CN215437085U - Light splitting and braiding integrated machine - Google Patents

Abstract

The application provides a light splitting and braiding integrated machine which comprises a light splitting device, a braiding device and a pushing mechanism; the light splitting device comprises a material conveying mechanism with a material loading position and a material unloading position; the feeding position of the braiding device is close to the discharging position, and the speed of the material conveying mechanism for conveying the LED chips is equal to the speed of the braiding device for braiding the LED chips. This application beam split braid all-in-one sets up and braid device braid speed through the speed that will defeated material mechanism carried the LED chip in the beam splitting device equals to set up LED chip propelling movement to the braid device in the propelling movement mechanism will defeated material mechanism, need not to keep in the LED chip, guarantee to supply with the LED chip to the braid device in succession, in order to carry out the braid, raise the efficiency, also need not frequently to open and stop the beam splitting device, guarantee beam splitting device's life.

Description

Light splitting and braiding integrated machine

Technical Field

The application belongs to the technical field of LED production equipment, and more specifically relates to a beam split braid all-in-one machine.

Background

After the LED chips are produced, the LED chips often have differences in light intensity, color temperature, quality and the like, so that the LED chips need to be sorted out by using a light splitter, and the qualified LED chips need to be sent into a braider for positioning and braiding for subsequent use. The traditional mode is that two sets of equipment of a light splitting machine and a braider are respectively arranged, the light splitting machine is used for sorting out qualified LED chips to be collected and then sending the chips to the braider for braiding, but the light splitting machine and the braider with the structure need to be respectively provided with a feeding mechanism, so that the occupied area is large, and the cost is high. In order to solve the problem, a scheme for combining the light splitting device and the braiding device into a whole is proposed currently, specifically, the braiding device is arranged adjacent to the light splitting device, and in order to adapt to the sorting speed of the light splitting device, a vibrating wire is arranged between a feeding position of the braiding device and a discharging position of the light splitting device for material transfer. However, with the structure, when the vibration wire is full of the LED chip, the light splitting device usually needs to be stopped for a period of time; after most of the LED chips on the vibration wire enter the braiding device for braiding, the LED chips are started. This can lead to the braid device feeding discontinuity, and inefficiency, and frequently opens and stops, easily influence the beam split device life-span.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the application is to provide a light splitting braid all-in-one machine to solve the problem that the light splitting braid all-in-one machine braid device feeding that exists among the correlation technique is discontinuous, and is inefficient, and frequently opens and stops, easily influences the light splitting device life-span.

In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions: the light splitting and braiding integrated machine comprises a light splitting device and a braiding device; the light splitting device includes:

the material conveying mechanism is used for positioning and conveying the LED chip;

the feeding mechanism is used for supplying the LED chips to the conveying mechanism;

the testing assembly is used for testing the LED chip on the material conveying mechanism; and the number of the first and second groups,

the sorting mechanism is used for sorting the LED chips on the material conveying mechanism; the feeding mechanism, the testing assembly and the sorting mechanism are sequentially arranged along the conveying direction of the conveying mechanism; the feeding mechanism is provided with a feeding position and a discharging position and is connected with the feeding position; it is characterized in that the preparation method is characterized in that,

the feed level of braid device is close to the material level setting of unloading, defeated material mechanism conveys the speed of LED chip with the braid device will LED chip braid speed equals, beam split braid all-in-one still including be used for with the material level of unloading the LED chip propelling movement extremely the push mechanism of feed level.

In an optional embodiment, the pushing mechanism comprises a blowing nozzle used for blowing the LED chip to the feeding position and a feeding seat supporting the blowing nozzle, and the blowing nozzle is arranged on one side of the blanking position far away from the feeding position.

In an optional embodiment, the pushing mechanism further includes a detecting unit for detecting whether the LED chip at the feeding position blows into the feeding position, and the detecting unit is mounted on the feeding seat.

In an optional embodiment, the pushing mechanism further includes a limiting block for covering the feeding level and the feeding level, the detecting unit is installed in the limiting block, and the limiting block is installed on the feeding seat in a sliding manner along a vertical direction.

In an optional embodiment, the feeding level and the discharging level are arranged at intervals, and the light splitting and braiding all-in-one machine further comprises a guide rail for connecting the feeding level and the discharging level; or the blanking position is connected with the feeding position.

In an optional embodiment, the material conveying mechanism includes a turntable, a rotary ring protruding upward from the periphery of the turntable, and a light splitting motor driving the turntable to rotate, and the rotary ring is provided with a plurality of accommodating grooves for accommodating the LED chips.

In an optional embodiment, beam splitting device still includes clout and gets rid of the mechanism, clout get rid of the mechanism include the clout calandria, be used for with in the storage tank the LED chip blows in the row's of material mouth in the clout calandria, and support the clout calandria with the row's of material seat of material mouth, it holds the groove to have seted up on the row's of material seat, the change stretches into hold in the groove, the row's of material mouth with the clout calandria is located respectively hold the relative both sides in groove, the row's of material seat is followed the change direction of rotation is located down the material level with go up between the material level.

In an alternative embodiment, the braiding apparatus comprises:

the material conveying mechanism is used for conveying the LED chips and is provided with a material outlet position and a material inlet position;

the tape-feeding mechanism is used for conveying the carrier tape;

the implanting mechanism is used for implanting the LED chips conveyed by the material conveying mechanism into the carrier tape;

the cutter sealing mechanism is used for attaching the adhesive film to the carrier tape;

the film feeding mechanism is used for feeding the adhesive film to the sealing cutter mechanism; and the number of the first and second groups,

the tape collecting mechanism is used for collecting the carrier tape attached with the adhesive film;

the implanting mechanism, the knife sealing mechanism and the tape collecting mechanism are sequentially arranged along the conveying direction of the carrier tape, and the discharging position of the material conveying mechanism is arranged at the implanting mechanism.

In an optional embodiment, the material conveying mechanism includes a disc, a supporting plate for supporting the disc, a rotating shaft for driving the disc to rotate on the supporting plate, and a material conveying motor for driving the rotating shaft to rotate, and a plurality of openings for accommodating the LED chips are formed in the periphery of the disc.

In an optional embodiment, the braiding apparatus further comprises:

the image detection mechanism is used for detecting the appearance of the LED chip implanted into the carrier tape; and the number of the first and second groups,

the material supplementing mechanism is used for removing the LED chips which are detected to be unqualified by the image detection mechanism from the carrier tape and replacing the qualified LED chips to be implanted into the carrier tape;

the image detection mechanism and the material supplementing mechanism are arranged between the implantation mechanism and the cutter sealing mechanism.

The beneficial effect of beam split braid all-in-one that this application embodiment provided lies in: compared with the prior art, this application beam split braid all-in-one sets up the speed that carries the LED chip through defeated material mechanism in with the beam split device and equals with braid device braid speed to set up LED chip propelling movement to the braid device in the propelling movement mechanism will defeated material mechanism, need not to keep in the LED chip, guarantee to supply with the LED chip to the braid device in succession, in order to carry out the braid, raise the efficiency, also need not frequently to open and stop the beam split device, guarantee beam split device's life.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or exemplary technical descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic perspective view of a light splitting and taping all-in-one machine provided in an embodiment of the present application;

FIG. 2 is a schematic top view of the light splitting and taping integrated machine shown in FIG. 1;

FIG. 3 is a schematic view of a portion of the light splitting device and the braiding device of FIG. 2;

FIG. 4 is an enlarged view of portion A of FIG. 3;

FIG. 5 is a schematic view of a portion of the light-splitting device shown in FIG. 3;

fig. 6 is a schematic structural diagram of a material conveying mechanism according to an embodiment of the present application;

FIG. 7 is an enlarged view of portion B of FIG. 6;

FIG. 8 is a schematic view of the sorting mechanism of FIG. 6;

FIG. 9 is a schematic view of a portion of the structure of the excess material removing mechanism and the braiding apparatus shown in FIG. 3;

fig. 10 is a partial structural schematic view of a material conveying mechanism provided in an embodiment of the present application;

fig. 11 is a schematic top view of a feeding position and a discharging position according to an embodiment of the present disclosure;

fig. 12 is a schematic top view of a feeding level and a discharging level according to another embodiment of the present disclosure;

FIG. 13 is a schematic structural diagram of a pushing mechanism provided in an embodiment of the present application;

fig. 14 is a schematic structural diagram of a bin provided in an embodiment of the present application.

Wherein, in the drawings, the reference numerals are mainly as follows:

100-light splitting and braiding integrated machine;

10-a frame; 11-a printer; 12-a computer host; 13-a display; 14-a human-machine interface; 15-an ion fan; 16-start stop button;

20-a light splitting device; 201-a spectroscopic support;

21-a feeding mechanism; 211-vibrating disk; 22-a correction mechanism; 23-an integrating sphere; 24-an electrical testing mechanism; 25-excess material removing mechanism; 251-a discharge seat; 2511-a vessel; 252-excess discharge pipe; 253-a material receiving nozzle; 254-a discharge nozzle; 255-a pipe joint; 26-an inductor;

30-a material conveying mechanism; 301-a loading level; 302-a discharge level; 31-swivel; 311-a receiving groove; 32-a turntable; 33-a beam splitting motor; 34-positioning seat; 341-a positioning groove; 35-an air suction pipe; 40-a sorting mechanism; 41-a fixed seat; 411-an arc-shaped slot; 42-a discharge pipe; 43-receiving pipe; 44-a blowing nozzle; 45-a connector; 46-a bin; 461-case frame; 462-a cartridge; 463-a drawer; 464-a cannula; 465-cover plate; 466-guide plate;

50-a braiding device; 501-braiding a support;

51-a tape-feed mechanism; 52-an implantation mechanism; 53-knife sealing mechanism; 54-a take-up mechanism; 55-a film feeding mechanism; 551-glue film material roll; 552-a guide shaft; 56-a tape cutting mechanism; 57-a carrier web roll; 58-guide axis; 60-a material conveying mechanism; 601-a feed position; 61-a pallet; 611-gas port; 62-disc; 621-opening; 63-a rotating shaft; 64-a material conveying motor; 65-a support seat; 66-an insulating block;

71-an adjustment mechanism; 72-a vision mechanism; 73-a discharge mechanism; 731-bad cartridges; 74-image detection means; 75-a feeding mechanism; 751-a recovery box;

80-a pushing mechanism; 81-blowing nozzle; 82-a feed block; 83-a detection unit; 84-a limiting block; 85-a guide rail; 86-a striker plate; and 90-LED chips.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.

In the description of the present application, it is to be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present application and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present application.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

Reference throughout this specification to "one embodiment," "some embodiments," or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," or the like, in various places throughout this specification are not necessarily all referring to the same embodiment, but rather "one or more but not all embodiments" unless specifically stated otherwise. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

The english abbreviations used in this application correspond to the following chinese and english letters:

LED, english: light Emitting Diode; chinese: a light emitting diode.

Referring to fig. 1 to 3, a light splitting and taping all-in-one machine 100 provided by the present application will now be described. Referring to fig. 11, the light splitting and braiding integrated machine 100 includes a light splitting device 20, a braiding device 50, and a pushing mechanism 80, wherein the light splitting device 20 is used for classifying the LED chips 90, and classifying the LED chips 90 according to the quality difference of the LED chips 90, so as to sort out the required LED chips 90. The taping device 50 is used for taping the desired LED chips 90 sorted out by the light-splitting device 20 for subsequent use. And the pushing mechanism 80 is used for pushing the LED chips 90 sorted by the light-splitting device 20 into the braiding device 50 for braiding by the braiding device 50.

Referring to fig. 3, 5 and 6, the light splitting device 20 includes a material conveying mechanism 30, and the material conveying mechanism 30 is used for positioning and conveying the LED chips 90 so as to screen and classify the LED chips 90.

The feeding mechanism 30 has a loading position 301 for placing the LED chip 90 from the loading position 301 to the feeding mechanism 30 for positioning and conveying by the feeding mechanism 30.

The feeding mechanism 30 has a feeding position 302, and the sorted LED chips 90 are pushed from the feeding position 302 to the tape knitting device 50 by the pushing mechanism 80.

The respective braiding device 50 has a feed location 601, i.e. LED chips 90 enter the braiding device 50 from the feed location 601 in order to braid the braiding device 50.

The feeding position 601 of the braiding device 50 is arranged close to the blanking position 302, the speed of the material conveying mechanism 30 for conveying the LED chips 90 is equal to the speed of the braiding device 50 for braiding the LED chips 90, so that when the sorted LED chips 90 are blanked at the blanking position 302, the feeding position 601 of the braiding device 50 can be just emptied, and the pushing mechanism 80 pushes the LED chips 90 at the blanking position 302 to the feeding position 601 for braiding of the braiding device 50. Therefore, the LED chips 90 do not need to be suspended, and when the material conveying mechanism 30 continuously conveys the LED chips 90, the LED chips 90 can be continuously supplied to the braiding device 50, so that the efficiency is improved. The structure can also realize the synchronization of the material conveying mechanism 30 and the speed of the braid, the light splitting device 20 does not need to be started and stopped frequently, and the service life of the light splitting device 20 is ensured.

In one embodiment, referring to fig. 1 and 2, the light splitting and braiding machine 100 further includes a frame 10, and the light splitting device 20 and the braiding device 50 are mounted on the frame 10 for convenient assembly, movement, transportation and use. It is understood that the frame 10 may be provided separately at the place of use, and the spectroscopic device 20 and the taping device 50 may be mounted.

In one embodiment, referring to fig. 3, 6 and 7, the feeding mechanism 30 includes a turntable 32, a rotary ring 31 and a light splitting motor 33, the rotary ring 31 is disposed at the periphery of the turntable 32 and protrudes from the periphery of the turntable 32, so as to support the rotary ring 31 by the turntable 32. The turntable 32 is mounted on the light splitting motor 33, and the turntable 32 is driven to rotate by the light splitting motor 33 so as to drive the rotating ring 31 to rotate. The swivel 31 is provided with a plurality of receiving grooves 311, so that the LED chip 90 can be placed in the receiving grooves 311 to be positioned and received by the LED chip 90, and when the swivel 31 rotates, the LED chip 90 can be positioned and conveyed. One of the positions may be set as the loading position 301 on a circular line on which the swivel 31 rotates, and when the accommodating groove 311 on the swivel 31 rotates to the loading position 301, the LED chip 90 is placed in the accommodating groove 311. After the swivel 31 conveys the LED chips 90 for sorting, a position on the circular line where the swivel 31 rotates is set as a feeding position 302, and when the accommodating groove 311 drives the sorted LED chips 90 to reach the feeding position 302, the pushing mechanism 80 pushes the LED chips 90 to the feeding position 601 of the tape coding device 50. The swivel 31 is used for transmitting the LED chip 90, so that the transmission efficiency is high, the occupied space is small, and the cost is low. It is understood that the feeding mechanism 30 may also use a linear feeding line to transport the LED chips 90.

In one embodiment, referring to fig. 6 to 8, the feeding mechanism 30 further includes a suction pipe 35, and the suction pipe 35 is installed at the center of the turntable 32 for facilitating connection with an external suction device, such as a vacuum machine. The swivel 31 is opened with first air suction holes (not shown) communicating with the receiving grooves 311, and the turntable 32 is opened with second air suction holes (not shown) communicating with the first air suction holes, and the second air suction holes are communicated with the air suction pipe 35, so that the air suction pipe 35 can generate negative pressure in the first air suction holes, and further the receiving grooves 311 can generate negative pressure, when the LED chip 90 is placed in the receiving grooves 311, the LED chip 90 can be adsorbed, and the LED chip 90 is prevented from falling, so that the LED chip 90 can be stably conveyed.

In one embodiment, the positioning seat 34 is installed in the accommodating groove 311, the positioning seat 34 is provided with a positioning groove 341, and the positioning groove 341 is adapted to the LED chip 90 to accommodate the LED chip 90. Set up positioning seat 34 to better adaptation LED chip 90, if can be according to the kind and the size of LED chip 90, with the positioning seat 34 of change correspondence, and then stably convey corresponding LED chip 90, promote this defeated material mechanism 30's application scope. It should be understood that the containing slot 311 may be configured to fit the LED chip 90, so that the material conveying mechanism 30 can convey one size of the LED chip 90.

In one embodiment, a third suction hole (not shown) is formed in the positioning seat 34, and the third suction hole is communicated with the first suction hole to communicate the third suction hole with the suction pipe 35, so that a negative pressure can be generated in the positioning groove 341 to suck the LED chip 90, thereby facilitating stable transmission of the LED chip 90.

In one embodiment, the positioning seat 34 may be a ceramic seat, which has good wear resistance and insulation property, so as to precisely position and support the LED chip 90, better protect the LED chip 90, and facilitate the testing of the LED chip 90. It is understood that other materials may be used for the positioning seat 34.

In one embodiment, referring to fig. 3 and 5, the light splitting apparatus 20 further includes a light splitting bracket 201, and the feeding mechanism 30 is mounted on the light splitting bracket 201 for convenient assembly. It will be appreciated that the feeding mechanism 30 may be mounted to the frame 10. Of course, a support structure may be separately provided to support the feeding mechanism 30.

In one embodiment, referring to fig. 2, fig. 3 and fig. 5, the light splitting device 20 further includes a feeding mechanism 21, the feeding mechanism 21 is connected to the feeding level 301, and the feeding mechanism 21 feeds the LED chips 90 onto the material conveying mechanism 30, so as to automatically feed the LED chips 90.

In one embodiment, the feeding mechanism 21 is a vibrating tray 211, that is, the feeding is performed through the vibrating tray 211, which is low in cost, high in efficiency and small in occupied space. It is understood that when a material plate on which the LED chips 90 are arranged is used, the feeding may be performed using a suction nozzle swing arm mechanism. The LED chips 90 may also be fed to the conveyor line using a guide structure, such as by adjusting the angle of the LED chips 90 with the guide structure to slide onto the conveyor line, through which the material is fed. Of course, vibrating wire feeding may also be used.

In one embodiment, the light splitting bracket 201 is provided with the sensor 26, and the sensor 26 is used for sensing whether the LED chip 90 reaches the loading position 301, so that accurate loading of the LED chip 90 can be better ensured.

In one embodiment, the inductor 26 may be an inductive fiber. Of course, a camera, an ultrasonic sensor, or the like may be used for the sensor 26.

In one embodiment, referring to fig. 3 and 5, the light splitting device 20 further includes a testing component for testing the LED chips 90 on the feeding mechanism 30 to determine the qualified or required LED chips 90. The testing component is arranged between the feeding position 301 and the discharging position 302 along the conveying direction of the conveying mechanism 30.

In one embodiment, the testing assembly includes a calibration mechanism 22, and the calibration mechanism 22 calibrates the position of the LED chip 90 on the feeding mechanism 30 so as to test the LED chip 90.

In one embodiment, when a spectroscopy mount 201 is provided, the calibration mechanism 22 is mounted on the spectroscopy mount 201 to facilitate assembly. It will be appreciated that the alignment mechanism 22 may be mounted on the frame 10. Of course, a support structure may be provided separately to mount the alignment mechanism 22.

In one embodiment, the test assembly includes an integrating sphere 23, and integrating sphere 23 is used to detect the optical properties of LED chip 90. The integrating sphere 23 is disposed between the feeding level 301 and the discharging level 302 along the conveying direction of the conveying mechanism 30.

In one embodiment, integrating sphere 23 is mounted on light-splitting mount 201 to facilitate assembly when light-splitting mount 201 is provided. It will be appreciated that integrating sphere 23 may be mounted on housing 10. Of course, a support structure may be separately provided to mount integrating sphere 23.

In one embodiment, the testing assembly includes an electrical testing mechanism 24, and the electrical testing mechanism 24 is used to detect electrical properties of the LED chip 90. The electrical property testing mechanism 24 is disposed between the feeding position 301 and the discharging position 302 along the conveying direction of the conveying mechanism 30.

In one embodiment, when the spectroscopy mount 201 is provided, the electrical testing mechanism 24 is mounted on the spectroscopy mount 201 to facilitate assembly. It will be appreciated that the electrical testing mechanism 24 may be mounted on the chassis 10. Of course, a separate support structure may be provided to mount the electrical testing mechanism 24.

In one embodiment, the testing assembly includes a calibration mechanism 22, an integrating sphere 23 and an electrical testing mechanism 24, wherein the calibration mechanism 22, the integrating sphere 23 and the electrical testing mechanism 24 are sequentially disposed along the conveying direction of the material conveying mechanism 30 to better test the LED chip 90 and determine the quality and parameters of the LED chip 90.

In one embodiment, referring to fig. 3, 5 and 6, the light-splitting device 20 includes a sorting mechanism 40, the sorting mechanism 40 is used for sorting the LED chips 90 on the feeding mechanism 30 to sort and collect the LED chips 90 on the feeding mechanism 30, and the qualified or required LED chips 90 are conveyed to the discharging position 302.

In one embodiment, when the light splitting device 20 includes the feeding mechanism 21, the testing component and the sorting mechanism 40, the feeding mechanism 21, the testing component and the sorting mechanism 40 are sequentially arranged along the conveying direction of the material conveying mechanism 30, so that the feeding mechanism 21 automatically feeds the material to the material conveying mechanism 30, the testing component tests the LED chips 90 on the material conveying mechanism 30, and the sorting mechanism 40 sorts the LED chips 90 tested by the testing component according to the testing performance, so that the qualified or required LED chips 90 are conveyed to the material discharging position 302.

In one embodiment, when a spectroscopy mount 201 is provided, the sorting mechanism 40 is mounted on the spectroscopy mount 201 to facilitate assembly. It will be appreciated that the sorting mechanism 40 may be mounted on the frame 10. Of course, a separate support structure may be provided to mount the sorting mechanism 40.

In one embodiment, referring to fig. 6, 7 and 9, the sorting mechanism 40 includes a fixed base 41, a plurality of discharging pipes 42 and a plurality of blowing nozzles 44, the fixed base 41 is disposed in an arc shape, and an arc slot 411 is formed in the fixed base 41, so that the rotary ring 31 can be inserted into the arc slot 411. A plurality of discharge pipes 42 are installed at intervals on the fixing base 41, and the discharge pipes 42 are supported by the fixing base 41. The mouthpiece 44 is mounted on the holder 41, and the mouthpiece 44 is supported by the holder 41. The mouthpiece 44 is used to connect with an insufflation tube. The blowing nozzles 44 are in one-to-one correspondence with the discharge pipes 42, and the blowing nozzles 44 and the discharge pipes 42 are respectively connected to opposite sides of the arc-shaped slot 411, so that an air flow can be blown out through the blowing nozzles 44 to blow the LED chips 90 in the accommodating grooves 311 into the corresponding discharge pipes 42 so as to collect the corresponding LED chips 90.

In one embodiment, the sorting mechanism 40 further comprises connectors 45, each blowing nozzle 44 is mounted on the connectors 45, and the connectors 45 are used for connecting a blowing pipe, so as to connect the blowing nozzle 44 with the blowing pipe conveniently. It will be appreciated that the mouthpiece 44 may also be connected directly to the insufflation tube.

In one embodiment, the sorting mechanism 40 further includes a plurality of material receiving pipes 43, the material receiving pipes 43 correspond to the material discharging pipes 42 one by one, each material discharging pipe 42 is connected to the corresponding material receiving pipe 43, each material receiving pipe 43 is inserted into the fixing base 41, and the blowing nozzle 44 corresponds to the material receiving pipe 43 so as to blow the LED chips 90 into the corresponding material receiving pipe 43. The material receiving pipe 43 is arranged to conveniently connect the material discharging pipe 42, the material discharging pipe 42 is conveniently connected with the fixed base 41, and the LED chip 90 is conveniently guided to enter the material discharging pipe 42. It will be appreciated that one end of the discharge tube 42 may be directly mounted on the holder 41, and the blowing nozzle 44 blows the LED chip 90 directly into the discharge tube 42.

In one embodiment, referring to fig. 1 and 14, the light splitting device 20 further includes a material box 46, the material box 46 includes a plurality of material cylinders 462, the plurality of material cylinders 462 correspond to the material discharging pipes 42 one by one, and one end of each material discharging pipe 42 away from the fixing base 41 is connected to the corresponding material cylinder 462, so that the LED chips 90 discharged from the corresponding material discharging pipe 42 are collected by the material cylinders 462.

In one embodiment, the magazine 46 further comprises a magazine frame 461, a plurality of cartridges 462 being mounted in the magazine frame 461 to support the cartridges 462 through the magazine frame 461 and to facilitate assembly for use.

In one embodiment, the magazine 46 further comprises a drawer 463, an insertion tube 464 and a cover 465, each cartridge 462 being mounted in the drawer 463 to support each cartridge 462 by the drawer 463. The drawer 463 is slidably mounted in the housing 461 to facilitate removal and replacement of the cartridge 462. The insertion tubes 464 are in one-to-one correspondence with the cartridges 462 and the insertion tubes 464 are connected to the discharge conduit 42, with each insertion tube 464 being mounted on a cover 465, with the insertion tubes 464 being supported by the cover 465, thus facilitating communication of the discharge conduit 42 with the cartridges 462. So that in use, the cartridge 462 can be removed from the carriage 461 by pulling out the drawer 463 to facilitate replacement of the cartridge 462; when the drawer 463 is inserted into the frame 461, each insertion tube 464 corresponds to a respective cartridge 462 to connect the cartridge 462 to the corresponding discharge tube 42 for ease of assembly.

In one embodiment, the magazine 46 further comprises a guide plate 466, the guide plate 466 being slidably mounted in the magazine frame 461, and each cartridge 462 being mounted in the guide plate 466 to support the cartridge 462 by the guide plate 466 cooperating with the drawer 463 to stably support the cartridge 462.

In one embodiment, the bins 46 may be mounted in the rack 10 to reduce the footprint. It will be appreciated that the magazine 46 may also be provided separately.

In one embodiment, referring to fig. 3, 4 and 9, the light splitting device 20 further comprises a residue removing mechanism 25, and the residue removing mechanism 25 is located downstream of the feeding level 302. The remainder removing mechanism 25 is used for removing the LED chips 90 which are not discharged after passing through the blanking position 302 in the material conveying mechanism 30. So that the feeding mechanism 30 receives the LED chips 90 at the feeding position 301, and stable feeding and loading of the LED chips 90 are ensured. In this embodiment, the remainder removing mechanism 25 is located between the lower position 302 and the upper position 301 along the rotation direction of the rotary ring 31, and removes the LED chips 90 in the accommodating groove 311 before the accommodating groove 311 on the rotary ring 31 reaches the upper position 301, so as to receive the LED chips 90 at the upper position 301.

In one embodiment, referring to fig. 3, fig. 4 and fig. 9, the remainder discharging mechanism 25 includes a remainder discharging pipe 252, a discharging nozzle 254 and a discharging base 251, the discharging base 251 is provided with a containing groove 2511, the discharging nozzle 254 and the remainder discharging pipe 252 are respectively located at two opposite sides of the containing groove 2511, the discharging base 251 is located between the lower position 302 and the upper position 301 along the rotation direction of the rotating ring 31, the rotating ring 31 extends into the containing groove 2511, so that the discharging nozzle 254 can blow the LED chips 90 in the containing groove 311 on the rotating ring 31 into the remainder discharging pipe 252, so as to remove the LED chips 90 before the containing groove 311 on the rotating ring 31 rotates to the upper position 301.

In one embodiment, the residue removing mechanism 25 further includes a material receiving nozzle 253, the material receiving nozzle 253 is connected to the residue discharge pipe 252, the material receiving nozzle 253 is mounted on the material discharge seat 251, and the material discharge nozzle 254 corresponds to the material receiving nozzle 253 to blow the LED chip 90 into the material receiving nozzle 253. The material receiving nozzle 253 is arranged to facilitate connection of the excess material discharge pipe 252, connection of the excess material discharge pipe 252 with the material discharge seat 251, and introduction of the LED chip 90 into the excess material discharge pipe 252. It will be appreciated that one end of the slug discharge pipe 252 may be mounted directly on the discharge seat 251, and the discharge nozzle 254 blows the LED chips 90 directly into the slug discharge pipe 252.

In one embodiment, the residue removing mechanism 25 further comprises a pipe connector 255, the material receiving nozzle 253 is connected with the pipe connector 255, and the pipe connector 255 is used for connecting a blow pipe, so that the material receiving nozzle 253 is conveniently connected with the blow pipe. It will be appreciated that the material receiving nozzle 253 may be connected directly to the insufflation tube.

In one embodiment, the residue discharge mechanism 25 may be installed on the light-splitting device 20 so as to support the residue discharge mechanism 25. It is understood that the discard eliminators 25 may also be mounted on the frame 10 to support the discard eliminators 25. Of course, a support structure may be separately provided to support the surplus material removal mechanism 25.

In one embodiment, referring to fig. 2, 3 and 9, the taping device 50 includes a material conveying mechanism 60, and the material conveying mechanism 60 is used for conveying the LED chips 90. The transfer mechanism 60 is configured to transfer the LED chips 90 for directional transfer of the LED chips 90 for use in taping. The material conveying mechanism 60 is provided with a material discharging position and a material feeding position 601, the LED chips 90 are placed on the material conveying mechanism 60 from the material feeding position 601, the material conveying mechanism 60 drives the LED chips 90 to move towards the material discharging position, and the LED chips 90 reach the material discharging position and are used by the braid.

In one embodiment, the feeding level 601 of the material conveying mechanism 60 is arranged close to the feeding level 302 of the feeding device, so that the pushing mechanism 80 pushes the LED chip 90 at the feeding level 302 of the feeding device into the material conveying mechanism 60.

In one embodiment, referring to fig. 3 and 9, the braiding apparatus 50 further includes a braiding support 501, and the material transfer mechanism 60 is mounted on the braiding support 501 for easy assembly. It will be appreciated that the transfer mechanism 60 may also be mounted on the frame 10. Of course, a support structure may be separately provided to support the transfer mechanism 60.

In one embodiment, fig. 3, 9 and 10, the material transfer mechanism 60 includes a disc 62, a support plate 61, a rotating shaft 63 and a material transfer motor 64, the disc 62 is mounted on the support plate 61, and the disc 62 is supported by the support plate 61. The shaft 63 is connected to a material transferring motor 64, and the disc 62 is connected to the shaft 63, so that the shaft 63 is driven by the material transferring motor 64 to rotate, and the disc 62 is driven to rotate on the supporting plate 61. The periphery of the disc 62 is provided with a plurality of openings 621, the LED chip 90 can be placed in the openings 621, and the supporting plate 61 supports the disc 62, so as to support the LED chip 90 in cooperation with the disc 62. When the disc 62 rotates, the LED chip 90 can be driven to move, so as to transmit the LED chip 90. The LED chip 90 is conveyed by matching the disc 62 and the supporting plate 61, so that the space is occupied, the conveying efficiency is high, and the conveying precision is high. In addition, the structure is convenient to process and manufacture, low in manufacturing cost and high in manufacturing precision. It is understood that the transfer mechanism 60 may also use a linear conveyor line to transport the LED chips 90.

When the disc 62 is disposed near the feeding mechanism 30 during assembly, a feeding position 601 is formed on the supporting plate 61 near the feeding mechanism 30 to facilitate the LED chip 90 on the feeding mechanism 30 to enter the opening 621 of the disc 62. A material discharging position is arranged at another position on the circular line of the rotating opening 621 on the supporting plate 61, and when the disc 62 rotates to drive the LED chip 90 to reach the material discharging position, the LED chip 90 is braided.

In one embodiment, referring to fig. 3, 9 and 11, when the feeding mechanism 30 includes the rotary ring 31, the position of the rotary ring 31 adjacent to the disc 62 forms the feeding position 302, and the corresponding position of the disc 62 adjacent to the rotary ring 31 forms the feeding position 601. Therefore, when the containing groove 311 on the rotary ring 31 rotates to the blanking position 302 and the opening 621 of the disc 62 rotates to the feeding position 601, the LED chip 90 can be conveniently pushed into the opening 621 from the containing groove 311, so that the transfer of the LED chip 90 is realized, and the efficiency is high.

When the rotary ring 31 and the disc 62 rotate respectively to convey the LED chips 90, the time for moving an accommodating groove 311 upstream of the blanking position 302 to the blanking position 302 is equal to the time for moving an opening 621 upstream of the feeding position 601 to the feeding position 601. An accommodating groove 311 at the upstream of the blanking position 302 means that when the rotary ring 31 rotates, the next stop position of the accommodating groove 311 is located at the blanking position 302, and also means an accommodating groove 311 at the nearest distance from the blanking position 302 at the upstream of the blanking position 302 along the rotation direction of the rotary ring 31. An opening 621 upstream of the feed location 601 means that the next stop location of the opening 621 is located at the feed location 601 when the disc 62 rotates, and also means an opening 621 closest to the feed location 601 upstream of the feed location 601 in the direction of rotation of the disc 62. When the rotary ring 31 rotates, a receiving groove 311 on the upstream of the blanking position 302 moves to the blanking position 302; when the disc 62 rotates, an opening 621 at the upstream of the feeding position 601 moves to the feeding position 601, and the two time settings are the same, so that when one accommodating groove 311 rotates to the discharging position 302, one opening 621 on the disc 62 rotates to the feeding position 601, which can facilitate the pushing mechanism 80 to push the LED chips 90 in the accommodating groove 311 to the opening 621 of the feeding position 601, so as to realize continuous, smooth and efficient transmission of the LED chips 90, without temporarily storing the LED chips 90, and improve the efficiency of transmission of the LED chips 90 between the light splitting device 20 and the braiding device 50, thereby improving the braiding efficiency. In addition, this structure can make light splitting device 20 steady operation in succession, need not frequently to open and stop, guarantees light splitting device 20's life to promote light splitting device 20 and select separately the efficiency of LED chip 90, and then promote the efficiency of this light splitting braid all-in-one 100.

In one embodiment, the openings 621 of the disc 62 correspond to the receiving slots 311 of the swivel 31 one by one, so that the openings 621 of the disc 62 can better receive the LED chips 90 moved by the receiving slots 311 of the swivel 31, the efficiency is higher, and the synchronization between the transmission of the LED chips 90 by the swivel 31 and the transmission of the LED chips 90 by the disc 62 can be better ensured, and the control is also convenient.

In one embodiment, the plurality of receiving slots 311 are uniformly disposed on the rotating ring 31, the plurality of openings 621 are uniformly disposed on the disc 62, and the angular velocity of the rotating ring 31 is equal to the angular velocity of the disc 62, so that when the rotating ring 31 and the disc 62 rotate respectively, it is ensured that each receiving slot 311 rotates synchronously with the corresponding opening 621, and each receiving slot 311 corresponds to the corresponding opening 621 exactly one to one, which is convenient for control and improves efficiency.

In one embodiment, the material transfer mechanism 60 further comprises a support base 65, the rotating shaft 63 penetrates through the support base 65, the supporting plate 61 is mounted on the support base 65, and the material transfer motor 64 is connected with the support base 65. The support seat 65 is provided to conveniently support the rotation shaft 63, so as to ensure that the rotation shaft 63 rotates smoothly.

In one embodiment, the rotating shaft 63 may be rotatably connected to the supporting seat 65 through a bearing, so as to ensure that the rotating shaft 63 can rotate flexibly in the supporting seat 65.

In one embodiment, the support base 65 is fixed to the braid support 501 to facilitate positioning and installation of the material transfer mechanism 60. It will be appreciated that the support 65 may also be fixed to the frame 10. Of course, a support structure may be provided separately to secure the support base 65.

In one embodiment, referring to fig. 9, the supporting plate 61 is provided with an air port 611, and the air port 611 is used for connecting an air path to suck or blow air through the air path. The bottom surface of the disc 62 is the surface of the disc 62 close to the supporting plate 61. The bottom surface of the disc 62 is provided with a plurality of grooves (not shown), the grooves correspond to the openings 621 one by one, each groove is communicated with the corresponding opening 621, one end of each groove far away from the corresponding opening 621 extends to the circumference where the air port 611 is located, and the circumference is a circumference taking the axis of the rotating shaft 63 as the center. Therefore, the air suction through the air inlet 611 can be controlled to generate negative pressure at the opening 621 communicated with the air inlet 611 to adsorb the LED chip 90, so that the disc 62 drives the LED chip 90 to move smoothly, and the LED chip 90 is prevented from being thrown out by centrifugal force generated by the rotation of the disc 62. When the LED chip 90 enters the opening 621 at an incorrect position or angle, or when the LED chip 90 needs to be removed from the opening 621, the corresponding air port 611 can be controlled to blow air to blow the LED chip 90 in the opening 621 communicated with the air port 611, so as to facilitate the removal or adjustment of the LED chip 90 in the opening 621.

In one embodiment, the air ports 611 are formed on the supporting plate 61, and the air ports 611 are located on a circumference centered on the axis of the rotating shaft 63, that is, the distance from the axis of the rotating shaft 63 to each air port 611 is substantially the same, and the distance from the rotating center of the disk 62 to each air port 611 is also substantially the same. Thus, the air pressure in the openings 621 at different positions can be respectively controlled by the plurality of air ports 611 to suck the LED chips 90 in the corresponding openings 621 or blow out the LED chips 90 in the corresponding openings 621 as required.

In one embodiment, the openings 621 of the disc 62 are respectively installed with an insulating block 66 to ensure that two adjacent pins of the LED chip 90 in the station of the electrical testing mechanism are not shorted to affect the testing effect.

In one embodiment, referring to fig. 2, fig. 3 and fig. 11, the feeding level 302 of the feeding mechanism 30 is disposed adjacent to the feeding level 601 of the conveying mechanism 60, that is, the feeding level 302 is disposed next to the feeding level 601. So that the pushing mechanism 80 pushes the LED chip 90 at the feeding position 302 to the feeding position 601.

In one embodiment, the disc 62 is positioned tangentially to the swivel 31 such that the feed level 302 is positioned adjacent to the feed level 601 such that the pushing mechanism 80 pushes the LED chip 90 at the feed level 302 to the feed level 601.

In one embodiment, referring to fig. 2, 3 and 12, the feeding level 302 of the feeding mechanism 30 is spaced from the feeding level 601 of the conveying mechanism 60, that is, the feeding level 302 is spaced from the feeding level 601. Be equipped with guide rail 85 between material level 302 and the feed level 601 down, guide rail 85 connects material level 302 and feed level 601 down, and when pushing mechanism 80 propelling movement LED chip 90 like this, LED chip 90 can remove feed level 601 through guide rail 85 from material level 302 to make things convenient for LED chip 90 to transfer, prevent that LED chip 90 from dropping. In addition, the structure also facilitates the position layout of the material conveying mechanism 30 and the material conveying mechanism 60, and is convenient to assemble. It is understood that when the feeding level 302 is spaced apart from the feeding level 601, the guide rail 85 may not be provided when the nozzle swing arm is used to transfer the LED chip 90.

In one embodiment, the disc 62 is spaced from the swivel 31 such that the feed level 601 is spaced from the feed level 302. The guide 85 is tangent to the rotary ring 31 and the disc 62 at both ends thereof, so that the guide 85 connects the feeding level 302 and the feeding level 601.

In one embodiment, the guide rail 85 is mounted on the braid support 501. It will be appreciated that the rails 85 may also be supported on the frame 10. Of course, a support structure may be provided separately to support the guide rail 85.

In one embodiment, the guide rail 85 is provided with two striker plates 86 on two sides, and the two striker plates 86 cooperate with the guide rail 85 to form a guide groove to guide the LED chip 90 to move. The striker plate 86 is arranged to prevent the LED chip 90 from falling off from the side of the guide rail 85 when moving. It will be appreciated that the guide groove may be provided directly on the guide rail 85.

In one embodiment, referring to fig. 1, fig. 2, fig. 3 and fig. 9, the taping device 50 includes a tape feeding mechanism 51 and an implanting mechanism 52, wherein the tape feeding mechanism 51 is used for conveying the carrier tape, and the implanting mechanism 52 is used for implanting the LED chips 90 conveyed by the material conveying mechanism 60 into the carrier tape. The discharging position of the material conveying mechanism 60 is arranged at the implantation mechanism 52. When the material conveying mechanism 60 conveys the LED chips 90 to the material discharging position, the implanting mechanism 52 takes out the LED chips 90 and implants the LED chips onto the carrier tape, so as to realize the braiding of the LED chips 90.

In one embodiment, the tape feed mechanism 51 may be mounted on the braid holder 501. It is understood that the tape feed mechanism 51 may be supported on the frame 10. Of course, a support structure may be separately provided to support the tape feed mechanism 51.

In one embodiment, the implant mechanism 52 may be mounted on a braid holder 501. It will be appreciated that the implant mechanism 52 may also be supported on the frame 10. Of course, a separate support structure may be provided to support the implant mechanism 52.

In one embodiment, the taping device 50 further includes a film feeding mechanism 55 and a sealing knife mechanism 53, the film feeding mechanism 55 is used for feeding the adhesive film to the sealing knife mechanism 53, and the sealing knife mechanism 53 is used for attaching the adhesive film to the carrier tape, so as to package the LED chip 90 on the carrier tape, so as to better implant the LED chip 90 into the carrier tape and protect the LED chip 90.

In one embodiment, the knife sealing mechanism 53 may be mounted on the braid holder 501. It will be appreciated that the knife sealing mechanism 53 may also be supported on the frame 10. Of course, a support structure may be separately provided to support the blade sealing mechanism 53.

In one embodiment, the knife sealing mechanism 53 may be mounted on the braid holder 501. It will be appreciated that the knife sealing mechanism 53 may also be supported on the frame 10. Of course, a support structure may be separately provided to support the blade sealing mechanism 53.

In one embodiment, the taping device 50 includes a tape collecting mechanism 54, and the tape collecting mechanism 54 is used for collecting the carrier tape attached with the adhesive film to collect the carrier tape implanted with the LED chip 90, so as to realize automatic collection of the carrier tape.

In one embodiment, the take-up mechanism 54 may be mounted on the braid holder 501. It will be appreciated that the take-up mechanism 54 may also be supported on the frame 10. Of course, a separate support structure may be provided to support the take-up mechanism 54.

In one embodiment, the braiding apparatus 50 includes an implanting mechanism 52, a knife sealing mechanism 53 and a ribbon collecting mechanism 54, the implanting mechanism 52, the knife sealing mechanism 53 and the ribbon collecting mechanism 54 are sequentially arranged along a conveying direction of the carrier tape, so that the LED chip 90 conveyed by the material conveying mechanism 60 is implanted into the carrier tape through the implanting mechanism 52, covered with an adhesive film through the knife sealing mechanism 53, and then recovered by the ribbon collecting mechanism 54.

In one embodiment, the taping device 50 includes a tape cutting mechanism 56, the tape cutting mechanism 56 is disposed between the tape collecting mechanism 54 and the sealing blade mechanism 53, and the tape cutting mechanism 56 is used for cutting the carrier tape. The tape cutting mechanism 56 is provided, and when the tape collecting mechanism 54 collects the carrier tape of a certain length, the carrier tape can be cut by the tape cutting mechanism 56 so that the tape collecting mechanism 54 collects the carrier tape of a specified length.

In one embodiment, tape cutting mechanism 56 may be mounted on braid support 501. It will be appreciated that the tape cutting mechanism 56 may also be supported on the frame 10. Of course, a separate support structure may be provided to support the tape cutting mechanism 56.

In one embodiment, the taping device 50 further includes an adjusting mechanism 71, the adjusting mechanism 71 is used for correcting the polarity of the LED chips 90 on the feeding mechanism 60, that is, the electrical testing mechanism 24 of the light splitting device 20 performs electrical testing on the LED chips 90, and the adjusting mechanism 71 corrects the polarity of the LED chips 90 according to the testing result. If the polarity of the LED chip 90 can be determined by the host computer 12, if the polarity of the LED chip 90 is inconsistent with the setting, the LED chip is rotated by 90 degrees or 180 degrees to adjust the polarity of the LED chip 90, so that when the implanting mechanism 52 implants the LED chip 90 into the carrier tape, the polarity direction of the LED chip 90 implanted into the carrier tape can be ensured to be consistent, thereby facilitating the subsequent use. It can be understood that, the adjusting mechanism 71 may also be provided with a testing component for directly testing the polarity of the LED chip 90, and then correcting the polarity of the LED chip 90 on the material conveying mechanism 60 according to the testing structure.

In one embodiment, adjustment mechanism 71 may be mounted on braid support 501. It will be appreciated that the adjustment mechanism 71 may also be supported on the frame 10. Of course, a support structure may be separately provided to support the adjustment mechanism 71.

In one embodiment, the taping device 50 further includes a vision mechanism 72 and a discharge mechanism 73, the vision mechanism 72 being used to check the appearance of the LED chips 90 on the transfer mechanism 60. The discharging mechanism 73 is used for removing the LED chips 90 which are inspected to be unqualified by the vision mechanism 72. Thus, the quality of the LED chip 90 implanted on the carrier tape can be ensured, and the subsequent use is facilitated.

In one embodiment, vision mechanism 72 may be mounted on braid holder 501. It will be appreciated that the vision mechanism 72 may also be supported on the frame 10. Of course, a support structure may be provided separately to support the vision mechanism 72.

In one embodiment, discharge mechanism 73 may be mounted on braid holder 501. It will be appreciated that the discharge mechanism 73 may also be supported on the frame 10. Of course, a support structure may be provided separately to support the discharge mechanism 73.

In one embodiment, the braiding apparatus 50 further comprises a bad magazine 731, and the bad magazine 731 is used for recovering the LED chips 90 discharged by the discharging mechanism 73. The defective magazine 731 is provided below the discharge mechanism 73 to facilitate recovery of the LED chips 90 discharged from the discharge mechanism 73.

In one embodiment, the discharging mechanism 73 may be an air nozzle mechanism to blow the LED chip 90 from the material conveying mechanism 60 to the defective magazine 731. Of course, the discharge mechanism 73 may also use a suction nozzle mechanism to suck and place the LED chip 90 to the defective magazine 731. It is understood that other configurations may be used for the discharge mechanism 73 to discharge the LED chips 90 to the defective magazine 731.

In one embodiment, bad cartridges 731 are provided in rack 10. It will be appreciated that defective cartridges 731 may also be mounted on the braiding carrier 501. Of course, a support structure may be separately provided to support the defective cartridge 731.

In one embodiment, when the taping device 50 includes the adjusting mechanism 71, the vision mechanism 72 and the discharging mechanism 73, the adjusting mechanism 71, the vision mechanism 72 and the discharging mechanism 73 are all disposed between the material feeding position 601 and the implanting mechanism 52, so that the material conveying mechanism 60 conveys the LED chips 90, the LED chips 90 are tested and corrected by the adjusting mechanism 71, and the vision mechanism 72 and the discharging mechanism 73 perform quality screening on the LED chips 90 and are then implanted into the carrier tape by the implanting mechanism 52, thereby ensuring the quality of the LED chips 90 implanted into the carrier tape.

In one embodiment, the taping device 50 further includes an image detecting mechanism 74 and a feeding mechanism 75, the image detecting mechanism 74 and the feeding mechanism 75 are disposed between the implanting mechanism 52 and the knife sealing mechanism 53, and the image detecting mechanism 74 is used for detecting the appearance of the LED chips 90 implanted in the carrier tape. The material supplementing mechanism 75 is used for removing the LED chips 90 that are detected by the image detecting mechanism 74 to be unqualified from the carrier tape, and replacing the qualified LED chips 90 to be embedded into the carrier tape, so as to further ensure the quality of the embedded LED chips 90 in the carrier tape.

In one embodiment, the image sensing mechanism 74 may be mounted on the braid support 501. It is understood that the image sensing mechanism 74 may also be supported on the frame 10. Of course, a support structure may be separately provided to support the image sensing mechanism 74.

In one embodiment, the feeding mechanism 75 may be mounted on the braid holder 501. It is understood that the feeding mechanism 75 may also be supported on the frame 10. Of course, a support structure may be separately provided to support the feeding mechanism 75.

In one embodiment, braiding apparatus 50 further comprises a waste bin 751. When the material transfer mechanism 60 transfers the LED chip 90 through the implanting mechanism 52, the implanting mechanism 52 does not perform the implanting action, and the material transfer mechanism 60 transfers the LED chip 90 to the downstream of the implanting mechanism 52 to discharge the LED chip 90, so that the material transfer mechanism 60 loads the LED chip 90 at the feeding position 601. The waste bin 751 is provided to recycle LED chips that are not implanted in the carrier tape by the implanting mechanism 52. As in the present embodiment, the remainder box 751 is used to recycle the LED chips 90 discharged from the disc 62 when the carrier tape passes through the implanting mechanism 52 but is not being implanted. The waste material box 751 is provided below the braiding device 50 to facilitate recovery of the LED chips 90 discharged from the braiding device 50.

In one embodiment, the feeding mechanism 75 can be manually operated to manually remove the defective LED chips 90 from the carrier tape and to manually feed the qualified LED chips 90 into the carrier tape. It is understood that the material removing mechanism 75 may also be configured to use other structures, such as a robot structure, to achieve the purpose of automatically replacing the LED chip 90.

In one embodiment, the waste bin 751 is disposed in the housing 10. It is understood that the flash cartridge 751 may also be mounted on the braid support 501. Of course, a support structure may be separately provided to support the waste bin 751.

In one embodiment, the taping device 50 further includes a carrier tape roll 57 for supplying a carrier tape, and a guide shaft 58 for guiding the carrier tape roll 57 into the tape feed mechanism 51. The carrier tape roll 57 and the guide shaft 58 are provided to more stably supply the carrier tape, facilitating the implanting mechanism 52 to implant the LED chip 90 into the carrier tape.

In one embodiment, the carrier tape roll 57 and the guide shaft 58 are mounted on the frame 10 to improve space efficiency, reduce cost, and improve integration. It is to be understood that a support structure may be separately provided to support the carrier tape roll 57 and the guide shaft 58.

In one embodiment, the film feeding mechanism 55 includes a film roll 551 and a plurality of guide shafts 552, the film roll 551 being used to supply a film. The plurality of guide shafts 552 are used to guide the adhesive film to the blade sealing mechanism 53. The adhesive film roll 551 and the plurality of guide shafts 552 are provided to stably supply the adhesive film and ensure that the tape is sealed by the sealing blade mechanism 53.

In one embodiment, the film roll 551 is mounted on the frame 10 to improve space utilization, reduce cost, and improve integration. It will be appreciated that a separate support structure may be provided to support the roll of film 551.

In one embodiment, referring to fig. 3, 11 and 13, the pushing mechanism 80 includes a blowing nozzle 81 and a feeding base 82, the blowing nozzle 81 is mounted on the feeding base 82, and the blowing nozzle 81 is supported by the feeding base 82. The blowing nozzle 81 is arranged on one side of the blanking position 302 far away from the feeding position 601 so as to blow the LED chips 90 of the blanking position 302 to the feeding position 601, and the LED chips 90 are transferred. The blowing nozzle 81 is used for blowing the LED chip 90, the efficiency is high, the occupied space is small, and the force for pushing the LED chip 90 is controlled conveniently to protect the LED chip 90. It is understood that air cylinders may also be used to push the LED chips 90.

In one embodiment, the infeed seat 82 is mounted on a braid holder 501. It is understood that the feeding base 82 may be mounted on the spectroscopic support 201. Of course, the infeed pedestal 82 may also be supported on the frame 10. A support structure may also be provided separately to support the charging stand 82.

In one embodiment, the pushing mechanism 80 further includes a detecting unit 83, and the detecting unit 83 is mounted on the feeding base 82, and the detecting unit 83 is supported by the feeding base 82. The detecting unit 83 is used for detecting whether the LED chip 90 at the feeding position 302 is blown into the feeding position 601, so as to better confirm that the LED chip 90 moves from the feeding position 302 to the feeding position 601, and ensure that the LED chip 90 is accurately conveyed.

In one embodiment, the detection unit 83 may use a visual camera device such as an optical fiber or a camera.

In one embodiment, the pushing mechanism 80 further includes a stopper 84, the detecting unit 83 is installed in the stopper 84, the stopper 84 is installed on the feeding seat 82 in a sliding manner along a vertical direction, and the stopper 84 is used for covering the feeding level 302 and the feeding level 601, so that the detecting unit 83 is supported by the stopper 84, and the detecting unit 83 can accurately detect whether the LED chip 90 of the feeding level 302 blows into the feeding level 601. In addition, the limiting block 84 can also play a role in stopping and limiting, so that a path for the LED chip 90 to move from the loading position 301 to the feeding position 601 is limited, the LED chip 90 is prevented from being blown off, and the positioning and moving accuracy of the LED chip 90 is ensured.

In one embodiment, referring to fig. 1, an electric cabinet (not shown) is installed at the rear side of the rack 10, and a door frame (not shown) is installed at the rear side of the rack 10 to facilitate modification of electrical parameters. The rack 10 is further provided with an ion fan 15, and the ion fan 15 is located on the rack 10 and close to the vibration disk 211 to remove static electricity carried by the LED chips 90 on the vibration disk 211. The rack 10 is also provided with a computer host 12, a display 13 and a human-machine interface 14. The computer host 12 is placed on the top of the rack 10, the display 13 is positioned above the human-computer interface 14, the human-computer interface 14 is positioned on the right side of the front face of the rack 10, and the mounting face of the human-computer interface 14 is made into an inclined angle, so that the operation is convenient. A start-stop button 16 is further arranged on the lower side of the human-computer interface 14, and therefore the machine can be started and stopped conveniently. A vacuum pump (not shown) is installed in the housing 10 to ensure sufficient negative pressure. A vacuum pump may be provided at the bottom of the rear side of the frame 10 to improve space utilization. The vacuum source is not limited to a vacuum pump, and may be provided centrally by the manufacturer and connected to the apparatus through a connector. The left side of the rack 10 is provided with a triple piece to ensure the cleanness of positive pressure gas and protect pneumatic components, and the material box 46 and the carrier tape material coil 57 are both positioned on the front side of the rack 10 to facilitate the operation of staff. The frame 10 is also provided with a printer 11 for printing the detection information.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (10)

1. A light splitting and braiding integrated machine comprises a light splitting device and a braiding device; the light splitting device includes:

the material conveying mechanism is used for positioning and conveying the LED chip;

the feeding mechanism is used for supplying the LED chips to the conveying mechanism;

the testing assembly is used for testing the LED chip on the material conveying mechanism; and the number of the first and second groups,

the sorting mechanism is used for sorting the LED chips on the material conveying mechanism; the feeding mechanism, the testing assembly and the sorting mechanism are sequentially arranged along the conveying direction of the conveying mechanism; the feeding mechanism is provided with a feeding position and a discharging position and is connected with the feeding position; it is characterized in that the preparation method is characterized in that,

the feed level of braid device is close to the material level setting of unloading, defeated material mechanism conveys the speed of LED chip with the braid device will LED chip braid speed equals, beam split braid all-in-one still including be used for with the material level of unloading the LED chip propelling movement extremely the push mechanism of feed level.

2. The light splitting and taping all-in-one machine of claim 1, wherein the pushing mechanism comprises a blowing nozzle for blowing the LED chips to the feeding position and a feeding seat for supporting the blowing nozzle, and the blowing nozzle is arranged on one side of the feeding position far away from the feeding position.

3. The light splitting and taping all-in-one machine of claim 2, wherein the pushing mechanism further comprises a detecting unit for detecting whether the LED chips at the feeding position are blown into the feeding position, and the detecting unit is mounted on the feeding seat.

4. The light splitting and taping all-in-one machine of claim 3, wherein the pushing mechanism further comprises a limiting block for covering the feeding level and the feeding level, the detecting unit is installed in the limiting block, and the limiting block is installed on the feeding seat in a sliding manner along a vertical direction.

5. The light splitting and braiding all-in-one machine according to any one of claims 1 to 4, wherein the feeding level and the feeding level are arranged at intervals, and the light splitting and braiding all-in-one machine further comprises a guide rail for connecting the feeding level and the feeding level; or the blanking position is connected with the feeding position.

6. The light-splitting and taping all-in-one machine as claimed in any one of claims 1 to 4, wherein the material conveying mechanism comprises a turntable, a rotary ring which is arranged to protrude upwards from the periphery of the turntable, and a light-splitting motor which drives the turntable to rotate, and a plurality of accommodating grooves for accommodating the LED chips are formed in the rotary ring.

7. The light-splitting and taping all-in-one machine according to claim 6, wherein the light-splitting device further comprises a remainder discharging mechanism, the remainder discharging mechanism comprises a remainder discharging pipe, a discharging nozzle for blowing the LED chips in the accommodating groove into the remainder discharging pipe, and a discharging seat for supporting the remainder discharging pipe and the discharging nozzle, the discharging seat is provided with an accommodating groove, the swivel extends into the accommodating groove, the discharging nozzle and the remainder discharging pipe are respectively positioned at two opposite sides of the accommodating groove, and the discharging seat is positioned between the discharging position and the loading position along the rotation direction of the swivel.

8. The light-splitting taping all-in-one machine of any one of claims 1 to 4, wherein the taping device comprises:

the material conveying mechanism is used for conveying the LED chips and is provided with a material outlet position and a material inlet position;

the tape-feeding mechanism is used for conveying the carrier tape;

the implanting mechanism is used for implanting the LED chips conveyed by the material conveying mechanism into the carrier tape;

the cutter sealing mechanism is used for attaching the adhesive film to the carrier tape;

the film feeding mechanism is used for feeding the adhesive film to the sealing cutter mechanism; and the number of the first and second groups,

the tape collecting mechanism is used for collecting the carrier tape attached with the adhesive film;

the implanting mechanism, the knife sealing mechanism and the tape collecting mechanism are sequentially arranged along the conveying direction of the carrier tape, and the discharging position of the material conveying mechanism is arranged at the implanting mechanism.

9. The light-splitting and braiding integrated machine according to claim 8, wherein the material-transferring mechanism comprises a disc, a supporting plate for supporting the disc, a rotating shaft for driving the disc to rotate on the supporting plate, and a material-transferring motor for driving the rotating shaft to rotate, and a plurality of openings for accommodating the LED chips are formed in the periphery of the disc.

10. The light splitting and taping all-in-one machine of claim 8, wherein the taping device further comprises:

the image detection mechanism is used for detecting the appearance of the LED chip implanted into the carrier tape; and the number of the first and second groups,

the material supplementing mechanism is used for removing the LED chips which are detected to be unqualified by the image detection mechanism from the carrier tape and replacing the qualified LED chips to be implanted into the carrier tape;

the image detection mechanism and the material supplementing mechanism are arranged between the implantation mechanism and the cutter sealing mechanism.

Images