CN215472751U - Semiconductor plastic package mould - Google Patents

Abstract

The invention discloses a semiconductor plastic package mold, which comprises an upper mold and a lower mold, wherein the lower mold comprises a lower mold body, a lower runner strip and a molding unit, the molding unit comprises a pin cavity and a glue expanding groove, the glue expanding groove is far away from the bottom of the pin cavity, and the depth of the glue expanding groove is smaller than that of the pin cavity. In the process of actual plastic envelope, go up the mould and be connected the back with the lower mould, form the enclosure space of a plastic envelope, then utilize the plastic envelope material to pour into a mould, utilize plastic envelope material parcel pin through the pin chamber, so that the later stage forms the plastic envelope colloid, utilize and expand the gluey groove and make the plastic envelope material when the pin intracavity overflows, can spread the plastic envelope material that overflows to expand gluey inslot, when making the later stage form the plastic envelope product, the clout body surface area of parcel pin department is big, and the groove depth in expanding gluey groove is less than the groove depth in pin chamber, the clout of later stage formation is thinner, make things convenient for the clout of the die-cut plastic envelope product in later stage, let the product avoid the crush injury, reduce the damage of product, and reduce production cost, and promote the quality of product.

Description

Semiconductor plastic package mould

Technical Field

The application relates to the field of dies, in particular to a semiconductor plastic package die.

Background

In semiconductor microelectronic production, chips are generally required to be subjected to plastic packaging, so that the chips are convenient to use, and meanwhile, the chips are protected by using the colloid. The plastic package of the chip is usually performed by using a plastic package mold, pins, metal wires and the chip are placed in the mold in the plastic package process, then the product is wrapped by using a plastic package material, the product after the plastic package is a plastic package product, and finally the plastic package product is subjected to excess material removal to obtain a complete product.

The plastic package mold used at present has the characteristic of no material overflow because a pin cavity for placing pins is in a straight-through type and is designed to be smaller, but the rib pressing and the wire raising are caused because the pin cavity is small, the position of a metal wire is easy to move when the plastic package material is molded, injected and molded, the contact position of the metal wire and a chip is changed, and short circuit is caused, which is a major quality safety accident. Therefore, in order to avoid this situation, the size of the groove of the pin cavity is usually increased, but with the increase of the pin cavity, the side surface of the pin cavity overflows due to the gap between the upper die and the lower die, the excess material formed by the overflow has to be removed in the later process, the volume of the excess material formed by the overflow is small, when the excess material of the product body is punched, the product is crushed or damaged, the yield of the product is reduced, and the production cost is increased.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem that die-cut product body yield is not high, promote the quality of product, this application provides a semiconductor plastic envelope mould.

The application provides a semiconductor plastic package mould adopts following technical scheme:

the utility model provides a semiconductor plastic envelope mould, includes last mould and cooperation go up the lower mould that the mould used, the lower mould includes lower mould body, lower runner strip and is used for the fashioned shaping unit of plastic envelope colloid, the shaping unit set up in on the lower mould body, the lower mould body set up in the both sides of lower runner strip, the shaping unit include with pin complex pin chamber and communicate in the groove is glued in expanding of pin chamber, expand the tank bottom of gluing the groove and keeping away from the pin chamber, the groove depth that expands the groove is less than the groove depth in pin chamber.

Through adopting above-mentioned technical scheme, in the process of actual plastic envelope, go up the mould and be connected the back with the lower mould, form the enclosure space of a plastic envelope, then utilize the plastic envelope material to pour into a mould, utilize plastic envelope material parcel pin through the pin chamber, so that the later stage forms the plastic envelope colloid, utilize and expand the gluey groove and make the plastic envelope material when the pin intracavity overflows, can flow the plastic envelope material stall that overflows to expanding gluey inslot, when making the later stage form the plastic envelope product, the clout body surface area of parcel pin department is big, and the groove depth that expands gluey groove is less than the groove depth in pin chamber, the clout of later stage formation is thinner, make things convenient for the clout of the die-cut plastic envelope product in later stage, let the product avoid the crush injury, reduce the damage of product, reduce manufacturing cost, promote the yield of product, promote the quality of product.

Optionally, the molding unit further includes a cavity for placing a chip, the pin cavity is disposed on two sides of the cavity, and the pin cavity is communicated with the cavity.

Through adopting above-mentioned technical scheme, can get up the better parcel of chip through the die cavity to the plastic envelope material can form stable in structure, and the product that the shape is pleasing to the eye promotes the performance requirement of chip.

Optionally, a space is left between the cavity bottom of the cavity and the groove bottom of the pin cavity.

By adopting the technical scheme, the space is reserved between the cavity bottom of the cavity and the groove bottom of the pin cavity, so that a certain amount of plastic package material can be filled in the cavity, the chip can be better wrapped, the protection effect is achieved, and the performance of a plastic package product is optimized.

Optionally, one end of the glue spreading groove close to the cavity is narrowed in the middle, a gap is reserved between the glue spreading groove and the cavity, the gap is set as an easy-removing section, and the easy-removing section is used for avoiding direct connection between the glue spreading groove and the cavity.

Through adopting above-mentioned technical scheme, make things convenient for the die-cut plastic envelope product clout in later stage through easily removing the section, improve the yield of product, promote the plastic envelope performance of this mould.

Optionally, go up the mould and include the mould body, be used for controlling the last runner strip of plastic-sealed material flow direction and be used for the confined space seal the chamber unit, seal the chamber unit set up in go up on the mould body, go up the mould body set up in go up the both sides of runner strip, go up the runner strip with runner strip suits and both cooperate the use down, seal the chamber unit with the shaping unit suits and both cooperate the use.

Through adopting above-mentioned technical scheme, use through the cooperation of runner strip and lower runner strip to in the better packing of plastic-enclosed material to the die cavity, can dismantle with the lower mould body through last mould body and be connected, simple easy operation promotes the suitability of this mould.

Optionally, the lower runner strip is provided with a plurality of lower runner units, each lower runner unit is provided with a plastic package material cylinder, the upper runner strip is arranged on a plurality of upper runner units, the upper runner units comprise a cylinder sealing cake and a glue runner which are arranged on the upper runner strip, and the cylinder sealing cake is used for sealing an opening of the plastic package material cylinder.

By adopting the technical scheme, the plastic packaging efficiency can be improved through the lower runner units, and the diversion cakes can be used for conducting diversion on the plastic packaging material, so that the plastic packaging effect is improved, and the production efficiency is improved.

Optionally, the cavity sealing unit includes a glue flow groove communicated with the glue flow channel and cavity sealing grooves communicated with the glue flow groove and arranged on two sides of the glue flow groove, the glue flow groove is matched with the surface of the lower die body to form a closed space, and the cavity sealing grooves are matched with the cavity to form a closed cavity.

Through adopting above-mentioned technical scheme, be connected at last mould body and lower mould body, seal the cavity groove and form closed cavity jointly with the die cavity to in the plastic envelope material complete wrap up the chip, thereby the aspect of the full protects the chip, promotes the stability of being connected of chip and pin.

Optionally, the tank bottom of the cavity sealing groove and the tank bottom of the glue flow groove leave a space, and a buffer slope used for buffering plastic package material injection flow is arranged at the joint of the cavity sealing groove and the glue flow groove.

By adopting the technical scheme, the flow speed of the plastic package material entering the cavity is slowed down through the buffer slope, so that the plastic package material is better injected into the cavity, and the molding quality of a plastic package product is improved.

Optionally, the lower die is connected with a lower die box for accommodating and mounting the lower die box, and the lower die box is provided with a lower mounting groove.

Through adopting above-mentioned technical scheme, through lower mould box easy to assemble lower mould, with the concentrated installation of lower mould on lower mould box, the convenience removes it to in operation plastic envelope process, thereby promote the performance of this mould.

Optionally, the upper die is connected with an upper die box used for accommodating and installing the upper die box, the upper die box is provided with an upper mounting groove, the upper die box is matched with the lower die box for use, and the upper die box and the lower die box can be detachably connected.

Through adopting above-mentioned technical scheme, through last mould box easy to assemble last mould, will go up the concentrated installation of mould on last mould box to in remove it, so that the workman operates it.

In summary, the present application includes at least one of the following beneficial technical effects:

1. after the upper die and the lower die are connected, a plastic sealed closed space is formed, then plastic packaging materials are used for pouring, pins are wrapped by the plastic packaging materials through pin cavities, so that plastic packaging colloid is formed in the later period, when the plastic packaging materials overflow in the pin cavities through the glue expansion grooves, the overflowing plastic packaging materials can be spread and flowed into the glue expansion grooves, when plastic packaging products are formed in the later period, the surface area of surplus materials at the positions where the pins are wrapped is large, the groove depth of the glue expansion grooves is smaller than that of the pin cavities, the surplus materials formed in the later period are thin, the surplus materials of the plastic packaging products are conveniently punched in the later period, the products are prevented from being damaged by pressure, the production cost is reduced, the yield of the products is improved, and the quality of the products is improved;

2. the plastic package product excess material is conveniently punched in the later period through the easy removing section, the yield of the product is improved, and the plastic package performance of the die is improved.

Drawings

Fig. 1 is a schematic structural diagram for showing an upper die according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram for showing a lower die according to an embodiment of the present application.

FIG. 3 is a partial enlarged view of an embodiment of the present application, shown at A in FIG. 2.

Fig. 4 is a schematic structural diagram for showing an upper flow passage unit according to an embodiment of the present application.

FIG. 5 is a partial enlarged view of an embodiment of the present application, shown at B in FIG. 4.

Description of reference numerals: 1. an upper die; 11. an upper die body; 12. an upper runner strip; 121. an upper flow passage unit; 1211. a diversion cake; 1212. a glue flow channel; 13. a cavity sealing unit; 131. a glue flow groove; 132. a cavity sealing groove; 14. buffering the slope; 2. a lower die; 21. a lower die body; 22. a lower runner strip; 221. a lower flow path unit; 23. a molding unit; 231. a pin chamber; 232. a cavity; 233. a glue spreading groove; 31. the sections are easy to remove; 32. a lower die box; 321. a lower mounting groove; 33. putting the die box; 331. and (4) mounting the groove.

Detailed Description

The present application will be described in further detail below with reference to the accompanying drawings.

The embodiment of the application discloses a semiconductor plastic package mold. Referring to fig. 1 and 2, a semiconductor plastic package mold includes an upper mold 1 and a lower mold 2 used in cooperation with the upper mold 1. The lower die 2 comprises a lower die body 21, a lower runner strip 22 spliced with the lower die body 21 and a forming unit 23 for plastic-sealed colloid forming. The forming units 23 are arranged on the lower die body 21, the forming units 23 are distributed in a matrix shape, the lower die body 21 is located on two sides of the lower runner strip 22, the lower runner strip 22 is provided with a plurality of lower runner units 221, and each lower runner unit 221 is provided with a plastic packaging material barrel.

Referring to fig. 2 and 3, the forming unit 23 includes a pin cavity 231 matched with the pin, a cavity 232 for placing the chip, and a glue spreading groove 233 communicated with the pin cavity 231, the pin cavity 231 is disposed at two sides of the cavity 232, the pin cavity 231 is communicated with the cavity 232, and the glue spreading groove 233 and the groove bottom of the pin cavity 231 are far away from each other. The groove depth of the glue expanding groove 233 is smaller than that of the pin cavity 231, the notch size of the glue expanding groove 233 is larger than that of the pin cavity 231, and the pin cavity 231 is communicated with the plastic packaging barrel.

In the actual plastic packaging process, the upper die 1 and the lower die 2 are well assembled and connected, so that a closed operation space is formed, plastic packaging materials are injected into the cavity 232 through the flow pin cavity 231 at the position of a plastic packaging material barrel, after the cavity 232 is filled with the plastic packaging materials, the plastic packaging materials in the pin cavity 231 can overflow and flow into the glue spreading groove 233 in a brutal manner, so that when plastic packaging products are formed in the later period, the surface area of surplus materials wrapping the pin position is large, the surplus materials of the plastic packaging products are conveniently punched in the later period, the products are prevented from being crushed, the damage of the products is reduced, the production cost is reduced, the yield of the products is improved, and the quality of the products is improved.

Referring to fig. 3, one end of the glue spreading groove 233 close to the cavity 232 is not only narrowed in the middle, but also has a distance from the cavity 232, and the distance is set as the easy removal section 31, the easy removal section 31 is used for avoiding direct connection between the glue spreading groove 233 and the cavity 232, and a distance is reserved between the bottom of the cavity 232 and the bottom of the pin cavity 231. The plastic package colloid formed in the glue expanding groove 233 and the plastic package colloid formed in the cavity 232 are prevented from being directly connected through the easy removing section 31, so that the plastic package colloid at the cavity 232 can not be driven when the later punching excess materials are punched, the product is protected better, and the yield of the product is improved better.

Referring to fig. 4 and 5, the lower mold 2 is connected with a lower mold 2 box for installing itself, the lower mold 2 box is provided with a lower mounting groove 321, the upper mold 1 is connected with an upper mold 1 box for installing itself, the upper mold 1 box is provided with an upper mounting groove 331, and the upper mold 1 box is used in cooperation with the lower mold 2 box. Go up mould 1 including using the bolt fastening to go up mould body 11 of mould 1 box, be used for controlling the runner strip 12 and be used for the chamber unit 13 that seals of enclosure space of going up of plastic-sealed material flow direction, seal chamber unit 13 and set up on last mould body 11, go up mould body 11 and be located the both sides of runner strip 12, and both splice each other. The upper runner strip 12 is adapted to the lower runner strip 22 and is used in cooperation with the lower runner strip, and the cavity sealing unit 13 is adapted to the forming unit 23 and is used in cooperation with the forming unit.

Referring to fig. 4 and 5, the upper flow channel strip 12 is disposed on a plurality of upper flow channel units 121, each of the upper flow channel units 121 includes a flow guiding cake 1211 and a glue flow channel 1212, both of which are disposed on the upper flow channel strip 12, and the flow guiding cake 1211 is used for guiding the plastic package material. The cavity sealing unit 13 includes a glue flow groove 131 communicated with the glue flow channel 1212 and cavity sealing grooves 132 communicated with and disposed on two sides of the glue flow groove 131, the glue flow groove 131 and the surface of the lower die body 21 cooperate to form a sealed space, and the cavity sealing grooves 132 cooperate with the cavity 232 to form a sealed cavity. The upper die 1 and the lower die 2 are fixed by using bolts, the lower runner strip 22 and the upper runner strip 12 are abutted to each other, the plastic runner 1212 forms a closed runner, the upper runner unit 121 is connected with a plastic package material cylinder, the plastic package material can be injected according to a predetermined path through the flow guide cake 1211, and the plastic package material flows to the plastic runner 131 through the plastic runner 1212, so that the feeding effect of the plastic package material is improved.

Referring to fig. 4, a space is left between the bottom of the cavity-sealing groove 132 and the bottom of the glue flow groove 131, and a buffer slope 14 for buffering the injection flow of the molding compound is disposed at the connection between the cavity-sealing groove 132 and the glue flow groove 131. The interval that the tank bottom through seal chamber groove 132 and the tank bottom of gluing chute 131 left for gluing chute 131 can gather many plastic envelope material and just flow to in the die cavity 232, so that the injection that the plastic envelope material can last in die cavity 232, guarantee that the plastic envelope material in the die cavity 232 closely fills, slow down the velocity of flow that the plastic envelope material got into in the die cavity 232 through buffering slope 14 simultaneously, and then make in the better injection die cavity 232 of plastic envelope material, promote the shaping quality of plastic envelope product.

The implementation principle of the semiconductor plastic package mold in the embodiment of the application is as follows: in the actual plastic packaging process, the upper die 1 and the lower die 2 are well assembled and connected, so that a closed working space is formed, plastic packaging materials are injected into the cavity 232 through the glue flowing groove 131 at the position of a plastic packaging material barrel, after the cavity 232 is filled with the plastic packaging materials, the plastic packaging materials in the pin cavities 231 can overflow and flow to the glue spreading groove 233 in a brutal mode, so that when plastic packaging products are formed in the later period, the surface area of surplus materials wrapping the pin positions is large, the surplus materials of the plastic packaging products can be conveniently punched in the later period, the products are prevented from being crushed, the damage of the products is reduced, the production cost is reduced, the yield of the products is improved, and the quality of the products is improved.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims (10)

1. A semiconductor plastic package mould is characterized in that: including last mould (1) and cooperation go up lower mould (2) that mould (1) used, lower mould (2) include lower mould body (21), down runner strip (22) and are used for the fashioned forming unit (23) of plastic envelope colloid, forming unit (23) set up in on lower mould body (21), lower mould body (21) set up in the both sides of runner strip (22) down, forming unit (23) including with pin complex pin chamber (231) and communicate in the groove (233) are glued in expanding of pin chamber (231), expand gluey groove (233) and keep away from the tank bottom of pin chamber (231), the groove depth that expands gluey groove (233) is less than the groove depth of pin chamber (231).

2. The semiconductor plastic package mold according to claim 1, wherein: the molding unit (23) further comprises a cavity (232) for placing a chip, the pin cavities (231) are arranged on two sides of the cavity (232), and the pin cavities (231) are communicated with the cavity (232).

3. The semiconductor plastic package mold according to claim 2, wherein: and a space is reserved between the cavity bottom of the cavity (232) and the groove bottom of the pin cavity (231).

4. The semiconductor plastic package mold according to claim 3, wherein: one end, close to the cavity (232), of the glue expanding groove (233) is narrowed in the middle, a space is reserved between the glue expanding groove and the cavity (232), the space is set to be a section (31) easy to remove, and the section (31) easy to remove is used for the glue expanding groove (233) and the cavity (232) to avoid direct connection.

5. The semiconductor plastic package mold according to claim 4, wherein: go up mould (1) including last mould body (11), be used for controlling the last runner strip (12) of plastic envelope material flow direction and be used for the confined space seal chamber unit (13), seal chamber unit (13) set up in go up on mould body (11), go up mould body (11) set up in go up the both sides of runner strip (12), go up runner strip (12) with runner strip (22) suit down and both cooperate and use, seal chamber unit (13) with shaping unit (23) suit and both cooperate and use.

6. The semiconductor plastic package mold according to claim 5, wherein: the lower runner strip (22) is provided with a plurality of lower runner units (221), each lower runner unit (221) is provided with a plastic package material barrel, the upper runner strip (12) is arranged on a plurality of upper runner units (121), each upper runner unit (121) comprises a flow guiding cake (1211) and a glue runner (1212) which are arranged on the upper runner strip (12), and the flow guiding cakes (1211) are used for guiding plastic package materials.

7. The semiconductor plastic package mold according to claim 6, wherein: seal chamber unit (13) including with glue runner (131) and the intercommunication that runner (1212) communicates are glued and set up in seal chamber groove (132) of glue runner (131) both sides, glue runner (131) with the surface cooperation of lower mould body (21) forms confined space, seal chamber groove (132) with die cavity (232) cooperation forms confined cavity.

8. The semiconductor plastic package mold according to claim 7, wherein: the bottom of sealing chamber groove (132) with the bottom of glue groove (131) leaves the interval, seal chamber groove (132) with the junction of glue groove (131) is provided with and is used for buffering plastic-sealed material notes buffering slope (14) of flowing.

9. The semiconductor plastic package mold according to claim 8, wherein: the lower die (2) is connected with a lower die (2) box used for containing and installing the lower die (2) box, and a lower installation groove (321) is formed in the lower die (2) box.

10. The semiconductor plastic package mold according to claim 9, wherein: go up mould (1) and be connected with last mould (1) box that is used for holding and installing its self, go up mould (1) box and seted up mounting groove (331), go up mould (1) box with lower mould (2) box cooperation is used, and both can dismantle the connection.

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