CN216600298U - Circuit assembly - Google Patents
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- CN216600298U CN216600298U CN202122436819.0U CN202122436819U CN216600298U CN 216600298 U CN216600298 U CN 216600298U CN 202122436819 U CN202122436819 U CN 202122436819U CN 216600298 U CN216600298 U CN 216600298U
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Abstract
The application provides a circuit assembly, including base plate, first connecting means, second connecting means and inductance device. The first and second connection parts are disposed on the substrate, and the inductance device is attached to the first and second connection parts. The length of the inductance device is M, the length of the first connecting component is Y1, the length of the second connecting component is Y2, and the distance between the first connecting component and the second connecting component in the length direction is G. The inductance device meets the following requirements with the first connecting component and the second connecting component: y1+ Y2+ G is less than or equal to 1.01M and less than or equal to 1.2M. The circuit assembly of this application through the length Y1 that sets up first connecting part, the length Y2 of second connecting part and first connecting part and the second connecting part in the ascending and in certain scope of the interval G of length direction, has increased the area of being connected of inductance device and base plate to increase the adhesive force between inductance device and the base plate, under the condition that electronic equipment accident fell, can avoid the inductance device to drop.
Description
Technical Field
The application relates to the technical field of electronic products, in particular to a circuit assembly.
Background
With the development of electronic technology, people have higher and higher pursuits and requirements on electronic equipment. A main board of an electronic device, an internal memory, and the like each include a plurality of packaged chips, one or more integrated circuits are integrated in the chips, and an inductor is often used as an electronic device in the integrated circuits. Therefore, the reliability of the inductor is related to the reliability of the function of the whole chip. The existing electronic equipment still has the problem of unreliable inductive connection in the test.
SUMMERY OF THE UTILITY MODEL
The application provides a circuit assembly to solve the technical problem that inductance connection is unreliable in the prior art.
The present application provides a circuit assembly, comprising:
a substrate;
a first connection member and a second connection member provided on the substrate;
an inductance device attached to the first and second connection parts;
the inductance device and the first connecting component and the second connecting component meet the following conditions:
1.01M≤Y1+Y2+G≤1.2M；
where M is a length of the inductance device, Y1 is a length of the first connection part, Y2 is a length of the second connection part, and G is a distance between the first connection part and the second connection part in a length direction.
The circuit assembly that this application embodiment provided has increased the connection area between inductance device and the base plate through the sum of the length Y1 that sets up first connecting part, the length Y2 of second connecting part and first connecting part and the interval G of second connecting part on length direction in certain scope to can increase the adhesive force of inductance device on the base plate, under the unexpected situation that falls of electronic equipment, can avoid the inductance device to drop.
In one possible embodiment, the length of the first connecting part and the length of the second connecting part satisfy:
Y1＝Y2。
in the scheme, the first connecting part and the second connecting part are the same in length and size, and the process is simplified.
In a possible embodiment, the relationship between the inductive device and the first and second connection parts is:
Y1+Y2+G＝1.15M。
in the above scheme, the inductance device and the substrate have better connection force, and can not occupy more space inside the electronic equipment.
In one possible embodiment, the distance between the first connecting member and the second connecting member in the longitudinal direction and the length of the first connecting member are such that:
0.4Y1≤G≤0.6Y1。
in the above scheme, the distance between the first connecting part and the second connecting part in the length direction and the length relation of the first connecting part are set, so that the inductance device has better adhesive force on the substrate.
In one possible embodiment, the relationship between the distance between the first connecting member and the second connecting member in the longitudinal direction and the length of the first connecting member is:
G＝0.5Y1。
in one possible embodiment, the inductive device and the first and second connection parts satisfy:
N≤X1≤1.1N；
N≤X2≤1.1N；
wherein N is a width of the inductance device, X1 is a width of the first connection part, and X2 is a width of the second connection part.
According to the scheme, the adhesive force of the inductance device on the substrate is improved by setting the relation between the width size of the inductance device and the width of the first connecting part and the width of the second connecting part.
In one possible embodiment, the width of the first connecting part and the width of the second connecting part satisfy:
X1＝X2。
in the scheme, the width sizes of the first connecting part and the second connecting part are the same, and the advantage of simplifying the process is achieved.
In a possible embodiment, the relationship between the inductive device and the first and second connection parts is:
X1＝X2＝1.05N。
according to the scheme, the relation between the width size of the inductance device and the width of the first connecting part and the width of the second connecting part is set, and the connecting force between the inductance device and the substrate is improved.
In one possible embodiment, the substrate has a thickness T, which satisfies:
0.6mm≤T≤0.7mm。
the scheme can meet the requirement of miniaturization of electronic equipment.
In one possible embodiment, the first connection part and the second connection part are both pads protruding from the substrate.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
FIG. 1 is a functional diagram of a circuit board in an electronic device;
fig. 2 is a schematic structural diagram of a circuit assembly according to an embodiment of the present disclosure;
FIG. 3 is a front cross-sectional view of a circuit assembly provided by an embodiment of the present application;
FIG. 4 is a top view of a partial structure of a circuit assembly according to an embodiment of the present disclosure;
fig. 5 is a schematic diagram illustrating a positional relationship between a first connection component and a second connection component in a circuit assembly according to an embodiment of the present disclosure;
FIG. 6 is a schematic diagram of an inductive device in a circuit assembly provided by an embodiment of the present application;
fig. 7 is a schematic structural diagram of a test bench for testing a circuit assembly provided in an embodiment of the present application.
Reference numerals:
1-circuit component, 11-substrate, 111-interconnection structure, 12-connection component, 121-first connection component, 122-second connection component, 13-inductance device, 14-wire, 15-via hole, 2-impact table, 3-bolt and 4-clamp.
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.
Detailed Description
For better understanding of the technical solutions of the present application, the following detailed descriptions of the embodiments of the present application are provided with reference to the accompanying drawings.
The embodiment of the application provides a circuit assembly, which is applied to electronic equipment such as a mobile phone and the like, and can also be applied to equipment which needs a chip, such as a computer, a tablet computer, a television, a vehicle-mounted display, an intelligent watch, a server, a memory, a radar, a base station and the like. For convenience of description, the circuit components are exemplified below as applied to a mobile phone.
The mobile phone may include a motherboard, a display screen, a battery, a camera, etc. As shown in fig. 1, a circuit board as a motherboard may have a processor, an internal memory, a charging circuit, and the like integrated thereon. Of course, the mobile phone may further include other components, and other circuit structures may also be integrated on the motherboard, which is not limited in this embodiment of the present application.
The processor may include one or more processing units, such as: the processor may include an Application Processor (AP), a modem processor, a Graphics Processing Unit (GPU), an Image Signal Processor (ISP), a controller, a memory, a video codec, a Digital Signal Processor (DSP), a baseband processor, and/or a neural-Network Processing Unit (NPU), among others. The different processing units may be separate devices or may be integrated into one or more processors.
The GPU is a microprocessor for image processing and is connected with a display screen and an application processor. The GPU is used to perform mathematical and geometric calculations for graphics rendering. Therefore, the mobile phone realizes the display function through the GPU, the display screen, the application processor and the like.
The charging circuit of the mobile phone comprises a power supply management circuit and a charging management circuit. The power management circuit is connected with the battery, the charging management circuit and the processor. The charge management circuit may receive a charge input from the charger to charge the battery. The charging management circuit can charge the battery and supply power to the mobile phone through the power management circuit. The power management circuit receives the input of the battery and/or the charging management module and supplies power to the processor, the internal memory, the display screen, the camera and the like.
The mobile phone can also realize shooting function through a camera, a GPU, a display screen, an application processor and the like.
The internal memory in the handset may be used to store computer executable program code, which includes instructions. The processor executes various functional applications and data processing of the mobile phone by executing instructions stored in the internal memory.
The processor, the internal memory, the charging circuit and the like integrated on the mainboard comprise one or more chips. One or more integrated circuits are integrated in the chip, and the inductor is often used as an electronic component in the integrated circuit. Whether the inductance is reliable or not is related to the function of the integrated circuit, even the whole chip.
The circuit assembly provided by the embodiment of the application can improve the connection reliability of the inductor.
Fig. 2 is a schematic structural diagram of a circuit assembly according to an embodiment of the present disclosure. As shown in fig. 2, the present embodiment provides a circuit assembly 1, which includes a substrate 11 and an inductive device 13, where the inductive device 13 is disposed on the substrate 11. Metal traces 14 may also be laid on the substrate 11, and metallized vias 15 are formed at the ends of the metal traces 14 for connecting the inductive device 13 to other circuits. The substrate 11 may be a circuit board as described above.
Fig. 3 is a front cross-sectional view of a circuit assembly provided by an embodiment of the present application. As shown in fig. 3, the circuit assembly 1 provided in the embodiment of the present application further includes a connection part 12, and the connection part 12 includes a first connection part 121 and a second connection part 122 having the same structure and shape. The first and second connection parts 121 and 122 may also be different in structure and shape. The number of the connection members 12 is not limited to two, and may be provided in plurality according to the structure of the inductance device 13.
In this embodiment, the first connection part 121 and the second connection part 122 have the same structure and size and are disposed on the substrate 11. The inductance device 13 is attached to the first and second connection parts 121 and 122. The substrate 11 is provided with a hole, the interconnection structure 111 is provided in the hole, and the inductance device 13 is electrically connected to other circuits through the interconnection structure 111 via the first connection part 121 and the second connection part 122.
The inductance device 13 may be a patch inductance, or may be another type of inductance. In the circuit module 1 shown in fig. 2, three chip inductors are provided on the substrate 11. As shown in fig. 3, the chip inductor is a sheet, and is mostly rectangular, and output pins are disposed at positions close to two ends of the bottom surface of the chip inductor, and the output pins are tiled on the bottom surface of the inductor and are substantially coplanar with the bottom surface of the inductor. The chip inductor is connected to the first connection part 121 and the second connection part 122 through output pins, respectively.
The substrate 11 may be a stacked design, and the threaded holes on the substrate 11 may be a metalized design, with each layer of copper mesh.
The thickness of the substrate 11 is not limited in the present application, the thickness of the substrate 11 may be denoted as T, and the substrate 11 in the present application can satisfy: t is more than or equal to 0.6mm and less than or equal to 0.7mm, and the thickness T of the substrate 11 can meet the miniaturization requirement of the circuit assembly 1, so that the substrate is suitable for various small-sized electronic equipment.
The first and second connection parts 121 and 122 may be, for example, pads protruding from the substrate 11. In an example where the inductance device 13 is a chip inductor, the chip inductor is connected to a pad through an output pin, and is further connected to the substrate 11.
Fig. 4 is a top view of a partial structure of a circuit assembly according to an embodiment of the present disclosure. As shown in fig. 4, it shows a state that the inductance device 13 is connected to the first connection part 121 and the second connection part 122. In the view of fig. 4, the projection of the inductive device 13 falls completely onto the first and second connection parts 121, 122, and the inductive device 13 can be attached to the first and second connection parts 121, 122 with a larger area, thereby increasing the adhesion of the inductive device 13 (e.g., the adhesion of the inductive device 13 is improved by 50% compared to the conventional manner).
Fig. 5 is a schematic diagram illustrating a positional relationship between a first connection component and a second connection component in a circuit assembly according to an embodiment of the present disclosure. As shown in fig. 5, which shows the positional relationship of the first connection part 121 and the second connection part 122 on the substrate 11, the first connection part 121 and the second connection part 122 may be both rectangular pads, for example, and both pads have a certain distance G in the longitudinal direction. The first connection part 121 has a length Y1 and a width X1, and the second connection part 122 has a length Y2 and a width X2. The distance between the sides of the first and second connection parts 121 and 122 adjacent to each other is G.
Fig. 6 is a schematic diagram of an inductive device in a circuit assembly according to an embodiment of the present disclosure. As shown in fig. 6, which shows the size parameters of the inductive device 13, the inductive device 13 is, for example, a chip inductor and has a rectangular sheet shape. The inductive device 13 has a length M and a width N.
The inductance device 13, the first connection part 121 and the second connection part 122 satisfy: y1+ Y2+ G is less than or equal to 1.01M and less than or equal to 1.2M.
Optionally, in some embodiments, the length of the first connection part 121 and the length of the second connection part 122 satisfy: y1 ═ Y2. That is, the first and second connection parts 121 and 122 have the same length size.
Optionally, in some embodiments, the relationship between the inductive device 13 and the first and second connection parts 121, 122 is: y1+ Y2+ G ═ 1.15M. When the relationship between the inductance device 13 and the first and second connection parts 121 and 122 is satisfied, the inductance device 13 has better adhesion on the substrate 11 and can not occupy more space inside the electronic device.
In embodiment 1, the length Y1 of the first connection part 121, the length Y2 of the second connection part 122, the distance G in the longitudinal direction between the first connection part 121 and the second connection part 122, and the size of the inductance device 13 may be set using the corresponding parameters in table 1.
In table 1, the inductor device 13 is a chip inductor having several types, i.e., a length M and a width N of 1.6mm × 0.8mm, a length 2.0mm × 1.2mm, and a length 2.0mm × 1.2mm, respectively. Accordingly, the first connection part 121 is a first pad, the second connection part 122 is a second pad, and the first pad, the second pad, and the gap G between the first pad and the second pad are listed in table 1.
TABLE 1
In the above embodiment 1, the two pads have the same size, the inductance device 13 and the substrate 11 have a sufficient connection area, and the adhesion of the inductance device 13 is large.
Optionally, in some embodiments, the first and second connection members 121, 122 are the same length, i.e., Y1 — Y2. The distance G between the first connecting member 121 and the second connecting member 122 in the length direction is within a certain range, which can take into account the adhesive property of the inductance device 13 and the internal space arrangement of the electronic device. In the present application, the distance G between the first connection member 121 and the second connection member 122 in the longitudinal direction and the length of the first connection member 12 satisfy: g is more than or equal to 0.4Y1 and less than or equal to 0.6Y1, so that the inductance device 13 has better adhesive force performance, and the space arrangement of the electronic equipment is more compact.
Alternatively, the relationship between the distance G in the length direction of the first and second connection parts 121 and 122 and the length of the first connection part 121 is: G-0.5Y 1 to optimize the adhesion performance of the inductive device 13 and the spatial arrangement of the electronic device.
In embodiment 2, the length Y1 of the first connection part 121, the length Y2 of the second connection part 122, the distance G in the longitudinal direction between the first connection part 121 and the second connection part 122, and the size of the inductance device 13 may be set using the corresponding parameters in table 2.
In table 2, the inductor device 13 is a chip inductor having a length M and a width N of 1.6mm × 0.8 mm. Accordingly, the first connection part 121 is a first pad, the second connection part 122 is a second pad, and the first pad, the second pad, and the pitch G between the first pad and the second pad are listed in table 2.
TABLE 2
In the above embodiment, after the distance G between the first pad and the second pad in the length direction and the length of the first pad or the second pad satisfy the relationship that G is greater than or equal to 0.4Y1 and less than or equal to 0.6Y1, the adhesive force of the chip inductor on the substrate 11 is improved.
Referring to fig. 5, the first connection part 121 has a width of X1, the second connection part 122 has a width of X2, and the widths of the first connection part 121 and the second connection part 122 may be equal, that is, X1 is equal to X2.
Referring also to fig. 6, the width of the inductive device 13 is N, and in some embodiments, the width between the inductive device 13 and the first and second connection parts 121 and 122 satisfies: x1 is more than or equal to N and less than or equal to 1.1N, and X2 is more than or equal to N and less than or equal to 1.1N. That is, the width X1 of the first connection part 121 is between 1 times and 1.1 times the width of the inductance device 13, and the width X2 of the second connection part 122 is also between 1 times and 1.1 times the width of the inductance device 13, to increase the adhesive force of the inductance device 13.
Optionally, in some embodiments, the relationship between the inductive device 13 and the first and second connection parts 121, 122 is: X1-X2-1.05N is preferable for better adhesion of the inductor 13 to the substrate 11.
In embodiment 3, the width X1 of the first connection member 121, the width X2 of the second connection member 122, and the size of the inductance device 13 may be set by the corresponding parameters in table 3.
In table 3, the inductor device 13 is a chip inductor having a length M and a width N of 1.6mm × 0.8 mm. Accordingly, the first connection part 121 is a first pad, the second connection part 122 is a second pad, and the first pad, the second pad, and the gap G between the first pad and the second pad are listed in table 3.
TABLE 3
In the above embodiment, the width of the inductor device 13 and the width of the first pad or the second pad satisfy the relationship that N is not less than X1 and not more than 1.1N and N is not less than X2 and not more than 1.1N, so that the adhesive force of the chip inductor on the substrate 11 is improved.
It should be noted that in the embodiments of the present application, for the case of "equal" or "═ equal", there may be an error in an actual product. For example, in an example where the relationship between the inductance device 13 and the first and second connection parts 121 and 122 is Y1+ Y2+ G ≈ 1.15M, in an actual product, the relationship between the inductance device 13 and the first and second connection parts 121 and 122 is Y1+ Y2+ G ≈ 1.15M.
For the circuit component 1 provided by the embodiment of the application, a drop test impact table can be used for impact test so as to simulate a drop scene of electronic equipment. After a set number of drops, it is checked whether the connection of the inductive component 13 to the circuit assembly 1 has failed. If not, the circuit component 1 can meet the design requirement, otherwise, the circuit component 1 cannot meet the design requirement. Tests prove that the circuit assembly 1 related to the application can meet the design requirements.
Fig. 7 is a schematic structural diagram of a test bench for testing a circuit assembly provided in an embodiment of the present application. As shown in fig. 7, the substrate 11 of the circuit component 1 to be tested is mounted on the jig 4 by the screws 3, and the circuit component 1 is subjected to a drop test on the impact table 2.
The specific test method is as follows:
first, a test board is fabricated, and the drop height is calibrated by using the test board. And connecting the chip inductor to the bonding pad on the test board through three times of reflow soldering.
During the first test, the impact table 2 is firstly dropped for 20 times so as to ensure the stability of the impact table 2 during the test. The test board was fixed to the jig 4 with the inductor with the strain gauge attached facing down. And carrying out drop strain test on the fixed test board. The strain gauge of the inductor is connected with data acquisition equipment, and an acquired strain curve is recorded, wherein the strain acquisition rate of the equipment is not less than 200 kHz. The drop height of the clamp 4 is adjusted to a drop strain level of about 3000 ue. At least five sets of stable data can be measured and the five sets of data fluctuate within 5% of the mean. The drop heights at 2000ue, 2500ue, 3500ue and 4000ue strain levels were continuously calibrated in the same manner, and a strain-drop height curve was fitted to determine the drop height. After the device calibration, the circuit assembly 1 provided by the embodiment of the application is subjected to a drop test at a level of 3000 ue. The number of inductors per test was greater than 36 and the number of dips was 50. After every 10 falls, whether the inductor is broken, falls, loosened and abnormal in appearance is checked, and after the test is finished, whether cracks exist in all 36 inductors in the slice is checked.
Through the above tests, it is found that the circuit component 1 provided in the present embodiment can satisfy the requirement of compliance, that is: the drop failure strain of the inductor 13 is less than or equal to 3000ue, the inductor 13 has no cracking, chipping, dropping and loosening problems in appearance, the inductor 13 has no cracking, no peeling between a welding end and a body, no welding spot cracking and other failures (the slice crack is less than or equal to 50 percent) in the electrical parameter test, and the slice analysis of the inductor 13 has no abnormity.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A circuit assembly, comprising:
a substrate;
a first connection member and a second connection member provided on the substrate;
an inductance device attached to the first and second connection parts;
the inductance device and the first connecting component and the second connecting component meet the following conditions:
1.01M≤Y1+Y2+G≤1.2M；
where M is a length of the inductance device, Y1 is a length of the first connection part, Y2 is a length of the second connection part, and G is a distance between the first connection part and the second connection part in a length direction.
2. The circuit assembly of claim 1, wherein the length of the first connection member and the length of the second connection member satisfy:
Y1＝Y2。
3. the circuit assembly of claim 2, wherein the relationship between the inductive device and the first and second connection members is:
Y1+Y2+G＝1.15M。
4. the circuit assembly of claim 3, wherein a spacing of the first and second connection members in a length direction and a length of the first connection member satisfies:
0.4Y1≤G≤0.6Y1。
5. the circuit assembly of claim 4, wherein a spacing of the first and second connection members in the length direction relative to a length of the first connection member is:
G＝0.5Y1。
6. a circuit assembly according to any of claims 1 to 5, wherein the inductive device and the first and second connection parts are such that:
N≤X1≤1.1N；
N≤X2≤1.1N；
wherein N is a width of the inductance device, X1 is a width of the first connection part, and X2 is a width of the second connection part.
7. The circuit assembly of claim 6, wherein the width of the first connection member and the width of the second connection member satisfy:
X1＝X2。
8. the circuit assembly of claim 7, wherein the relationship between the inductive device and the first and second connection members is:
X1＝X2＝1.05N。
9. the circuit assembly of any of claims 1-5, wherein the substrate has a thickness T that satisfies:
0.6mm≤T≤0.7mm。
10. the circuit assembly of any of claims 1-5, wherein the first and second connection members are each pads protruding from the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122436819.0U CN216600298U (en) | 2021-10-09 | 2021-10-09 | Circuit assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122436819.0U CN216600298U (en) | 2021-10-09 | 2021-10-09 | Circuit assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216600298U true CN216600298U (en) | 2022-05-24 |
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| CN202122436819.0U Active CN216600298U (en) | 2021-10-09 | 2021-10-09 | Circuit assembly |
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| CN (1) | CN216600298U (en) |
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- 2021-10-09 CN CN202122436819.0U patent/CN216600298U/en active Active
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Effective date of registration: 20220630 Address after: 518122 floor 5, building B1, glory Intelligent Manufacturing Industrial Park, No. 9, Lanzhu West Road, Zhukeng community, Longtian street, Pingshan District, Shenzhen, Guangdong Province Patentee after: Shenzhen glory Intelligent Machine Co.,Ltd. Address before: Unit 3401, unit a, building 6, Shenye Zhongcheng, No. 8089, Hongli West Road, Donghai community, Xiangmihu street, Futian District, Shenzhen, Guangdong 518040 Patentee before: Honor Device Co.,Ltd. |
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