaging substrate, so that the area waste of the packaging structure is reduced, the communication path between the first components is shortened, and the energy loss is reduced. The second components can be arranged on one side surface of the power supply printed circuit board, the second components can be electrically connected with the first components through the power supply printed circuit board and the high-density printed circuit board and used for supplying power to the first components, the first components and the second components are integrated in the same packaging structure, the connection reliability of the first components and the second components is guaranteed while the integration level of the packaging structure is improved, and the wiring complexity and the current density of the high-density printed circuit board can be reduced to a certain extent due to the existence of the power supply printed circuit board, so that the reliability of the high-density printed circuit board is improved. The high density printed circuit board has a first protection board on the side where the first component is provided for protecting the first component on the surface of the high density printed circuit board from damage and contamination. The fastening structure penetrates through the first protection plate and the high-density printed circuit board, so that the high-density printed circuit board provided with the first component is fixedly connected with the first protection plate, and the packaging strength of the packaging structure is enhanced.

In some possible embodiments, the first component is disposed on a side surface of the high density printed circuit board remote from the power supply printed circuit board;

the high-density printed circuit board is provided with an avoidance opening, and the power supply printed circuit board exposed by the avoidance opening is provided with the second component.

In the embodiment of the application, the avoidance opening is arranged on the high-density printed circuit board, and the second component is arranged in the avoidance opening, so that the overall thickness of the packaging structure can be further reduced, the volume of the packaging structure is effectively reduced, and the miniaturization of the packaging structure is realized.

In some possible embodiments, the first component is disposed on a side surface of the high-density printed circuit board away from the power supply printed circuit board, and the second component is disposed on a side surface of the power supply printed circuit board away from the high-density printed circuit board.

In the embodiment of the application, the first components and the second components are arranged oppositely, so that a plurality of first components can be arranged on one side surface of the high-density printed circuit board, the distance between the plurality of first components is shorter, and the integration level in a limited packaging area can be improved. And a plurality of second components are arranged on one side surface of the power supply printed circuit board, so that sufficient power supply support can be provided for the plurality of first components.

In some possible embodiments, the number of power supply printed circuit boards is plural, each power supply printed circuit board supplying power to a corresponding first component.

In the embodiment of the application, the power is supplied by utilizing the plurality of power supply printed circuit boards, and the characteristic size of the plurality of power supply printed circuit boards can be smaller, so that the cost of the packaging structure can be further reduced.

In some possible embodiments, the method further comprises: a second protection plate;

the second protection plate is arranged on one side, far away from the high-density printed circuit board, of the power supply printed circuit board.

In the embodiment of the application, the second protection plate is used for protecting the device arranged on one side of the power supply printed circuit board far away from the high-density printed circuit board.

In some possible embodiments, if the high-density printed circuit board has an avoidance opening, the second component is disposed on the power supply printed circuit board exposed by the avoidance opening, and the method further includes:

and a third component is arranged on the surface of one side of the power supply printed circuit board, which is far away from the high-density printed circuit board, and the second protection plate is used for protecting the third component.

In the embodiment of the application, the third component is arranged on the surface of one side of the power supply printed circuit board far away from the high-density printed circuit board, so that more chips are integrated in the packaging structure, and the integration level is improved.

In some possible embodiments, the first protection plate and the second protection plate are used to dissipate heat from the first component and the second component, respectively.

In the embodiment of the application, the first protection plate and the second protection plate can protect the first component and the second component and can radiate heat of the first component and the second component.

In some possible embodiments, the feature size of the high density printed circuit board is equal to the feature size of the power supply printed circuit board, and the fastening structure penetrates through the first protection board, the high density printed circuit board, the power supply printed circuit board and the second protection board to achieve fixed connection of the first protection board, the high density printed circuit board, the power supply printed circuit board and the second protection board.

In the embodiment of the application, the first protection plate, the high-density printed circuit board, the power supply printed circuit board and the second protection plate are fixedly connected, so that the packaging strength of the packaging structure can be enhanced, and the performance of the packaging structure can be improved.

In some possible embodiments, the method further comprises: a connecting device;

the connecting device is arranged on one side surface of the high-density printed circuit board, which is far away from the power supply printed circuit board, and the first protection plate is provided with a first opening which exposes the connecting device;

Or alternatively, the first and second heat exchangers may be,

when the characteristic dimension of the high-density printed circuit board is equal to that of the power supply printed circuit board, the connecting device is arranged on the surface of one side, far away from the high-density printed circuit board, of the power supply printed circuit board, and the second protection plate is provided with a second opening, and the second opening exposes the connecting device;

or alternatively, the first and second heat exchangers may be,

when the characteristic dimension of the high-density printed circuit board is larger than that of the power supply printed circuit board, the connecting device is arranged on one side surface of the high-density printed circuit board, which is close to the power supply printed circuit board, and the second protection board is provided with a third opening, and the third opening exposes the connecting device.

In the embodiment of the application, the connecting device can be arranged on a high-density printed circuit board or a power supply printed circuit board, and different arrangement modes can provide more application scenes for the packaging structure.

In some possible embodiments, a thermally conductive material is also included between the first component and the first protective plate.

In the embodiment of the application, the heat conducting material is used for further providing a heat dissipation effect for the first component.

In some possible embodiments, the method further comprises: a first support structure;

The first support structure is disposed between the first protective plate and the high density printed circuit board.

In the embodiment of the application, the first supporting structure is used for supporting the first protection plate, so that the first protection plate is prevented from extruding the first component, and the leveling and the flatness control of the packaging structure can be realized.

In some possible embodiments, an adhesive material is further included between the high density printed circuit board and the power supply printed circuit board.

In the embodiment of the application, the bonding material realizes the tight and fixed connection of the high-density printed circuit board and the power supply printed circuit board, further increases the rigidity of the packaging structure and meets the requirements of the mechanical and reliability of the packaging structure.

In some possible embodiments, the first component includes a semiconductor chip and a surface mount device.

In some possible embodiments, the second component comprises a power supply device comprising a voltage regulation module, a resonant converter, and a capacitor.

In a second aspect of the embodiment of the present application, there is provided a packaging method, including:

a first component is arranged on one side surface of a high-density printed circuit board, a power supply printed circuit board is arranged on the other side of the high-density printed circuit board, and a second component is arranged on one side surface of the power supply printed circuit board; the second component is electrically connected with the first component through the high-density printed circuit board and the power supply printed circuit board and is used for supplying power to the first component;

A first protection plate is arranged on one side of the high-density printed circuit board, on which the first component is arranged; and a fastening structure is arranged, and penetrates through the first protection plate and the high-density printed circuit board, so that the high-density printed circuit board is fixedly connected with the first protection plate.

In some possible embodiments, before the first component is disposed on one side surface of the high-density printed circuit board, the method further includes:

forming an avoidance opening in the high-density printed circuit board;

the other side of the high-density printed circuit board is provided with a power supply printed circuit board, and the power supply printed circuit board is provided with a second component which comprises:

and the surface of one side of the power supply printed circuit board exposed by the avoidance opening is provided with the second component.

In some possible embodiments, the method further comprises:

and a third component is arranged on the surface of one side of the power supply printed circuit board, which is far away from the high-density printed circuit board.

And the second component is arranged on the surface of one side of the power supply printed circuit board, which is far away from the high-density printed circuit board.

In some possible embodiments, before the fastening structure is provided, further comprising:

and a second protection plate is arranged on one side of the power supply printed circuit board, which is far away from the high-density printed circuit board.

In some possible embodiments, the feature size of the high density printed circuit board is equal to the feature size of the power supply printed circuit board, and the disposing fastening structure includes:

the fastening structure penetrates through the first protection plate, the high-density printed circuit board, the power supply printed circuit board and the second protection plate, and the first protection plate, the high-density printed circuit board, the power supply printed circuit board and the second protection plate are fixedly connected.

In some possible embodiments, the method further comprises:

providing a connecting device on a surface of the high-density printed circuit board, which is far away from the power supply printed circuit board, wherein the first protection plate is provided with a first opening, and the first opening exposes the connecting device;

Or alternatively, the first and second heat exchangers may be,

when the characteristic dimension of the high-density printed circuit board is equal to that of the power supply printed circuit board, arranging the connecting device on the surface of one side of the power supply printed circuit board far away from the high-density printed circuit board, wherein the second protection plate is provided with a second opening, and the second opening exposes the connecting device;

or alternatively, the first and second heat exchangers may be,

and when the characteristic dimension of the high-density printed circuit board is larger than that of the power supply printed circuit board, the connecting device is arranged on the surface of one side, close to the power supply printed circuit board, of the high-density printed circuit board, the second protection plate is provided with a third opening, and the third opening exposes the connecting device.

In some possible embodiments, before the first protection board is disposed on the side where the first component is disposed on the high-density printed circuit board, the method further includes:

and covering the surface of one side of the first component far away from the high-density printed circuit board with a heat conducting material.

and a first supporting structure is arranged on one side of the high-density printed circuit board, on which the first component is arranged.

In some possible embodiments, the method further comprises:

and filling an adhesive material between the high-density printed circuit board and the power supply printed circuit board.

In a third aspect of the embodiments of the present application, an electronic device is provided, where the electronic device includes a package structure as described in the foregoing embodiments.

From the above technical solutions, the embodiment of the present application has the following advantages:

the embodiment of the application provides a packaging structure, which comprises a high-density printed circuit board and a power supply printed circuit board, wherein a first component is arranged on one side surface of the high-density printed circuit board, the power supply printed circuit board is arranged on the other side surface of the high-density printed circuit board, the first component is directly arranged on the surface of the high-density printed circuit board to realize electric connection with the high-density printed circuit board, and a packaging substrate is not required to be arranged between the first component and the high-density printed circuit board to realize electric connection, so that the thickness of the packaging structure is reduced while the technological process is saved, and in addition, the distance between the adjacent first components in the packaging structure is far smaller than the distance between the adjacent packaging substrates in the packaging structure due to the difference of the packaging technologies of the first component and the packaging substrate, so that the area waste of the packaging structure is reduced, the communication path between the first components is shortened, and the energy loss is reduced. The second components can be arranged on one side surface of the power supply printed circuit board, the second components can be electrically connected with the first components through the power supply printed circuit board and the high-density printed circuit board and used for supplying power to the first components, the first components and the second components are integrated in the same packaging structure, the connection reliability of the first components and the second components is guaranteed while the integration level of the packaging structure is improved, and the wiring complexity and the current density of the high-density printed circuit board can be reduced to a certain extent due to the existence of the power supply printed circuit board, so that the reliability of the high-density printed circuit board is improved. The high density printed circuit board has a first protection board on the side where the first component is provided for protecting the first component on the surface of the high density printed circuit board from damage and contamination. The fastening structure penetrates through the first protection plate and the high-density printed circuit board, so that the high-density printed circuit board provided with the first component is fixedly connected with the first protection plate, and the packaging strength of the packaging structure is enhanced.

Drawings

In order that the detailed description of the application may be clearly understood, a brief description of the drawings will be provided below in which the detailed description of the application is presented. It is apparent that these drawings are only some of the embodiments of the present application.

FIG. 1 is a schematic diagram of a package structure;

fig. 2-14 are schematic structural diagrams of various package structures according to an embodiment of the present application;

fig. 15 is a flow chart of a packaging method according to an embodiment of the present application;

fig. 16-27 are schematic structural views of a package structure manufactured according to a packaging method according to an embodiment of the present application.

Detailed Description

The terms "first," "second," "third," "fourth" and the like in the description and in the claims and in the above drawings, if any, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments described herein may be implemented in other sequences than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

While the embodiments of the present application have been illustrated and described in detail in the drawings, the cross-sectional view of the device structure is not to scale in the general sense for ease of illustration, and the drawings are merely exemplary and should not be construed as limiting the scope of the application. In addition, the three-dimensional dimensions of length, width and depth should be included in actual fabrication.

Currently, with the development of computer, semiconductor and communication technologies, various chips may be disposed in an electronic device to implement functions such as computing or data communication of the electronic device. Specifically, a plurality of chips are packaged to obtain a packaging structure, and the packaging structure is installed in the electronic equipment to finally realize the functions of the electronic equipment.

In a package structure, a semiconductor chip (die) may be mounted on a package substrate, and then a plurality of package substrates on which the semiconductor chip is mounted are soldered on a printed circuit board (printed circuit board, PCB) through a soldering process, and the semiconductor chips on different package substrates are electrically connected through the package substrate and the PCB, referring to fig. 1, which is a schematic structural diagram of a current package structure, the semiconductor chip on the left package substrate is electrically connected with the semiconductor chip on the right package substrate through the left package substrate, the lower PCB and the right package substrate, which results in a longer communication path of the semiconductor chip on the different package substrates. Because the large-size package substrate is difficult to manufacture, a plurality of semiconductor chips need to be arranged on the plurality of package substrates, the distance between the package substrates determines the integration level of the package structure, the minimum distance between the current package substrates is 0.9-1 mm, which is far greater than the distance between two adjacent semiconductor chips on the same package substrate, that is, the current package structure cannot integrate more semiconductor chips in a limited area. In addition, the semiconductor chip on the packaging substrate is electrically connected with the power supply device through the PCB, so that the power supply device can supply power to the semiconductor chip, but the power supply device is limited by the area of the PCB, and cannot be arranged. Therefore, the packaging structure has the problem that more semiconductor chips or power supply devices cannot be arranged in the packaging structure, and the integration level of the packaging structure is low.

In another package structure, an integrated fan-out package (InFO) technology is adopted, a package substrate and a PCB board are not adopted, and the semiconductor chip and the power supply device are directly soldered longitudinally, so that the electrical connection of the semiconductor chip and the power supply device is realized, but the scheme has a low yield and cannot be applied in industry on a large scale.

Based on this, the embodiment of the application provides a packaging structure, the packaging structure comprises a high-density printed circuit board and a power supply printed circuit board, a first component is arranged on one side surface of the high-density printed circuit board, the power supply printed circuit board is arranged on the other side surface of the high-density printed circuit board, the first component is directly arranged on the surface of the high-density printed circuit board to realize electric connection with the high-density printed circuit board, and a packaging substrate is not required to be arranged between the first component and the high-density printed circuit board to realize electric connection, so that the thickness of the packaging structure is reduced while the process flow is saved, and in addition, the distance between the adjacent first components in the packaging structure is far smaller than the distance between the adjacent packaging substrates in the packaging structure due to the different packaging processes of the first component and the packaging substrate, so that the area waste of the packaging structure is reduced, the communication path between the first components is shortened, and the energy loss is reduced. The second components can be arranged on one side surface of the power supply printed circuit board, the second components can be electrically connected with the first components through the power supply printed circuit board and the high-density printed circuit board and used for supplying power to the first components, the first components and the second components are integrated in the same packaging structure, the connection reliability of the first components and the second components is guaranteed while the integration level of the packaging structure is improved, and the wiring complexity and the current density of the high-density printed circuit board can be reduced to a certain extent due to the existence of the power supply printed circuit board, so that the reliability of the high-density printed circuit board is improved. The high density printed circuit board has a first protection board on the side where the first component is provided for protecting the first component on the surface of the high density printed circuit board from damage and contamination. The fastening structure penetrates through the first protection plate and the high-density printed circuit board, so that the high-density printed circuit board provided with the first component is fixedly connected with the first protection plate, and the packaging strength of the packaging structure is enhanced.

In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings.

Fig. 2 to 13 are schematic structural diagrams of various package structures according to an embodiment of the present application. The package structure provided by the embodiment of the present application includes a high-density printed circuit board 110, a power supply printed circuit board 120, a first protection plate 130, and a fastening structure 140.

For convenience of description, in the embodiment of the present application, the first protection plate is taken as the lower part of the packaging structure, and other components are disposed above the first protection plate for illustration. In fact, the "upper" and "lower" of the package structure are related to the placement direction of the package structure, and in other embodiments, the first protection plate may be placed upward, and other components are disposed under the first protection plate.

In an embodiment of the present application, the high density printed circuit board 110 may be one or more stacked printed circuit boards. The first component 111 is provided on one surface of the high-density printed circuit board 110, and as shown in fig. 2 to 7, fig. 2 is a cross section taken along the AA direction of the top view of the package structure shown in fig. 3, fig. 4 is a cross section taken along the BB direction of the top view of the package structure shown in fig. 5, and fig. 6 is a cross section taken along the CC direction of the top view of the package structure shown in fig. 7. The first component 111 may include a semiconductor chip and a surface mount device (surface mounting devices, SMD), where the semiconductor chip may be a memory chip or a large-size chip, that is, the surface of the high-density printed circuit board 110 may be directly provided with the large-size chip, so as to directly electrically connect the large-size chip and the high-density printed circuit board 110, and the package substrate is not required to be disposed between the large-size chip and the high-density printed circuit board to realize the electrical connection, which not only saves the process flow, but also reduces the thickness of the package structure. The surface mount device can be specifically at least one of a capacitor device, a resistor device and an inductor device, so that the personalized requirement of the packaging structure is met. The surface mount device may be disposed on the surface of the high density printed circuit board 110 using a surface mount technology (surface mounting technology, SMT). In the high-density printed circuit board 110, microstrip or copper traces are provided to realize electrical extraction of the high-density printed circuit board 110.

In the embodiment of the present application, the first component 111 is disposed on one surface of the high-density printed circuit board 110, and the power supply printed circuit board 120 is disposed on the other surface, i.e., the power supply printed circuit board 120 is disposed on the surface of the high-density printed circuit board 110 on which the first component 111 is not disposed. Specifically, the power supply printed circuit board 120 and the high density printed circuit board 110 may be combined by sintering or soldering to achieve an electrical connection between the power supply printed circuit board 120 and the high density printed circuit board 110. The power supply printed circuit board 120 is provided with a second component 121 on one side surface thereof, as shown with reference to fig. 2, 4 or 6. The second component 121 includes a power supply device including a voltage regulation module, a resonant converter, and a capacitor. The second component 121 may be electrically connected to the first component 111 through the power supply printed circuit board 120 and the high density printed circuit board 110 so that the second component 121 supplies power to the first component.

That is, in the embodiment of the present application, the first components 111 are directly disposed on one side surface of the high-density printed circuit board 110, and the distance between the first components 111 is relatively short, so that the area waste of the package structure is reduced, the communication path between the first components 111 is shortened, and the energy loss is reduced. And the second component 121 may be disposed on a surface of one side of the power supply printed circuit board 120, the second component 121 supplies power to the first component 111, and integrates the first component 111 and the second component 121 in the same package structure, so that the integration level of the package structure is improved, and meanwhile, the connection reliability of the first component 111 and the second component 121 is ensured, and in addition, when the second component 121 supplies power to the first component 111, the power supply printed circuit board 120 may reduce the wiring complexity and the current density of the high-density printed circuit board 110 to a certain extent, and improve the reliability of the high-density printed circuit board 110.

In the embodiment of the present application, the second component 121 may be disposed on any side surface of the power supply printed circuit board 120, as shown in fig. 2, 4 or 6, and will be described in detail below:

as a possible implementation manner, referring to fig. 2 or fig. 4, the first component 111 is disposed on a side surface of the high-density printed circuit board 110 away from the power supply printed circuit board 120, and the second component 121 is disposed on a side surface of the power supply printed circuit board 120 away from the high-density printed circuit board 110, that is, if the first component 111 is disposed on a lower side of the high-density printed circuit board 110, the second component 121 is disposed on an upper side of the power supply printed circuit board 120, that is, the first component 111 and the second component 121 are disposed opposite to each other. This can realize that a plurality of first components 111 are provided on one side surface of the high-density printed circuit board 110, and the pitch between the plurality of first components 111 is short, so that the degree of integration in a limited package area can be improved. And a plurality of second components 121 are provided on one side surface of the power supply printed circuit board 120, so that sufficient power supply support can be provided for the plurality of first components 111.

As another possible implementation manner, referring to fig. 6, the first component 111 is disposed on a surface of the high-density printed circuit board 110, which is far away from the power supply printed circuit board 120, and the high-density printed circuit board 110 has a dodging opening 112, the dodging opening 112 exposes a surface of the power supply printed circuit board 120, which is close to the high-density printed circuit board 110, and the second component 121 is disposed on a surface of the power supply printed circuit board 120, which is exposed by the dodging opening 112, that is, the first component 111 and the second component 121 are disposed on the same side of the power supply printed circuit board 120. Through set up dodge opening 112 on high density printed circuit board 110 to set up second components 121 in dodging opening 112, can further reduce packaging structure's overall thickness, effectively reduce packaging structure's volume, realize packaging structure's miniaturization.

That is, the second component 121 may be disposed on a side of the power supply pcb 120 away from the high-density pcb 110, or on a side of the power supply pcb 120 close to the high-density pcb 110, so as to provide more possibilities for the placement of the second component of the package structure, and meet the personalized requirements of the package structure, so as to widen the application scenario of the package structure.

In the embodiment of the present application, a first protection plate 130 is provided at the side of the high-density printed circuit board 110 where the first component 111 is provided, and as shown with reference to fig. 2 to 7, the first protection plate 130 serves to protect the first component 111 from contamination and damage. The first protection plate 130 may also have a heat dissipation function, that is, the first protection plate 130 may be made of a material having good heat conduction property so as to dissipate heat of the first component 111.

In the embodiment of the present application, the fastening structure 140 penetrates through the first protection plate 130 and the high-density printed circuit board 110 to realize the fixed connection between the high-density printed circuit board 110 provided with the first component 111 and the first protection plate 130, and compared with the package structure in which the first component is arranged on the package substrate and then the package substrate is soldered to the printed circuit board, the fastening structure 140 is directly used to realize the fixed connection between the high-density printed circuit board 110 and the first protection plate 130, so that the first component 111 can be more firmly fixed on the surface of the high-density printed circuit board 110, and the package strength of the package structure is further enhanced. In particular, the fastening structure 140 may be a fastening screw.

That is, in the package structure provided by the embodiment of the application, the plurality of first components 111 are directly arranged on the surface of the high-density printed circuit board 110, the first protection plate 130 is fixedly connected with the high-density printed circuit board 110 by using the fastening structure 140, the package strength of the package structure is enhanced while the integration level of the package structure is improved, the performance of the package structure is improved, the requirement on the package substrate is avoided, and the difficult problem of supplying the package substrate can be avoided.

In the embodiment of the present application, the number of the power supply printed circuit boards 120 may be one or more, which provides more structural possibilities for the package structure, and meets various scene requirements of the package structure, as shown in fig. 2-13, and described in detail below:

as one possible implementation manner, the number of the power supply printed circuit boards 120 is one, and referring to fig. 2, 3, 8-10, and 12-14, fig. 8 is a cross section taken along the DD direction of the top view of the package structure shown in fig. 9, and a plurality of second components 121 may be disposed on one complete power supply printed circuit board 120, so that the second components 121 supply power to the first components 111, and the complete power supply printed circuit board 120 may provide a stable supporting effect for the plurality of second components 121, and may also be combined with the high-density printed circuit board 110 to obtain a package structure with higher rigidity.

As an example, the feature size of the power supply printed circuit board 120 may be the same as the feature size of the high-density printed circuit board 110, i.e., the feature size of the power supply printed circuit board 120 may be equal to the feature size of the high-density printed circuit board 110, so that the power supply printed circuit board 120 can provide a strong supporting effect for the high-density printed circuit board 110, avoid breakage of the high-density printed circuit board 110, and further enhance the rigidity of the package structure, as shown with reference to fig. 2, 8, 12, or 13.

When the feature size of the power supply printed circuit board 120 may be the same as the feature size of the high density printed circuit board 110, the fastening structure 140 may penetrate the first protection plate 130, the high density printed circuit board 110 and the power supply printed circuit board 120 to achieve a fixed connection of the first protection plate 130, the high density printed circuit board 110 and the power supply printed circuit board 120, thereby providing a more stable and fastened package structure while improving the rigidity of the package structure.

As another example, the feature size of the power supply printed circuit board 120 may be different from the feature size of the high density printed circuit board 110, for example, the feature size of the power supply printed circuit board 120 may be smaller than the feature size of the high density printed circuit board 110, as shown with reference to fig. 4 or 14. The larger size of the power supply printed circuit board 120 is more expensive, so that the power supply printed circuit board 120 with a feature size slightly smaller than that of the high-density printed circuit board 110 can be used, which can provide a supporting function for the high-density printed circuit board 110 and can reduce the cost of the packaging structure.

As another possible implementation manner, the number of the power supply printed circuit boards 120 is plural, and referring to fig. 4 or 11, a plurality of second components 121 may be disposed on the power supply printed circuit boards 120, so that the second components 121 on each power supply printed circuit board 120 can supply power to the corresponding first component 111, and the power supply printed circuit boards 120 are utilized to supply power, so that the feature sizes of the power supply printed circuit boards 120 may be smaller, and the cost of the packaging structure may be further reduced.

As an example, when the first component 111 is disposed on a side surface of the high-density printed circuit board 110 away from the power supply printed circuit board 120 and the second component 121 is disposed on a side surface of the power supply printed circuit board 120 away from the high-density printed circuit board 110, each power supply printed circuit board 120 may be opposite to the first component 111 on the high-density printed circuit board 120, as shown in fig. 4, to achieve power supply to the first component 111 by using a minimum power supply path, avoid power supply loss, and improve the overall performance of the package structure.

As another example, when the second component 121 is disposed within the relief opening 112 of the high-density printed circuit board 110, a corresponding power supply printed circuit board 120 may be disposed for the first component 111 located in a different area of the high-density printed circuit board 110. The size range of the power supply printed circuit board 120 covers the area where the plurality of first components 111 are located, so that it is ensured that the current of the power supply printed circuit board 120 can be uniformly distributed to the plurality of first components 111.

In an embodiment of the present application, the package structure may further provide a second protection board 150 on a side of the power supply printed circuit board 120 remote from the high density printed circuit board 110, and as shown in fig. 8 to 14, the device disposed on the side of the power supply printed circuit board 120 remote from the high density printed circuit board 110 is protected by the second protection board 150.

As an example, when the first component 111 is disposed at a side surface of the high-density printed circuit board 110 remote from the power supply printed circuit board 120 and the second component 121 is disposed at a side surface of the power supply printed circuit board 120 remote from the high-density printed circuit board 110, the second protection plate 150 serves to protect the second component 121 disposed at a side of the power supply printed circuit board 120 remote from the high-density printed circuit board 110 from contamination and damage, as shown with reference to fig. 8. The second protection plate 150 may also have a heat dissipation function, that is, the second protection plate 150 may be made of a material having good heat conduction performance, so as to dissipate heat of the second component 121.

As another example, when the second component 121 is disposed in the escape opening 112 of the high-density printed circuit board 110, the third component 113 may be disposed at a side surface of the power supply printed circuit board 120 remote from the high-density printed circuit board 110 to integrate more chips in a package structure, improving the integration, and the second protection plate 150 may be used to protect the third component 113 disposed at a side of the power supply printed circuit board 120 remote from the high-density printed circuit board 110, as shown with reference to fig. 12 or 13. The third component 113 may include a surface mount device, which may be specifically disposed on a surface of the power supply pcb 120 away from the high-density pcb 110, where the surface mount device has a low height, and does not additionally increase the volume of the entire package structure.

In the embodiment of the present application, the fastening structure 140 may penetrate through the first protection plate 130, the high-density printed circuit board 110 and the second protection plate 150, and referring to fig. 10, the first protection plate 130, the high-density printed circuit board 110 and the second protection plate 150 are fixedly connected, so that the packaging strength of the packaging structure can be enhanced, and the performance of the packaging structure can be improved. Further, when the feature size of the power supply printed circuit board 120 may be the same as the feature size of the high-density printed circuit board 110, the fastening structure 140 may penetrate through the first protection plate 130, the high-density printed circuit board 110, the power supply printed circuit board 120, and the second protection plate 150 at the same time, further increasing the packaging strength of the packaging structure.

In an embodiment of the present application, a connection device 160 may be further disposed in the package structure, where the connection device 160 is used to implement the signal transmission function of the first component 111. The connection device 160 may be a high-speed interface connector. The connection device 160 may be disposed on the high-density printed circuit board 110 or on the power supply printed circuit board 120, and different arrangement modes can provide more application scenarios for the package structure.

As an example, the connection device 160 may be disposed on a surface of the high-density printed circuit board 110 on a side away from the power supply printed circuit board 120, as shown with reference to fig. 13, that is, the connection device 160 and the first component 111 are disposed on the same side of the high-density printed circuit board 110, and the connection device 160 may directly make electrical connection with the first component 111 using the high-density printed circuit board 110. Because of the thicker thickness of the connection device 160, the first protective plate 130 has a first opening 131, and the first opening 131 exposes the connection device 160.

As another example, when the feature size of the high-density printed circuit board 110 is equal to the feature size of the power supply printed circuit board 120, the connection device 160 may be disposed at a side surface of the power supply printed circuit board 120 remote from the high-density printed circuit board 110, as shown with reference to fig. 8 or 12, that is, the connection device 160 is disposed on the power supply printed circuit board 120, and the connection device 160 may make electrical connection with the first component 111 using the power supply printed circuit board 120 and the high-density printed circuit board 110. Since the connection device 160 is thicker, the second protection plate 150 has the second opening 151, and the second opening 151 exposes the connection device 160.

As yet another example, when the feature size of the high density printed circuit board 110 is greater than the feature size of the power supply printed circuit board 120, the connection device 160 may be disposed at a side surface of the high density printed circuit board 110 near the power supply printed circuit board 120, as shown with reference to fig. 10, 11, or 14, i.e., the connection device 160 and the first component 111 are disposed at different sides of the high density printed circuit board 110, and the connection device 160 may directly make electrical connection with the first component 111 using the high density printed circuit board 110. The second protection plate 150 has a third opening 152 due to the thicker thickness of the connection device 160, and the third opening 152 exposes the connection device 160.

As can be seen from the above description, fig. 2 to 7 show various placement positions of the connection devices 160, and the number of the connection devices 160 may be one or more, so that the specific number and positions of the connection devices 160 may be set according to the application scenario of the package structure.

In an embodiment of the present application, a heat conductive material 170 is further included between the first component 111 and the first protection plate 130, and the heat conductive material is used to further provide a heat dissipation effect for the first component 111, as shown in fig. 8-14. Specifically, when the second component 121 is disposed on a side surface of the power supply printed circuit board 120 remote from the high-density printed circuit board 110, a heat conductive material 171 is included between the second component 121 and the second protection board 150 for further providing a heat dissipation effect to the second component 121. When the second component 121 is disposed in the escape opening 112 of the power supply printed circuit board 120 near one side surface of the high density printed circuit board 110, a thermally conductive material 172 is included between the second component 121 and the first protective plate 130.

In an embodiment of the present application, the package structure may further include a supporting structure, where the supporting structure is used to support the first protection plate 130 or the second protection plate 150, so as to avoid the first protection plate 130 or the second protection plate 150 from extruding the first component 111 or the second component 121, and further enable leveling and flatness control of the package structure. The support structure includes a first support structure 181 and a second support structure 182, the first support structure 181 is disposed between the first protection plate 130 and the high density printed circuit board 110, and the second support structure 182 is disposed between the second protection plate 150 and the power supply printed circuit board 120. Specifically, the first support structure 181 and the first protection plate 130 may be a unitary structure, and the second support structure 182 and the second protection plate 150 may be a unitary structure.

In the embodiment of the present application, the high-density printed circuit board 110 and the power supply printed circuit board 120 are bonded by welding or sintering, and an adhesive material may be disposed between the high-density printed circuit board 110 and the power supply printed circuit board 120 in addition to solder, that is, the adhesive material is used to achieve tight fixation connection between the high-density printed circuit board 110 and the power supply printed circuit board 120, further increasing the rigidity of the package structure, and meeting the requirements of the package structure on mechanics and reliability.

In an embodiment of the present application, after the first component 111 is disposed on the surface of the high-density printed circuit board 110, an underfill (underfill) is further included on the first component 110 near the bottom of the high-density printed circuit board 110, the underfill being used to protect the first component 110 and to enhance the fixed connection between the first component 110 and the high-density printed circuit board 110. A protection structure may also be disposed around the first component 111, where the protection structure is used to encapsulate the first component 111 to protect the first component 111 from damage.

Based on the package structure provided by the embodiment of the present application, the embodiment of the present application further provides a packaging method, and referring to fig. 15, which is a flowchart of the packaging method provided by the embodiment of the present application, fig. 16 to fig. 27 are schematic structural diagrams of the package structure in a manufacturing process, where the method may include:

s101, a first component 111 is disposed on one surface of the high-density printed circuit board 110, and a power supply printed circuit board 120 is disposed on the other surface of the high-density printed circuit board 110, as shown with reference to fig. 16 to 27.

In an embodiment of the present application, a first component 111 may be disposed on one side surface of the high-density printed circuit board 110, and a power supply printed circuit board 120 is disposed on the other side surface, wherein a second component 121 is disposed on one side surface of the power supply printed circuit board 120, the second component 121 is electrically connected to the first component 111 by using the high-density printed circuit board 110 and the power supply printed circuit board 120, and the second component 121 is used to supply power to the first component 111.

The following three possible implementations are possible for the process of disposing the first component 111 on the high-density printed circuit board 110 and disposing the power supply printed circuit board 120:

the first implementation is to provide the first component 111 and the second component 121 on the surfaces of the high-density printed circuit board 110 and the power supply printed circuit board 120, respectively, after the high-density printed circuit board 110 and the power supply printed circuit board 120 are combined.

The second implementation is that after the first component 111 is disposed on the surface of the high-density printed circuit board 110, the high-density printed circuit board 110 is combined with the power supply printed circuit board 120 on which the second component 121 has been disposed.

The third implementation manner is that an avoidance opening 112 is formed on the high-density printed circuit board 110, then a first component 111 is disposed on one side surface of the high-density printed circuit board 110, a power supply printed circuit board 120 is disposed on the other side surface, and a second component 121 disposed on the surface of the power supply printed circuit board 120 is exposed by the avoidance opening 112.

The three possible implementations are described in detail below, and are not described in detail herein.

S102, a first protection plate 130 is provided on the side of the high-density printed circuit board 110 where the first component 111 is provided, and a fastening structure 140 is provided, as shown with reference to fig. 8 to 14.

In an embodiment of the present application, after the first component 111 is disposed at one side of the high-density printed circuit board 110 and the power supply printed circuit board 120 is disposed at the other side, the first protective plate 130 may be disposed at the side of the high-density printed circuit board 110 where the first component 111 is disposed, and then the fastening structure 140 may be disposed.

Specifically, a first protection plate 130 is provided on the side of the high-density printed circuit board 110 where the first component 111 is provided, and as shown with reference to fig. 8, the first protection plate 130 serves to protect the first component 111 from contamination and damage. The first protection plate 130 may also have a heat dissipation function, that is, the first protection plate 130 may be made of a material having good heat conduction property so as to dissipate heat of the first component 111.

Specifically, the fastening structure 140 penetrates through the first protection plate 130 and the high-density printed circuit board 110, so that the high-density printed circuit board 110 provided with the first component 111 and the first protection plate 130 are fixedly connected, and compared with the packaging structure in which the first component is arranged on the packaging substrate and then the packaging substrate is welded to the printed circuit board, the fastening structure 140 is directly utilized to realize the fixed connection of the high-density printed circuit board 110 and the first protection plate 130, so that the first component 111 can be more firmly fixed on the surface of the high-density printed circuit board 110, and the packaging strength of the packaging structure is further enhanced. In particular, the fastening structure 140 may be a fastening screw.

Three possible implementations of the process of providing the first component 111 on the high density printed circuit board 110 and providing the power supply printed circuit board 120 are described in detail below:

S101A-1: reference is made to fig. 16 for a combination of a high density printed circuit board 110 and a power supply printed circuit board 120.

In the embodiment of the present application, the high-density printed circuit board 110 and the power supply printed circuit board 120 may be combined by sintering or soldering, and the solder is provided between the high-density printed circuit board 110 and the power supply printed circuit board 120, so as to realize electrical connection between the high-density printed circuit board 110 and the power supply printed circuit board 120. The soldering process may be Land Grid Array (LGA) or Ball Grid Array (BGA), and the distance between the high-density printed circuit board 110 and the power supply printed circuit board 120 may be controlled by using a spacer when soldering.

The feature sizes of the high density printed circuit board 110 and the power supply printed circuit board 120 may be the same or different, and fig. 10 illustrates the same as an example.

S101A-2: the first component 111 is provided on a side surface of the high density printed circuit board 110 remote from the power supply printed circuit board 120, as shown with reference to fig. 17.

In an embodiment of the present application, the first component 111 may be disposed on a side surface of the high-density printed circuit board 110 remote from the power supply printed circuit board 120. Specifically, the first component 111 may include a semiconductor chip and a surface mount device, and the semiconductor chip may be disposed on the surface of the high-density printed circuit board 110 by a soldering or bonding process after the surface mount device is disposed on the surface of the high-density printed circuit board 110 by using a surface mount technology because the feature size of the surface mount device is small.

Specifically, after the first component 111 is disposed on the surface of the high-density printed circuit board 110, an underfill may be disposed on the first component 110 near the bottom of the high-density printed circuit board 110, where the underfill is used to protect the first component 110 and enhance the fixed connection between the first component 110 and the high-density printed circuit board 110. A protection structure may also be disposed around the first component 111, where the protection structure is used to encapsulate the first component 111 to protect the first component 111 from damage. The protective structure may be formed using a filling process or a molding process.

S101A-3: a first supporting structure 181 is provided on a side of the high density printed circuit board 110 where the first component 111 is provided, as shown with reference to fig. 18.

In the embodiment of the present application, after the first component 111 is disposed on the surface of the high-density printed circuit board 110 on the side far from the power supply printed circuit board 120, the first supporting structure 181 may be disposed on the surface of the high-density printed circuit board 110 on the side where the first component 111 is disposed, so as to implement leveling of the package structure and flatness control. Specifically, the first support structure 181 may be adhered or fastened to the high-density printed circuit board 110 using screws.

S101A-4: a second component 121 is provided on a side surface of the power supply printed circuit board 120 remote from the high-density printed circuit board 110, as shown with reference to fig. 19 or 20.

In an embodiment of the present application, after the first supporting structure 181 is disposed, the second component 121 may be disposed on a side surface of the power supply printed circuit board 120 remote from the high-density printed circuit board 110. In particular, the second component 121 may be soldered to the power supply printed circuit board 120.

In an embodiment of the present application, the connection device 160 may also be disposed in the package structure when the second component 121 is soldered.

As an example, when the feature size of the high-density printed circuit board 110 is equal to the feature size of the power supply printed circuit board 120, the connection device 160 may be soldered to a side surface of the power supply printed circuit board 120 remote from the high-density printed circuit board 110, as shown with reference to fig. 19, that is, the connection device 160 is soldered to the power supply printed circuit board 120, and the connection device 160 may make electrical connection with the first component 111 using the power supply printed circuit board 120 and the high-density printed circuit board 110.

As another example, when the feature size of the high-density printed circuit board 110 is larger than that of the power supply printed circuit board 120, the connection device 160 may be soldered to a surface of one side of the high-density printed circuit board 110 near the power supply printed circuit board 120, as shown with reference to fig. 20, that is, the connection device 160 and the first component 111 are disposed at different sides of the high-density printed circuit board 110, and the connection device 160 may directly make electrical connection with the first component 111 using the high-density printed circuit board 110.

S101B-1: a first component 111 is provided on one side surface of the high density printed circuit board 110, as shown with reference to fig. 21.

In an embodiment of the present application, the first component 111 may be disposed on one side surface of the high-density printed circuit board 110. Specifically, the first component 111 may include a semiconductor chip and a surface mount device, and the semiconductor chip may be disposed on the surface of the high-density printed circuit board 110 by a soldering or bonding process after the surface mount device is disposed on the surface of the high-density printed circuit board 110 using a surface mount technology because the feature size of the surface mount device is small.

Specifically, after the first component 111 is disposed on the surface of the high-density printed circuit board 110, an underfill may be disposed on the first component 110 near the bottom of the high-density printed circuit board 110, where the underfill is used to protect the first component 110 and enhance the fixed connection between the first component 110 and the high-density printed circuit board 110. A protection structure may also be disposed around the first component 111, where the protection structure is used to encapsulate the first component 111 to protect the first component 111 from damage. The protective structure may be formed using a filling process or an injection molding process.

S101B-2: a first supporting structure 181 is provided on a side of the high density printed circuit board 110 where the first component 111 is provided, as shown with reference to fig. 22.

In the embodiment of the present application, after the first component 111 is disposed on the side surface of the high-density printed circuit board 110, the first supporting structure 181 may be disposed on the side surface of the high-density printed circuit board 110 where the first component 111 is disposed, so as to implement leveling of the package structure and flatness control. Specifically, the first support structure 181 may be adhered or fastened to the high-density printed circuit board 110 using screws.

S101B-3: a power supply printed circuit board 120 is provided on a side surface of the high density printed circuit board 110 facing away from the first component 111, as shown with reference to fig. 23.

In an embodiment of the present application, after the first component 111 is disposed on one side surface of the high-density printed circuit board 110, the power supply printed circuit board 120 may be disposed on the other side surface, and the power supply printed circuit board 120 may have disposed the second component 121. Specifically, the power supply printed circuit board 120 may be soldered to the other side surface of the high-density printed circuit board 110, and the soldering process may be a grid array package or a solder ball array package, and a spacer (spacer) may be used to control the distance between the high-density printed circuit board 110 and the power supply printed circuit board 120 during the specific soldering.

Specifically, the number of the power supply printed circuit boards 120 may be plural, and a plurality of second components 121 may be disposed on the power supply printed circuit boards 120, and the power supply printed circuit boards 120 may be soldered to the other side surface of the high-density printed circuit board 110, so that the second components 121 on each power supply printed circuit board 120 can supply power to the corresponding first component 111.

In an embodiment of the present application, the connection device 160 may also be provided in the package structure after the soldering of the power supply printed circuit board 120 is completed.

As an example, when the feature size of the high-density printed circuit board 110 is larger than that of the power supply printed circuit board 120, the connection device 160 may be soldered to a surface of one side of the high-density printed circuit board 110 near the power supply printed circuit board 120, as shown with reference to fig. 23, that is, the connection device 160 and the first component 111 are disposed at different sides of the high-density printed circuit board 110, and the connection device 160 may directly make electrical connection with the first component 111 using the high-density printed circuit board 110.

S101C-1: the relief opening 112 is formed in the high density printed circuit board 110, as shown with reference to fig. 24.

In an embodiment of the present application, before the first component 111 is disposed on one side surface of the high-density printed circuit board 110, the escape opening 112 may be formed on the high-density printed circuit board 110, and the escape opening 112 penetrates the high-density printed circuit board 110.

S101C-2: a first component 111 is provided on one side surface of the high density printed circuit board 110, as shown with reference to fig. 25.

In an embodiment of the present application, the first component 111 may be disposed on one side surface of the high-density printed circuit board 110. Specifically, the first component 111 may include a semiconductor chip and a surface mount device, and the semiconductor chip may be disposed on the surface of the high-density printed circuit board 110 by a soldering or bonding wire bonding process after the surface mount device is disposed on the surface of the high-density printed circuit board 110 by using a surface mount technology because the feature size of the surface mount device is small.

Specifically, after the first component 111 is disposed on the surface of the high-density printed circuit board 110, an underfill may be disposed on the first component 110 near the bottom of the high-density printed circuit board 110, where the underfill is used to protect the first component 110 and enhance the fixed connection between the first component 110 and the high-density printed circuit board 110. A protection structure may also be disposed around the first component 111, where the protection structure is used to encapsulate the first component 111 to protect the first component 111 from damage. The protective structure may be formed using a fill process or an injection molding process.

S101C-3: a second component 121 is provided on one side surface of the power supply printed circuit board 120, as shown with reference to fig. 26.

In an embodiment of the present application, the second component 121 may be disposed on one side surface of the power supply printed circuit board 120. In particular, the second component 121 may be soldered to the power supply printed circuit board 120.

Specifically, the third component 113 may be disposed on a surface of the power supply pcb 120, which is far away from the second component 121, so as to integrate more chips in the package structure, thereby improving the integration, as shown in fig. 26. The third component may include a surface mount device, which may specifically be disposed on a surface of the power supply pcb 120 away from the second component 121, where the surface mount device has a low height, and does not additionally increase the volume of the entire package structure.

In embodiments of the present application, the connection device 160 may also be provided in a package structure.

As an example, when the feature size of the high-density printed circuit board 110 is equal to the feature size of the power supply printed circuit board 120, the connection device 160 may be soldered to a side surface of the power supply printed circuit board 120 remote from the second component 121, as shown with reference to fig. 26, that is, the connection device 160 is soldered to the power supply printed circuit board 120, and the subsequent connection device 160 may make electrical connection with the first component 111 using the power supply printed circuit board 120 and the high-density printed circuit board 110.

As another example, when the feature size of the high-density printed circuit board 110 is equal to the feature size of the power supply printed circuit board 120, the connection device 160 may be disposed on a side surface of the high-density printed circuit board 110 near the first component 111, as shown with reference to fig. 25, that is, the connection device 160 and the first component 111 are disposed on the same side of the high-density printed circuit board 110, and the connection device 160 may directly make electrical connection with the first component 111 using the high-density printed circuit board 110. Specifically, the connection device 160 may be soldered when the first component 111 is provided on the high-density printed circuit board 110.

S101C-4: the power supply printed circuit board 120 is combined with the power supply printed circuit board 120 and the high density printed circuit board 110 in a direction in which the second component 121 is disposed and a direction in which the high density printed circuit board 110 is not disposed with the first component 111, as shown with reference to fig. 27.

In the embodiment of the present application, the power supply printed circuit board 120 is combined with the power supply printed circuit board 120 and the high-density printed circuit board 110 in a direction in which the second component 121 is disposed and in a direction in which the high-density printed circuit board 110 is not disposed, and after the combination, a surface of a side of the power supply printed circuit board 120 exposed by the avoidance opening 112 is provided with the second component 121, that is, the avoidance opening 112 exposes the second component 121. The high-density printed circuit board 110 and the power supply printed circuit board 120 may be bonded by sintering or soldering with solder between the high-density printed circuit board 110 and the power supply printed circuit board 120, and electrical connection between the high-density printed circuit board 110 and the power supply printed circuit board 120 is achieved. The soldering process may be Land Grid Array (LGA) or Ball Grid Array (BGA), and the distance between the high-density printed circuit board 110 and the power supply printed circuit board 120 may be controlled by using a spacer when soldering.

Fig. 27 illustrates an example in which the feature size of the high density printed circuit board 110 is equal to the feature size of the power supply printed circuit board 120, and the connection device 160 is soldered to the surface of the power supply printed circuit board 120 on the side away from the second component 121.

Three possible implementations of the process of providing the first component 111 and providing the power supply printed circuit board 120 on the high density printed circuit board 110 are described in detail above, and the sequence of steps of the formation process for specifically forming the package structure may be modified, and any modification may be made by those skilled in the art.

As another example, when the second component 121 is disposed in the escape opening 112 of the high-density printed circuit board 110, a portion of the first component 111 may be disposed on a side surface of the power supply printed circuit board 120 remote from the high-density printed circuit board 110 to integrate more chips in a package structure, improving the integration, and the second protection plate 150 may be used to protect a portion of the first component 111 disposed on a side of the power supply printed circuit board 120 remote from the high-density printed circuit board 110, as shown with reference to fig. 12 or 13. Specifically, the surface mount device can be disposed on a surface of the power supply pcb 120, which is far away from the high-density pcb 110, so that the surface mount device has a low height, and the volume of the whole package structure is not increased additionally.

In the embodiment of the present application, before the first protection plate 130 is disposed on the side of the high-density printed circuit board 110 where the first component 111 is disposed, a surface of the first component 111 on the side far from the high-density printed circuit board 110 is covered with the heat conductive material 170, and the heat conductive material 170 is used to further provide a heat dissipation effect for the first component 111, as shown in fig. 8 to 14. Specifically, when the second component 121 is disposed on a side surface of the power supply printed circuit board 120 away from the high-density printed circuit board 110, a heat conducting material 171 is covered on a side surface of the second component 121 away from the power supply printed circuit board 120, and the heat conducting material 171 is used to further provide a heat dissipation effect for the second component 121. When the second component 121 is disposed in the escape opening 112 of the power supply printed circuit board 120 near one side surface of the high density printed circuit board 110, a thermally conductive material 172 is included between the second component 121 and the first protective plate 130.

In the embodiment of the application, the high-density printed circuit board 110 and the power supply printed circuit board 120 are combined by welding or sintering, besides solder, an adhesive material can be filled between the high-density printed circuit board 110 and the power supply printed circuit board 120, and the high-density printed circuit board 110 and the power supply printed circuit board 120 are tightly and fixedly connected by the adhesive material, so that the rigidity of the packaging structure is further increased, and the requirements of the packaging structure on mechanics and reliability are met.

The embodiment of the application also provides electronic equipment, which comprises the packaging structure. The electronic equipment provided by the embodiment of the application can be product equipment with communication or calculation requirements of large broadband requirements.

In this specification, each embodiment is described in a progressive manner, and identical and similar parts of each embodiment are all referred to each other, and each embodiment mainly describes differences from other embodiments.

The foregoing is a specific implementation of the present application. It should be understood that the above-described embodiments are only for illustrating the technical solution of the present application, and are not limiting thereof; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the application.

Claims

1. A package structure, comprising:

a high-density printed circuit board, wherein a first component is arranged on one side surface of the high-density printed circuit board;

the power supply printed circuit board is arranged on the other side surface of the high-density printed circuit board; a second component is arranged on one side surface of the power supply printed circuit board; the second component is electrically connected with the first component through the power supply printed circuit board and the high-density printed circuit board and is used for supplying power to the first component;

the first protection plate is arranged on one side of the high-density printed circuit board where the first component is arranged;

the fastening structure penetrates through the first protection plate and the high-density printed circuit board, and the high-density printed circuit board is fixedly connected with the first protection plate.

2. The package structure of claim 1, wherein the first component is disposed on a side surface of the high density printed circuit board remote from the power supply printed circuit board;

3. The package structure of claim 1, wherein the first component is disposed on a side surface of the high-density printed circuit board away from the power supply printed circuit board, and the second component is disposed on a side surface of the power supply printed circuit board away from the high-density printed circuit board.

4. A package structure according to claim 3, wherein the number of power supply printed circuit boards is plural, each power supply printed circuit board supplying power to a corresponding first component.

5. A package structure according to claim 2 or 3, further comprising: a second protection plate;

6. The package structure of claim 5, wherein if the high-density printed circuit board has an escape opening, the second component is disposed on the power supply printed circuit board exposed by the escape opening, further comprising:

7. The package structure of claim 5, wherein the first protective plate and the second protective plate are used to dissipate heat from the first component and the second component, respectively.

8. The package structure of claim 5, wherein the feature size of the high density printed circuit board is equal to the feature size of the power supply printed circuit board, and the fastening structure penetrates the first protective board, the high density printed circuit board, the power supply printed circuit board, and the second protective board to achieve a fixed connection of the first protective board, the high density printed circuit board, the power supply printed circuit board, and the second protective board.

9. The package structure of claim 5, further comprising: a connecting device;

or alternatively, the first and second heat exchangers may be,

Or alternatively, the first and second heat exchangers may be,

10. The package structure of any one of claims 1-9, further comprising a thermally conductive material between the first component and the first protective plate.

11. The package structure according to any one of claims 1 to 9, further comprising: a first support structure;

12. The package structure of any one of claims 1-9, further comprising an adhesive material between the high density printed circuit board and the power supply printed circuit board.

13. The package structure according to any one of claims 1 to 9, wherein the first component includes a semiconductor chip and a surface mount device.

14. The package structure of any one of claims 1-9, wherein the second component comprises a power supply device comprising a voltage regulation module, a resonant converter, and a capacitor.

15. A method of packaging, comprising:

16. The method of claim 15, further comprising, prior to disposing the first component on a side surface of the high density printed circuit board:

forming an avoidance opening in the high-density printed circuit board;

17. The method as recited in claim 16, further comprising:

18. The method of claim 15, wherein the first component is disposed on a side surface of the high density printed circuit board remote from the power supply printed circuit board;

19. The method of claim 18, wherein the number of powered printed circuit boards is a plurality, each powered printed circuit board powering a corresponding first component.

20. The method of claim 17 or 18, further comprising, prior to disposing the fastening structure:

21. The method of claim 20, wherein the feature size of the high density printed circuit board is equal to the feature size of the powered printed circuit board, the disposing a fastening structure comprising:

22. The method as recited in claim 20, further comprising:

or alternatively, the first and second heat exchangers may be,

23. The method of any of claims 15-22, further comprising, before the first protective plate is disposed on a side of the high density printed circuit board on which the first component is disposed:

24. The method of any of claims 15-22, further comprising, before the first protective plate is disposed on a side of the high density printed circuit board on which the first component is disposed:

25. The method according to any one of claims 15-22, further comprising:

26. The method of any of claims 15-22, wherein the first component comprises a semiconductor chip and a surface mount device.

27. The method of any one of claims 15-22, wherein the second component comprises a power supply device comprising a voltage regulation module, a resonant converter, and a capacitor.

28. An electronic device, characterized in that it comprises a packaging structure as claimed in any one of claims 1 to 14.