CN219107799U - Circuit board structure and electronic equipment - Google Patents

Abstract

The disclosure relates to a circuit board structure and an electronic device. The circuit board structure comprises: the main body is provided with a first installation area; the first bonding pad is arranged in the first mounting area; the bonding pad of the first electronic component is welded with the first bonding pad; wherein the first pad includes: an annular pad and an outer Zhou Hanpan surrounding the annular pad, the annular pad and the outer peripheral pad being connected to each other. In the present disclosure, the outer periphery of the annular bonding pad is additionally provided with the outer layer Zhou Hanpan, so that the bonding area of the bonding pad can be increased, and the occurrence of bonding failure between the circuit board structure and the electronic component can be reduced.

Description

Circuit board structure and electronic equipment

Technical Field

The disclosure relates to the technical field of circuit boards, and in particular relates to a circuit board structure and electronic equipment.

Background

Along with the development of science and technology, electronic devices such as smart phones and tablet computers are rapidly popularized, so that the electronic devices greatly promote the development of society and are convenient for people to live. The circuit board structure is an important component in electronic equipment, is a support body of electronic components, and is a carrier for electrically connecting the electronic components.

Currently, in designing circuit board structures, electronic components are typically attached to the circuit board by soldering. The bonding pads on the electronic component and the bonding pads on the circuit board structure are welded together, and most of the bonding pads on the circuit board structure are annular bonding pads and have smaller area.

Disclosure of Invention

In order to overcome the problems in the related art, the present disclosure provides a circuit board structure and an electronic device.

According to a first aspect of embodiments of the present disclosure, there is provided a circuit board structure comprising: the main body is provided with a first installation area; the first bonding pad is arranged in the first mounting area; the bonding pad of the first electronic component is welded with the first bonding pad; wherein the first pad includes: an annular pad and an outer Zhou Hanpan surrounding the annular pad, the annular pad and the outer peripheral pad being connected to each other.

In some embodiments, a via structure is disposed on the first pad, and a connection portion extending toward the inside of the body is disposed in the via structure.

In some embodiments, the body interior is further provided with a subsurface trace, the connection portion comprising: the first bonding pad is connected with the second end.

In some embodiments, the outer contoured shape of the outer Zhou Hanpan includes at least one of: rectangular, triangular, parallelogram, trapezoidal, polygonal.

In some embodiments, the first pads are a plurality, and the outer contour shape of the outer Zhou Hanpan of at least two of the plurality of first pads is different.

In some embodiments, the first electronic component is connected to the first pad through solder paste.

In some embodiments, the circuit-board structure further comprises: the second bonding pad is arranged in the second mounting area; and the bonding pad of the second electronic component is welded with the second bonding pad.

In some embodiments, the first electronic component is a radio assembly; and/or the second electronic component is a control chip, a memory, a capacitor, an inductor or a resistor.

In some embodiments, the second pads are configured in plurality, and at least one of the second pads is soldered to the plurality of pads of the second electronic component.

In some embodiments, at least one of the plurality of first pads or/and at least one of the plurality of second pads is a non-functional pad.

According to a second aspect of embodiments of the present disclosure, there is provided an electronic device, comprising: the circuit-board structure of the first aspect.

The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects: in the present disclosure, the outer periphery of the annular bonding pad is additionally provided with the outer layer Zhou Hanpan, so that the bonding area of the bonding pad can be increased, and the occurrence of bonding failure between the circuit board structure and the electronic component can be reduced.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure.

Fig. 1 is a schematic diagram of a circuit board structure, shown according to an exemplary embodiment.

Fig. 2 is a cross-sectional view of a circuit board structure shown in accordance with an exemplary embodiment.

Reference numerals:

1. a circuit board structure; 11. a main body; 111. a first mounting region;

12. a first bonding pad; 121. an annular bonding pad; 122. an outer Zhou Hanpan;

13. a via structure; 131. a connection part; 132. routing the subsurface layer; 133. a first end; 134. a second end.

Detailed Description

Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with some aspects of the disclosure as detailed in the scope of the claims.

Along with the development of science and technology, electronic devices such as smart phones and tablet computers are rapidly popularized, so that the electronic devices greatly promote the development of society and are convenient for people to live. The circuit board structure is an important component in electronic equipment, and provides fixed and assembled mechanical support for components such as transistors, integrated circuits, resistors, capacitors, inductors and the like; wiring and electrical connection between elements such as transistors, integrated circuits, resistors, capacitors, inductors, and the like, and electrical insulation are realized to satisfy electrical characteristics thereof; the method provides identification characters and patterns for the inspection and maintenance of elements in the electronic assembly process, and provides a solder resist pattern for wave soldering.

Currently, in designing circuit board structures, electronic components are typically attached to the circuit board by soldering. The bonding pads on the electronic component and the bonding pads on the circuit board structure are welded together, and most of the bonding pads on the circuit board structure are annular bonding pads and have smaller area. Because the land area on the circuit board structure is small, soldering failure and the like easily occur after soldering with the electronic component.

In summary, solving the problem of solder failure of a part of electronic components caused by the smaller area of the bonding pads on the circuit board structure is one of the problems that needs to be solved by those skilled in the art.

In order to solve the above technical problems, embodiments according to the present disclosure provide a circuit board structure and an electronic device.

Fig. 1 is a schematic diagram of a circuit board structure, shown according to an exemplary embodiment. Fig. 2 is a cross-sectional view of a circuit board structure shown in accordance with an exemplary embodiment.

As shown in fig. 1, the present disclosure provides a circuit board structure 1, which may include: the main body 11, the main body 11 may be provided with a first mounting region 111. The body 11 may be a substrate of the circuit board structure 1. The substrate may be a dielectric material and its composition may be a resin, a reinforcing material, and a filler.

Typically, the main body 11 of the circuit-board structure 1, i.e. the substrate, may be a copper-clad board. The copper-clad laminate (CopperCladLaminate, CCL) is a plate-like material prepared by impregnating electronic glass fiber cloth or other reinforcing materials with resin, cladding copper foil on one or both sides, and hot-pressing, and may be simply referred to as a copper-clad laminate.

The copper-clad plate is used as a substrate material in the manufacture of the circuit board structure 1, plays roles of interconnection conduction, insulation and support on the circuit board structure 1, and has certain influence on the transmission speed, energy loss, characteristic impedance and the like of signals in a circuit, so that the performance, quality, processability in the manufacture, manufacturing level, manufacturing cost and long-term reliability and stability of the circuit board structure 1 are related to the copper-clad plate.

In the present disclosure, the main body 11 of the circuit board structure 1 may be a copper clad laminate, but the present disclosure is not limited thereto, and the main body 11 of the circuit board structure 1 may be other substrates. In the following embodiments, a copper clad laminate is taken as an example of the main body 11 of the circuit board structure 1.

In the present disclosure, the shape of the first mounting region 111 may be rectangular, but the present disclosure is not limited thereto, and the shape of the first mounting region 111 may also be square, circular, oval, irregular, or other shapes, and the shape of the first mounting region 111 may also be selected according to the shape of the component disposed on the first mounting region 111.

In some embodiments, the circuit-board structure 1 may include a first pad 12, and the first pad 12 may be disposed at the first mounting region 111. The pads, which may be the basic building blocks of the surface mount assembly in the circuit board structure 1, are used to build up the land patterns (land patterns) of the circuit board, i.e. various combinations of pads designed for specific component types. The bonding pad can be used for electric connection and device fixation, and can also be a part of conductive patterns which are both provided.

In the present disclosure, the shape of the first pad 12 is not particularly limited, and may be an annular pad, a circular pad, a rectangular pad, an octagonal pad, a shaped pad, or the like, but may be other shapes.

In the present disclosure, the first pad 12 may be fixed to the first mounting region 111 by an adhesive connection manner, for example, the first pad 12 may be fixed to the first mounting region 111 by an adhesive such as an epoxy adhesive, but the present disclosure is not limited thereto, and the first pad 12 may be fixed to the first mounting region 111 by other manners.

In the present disclosure, the number of first pads 12 configurations is not particularly limited, and may be configured as a plurality. Since the number of first pads 12 is not particularly limited in the present disclosure, the circuit board structure 1 of the present disclosure is equally applicable to electronic components having a smaller number of pads.

In the present disclosure, the manufacturing process of the first pad 12 is not particularly limited; the material of which the first pads 12 are made is not particularly limited; the location of the first pads 12 on the circuit board structure 1 is not particularly limited, and the first pads 12 need only be disposed in the first mounting region 111.

In some embodiments, the circuit-board structure 1 may further comprise a first electronic component (not shown in the figures), the pads of which may be soldered with the first pads 12. The pad requirements such as the pad width, the pad length, the pad pitch, and the like of the first electronic component are not particularly limited in the present disclosure.

In the present disclosure, the first electronic component may be fixed to the first pad 12 by soldering, and the present disclosure is not limited to the specific soldering. The first electronic component may be fixed to the first pad 12 by other means.

For example, in some embodiments, the first electronic component may be connected to the first pad 12 by solder paste. The solder paste has certain viscosity at normal temperature, can be used for initially adhering the electronic components at a set position, and is used for welding the components to be welded with the bonding pads together to form permanent connection along with volatilization of the solvent and part of the additives at the welding temperature.

In some embodiments, the first pad 12 may be configured in plurality, and at least one first pad 12 may include: annular pad 121 and outer Zhou Hanpan 122 surrounding annular pad 121, annular pad 121 and outer Zhou Hanpan may be connected to each other.

It should be noted that at least one of the plurality of first pads 12 includes an annular pad 121 and an outer portion Zhou Hanpan 122 surrounding the annular pad 121, and the annular pad 121 and the outer portion Zhou Hanpan may be connected to each other. In the present disclosure, annular pad 121 and outer Zhou Hanpan 122 can be integrally formed, i.e., annular pad 121 and outer Zhou Hanpan 122 can be a unitary pad; the annular pads 121 may also be connected to each other by adhesive connection, soldering, etc. and the outer side Zhou Hanpan, and the connection manner of the annular pads 121 and the outer side Zhou Hanpan is not particularly limited in the present disclosure.

In the present disclosure, the outer layer Zhou Hanpan 122 is added to the outer periphery of the annular pad 121, so that the soldering area of the pad can be increased, and the occurrence of soldering failure between the circuit board structure 1 and the electronic component due to the small pad area can be reduced.

In some embodiments, the first pad 12 may have a via structure 13 disposed thereon, and the via structure 13 may have a connection portion 131 disposed therein that extends toward the inside of the body 11. In the present disclosure, the circuit-board structure 1 may be a double-layer circuit-board structure 1 or a multi-layer circuit-board structure 1 when the via structure 13 is provided on the first pad 12. In designing the double-layer circuit-board structure 1 and the multi-layer circuit-board structure 1, the via structure 13 is an important component of the design of the circuit-board structure 1, which enables the connection of the pads of the electronic components through the different layers of the circuit-board structure 1.

The vias, also called metallization holes, may be wires for connecting the different layers. In the double-sided circuit-board structure 1 and the multi-layer circuit-board structure 1, a common hole, i.e. a via hole, is drilled at the junction of the conductors of each layer that need to be connected in order to connect the conductor conductors between each layer. The parameters of the via hole mainly include the outer diameter and the drilling size of the hole, which are not particularly limited in this disclosure. In the present disclosure, the via may be not only a through hole but also a buried via.

As shown in fig. 2, in some embodiments, the main body 11 may be further provided with a subsurface trace 132 inside, and the connection portion 131 may include: a first end 133 and a second end 134, wherein the subsurface trace 132 may be connected to the first end 133 and the first pad 12 may be connected to the second end 134. In the present disclosure, the circuit-board structure 1 may comprise a surface layer and a subsurface layer. The via structure 13 may be that the surface layer trace of the circuit board structure 1 is connected to at least the sub surface layer trace 132, and may play a role in reinforcing the soldering effect between the first bonding pad 12 and the first electronic component.

The connection portion 131 of the via structure 13 may include a first end 133 and a second end 134, the subsurface trace 132 may be connected to the first end 133, and the first pad 12 may be connected to the second end 134. By this arrangement, it is possible to realize that the pads of the electronic components are connected through different layers of the circuit-board structure 1.

In some embodiments, the outer contoured shape of the outer Zhou Hanpan 122 can comprise at least one of the following: rectangular, triangular, parallelogram, trapezoidal, polygonal. In the present disclosure, the at least one first pad 12 may include an annular pad 121 and an outer Zhou Hanpan surrounding the annular pad 121, and the annular pad 121 and the outer Zhou Hanpan may be connected to each other. When the outer contour shape of the outer Zhou Hanpan is changed, the outer contour shape of the at least one first bonding pad 12 is changed and the outer contour shape of the first bonding pad 12 is the same as the outer contour shape of the outer Zhou Hanpan.

In some embodiments, the first bonding pad 12 may be plural, and the outer contour shape of the outer Zhou Hanpan 122 of at least two of the plural first bonding pads 12 may be different. In the present disclosure, the outer contour shape of the outer side Zhou Hanpan 122 can be one or more of a rectangle, a triangle, a parallelogram, a trapezoid, a polygon, and the outer contour shape of the outer side Zhou Hanpan of at least two of the plurality of first pads 12 can be different. For example, the outer contour shape of the outer Zhou Hanpan 122 of one of the plurality of first pads 12 may be rectangular and the outer contour shape of the outer Zhou Hanpan 122 of the other first pad 12 may be circular.

In some embodiments, the circuit-board structure 1 may further comprise: a second pad (not shown). In the present disclosure, the shape of the second pad is not particularly limited, and may be a circular pad, a rectangular pad, an octagonal pad, a shaped pad, or the like, but may be other shapes.

In some embodiments, the body 11 may be provided with a second mounting region (not shown in the drawings), and the second pad may be provided at the second mounting region. In the present disclosure, the shape of the second mounting region may be a shape in which the remaining portion of the first mounting region 111 is removed, but the present disclosure is not limited thereto and may also be rectangular, square, circular, elliptical, irregular, or other shapes, and the shape of the second mounting region may also be selected according to the shape of the component disposed on the second mounting region.

In the present disclosure, the second pad may be fixed to the second mounting region by an adhesive connection manner, for example, the second pad may be fixed to the second mounting region by an adhesive such as an epoxy adhesive, but the present disclosure is not limited thereto, and the first pad may be fixed to the second mounting region by other manners.

In some embodiments, the circuit board structure may further include: and a second electronic component (not shown in the figure), the pads of the second electronic component being soldered to the second pads. The pad requirements of the second electronic component such as the pad width, the pad length, the pad pitch, and the like are not particularly limited in the present disclosure.

In some embodiments, the second pads may be configured in plurality, and at least one second pad may be soldered with the plurality of pads of the second electronic component. In the present disclosure, the second electronic component may include a plurality of pads. In the present disclosure, the number of the second pads is not particularly limited, and at least one second pad is only required to be fixedly connected with a plurality of pads of the second electronic component.

In some embodiments, the first electronic component may be a radio assembly. In the present disclosure, a radio reception assembly may include: and electronic components such as a microphone, a radio antenna and the like. The present disclosure is not limited in this regard and the radio assembly may be other types or include other functions. The first electronic component is constructed as the sound receiving component, so that the functions of acquiring environmental sounds and the like through the sound receiving component in the electronic equipment can be realized.

In some embodiments, the second electronic component may be a control chip. The control chip plays an important role in the circuit-board structure 1, can be used for controlling and coordinating the operation of various components of the computer system, integrates a hard disk controller, and is responsible for processing Interrupt Requests (IRQs), direct Memory Access (DMA) and the like.

In other embodiments, the second electronic component may be a memory, a capacitor, an inductor, or a resistor. However, the present disclosure is not limited thereto, and in the present disclosure, the type of the second electronic component is not particularly limited.

It should be noted that, when the first electronic component is a radio receiving component, the second electronic component may be a control chip, a memory, a capacitor, an inductor or a resistor; when the first electronic component is a radio receiving component, the second electronic component may not be a control chip, a memory, a capacitor, an inductor or a resistor.

In some embodiments, at least one of the plurality of first pads 12 or/and at least one of the plurality of second pads may be a non-functional pad. In the present disclosure, the nonfunctional pads only play a role in fixing structurally, and the first electronic component or the second electronic component is fixed on the circuit board structure 1 through the nonfunctional pads.

In this disclosure, at least one of the plurality of first pads 12 may be a non-functional pad, and at least one of the plurality of second pads may also be a non-functional pad; when at least one of the plurality of first pads 12 is a nonfunctional pad, at least one of the plurality of second pads may be a functional pad or a nonfunctional pad.

Based on the same conception, the embodiment of the present disclosure also provides an electronic device (not shown in the drawings). Wherein the electronic device may comprise a circuit-board structure 1.

The electronic device of the present disclosure may be a mobile phone (e.g., a smart phone or a foldable mobile phone), but the present disclosure is not limited thereto, and may also be an electronic device such as a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, a translator, and a wearable device such as a wristwatch, a wristband, and the like.

In summary, according to an exemplary embodiment of the present disclosure, a circuit-board structure 1 is provided. The circuit-board structure 1 may comprise: a main body 11, wherein a first mounting area 111 is arranged on the main body 11; a first pad 12, the first pad 12 being disposed at the first mounting region 111; a first electronic component, wherein a bonding pad of the first electronic component is welded with the first bonding pad 12; wherein the first pad 12 comprises: an annular pad 121 and an outer Zhou Hanpan 122 surrounding the annular pad 121, the annular pad 121 and the outer Zhou Hanpan being connected to each other.

As can be seen from the above structure, in the present disclosure, by adding the outer layer Zhou Hanpan 122 to the outer periphery of the annular pad 121, the soldering area of the pad can be increased, and soldering failure or the like between the circuit board structure 1 and the electronic component can be reduced.

It is understood that the term "plurality" in this disclosure means two or more, and other adjectives are similar thereto. "and/or", describes an association relationship of an association object, and indicates that there may be three relationships, for example, a and/or B, and may indicate: a exists alone, A and B exist together, and B exists alone. The character "/" generally indicates that the context-dependent object is an "or" relationship. The singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It is further understood that the terms "first," "second," and the like are used to describe various information, but such information should not be limited to these terms. These terms are only used to distinguish one type of information from another and do not denote a particular order or importance. Indeed, the expressions "first", "second", etc. may be used entirely interchangeably. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure.

It will be further understood that the terms "center," "longitudinal," "transverse," "front," "rear," "upper," "lower," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship based on that shown in the drawings, merely for convenience in describing the present embodiments and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operate in a particular orientation.

It will be further understood that "connected" includes both direct connection where no other member is present and indirect connection where other element is present, unless specifically stated otherwise.

It will be further understood that although operations are depicted in the drawings in a particular order, this should not be understood as requiring that such operations be performed in the particular order shown or in sequential order, or that all illustrated operations be performed, to achieve desirable results. In certain circumstances, multitasking and parallel processing may be advantageous.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any adaptations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It is to be understood that the present disclosure is not limited to the precise arrangements and instrumentalities shown in the drawings, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the present disclosure is limited only by the scope of the appended claims.

Claims (11)

1. A circuit board structure, comprising:

the main body is provided with a first installation area;

the first bonding pad is arranged in the first mounting area;

the bonding pad of the first electronic component is welded with the first bonding pad; wherein the method comprises the steps of

The first bonding pad includes: an annular pad and an outer Zhou Hanpan surrounding the annular pad, the annular pad and the outer peripheral pad being connected to each other.

2. The circuit board structure of claim 1, wherein the circuit board comprises a plurality of circuit boards,

the first bonding pad is provided with a via structure, and a connecting part extending towards the inside of the main body is arranged in the via structure.

3. The circuit board structure of claim 2, wherein the circuit board is configured to,

the main body is internally provided with a subsurface wiring;

the connection part includes: a first end and a second end, wherein

The subsurface trace is connected with the first end, and the first bonding pad is connected with the second end.

4. The circuit board structure of claim 1, wherein the circuit board comprises a plurality of circuit boards,

the outer contour shape of the outer Zhou Hanpan includes at least one of: rectangular, triangular, parallelogram, trapezoidal, polygonal.

5. The circuit board structure of claim 1, wherein the circuit board comprises a plurality of circuit boards,

the outer contour shape of the outer Zhou Hanpan of at least two of the plurality of first pads is different.

6. The circuit board structure of claim 1, wherein the circuit board comprises a plurality of circuit boards,

the first electronic component is connected with the first bonding pad through solder paste.

7. The circuit-board structure of claim 1, wherein the circuit-board structure further comprises:

the second bonding pad is arranged in the second mounting area;

and the bonding pad of the second electronic component is welded with the second bonding pad.

8. The circuit board structure of claim 7, wherein the circuit board is configured to,

the first electronic component is a radio component; and/or

The second electronic component is a control chip, a memory, a capacitor, an inductor or a resistor.

9. The circuit board structure of claim 7, wherein the circuit board is configured to,

the second bonding pads are configured in a plurality, and at least one second bonding pad is welded and fixed with the plurality of bonding pads of the second electronic component.

10. The circuit board structure of claim 9, wherein the circuit board is configured to,

at least one of the plurality of first bonding pads or/and at least one of the plurality of second bonding pads is a non-functional bonding pad.

11. An electronic device, comprising:

the circuit-board structure of any one of claims 1-10.

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