CN113395617A - Sound production device and electronic device - Google Patents
Sound production device and electronic device Download PDFInfo
- Publication number
- CN113395617A CN113395617A CN202110606630.3A CN202110606630A CN113395617A CN 113395617 A CN113395617 A CN 113395617A CN 202110606630 A CN202110606630 A CN 202110606630A CN 113395617 A CN113395617 A CN 113395617A
- Authority
- CN
- China
- Prior art keywords
- heat
- heat dissipation
- diaphragm
- housing
- sound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/028—Casings; Cabinets ; Supports therefor; Mountings therein associated with devices performing functions other than acoustics, e.g. electric candles
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/021—Casings; Cabinets ; Supports therefor; Mountings therein incorporating only one transducer
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/026—Supports for loudspeaker casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/02—Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/02—Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups
- H04R2201/029—Manufacturing aspects of enclosures transducers
Abstract
The invention discloses a sounding device and an electronic device, wherein the sounding device comprises a shell, a sounding monomer accommodated in the shell and a supporting plate arranged outside the shell, a rear cavity is formed between the sounding monomer and the shell, a heat dissipation channel is formed between the supporting plate and the shell, a heat source is arranged on one side of the supporting plate facing the shell, the heat source is positioned in the heat dissipation channel, the shell is provided with a heat dissipation window communicated with the rear cavity and the heat dissipation channel, and a heat dissipation vibrating diaphragm is covered at the heat dissipation window. This sounding device is in the use, and the vibration of sound production monomer makes the air current of back intracavity produce the vibration, and then makes the heat dissipation vibrating diaphragm that covers in heat dissipation window department receive the air current impact of back chamber and produce the vibration, and the vibration of heat dissipation vibrating diaphragm produces the vibration air current in the heat dissipation passageway, and then produces the forced convection around the heat source, dispels the heat fast to the heat source for the radiating rate improves radiating efficiency and heat dispersion, satisfies high radiating demand.
Description
Technical Field
The invention relates to the technical field of electroacoustic, in particular to a sounding device and an electronic device.
Background
At present, the electronic device of sound production device is used, for example, the chip as the main heat source in the audio amplifier is usually conducted to the die-casting aluminum casing of the audio amplifier through the heat-conducting silica gel sheet, in order to carry out the high thermal conductivity of itself through the casing and dispel the heat, however, the thermal conductivity coefficient of the heat-conducting silica gel sheet is less, the heat that the chip produced can't be transmitted to the casing fast, and the heat that is transmitted to the casing can only rely on the part of casing itself that exposes in the natural air to carry out the natural convection heat dissipation, heat dispersion is relatively poor, and along with the increase of intelligent audio amplifier function, the demand for the heat dissipation of the chip is also bigger and bigger, the current heat dissipation mode can't satisfy the demand for the high heat dissipation.
Disclosure of Invention
The invention mainly aims to provide a sound production device and an electronic device, and aims to solve the problem that the existing sound box is poor in heat dissipation performance.
In order to achieve the above object, the present invention provides a sound-generating device, which includes a housing, a sound-generating unit accommodated in the housing, and a supporting plate disposed outside the housing, wherein a rear cavity is formed between the sound-generating unit and the housing, a heat-dissipating channel is formed between the supporting plate and the housing, a heat source is disposed on one side of the supporting plate facing the housing, the heat source is located in the heat-dissipating channel, the housing is provided with a heat-dissipating window communicating the rear cavity with the heat-dissipating channel, and a heat-dissipating diaphragm is covered on the heat-dissipating window.
Preferably, the heat dissipation vibrating diaphragm and the heat source are arranged in a staggered mode, an included angle between the heat dissipation vibrating diaphragm and the support plate is an acute angle, and the distance between the heat dissipation vibrating diaphragm and the support plate is gradually enlarged towards the direction close to the heat source.
Preferably, the heat dissipation diaphragm and the heat source are arranged in a staggered manner, and the heat dissipation diaphragm is perpendicular to the support plate.
Preferably, the case is provided with a protruding structure, the protruding structure protrudes from a wall of the case facing the support plate toward the support plate, the heat dissipation window is opened on a side of the protruding structure facing the heat source, and the heat dissipation diaphragm is mounted on the protruding structure.
Preferably, protruding structure includes windshield portion and installation department, the installation department has seted up the heat dissipation window, the heat dissipation vibrating diaphragm is installed on the installation department, windshield portion connects the installation department deviates from one side of heat source, just windshield portion with the backup pad butt.
Preferably, the protruding structure is integrally formed with the housing.
Preferably, the heat dissipation diaphragm, the support plate, and a shell wall of the shell on a side facing the support plate are arranged in parallel with each other.
Preferably, the heat dissipation diaphragm is arranged opposite to the heat source, and a gap communicated with the heat dissipation channel is formed between the heat dissipation diaphragm and the heat source.
Preferably, the heat dissipation diaphragm and the heat source are arranged in a staggered manner.
Preferably, the housing is a heat conducting material, a heat conducting fin is further disposed between the heat source and the housing, and two sides of the heat conducting fin are respectively in corresponding abutment with the heat source and the housing.
Preferably, the heat dissipation vibrating diaphragm includes collar and vibrating diaphragm, the vibrating diaphragm covers the heat dissipation window, just the outer fringe of vibrating diaphragm is installed on the collar, the collar encircles the setting of heat dissipation window and installs the periphery of heat dissipation window.
Preferably, the heat dissipation vibrating diaphragm further comprises a balancing weight, the balancing weight is arranged on the vibrating diaphragm, and the balancing weight is opposite to the heat dissipation window.
Preferably, the vibrating diaphragm is made of elastic soft materials.
Preferably, the supporting plate is a heat-conducting material part; and/or the support plate is detachably connected with the shell.
The invention also provides an electronic device which comprises a shell and the sounding device accommodated in the shell.
In the technical scheme of the invention, when the sound production device is used, the vibrating diaphragm of the sound production monomer vibrates up and down to enable the airflow in the rear cavity to oscillate, so that the heat dissipation vibrating diaphragm covering the heat dissipation window is impacted by the airflow in the rear cavity to vibrate, the vibration of the heat dissipation vibrating diaphragm generates oscillating airflow in the heat dissipation channel, and further forced convection is generated around the heat source to quickly dissipate and cool the heat source, accelerate the heat dissipation speed, improve the heat dissipation efficiency and the heat dissipation performance and meet the requirement of high heat dissipation.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is an exploded view of a sound device according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of a sound device according to an embodiment of the present invention;
FIG. 3 is an exploded view of a sound device according to yet another embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view of a sound device according to yet another embodiment of the present invention;
FIG. 5 is a schematic cross-sectional view of a heat-dissipating diaphragm in a sound device according to an embodiment of the present invention;
FIG. 6 is a schematic cross-sectional view of a heat-dissipating diaphragm in a sound-generating device according to another embodiment of the present invention;
FIG. 7 is a schematic cross-sectional view of an electronic device according to an embodiment of the invention;
fig. 8 is a schematic cross-sectional view of an electronic device according to another embodiment of the invention.
The reference numbers illustrate:
| 100 | |
50 | |
| 10 | |
60 | Heat |
| 11 | |
61 | |
| 12 | |
62 | Vibrating |
| 13 | First shell | 63 | |
| 14 | |
70 | |
| 15 | Bump structure | 80 | |
| 151 | |
200 | |
| 152 | Mounting ofPart (A) | 201 | |
| 20 | |
2011 | |
| 30 | |
2012 | |
| 40 | |
202 | Front sound cavity |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The description of the orientations of "up", "down", "left", "right", etc. in the present invention, with reference to the orientations shown in fig. 2 and 4, is merely used to explain the relative positional relationship between the components in the postures shown in fig. 2 and 4, and if the specific posture is changed, the directional indication is changed accordingly.
The invention provides a sounding device.
As shown in fig. 1 to 4, the sound generating device 100 of the present embodiment includes a housing 10, a sound generating unit 20 and a supporting plate 30, wherein the sound generating unit 20 is accommodated in the housing 10, the supporting plate 30 is disposed outside the housing 10, a rear cavity 11 is formed between the sound generating unit 20 and the housing 10, a heat dissipating channel 50 is formed between the supporting plate 30 and the housing 10, a heat source 40 is disposed on one side of the supporting plate 30 facing the housing 10, the heat source 40 is located in the heat dissipating channel 50, the housing 10 is provided with a heat dissipating window 12 communicating the rear cavity 11 and the heat dissipating channel 50, and a heat dissipating diaphragm 60 is covered on the heat dissipating window 12.
Specifically, as shown in fig. 1 to 4, in the sound generating device 100 of the present embodiment, the supporting plate 30 is located above the outside of the casing 10, the rear cavity 11 is formed between the sound generating unit 20 and the upper wall of the casing 10 facing the supporting plate 30, the supporting plate 30 and the upper wall of the casing 10 are arranged at an interval from top to bottom, so that the heat dissipation channel 50 is formed between the supporting plate 30 and the casing 10, the heat source 40 is disposed on one side of the supporting plate 30 facing the casing 10, that is, on the lower side of the supporting plate 30, the heat source 40 may be a chip of the sound generating device 100, and the present embodiment takes the heat source 40 as an example for description. The chip is located in the heat dissipation channel 50, the housing 10 is provided with a heat dissipation window 12 communicating the rear cavity 11 with the heat dissipation channel 50, the heat dissipation window 12 is specifically provided on the upper shell wall of the housing 10, and the heat dissipation window 12 is covered with a heat dissipation vibrating diaphragm 60, that is, the heat dissipation vibrating diaphragm 60 covers the heat dissipation window 12.
The sound-generating device 100 of the present embodiment is applied to an electronic device 200, such as a sound box, a computer, or a vehicle-mounted sound box, and the present embodiment takes the sound-generating device 100 as an example of a speaker applied in the sound box, and the sound-generating unit 20 is a speaker unit. It can understand, the speaker monomer has the vibrating diaphragm, in the use, the free vibrating diaphragm of speaker vibrates from top to bottom and makes the air current in the rear cavity 11 produce the vibration, and then make the heat dissipation vibrating diaphragm 60 that covers in heat dissipation window 12 department receive the air current impact of rear cavity 11 and produce the vibration, the vibration of heat dissipation vibrating diaphragm 60 produces the vibration air current in heat dissipation channel 50, and then produce the forced convection around the chip, cool down the chip fast heat dissipation, accelerate the radiating rate, raise radiating efficiency and heat dispersion, satisfy high radiating demand. Note that the arrows in fig. 2 and 4 indicate the airflow direction.
As shown in fig. 1 and fig. 2, in an embodiment, the heat dissipation diaphragm 60 and the heat source 40 are disposed in a staggered manner, an included angle between the heat dissipation diaphragm 60 and the support plate 30 is an acute angle, and a distance between the heat dissipation diaphragm 60 and the support plate 30 is gradually enlarged toward a direction close to the heat source 40. As shown in fig. 1 and 2, the heat dissipation window 12 is opened on the upper shell wall of the shell 10 to avoid the position of the chip, so that the heat dissipation diaphragm 60 and the chip are arranged in a staggered manner, and in order to facilitate the generation of forced convection around the chip, the heat dissipation diaphragm 60 is arranged obliquely, so that the included angle between the heat dissipation diaphragm 60 and the support plate 30 is an acute angle, and the distance between the heat dissipation diaphragm 60 and the support plate 30 is gradually enlarged toward the direction close to the heat source 40, as shown in fig. 1 and 2, the heat dissipation diaphragm 60 is positioned at the right side of the chip, and the heat dissipation diaphragm 60 is arranged obliquely downward from the right side to the left side, so that the oscillating airflow generated by the vibration of the heat dissipation diaphragm 60 can flow toward the chip leftward, and the distance between the heat dissipation diaphragm 60 and the support plate 30 is gradually enlarged from the right side to the left side, so that the airflow generated by the vibration of the heat dissipation diaphragm 60 smoothly flows toward the chip, and the heat dissipation efficiency is improved.
In this embodiment, the heat dissipating diaphragm 60 and the chip are disposed in a staggered manner, so that the heat dissipating diaphragm 60 avoids the chip, and the following heat conducting sheet 70 is convenient to mount. The housing 10 may be made of a heat conductive material, a heat conductive sheet 70 is further disposed between the heat source 40 and the housing 10, and two sides of the heat conductive sheet 70 are respectively abutted against the heat source 40 and the housing 10. Specifically, the housing 10 may be made of die-cast aluminum with better heat conductivity in the prior art, the heat conducting sheet 70 may be made of heat conducting silicone sheet in the prior art, and further, the housing 10 may be assembled by using the first housing 13 and the second housing 14, wherein the first housing 13 and the speaker unit form the rear cavity 11 therebetween, the supporting plate 30 is mounted on the first housing 13, and for saving the production cost, the first housing 13 may be made of die-cast aluminum, and the second housing 14 may be made of plastic.
Through setting up conducting strip 70, and the upside and the chip butt of conducting strip 70, the downside of conducting strip 70 and the upper shell wall butt of casing 10 (first casing 13) for the heat accessible conducting strip 70 that the chip produced conducts to casing 10, and go out through casing 10 heat dissipation again, and then utilize the dual radiating effect of heat dissipation vibrating diaphragm 60 with conducting strip 70, accelerated chip radiating rate greatly, increase substantially radiating efficiency.
In another embodiment, the heat dissipation diaphragm 60 is disposed offset from the heat source 40, and the heat dissipation diaphragm 60 is disposed perpendicular to the support plate 30. Specifically, backup pad 30 and the upper casing wall parallel arrangement of casing 10, the vertical setting of heat dissipation vibrating diaphragm 60 to make heat dissipation vibrating diaphragm 60 and backup pad 30 mutually perpendicular, compare with the heat dissipation vibrating diaphragm 60 that the slope set up, the heat dissipation vibrating diaphragm 60 of vertical setting can make the oscillating airflow that its vibration produced not have ascending weight, thereby can all flow to the chip left, in order to carry out rapid cooling to the chip, further accelerate radiating rate, improve the radiating efficiency.
In this embodiment, the heat dissipating diaphragm 60 and the chip are disposed in a staggered manner, so that the heat dissipating diaphragm 60 avoids the chip, and the following heat conducting sheet 70 is convenient to mount. The housing 10 may be made of a heat conductive material, a heat conductive sheet 70 is further disposed between the heat source 40 and the housing 10, and two sides of the heat conductive sheet 70 are respectively abutted against the heat source 40 and the housing 10. Specifically, the housing 10 may be made of die-cast aluminum with better heat conductivity in the prior art, the heat conducting sheet 70 may be made of heat conducting silicone sheet in the prior art, and further, the housing 10 may be assembled by using the first housing 13 and the second housing 14, wherein the first housing 13 and the speaker unit form the rear cavity 11 therebetween, the supporting plate 30 is mounted on the first housing 13, and for saving the production cost, the first housing 13 may be made of die-cast aluminum, and the second housing 14 may be made of plastic.
Through setting up conducting strip 70, and the upside and the chip butt of conducting strip 70, the downside of conducting strip 70 and the upper shell wall butt of casing 10 (first casing 13) for the heat accessible conducting strip 70 that the chip produced conducts to casing 10, and go out through casing 10 heat dissipation again, and then utilize the dual radiating effect of heat dissipation vibrating diaphragm 60 with conducting strip 70, accelerated chip radiating rate greatly, increase substantially radiating efficiency.
In order to realize the inclined arrangement or the vertical arrangement of the heat dissipation diaphragm 60, the housing 10 is provided with a protruding structure 15, the protruding structure 15 protrudes from the wall of the housing 10 facing the support plate 30 to the direction of the support plate 30, a heat dissipation window 12 is opened on one side of the protruding structure 15 facing the heat source 40, and the heat dissipation diaphragm 60 is installed on the protruding structure 15. Specifically, the protruding structure 15 is disposed on the upper wall of the housing 10, the protruding structure 15 protrudes upward from the upper wall of the housing 10, a heat dissipation window 12 is opened on a side of the protruding structure 15 facing the chip, and the heat dissipation diaphragm 60 is mounted on the protruding structure 15.
The protruding structure 15 includes a wind shielding portion 151 and an installation portion 152, the installation portion 152 has a heat dissipation window 12, the heat dissipation diaphragm 60 is installed on the installation portion 152, the wind shielding portion 151 is connected to one side of the installation portion 152 away from the heat source 40, and the wind shielding portion 151 abuts against the supporting plate 30.
As shown in fig. 2, the mounting portion 152 is disposed facing the chip, the heat dissipation window 12 is opened on the mounting portion 152, and the heat dissipation diaphragm 60 is mounted on the mounting portion 152, such that the heat dissipation diaphragm 60 is disposed facing the chip, and further, the oscillating airflow generated by the vibration of the heat dissipation diaphragm 60 flows toward the chip. The portion of keeping out the wind 151 is connected on the right side that installation department 152 deviates from the chip, and the upper end and the backup pad 30 butt of portion of keeping out the wind 151 for portion of keeping out the wind 151 has the effect of keeping out the wind, blocks the oscillating airflow that heat dissipation vibrating diaphragm 60 vibration produced and flows from portion of keeping out the wind 151, and then guarantees that the oscillating airflow that heat dissipation vibrating diaphragm 60 vibration produced all flows to the chip direction for the radiating rate improves the radiating efficiency.
The convex structure 15 is integrally formed on the housing 10, so that the assembling step and the assembling error are omitted, and the manufacturing is easy. Specifically, the protrusion structure 15 is integrally formed with the upper shell wall of the shell 10, and the heat dissipation diaphragm 60 may be mounted on the inner side of the protrusion structure 15 by gluing or screwing, or may be mounted on the outer side of the protrusion structure 15 by gluing or screwing, so that the assembly is simple and convenient.
As shown in fig. 3 and 4, in a further embodiment, the heat dissipation diaphragm 60, the support plate 30 and the wall of the casing 10 on the side facing the support plate 30 are arranged parallel to each other. The heat dissipation diaphragm 60 is disposed opposite to the heat source 40, and a gap 80 communicating with the heat dissipation channel 50 is formed between the heat dissipation diaphragm 60 and the heat source 40.
As shown in fig. 3 and 4, the heat dissipation diaphragm 60, the support plate 30 and the upper shell wall of the housing 10 are all horizontally disposed, the three are parallel to each other, the heat dissipation diaphragm 60 is disposed right opposite to the chip, and a gap 80 communicating with the heat dissipation channel 50 is provided between the heat dissipation diaphragm 60 and the heat source 40, i.e., the chip and the heat dissipation diaphragm 60 are disposed at an upper and a lower interval, and the chip is located right above the heat dissipation diaphragm 60, the oscillating airflow generated by the vibration of the heat dissipation diaphragm 60 can directly blow upwards through the gap 80 to the chip, the distance between the heat dissipation diaphragm 60 and the heat dissipation diaphragm 60 is shortened, the loss of the oscillating airflow in the flowing process is reduced, so that the oscillating airflow can directly and completely act on the chip, the heat dissipation speed is increased, and the heat dissipation efficiency is improved. In this embodiment, the sound generating device 100 has no requirement for heat conduction to the material of the casing 10, and the casing 10 may be made of a plastic material with a low cost, so as to save the production cost.
In another embodiment, the heat-dissipating diaphragm 60, the support plate 30 and the wall of the casing 10 on the side facing the support plate 30 are parallel to each other. The heat dissipation diaphragm 60 and the heat source 40 are disposed in a staggered manner. Specifically, the upper shell wall of the heat dissipation diaphragm 60, the support plate 30 and the shell 10 are all horizontally arranged, and are parallel to each other, and the heat dissipation diaphragm 60 and the chip are arranged in a staggered manner, so that the heat dissipation diaphragm 60 avoids the chip arrangement, and the following heat conducting fins 70 are conveniently installed.
In this embodiment, the housing 10 may be made of a heat conductive material, a heat conductive sheet 70 is further disposed between the heat source 40 and the housing 10, and two sides of the heat conductive sheet 70 are respectively abutted against the heat source 40 and the housing 10. Specifically, the housing 10 may be made of die-cast aluminum with better heat conductivity in the prior art, the heat conducting sheet 70 may be made of heat conducting silicone sheet in the prior art, and further, the housing 10 may be assembled by using the first housing 13 and the second housing 14, wherein the first housing 13 and the speaker unit form the rear cavity 11 therebetween, the supporting plate 30 is mounted on the first housing 13, and for saving the production cost, the first housing 13 may be made of die-cast aluminum, and the second housing 14 may be made of plastic.
Through setting up conducting strip 70, and the upside and the chip butt of conducting strip 70, the downside of conducting strip 70 and the upper shell wall butt of casing 10 (first casing 13) for the heat accessible conducting strip 70 that the chip produced conducts to casing 10, and go out through casing 10 heat dissipation again, and then utilize the dual radiating effect of heat dissipation vibrating diaphragm 60 with conducting strip 70, accelerated chip radiating rate greatly, increase substantially radiating efficiency.
As shown in fig. 5, in one embodiment, the heat dissipating diaphragm 60 includes a mounting ring 61 and a vibrating diaphragm 62, the vibrating diaphragm 62 covers the heat dissipating window 12, and an outer edge of the vibrating diaphragm 62 is mounted on the mounting ring 61, and the mounting ring 61 is disposed around the heat dissipating window 12 and mounted on an outer periphery of the heat dissipating window 12. The shape of the vibrating diaphragm 62 substantially matches the shape of the heat dissipation window 12, the vibrating diaphragm 62 covers the heat dissipation window 12, and during use of the sound box, the vibrating diaphragm 62 covering the heat dissipation window 12 is impacted by the airflow of the rear cavity 11 to generate vibration, so as to generate oscillating airflow in the heat dissipation channel 50. For convenient installation, the heat dissipation diaphragm 60 includes a mounting ring 61, the mounting ring 61 is disposed along an outer edge of the vibration diaphragm 62, the outer edge of the vibration diaphragm 62 is mounted on the mounting ring 61, the mounting ring 61 is disposed around the heat dissipation window 12 and fixed to the outer periphery of the heat dissipation window 12 by bonding or screwing, so as to achieve stable assembly of the heat dissipation diaphragm 60 and the housing 10.
As shown in fig. 6, in another embodiment, the heat dissipating diaphragm 60 further includes a weight 63 in addition to the mounting ring 61 and the vibrating diaphragm 62, the weight 63 is disposed on the vibrating diaphragm 62, and the weight 63 is disposed opposite to the heat dissipating window 12. The balancing weight 63 can be made of metal materials in the prior art, and the balancing weight 63 is arranged on the vibrating diaphragm 62, so that the effectiveness and stability of the vibration of the vibrating diaphragm 62 can be improved, and the sound quality effect of the sound box can be improved. The balancing weight 63 can be arranged on the upper surface of the vibrating diaphragm 62, also can be arranged on the lower surface of the vibrating diaphragm 62, and can be embedded in the vibrating diaphragm 62, so that the assembly is convenient and flexible.
The vibrating diaphragm 62 is made of elastic soft material. Specifically, the vibration diaphragm 62 may be made of elastic soft material such as silica gel or rubber in the prior art, so that the vibration diaphragm 62 has elasticity and is beneficial to vibration.
In order to further increase the heat dissipation speed of the chip, the supporting plate 30 may be made of a heat conductive material, the supporting plate 30 may be made of a metal material with a better heat conductivity in the prior art, and the heat generated by the chip may also be conducted to the supporting plate 30 to dissipate the heat through the supporting plate 30. The supporting plate 30 is detachably connected to the housing 10 for easy assembly and disassembly. It should be noted that the supporting plate 30 may also be made of a plastic material or an FR-4 plate material with low cost, so as to facilitate mounting the chip.
As shown in fig. 7 and 8, the present invention further provides an electronic device 200, where the electronic device 200 includes a housing 201 and the sound-generating device 100 accommodated in the housing 201, a front sound cavity 202 is formed between the housing 201 and the sound-generating device 100, the housing 201 is provided with a sound outlet 2011 communicated with the front sound cavity 202, and the sound outlet 2011 is disposed to realize normal sound generation of the electronic device 200. The number of the sound outlet holes 2011 may be plural, and the plural sound outlet holes 2011 are arranged at intervals. The housing 2011 is further provided with heat dissipation holes 2012, the heat dissipation holes 2012 are disposed on the housing 201 near the heat source 40, and after the air flow generated by the vibration of the heat dissipation diaphragm 60 and the air around the heat source 40 generate forced convection, the air flow with a large amount of heat flows out from the heat dissipation channel 50, and then is dissipated to the outside through the heat dissipation holes 2012, so as to achieve the purpose of rapid cooling. The number of the heat dissipation holes 2012 can be multiple, and the multiple heat dissipation holes 2012 are arranged at intervals. The specific structure of the sound generating device 100 in the electronic device 200 refers to the above-mentioned embodiments, and since the electronic device 200 adopts all technical solutions of all the above-mentioned embodiments, at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments are achieved, and no further description is given here. The electronic device 200 may be a computer, a mobile phone, a sound box, a vehicle-mounted sound box applied to an automobile, and the like.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (15)
1. The utility model provides a sounding device, its characterized in that, sounding device include the casing, accept in sounding monomer in the casing and set up in the outer backup pad of casing, sounding monomer with be formed with the back chamber between the casing, the backup pad with form heat dissipation channel between the casing, the backup pad towards one side of casing is provided with the heat source, the heat source is located in the heat dissipation channel, the intercommunication has been seted up to the casing the back chamber with heat dissipation channel's heat dissipation window, heat dissipation window department lid is equipped with the heat dissipation vibrating diaphragm.
2. The sound production device of claim 1, wherein the heat dissipation diaphragm and the heat source are arranged in a staggered manner, an included angle between the heat dissipation diaphragm and the support plate is an acute angle, and a distance between the heat dissipation diaphragm and the support plate is gradually enlarged toward a direction close to the heat source.
3. The sound-producing device of claim 1, wherein the heat-dissipating diaphragm is offset from the heat source, and the heat-dissipating diaphragm is disposed perpendicular to the support plate.
4. The sound-producing device according to claim 2 or 3, wherein the housing is provided with a protrusion protruding from a wall of the housing facing the supporting plate in a direction toward the supporting plate, the heat-dissipating window is opened on a side of the protrusion facing the heat source, and the heat-dissipating diaphragm is mounted on the protrusion.
5. The sound production device of claim 4, wherein the protrusion structure comprises a wind shielding portion and an installation portion, the installation portion is provided with the heat dissipation window, the heat dissipation diaphragm is installed on the installation portion, the wind shielding portion is connected to a side of the installation portion, which is far away from the heat source, and the wind shielding portion is abutted to the supporting plate.
6. The sound device of claim 4, wherein the boss structure is integrally formed with the housing.
7. The sound-producing device according to claim 1, wherein the heat-dissipating diaphragm, the support plate and a wall of the housing on a side facing the support plate are arranged parallel to each other.
8. The sound-producing device of claim 7, wherein the heat-dissipating diaphragm is disposed opposite the heat source, and a gap is formed between the heat-dissipating diaphragm and the heat source to communicate with the heat-dissipating channel.
9. The sounding device of claim 7, wherein the heat-dissipating diaphragm is offset from the heat source.
10. The sound production device as claimed in claim 2, 3 or 9, wherein the housing is made of a heat conductive material, a heat conductive sheet is further disposed between the heat source and the housing, and two sides of the heat conductive sheet are respectively abutted against the heat source and the housing.
11. The sound production device of claim 1, wherein the thermal diaphragm includes a mounting ring and a diaphragm, the diaphragm covering the thermal window, and an outer edge of the diaphragm being mounted on the mounting ring, the mounting ring being disposed around the thermal window and mounted at a periphery of the thermal window.
12. The sound-producing device of claim 11, wherein the diaphragm further comprises a weight disposed on the diaphragm and facing the window.
13. The sound-producing device of claim 11, wherein the diaphragm is made of a resilient soft material.
14. The sound producing device of claim 1, wherein the support plate is a thermally conductive material; and/or the support plate is detachably connected with the shell.
15. An electronic device comprising a housing and the sound-producing device of any one of claims 1-14 housed within the housing.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110606630.3A CN113395617B (en) | 2021-05-31 | 2021-05-31 | Sound production device and electronic device |
| PCT/CN2022/094052 WO2022253005A1 (en) | 2021-05-31 | 2022-05-20 | Sound generating device and electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110606630.3A CN113395617B (en) | 2021-05-31 | 2021-05-31 | Sound production device and electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113395617A true CN113395617A (en) | 2021-09-14 |
| CN113395617B CN113395617B (en) | 2022-10-18 |
Family
ID=77619766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110606630.3A Active CN113395617B (en) | 2021-05-31 | 2021-05-31 | Sound production device and electronic device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN113395617B (en) |
| WO (1) | WO2022253005A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022253005A1 (en) * | 2021-05-31 | 2022-12-08 | 歌尔股份有限公司 | Sound generating device and electronic apparatus |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005295335A (en) * | 2004-04-01 | 2005-10-20 | Alpine Electronics Inc | Speaker unit |
| CN105430124A (en) * | 2015-10-28 | 2016-03-23 | 努比亚技术有限公司 | Terminal and heat dissipation method |
| WO2017190454A1 (en) * | 2016-05-04 | 2017-11-09 | 中兴通讯股份有限公司 | Mobile terminal |
| CN207340158U (en) * | 2017-09-04 | 2018-05-08 | 西安Tcl软件开发有限公司 | Speaker |
| CN110475184A (en) * | 2019-07-23 | 2019-11-19 | 瑞声科技(新加坡)有限公司 | Sounding device and mobile terminal |
| CN210431861U (en) * | 2019-07-22 | 2020-04-28 | 瑞声科技(新加坡)有限公司 | Electronic device |
| CN210986331U (en) * | 2019-10-15 | 2020-07-10 | 瑞声科技(新加坡)有限公司 | Speaker box device and mobile terminal |
| US20210029458A1 (en) * | 2019-07-22 | 2021-01-28 | AAC Technologies Pte. Ltd. | Speaker Device and Mobile Terminal |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6353536B1 (en) * | 1998-06-25 | 2002-03-05 | Kabushiki Kaisha Toshiba | Electronic equipment system and extension device for expanding the functions of electronic equipment |
| CN102647880B (en) * | 2011-02-16 | 2015-12-02 | 技嘉科技股份有限公司 | Heat abstractor |
| US8798308B2 (en) * | 2012-02-21 | 2014-08-05 | Bose Corporation | Convective airflow using a passive radiator |
| US9992562B1 (en) * | 2016-12-06 | 2018-06-05 | Tymphany Hk Limited | Loudspeaker having passive heat dissipation assembly |
| CN112291645A (en) * | 2019-07-22 | 2021-01-29 | 瑞声科技(新加坡)有限公司 | Speaker device and mobile terminal |
| CN212727392U (en) * | 2020-06-22 | 2021-03-16 | 歌尔股份有限公司 | Sound production device and electronic equipment |
| CN214675560U (en) * | 2021-05-31 | 2021-11-09 | 歌尔股份有限公司 | Electronic device |
| CN113395617B (en) * | 2021-05-31 | 2022-10-18 | 歌尔股份有限公司 | Sound production device and electronic device |
-
2021
- 2021-05-31 CN CN202110606630.3A patent/CN113395617B/en active Active
-
2022
- 2022-05-20 WO PCT/CN2022/094052 patent/WO2022253005A1/en unknown
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005295335A (en) * | 2004-04-01 | 2005-10-20 | Alpine Electronics Inc | Speaker unit |
| CN105430124A (en) * | 2015-10-28 | 2016-03-23 | 努比亚技术有限公司 | Terminal and heat dissipation method |
| WO2017190454A1 (en) * | 2016-05-04 | 2017-11-09 | 中兴通讯股份有限公司 | Mobile terminal |
| CN207340158U (en) * | 2017-09-04 | 2018-05-08 | 西安Tcl软件开发有限公司 | Speaker |
| CN210431861U (en) * | 2019-07-22 | 2020-04-28 | 瑞声科技(新加坡)有限公司 | Electronic device |
| US20210029458A1 (en) * | 2019-07-22 | 2021-01-28 | AAC Technologies Pte. Ltd. | Speaker Device and Mobile Terminal |
| CN110475184A (en) * | 2019-07-23 | 2019-11-19 | 瑞声科技(新加坡)有限公司 | Sounding device and mobile terminal |
| CN210986331U (en) * | 2019-10-15 | 2020-07-10 | 瑞声科技(新加坡)有限公司 | Speaker box device and mobile terminal |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022253005A1 (en) * | 2021-05-31 | 2022-12-08 | 歌尔股份有限公司 | Sound generating device and electronic apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113395617B (en) | 2022-10-18 |
| WO2022253005A1 (en) | 2022-12-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104205870B (en) | For the method reappeared the device of acoustical signal and cool down speaker | |
| CN214675560U (en) | Electronic device | |
| CN210431861U (en) | Electronic device | |
| WO2016197569A1 (en) | Loudspeaker module | |
| CN210093444U (en) | Speaker device and mobile terminal having the same | |
| CN205584479U (en) | Loudspeaker module group | |
| WO2021135690A1 (en) | Loudspeaker module and electronic device | |
| WO2022253104A1 (en) | Sound production device | |
| CN113395617B (en) | Sound production device and electronic device | |
| CN210351614U (en) | Speaker device and mobile terminal | |
| CN210093268U (en) | Electronic product | |
| CN210986331U (en) | Speaker box device and mobile terminal | |
| CN210781309U (en) | Speaker device and mobile terminal | |
| CN210093534U (en) | Loudspeaker box and mobile terminal | |
| CN112291688A (en) | Loudspeaker box and mobile terminal | |
| CN212727392U (en) | Sound production device and electronic equipment | |
| CN210093533U (en) | Loudspeaker box and mobile terminal | |
| CN212486723U (en) | Wireless sound box convenient to heat dissipation | |
| CN210351476U (en) | Speaker device and mobile terminal having the same | |
| US20210029457A1 (en) | Speaker Box and Mobile Terminal | |
| CN210093535U (en) | Speaker device and mobile terminal having the same | |
| CN210274379U (en) | Sound box with good heat dissipation performance | |
| CN210670506U (en) | Intelligent sound box | |
| CN212115579U (en) | Loudspeaker module | |
| WO2021012276A1 (en) | Electronic apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |