CN215420736U - Magnetic shield assembly, miniature loudspeaker and sounding module - Google Patents
Magnetic shield assembly, miniature loudspeaker and sounding module Download PDFInfo
- Publication number
- CN215420736U CN215420736U CN202120463384.6U CN202120463384U CN215420736U CN 215420736 U CN215420736 U CN 215420736U CN 202120463384 U CN202120463384 U CN 202120463384U CN 215420736 U CN215420736 U CN 215420736U
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- heat dissipation
- magnetic shield
- heat
- shield assembly
- conducting plate
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 79
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000004917 carbon fiber Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910021389 graphene Inorganic materials 0.000 claims description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 4
- 238000004026 adhesive bonding Methods 0.000 claims description 3
- 239000011324 bead Substances 0.000 claims 2
- 238000003825 pressing Methods 0.000 abstract description 21
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- NMFHJNAPXOMSRX-PUPDPRJKSA-N [(1r)-3-(3,4-dimethoxyphenyl)-1-[3-(2-morpholin-4-ylethoxy)phenyl]propyl] (2s)-1-[(2s)-2-(3,4,5-trimethoxyphenyl)butanoyl]piperidine-2-carboxylate Chemical compound C([C@@H](OC(=O)[C@@H]1CCCCN1C(=O)[C@@H](CC)C=1C=C(OC)C(OC)=C(OC)C=1)C=1C=C(OCCN2CCOCC2)C=CC=1)CC1=CC=C(OC)C(OC)=C1 NMFHJNAPXOMSRX-PUPDPRJKSA-N 0.000 description 14
- 230000009286 beneficial effect Effects 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 230000005389 magnetism Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000001755 vocal effect Effects 0.000 description 1
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model discloses a magnetic shield assembly, a micro loudspeaker and a sound production module, wherein the sound production module comprises the micro loudspeaker, the micro loudspeaker comprises the magnetic shield assembly, the magnetic shield assembly comprises a magnetic shield and a heat dissipation structure, a heat dissipation blank holder is arranged on the magnetic shield, and the heat dissipation structure is arranged in the heat dissipation blank holder; the heat dissipation side pressing device has the characteristic of good heat dissipation performance, the heat dissipation side pressing arranged on the magnetic cover increases the area of a heat dissipation surface of the magnetic cover, and the heat dissipation rate is improved; the heat dissipation structure arranged in the heat dissipation blank holder can effectively dissipate heat conducted to the heat dissipation blank holder, and the heat dissipation rate is further improved.
Description
Technical Field
The utility model relates to the technical field of acoustic devices, in particular to a magnetic shield assembly, a micro loudspeaker and a sound production module.
Background
At present, the heat dissipation of the loudspeaker is mainly realized through the magnetic cover, along with the development trend of the miniaturization of electronic products, the overall size of the loudspeaker is smaller and smaller, correspondingly, the size of the magnetic cover is also smaller and smaller, so that the area of a heat dissipation surface on the magnetic cover is smaller and smaller, and the heat dissipation of the loudspeaker is limited.
SUMMERY OF THE UTILITY MODEL
The technical problem to be solved by the utility model is as follows: the utility model provides a magnetic shield subassembly, miniature speaker and vocal module that heat dispersion is good.
In order to solve the technical problems, the first technical scheme adopted by the utility model is as follows: a magnetic shield assembly comprises a magnetic shield and a heat dissipation structure, wherein a heat dissipation blank holder is arranged on the magnetic shield, and the heat dissipation structure is arranged in the heat dissipation blank holder.
Further, the heat dissipation structure is a heat conduction plate.
Further, the heat conducting plate is connected with the magnetic cover in an adhesive mode or welded mode.
Furthermore, the thickness of the heat conducting plate is smaller than the depth of the heat dissipation pressing edge.
Furthermore, the heat conducting plate is made of copper, carbon fiber or graphene.
Further, the heat dissipation structure is a heat conduction coating.
Furthermore, the number of the heat dissipation pressing edges on the magnetic cover is multiple.
Furthermore, the cross section of the heat dissipation pressing edge is circular or square.
The second technical scheme of the utility model is as follows: a micro-speaker comprises the magnetic shield assembly.
The third technical scheme of the utility model is as follows: a sound production module comprises the micro loudspeaker.
The utility model has the beneficial effects that: the magnetic shield assembly, the micro loudspeaker and the sounding module provided by the utility model have the characteristic of good heat dissipation performance, and the heat dissipation blank holder arranged on the magnetic shield increases the area of the heat dissipation surface of the magnetic shield and improves the heat dissipation rate; the heat dissipation structure arranged in the heat dissipation blank holder can effectively dissipate heat conducted to the heat dissipation blank holder, and the heat dissipation rate is further improved.
Drawings
FIG. 1 is a schematic structural diagram of a magnetic shield assembly according to an embodiment of the present invention;
FIG. 2 is another structural schematic diagram of a magnetic shield assembly according to an embodiment of the present invention;
FIG. 3 is a schematic partial cross-sectional view of a magnetic shield assembly according to a first embodiment of the present invention;
fig. 4 is a schematic structural diagram of a micro-speaker according to a second embodiment of the present invention;
fig. 5 is a schematic structural diagram of a sound module according to a third embodiment of the present invention.
Description of reference numerals:
1. a magnetic shield; 11. heat dissipation edge pressing; 2. a heat dissipation structure; 21. a first groove; 22. a second groove; 23. gluing; 3. a micro speaker; 31. edge magnetic steel; 32. a basin stand; 4. a housing.
Detailed Description
In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1 to 5, a magnetic shield assembly includes a magnetic shield 1 and a heat dissipation structure 2, wherein the magnetic shield 1 is provided with a heat dissipation edge 11, and the heat dissipation structure 2 is disposed in the heat dissipation edge 11.
From the above description, the beneficial effects of the present invention are: the heat dissipation pressing edge 11 arranged on the magnetic shield 1 increases the area of the heat dissipation surface of the magnetic shield 1 and improves the heat dissipation rate; the heat dissipation structure 2 arranged in the heat dissipation blank holder 11 can effectively dissipate heat conducted to the heat dissipation blank holder 11, and further improves the heat dissipation rate.
Further, the heat dissipation structure 2 is a heat conduction plate.
As can be seen from the above description, the heat conducting plate has a simple structure and is easy to install.
Further, the heat conducting plate is connected with the magnetic cover 1 in an adhesive manner or welded.
As can be seen from the above description, the connection mode between the heat conducting plate and the magnetic shield 1 can be selected according to the actual application requirements.
Further, the thickness of the heat conducting plate is smaller than the depth of the heat dissipation pressing edge 11.
As can be seen from the above description, the thickness of the heat conducting plate is smaller than the depth of the heat dissipating blank holder 11, so that the contour of the heat conducting plate is prevented from exceeding the heat dissipating blank holder 11, and the compactness of the structure is ensured.
Furthermore, the heat conducting plate is made of copper, carbon fiber or graphene.
According to the description, the material of the heat conducting plate can be selected according to the actual application requirement, so that the structural diversity is enriched, and the development dimension is favorably expanded.
Further, the heat dissipation structure 2 is a heat conductive coating.
According to the above description, the heat conduction layer can be uniformly covered on the heat dissipation edge pressing 11, which is beneficial to improving the structure compactness.
Furthermore, the number of the heat dissipation pressing edges 11 on the magnetic shield 1 is multiple.
From the above description, the number of the heat dissipation pressing edges 11 on the magnetic shield 1 can be set according to the actual application requirements, and the structural diversity is enriched.
Further, the cross-sectional shape of the heat dissipation pressing edge 11 is circular or square.
As can be seen from the above description, the cross-sectional shape of the heat dissipation blank holder 11 can be set according to the actual application requirements.
The second technical scheme of the utility model is as follows: a micro-speaker comprises the magnetic shield assembly.
The third technical scheme of the utility model is as follows: a sound production module comprises the micro loudspeaker 3.
Example one
Referring to fig. 1 to fig. 3, a first embodiment of the present invention is: the utility model provides a magnetic shield subassembly, includes magnetic shield 1 and heat radiation structure 2, heat dissipation blank holder 11 has been seted up on the magnetic shield 1, heat radiation structure 2 locates in the heat dissipation blank holder 11, it is specific, adopt the grinding apparatus to right magnetic shield 1 carries out the punching press and forms heat dissipation blank holder 11.
Optionally, the number of the heat dissipation pressing edges 11 on the magnetic shield 1 may be set according to actual application requirements, that is, the number of the heat dissipation pressing edges 11 on the magnetic shield 1 may be one or multiple; referring to fig. 1, in the present embodiment, the number of the heat dissipation pressing edges 11 is one, and the number of the heat dissipation structures 2 is also one, and more specifically, the heat dissipation structures 2 are heat conduction plates disposed in the heat dissipation pressing edges 11; in other embodiments, the number of the heat dissipation pressing edges 11 on the magnetic shield 1 may also be multiple (as shown in fig. 2), and at least one heat dissipation structure 2 is arranged in each heat dissipation pressing edge 11, which may be specifically set according to actual application requirements; further, the cross-sectional shape of the heat dissipating blank holder 11 can be set according to the actual application requirement, including but not limited to a circle or a square.
In other embodiments, the heat dissipation structure 2 may also be a heat conductive coating applied on the heat dissipation edge 11, which is beneficial to improving the compactness.
Furthermore, the material of the heat conducting plate can be set according to the actual application requirements, and specifically, the material of the heat conducting plate can be a metal material, such as copper, aluminum and other metals with good heat conducting performance but no magnetic conductivity; in addition, the heat conducting plate can also be made of non-metal materials, such as carbon fiber, graphene and the like.
Preferably, in order to prevent the outline of the heat dissipation plate from exceeding the heat dissipation edge pressing 11, the thickness of the heat conduction plate needs to be smaller than the depth of the heat dissipation edge pressing 11, so that the compactness of the structure is ensured, and the development trend of miniaturization of the loudspeaker is met.
Optionally, the heat conducting plate and the magnetic cover 1 are connected by gluing or welded, and can be specifically set according to actual application requirements.
As shown in fig. 3, in this embodiment, the heat conducting plate is adhered to the inside of the heat dissipating blank holder 11 by an adhesive 23, and the bottom of the heat conducting plate is provided with a plurality of first grooves 21; it is easy to understand that when the heat conducting plate is bonded to the heat dissipating blank 11 through the adhesive 23, a part of the adhesive 23 is pressed into the first groove 21 and bonded to the side wall of the first groove 21, so that the bonding force between the heat conducting plate and the magnetic shield 1 is improved, which is beneficial to enhancing the structural stability, and meanwhile, the contact area between the adhesive 23 and the heat conducting plate is increased, which is beneficial to improving the heat dissipation performance; specifically, the both ends of first recess 21 respectively with the outside intercommunication of heat-conducting plate, easy understanding works as the heat-conducting plate bonds to when the magnetism covers 1, the heat-conducting plate with remain the bubble easily between the magnetism cover 1, work as viscose 23 has absorbed behind the heat of magnetism cover 1, can lead to the bubble inflation to remain magnetic cover 1 with can't discharge between the heat-conducting plate, lead to the cohesion of heat-conducting plate and magnetic cover 1 to reduce, consequently, make the both ends of first recess 21 communicate respectively the outside of heat-conducting plate makes magnetic cover 1 with gas between the heat-conducting plate discharges more easily, has reduced the risk of forming the bubble, does benefit to structural stability's promotion.
More specifically, as shown in fig. 3, a plurality of second grooves 22 are formed in the top of the heat conducting plate, and it is easy to understand that the second grooves 22 increase the contact area between the heat conducting plate and the outside air, which is beneficial to improving the heat dissipation performance; further, first recess 21 with the quantity, length, width and the degree of depth of second recess 22 all equal, so, make the installation of heat-conducting plate is more nimble, has strengthened the suitability of structure, does benefit to production efficiency's promotion.
Example two
Referring to fig. 4, a second embodiment of the present invention is: a micro loudspeaker comprises a basin frame 32 and a magnetic shield assembly arranged on the basin frame 32, wherein the magnetic shield assembly is the magnetic shield assembly in the first embodiment of the utility model; specifically, the side wall of the magnetic cover 1 of the magnetic cover component close to the basin frame 32 is provided with central magnetic steel (not shown) and side magnetic steel 31, and the heat dissipation pressing edge 11 is arranged on the side wall of the magnetic cover 1 far away from the basin frame 32.
EXAMPLE III
Referring to fig. 5, a third embodiment of the present invention is: a sounding module comprises a shell 4 and a micro loudspeaker 3 installed on the shell 4, wherein the micro loudspeaker 3 is the micro loudspeaker 3 according to the second embodiment, and a heat dissipation structure 2 on a magnetic cover 1 is exposed out of the shell 4.
In summary, the magnetic shield assembly, the micro speaker and the sound production module provided by the utility model have the characteristics of good heat dissipation performance, strong structural stability, compact structure and rich structural style.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.
Claims (9)
1. The utility model provides a magnetic shield subassembly, its characterized in that includes magnetic shield and heat radiation structure, the heat dissipation blank holder has been seted up on the magnetic shield, heat radiation structure be adhesive bonding in heat-conducting plate in the heat dissipation blank holder, first recess has been seted up to one side of heat-conducting plate, the second recess has been seted up to the opposite side of heat-conducting plate.
2. The magnetic shield assembly of claim 1 wherein the thermally conductive plate is adhesively attached or welded to the magnetic shield.
3. The magnetic shield assembly of claim 1 wherein the thickness of the thermal conductive plate is less than the depth of the heat sink bead.
4. The magnetic shield assembly of claim 1 wherein the thermally conductive plate is copper, carbon fiber or graphene.
5. The magnetic shield assembly of claim 1 wherein the heat dissipation structure is a thermally conductive coating.
6. The magnetic shield assembly of claim 1, wherein the number of heat sink beads on the magnetic shield is multiple.
7. The magnetic shield assembly of claim 1 wherein the heat sink clip has a circular or square cross-sectional shape.
8. A micro-speaker comprising a magnetic shield assembly as claimed in any one of claims 1 to 7.
9. A sound emitting module comprising the micro-speaker of claim 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120463384.6U CN215420736U (en) | 2021-03-04 | 2021-03-04 | Magnetic shield assembly, miniature loudspeaker and sounding module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120463384.6U CN215420736U (en) | 2021-03-04 | 2021-03-04 | Magnetic shield assembly, miniature loudspeaker and sounding module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215420736U true CN215420736U (en) | 2022-01-04 |
Family
ID=79667780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120463384.6U Active CN215420736U (en) | 2021-03-04 | 2021-03-04 | Magnetic shield assembly, miniature loudspeaker and sounding module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215420736U (en) |
-
2021
- 2021-03-04 CN CN202120463384.6U patent/CN215420736U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 413000 building K1, standardized workshop, East Industrial Park, high tech Zone, Yiyang City, Hunan Province Patentee after: Weishi Technology Co.,Ltd. Country or region after: China Address before: 413000 building K1, standardized workshop, East Industrial Park, high tech Zone, Yiyang City, Hunan Province Patentee before: Yiyang Xinwei Acoustic Technology Co.,Ltd. Country or region before: China |