CN215453406U - Reliable grounding anti-electromagnetic interference circuit board - Google Patents

Abstract

The utility model discloses a reliable-grounding anti-electromagnetic-interference circuit board which comprises a solder mask layer, a circuit layer, an insulating layer and a metal substrate which are sequentially attached from top to bottom, wherein a boss which is obtained by etching and is higher than the surface of the metal substrate is arranged on the metal substrate, the boss and the metal substrate are integrally formed, through holes matched with the boss are arranged on the circuit layer and the insulating layer, the boss penetrates through the through holes and is connected and conducted with a grounding wire on the circuit layer, and the solder mask layer is formed on the circuit layer. The boss integrally formed with the metal substrate is used as the grounding bonding pad, so that circuit routing is more flexible, technologies such as external bonding or manual welding are not needed, and the safety and the reliability of the module are improved; meanwhile, the bosses arranged can enable the reference voltage among all the grounding points to be consistent, and the performance consistency of the modules is ensured.

Description

Reliable grounding anti-electromagnetic interference circuit board

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a reliable-grounding anti-electromagnetic-interference circuit board.

Background

In the prior art, the wiring mainly uses the wire layer when the ignition module circuit is designed by adopting the copper substrate, the copper of the substrate layer is not fully used, the ignition module circuit is mainly designed as a single panel, and the copper substrate does not have any electrical property and is in a suspended state.

On one hand, when the copper substrate is used as a single-layer single-panel, the flexibility of wiring is limited for a circuit (with a plurality of grounding points) with complicated typesetting and wiring; therefore, in order to solve the problem, bonding is required to be performed externally or connection to the ground point is required to be performed through a bonding wire, which greatly increases the cost and the risk, and the reference potential of each ground is different due to the resistance existing between the wires through the bonding or welding method, so that the performance of the module is directly influenced.

On the other hand, the ignition module works in an environment with strong radiation and strong electromagnetic interference, and the copper substrate is in a suspended state, so that interference signals are easily generated, the performance and the stability of the ignition module are influenced, and even sensitive electronic components can be damaged due to interference overload.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a reliable grounding anti-electromagnetic interference circuit board.

In order to realize the purpose, the following technical scheme is adopted:

the utility model provides a reliable ground connection anti-electromagnetic interference's circuit board, includes solder mask, circuit layer, insulating layer and the metal substrate that from the top down laminated in proper order, wherein be provided with on the metal substrate obtain through the etching, be higher than the boss on metal substrate surface, the boss with metal substrate integrated into one piece, the circuit layer with all be provided with on the insulating layer with boss matched with through-hole, the boss runs through the through-hole and with earth conductor on the circuit layer connects and switches on, the solder mask is in shaping on the circuit layer.

Furthermore, the position of the boss on the metal substrate corresponds to the position of a component needing heat dissipation on the circuit board. Meanwhile, the lug boss can be used as a heat dissipation welding disc, is arranged below the component, basically conducts heat of the component to metal and is convenient for heat dissipation.

Further, the through hole on the circuit layer is obtained by etching, and the through hole on the insulating layer is obtained by drilling. The through hole obtained by etching is utilized, so that the precision is higher, and the grounding lead on the circuit layer is more convenient to be connected with the boss.

Further, the metal substrate is a copper substrate. Is more favorable for heat dissipation.

By adopting the scheme, the utility model has the beneficial effects that:

the boss integrally formed with the metal substrate is used as the grounding bonding pad, so that circuit routing is more flexible, technologies such as external bonding or manual welding are not needed, and the safety and the reliability of the module are improved; meanwhile, the bosses arranged can enable the reference voltage of each grounding point to be consistent, and the performance consistency of the modules is ensured.

Meanwhile, the arrangement of the lug boss enables the ground of the circuit layer to be connected with the base material layer to be used as a large ground, the problem that large-area copper needs to be applied can be solved, the typesetting area does not need to be increased, and the cost is effectively reduced.

The arrangement of the boss is used for connecting the ground of the circuit layer with the metal substrate, so that the similar capacitance effect can be solved, and the anti-interference performance of the module is improved.

The bottom metal substrate is a complete and very reliable grounding plane, and can effectively shield external electromagnetic interference.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic structural diagram of an embodiment of the present invention;

fig. 2 is a schematic diagram of the connection of the ground lead to the boss according to an embodiment of the present invention.

Wherein the figures identify the description:

1. a solder resist layer; 2. a circuit layer; 21. a ground lead; 3. an insulating layer; 4. a metal substrate; 5. a boss; 6. a through hole; 7. a prepreg.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.

It should be noted that the terms of orientation such as outer, inner, middle and the like in the embodiments of the present invention are only relative concepts to each other or are referred to a normal use state of the product, and should not be considered as limiting.

As shown in fig. 1 to 2, a reliable grounding anti-electromagnetic interference circuit board comprises a solder mask layer 1, a circuit layer 2, an insulating layer 3 and a metal substrate 4 which are sequentially attached from top to bottom, wherein a boss 5 obtained by etching and higher than the surface of the metal substrate 4 is arranged on the metal substrate 4, the boss 5 and the metal substrate 4 are integrally formed, through holes 6 matched with the boss 5 are respectively arranged on the circuit layer 2 and the insulating layer 3, the boss 5 penetrates through the through holes 6 and is connected and conducted with a grounding wire 21 on the circuit layer 2, and the solder mask layer 1 is formed on the circuit layer 2.

The position of the boss 5 on the metal substrate 4 corresponds to the position of the component needing heat dissipation on the circuit board. Meanwhile, the boss 5 can be used as a heat dissipation welding disc, the boss 5 is arranged below the component, heat of the component is basically conducted to metal, and heat dissipation is facilitated.

The via 6 in the wiring layer 2 is obtained by etching, and the via 6 in the insulating layer 3 is obtained by drilling. The through hole 6 obtained by etching has higher precision, and is more convenient for the connection of the grounding lead on the circuit layer 2 and the boss 5.

The metal substrate 4 is a copper substrate. Is more favorable for heat dissipation.

The working principle of the utility model is as follows: in the production of the utility model, the position of the boss 5 on the metal substrate 4 is designed and laid, namely the position of the boss 5 is corresponding to the position of the grounding lead and the heat dissipation of the component, wherein the metal substrate 4 adopts a copper substrate, then exposure development is carried out, namely unnecessary copper foil on the metal substrate 4 is etched under the action of light, so that the boss 5 appears on the metal substrate 4, exemplarily, during the etching, a dry film is attached to the position of the boss 5 to prevent the boss 5 from being etched, then the position of the circuit layer 2 corresponding to the boss 5 is etched by adopting the exposure development method to obtain a through hole 6, meanwhile, a through hole 6 is obtained by drilling the insulating layer 3, the insulating layer 3 is attached to the metal substrate 4 through a prepreg 7, and the boss 5 just passes through the through hole 6, wherein the grounding lead 21 on the circuit layer 2 is connected with the boss 5 through the processes of copper plating and the like, more specifically, a pad may be provided on the boss 5, and the ground wire 21 may be connected to the pad.

In practical use, the boss 5 can make the reference voltage between the grounds of the grounding points consistent, and ensure the consistent performance of the circuit.

By adopting the scheme, the utility model has the beneficial effects that:

the boss 5 integrally formed with the metal substrate 4 is used as a grounding bonding pad, so that circuit routing is more flexible, technologies such as external bonding or manual welding are not needed, and the safety and the reliability of the module are improved; meanwhile, the boss 5 can enable the reference voltage of each grounding point to be consistent, and the performance of the modules is guaranteed to be consistent.

Meanwhile, the arrangement of the lug boss 5 enables the ground of the circuit layer 2 to be connected with the base material layer to be used as a large ground, so that the problem that large-area copper needs to be applied can be solved, the typesetting area does not need to be increased, and the cost is effectively reduced.

The arrangement of the boss 5 is used for connecting the ground of the circuit layer 2 with the metal substrate 4, so that the similar capacitance effect can be solved, and the anti-interference performance of the module is improved.

The bottom metal substrate 4 is a complete and very reliable ground plane, which can effectively shield the external electromagnetic interference.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims (4)

1. The utility model provides a reliable ground connection anti-electromagnetic interference's circuit board, includes solder mask, circuit layer, insulating layer and the metal substrate that from the top down laminated in proper order, its characterized in that, wherein be provided with on the metal substrate obtain through the etching, be higher than the boss on metal substrate surface, the boss with metal substrate integrated into one piece, the circuit layer with all be provided with on the insulating layer with boss matched with through-hole, the boss runs through the through-hole and with earth conductor on the circuit layer connects and switches on, the solder mask is in shaping on the circuit layer.

2. The circuit board of claim 1, wherein the location of the raised platform on the metal substrate corresponds to the location of the components on the circuit board that require heat dissipation.

3. The circuit board of claim 1, wherein said vias in said wiring layer are etched and said vias in said insulating layer are drilled.

4. The circuit board of claim 1, wherein the metal substrate is a copper substrate.

Images