CN210351971U - Cooling fin of ultrathin mainframe box - Google Patents
Cooling fin of ultrathin mainframe box Download PDFInfo
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- CN210351971U CN210351971U CN201920954874.9U CN201920954874U CN210351971U CN 210351971 U CN210351971 U CN 210351971U CN 201920954874 U CN201920954874 U CN 201920954874U CN 210351971 U CN210351971 U CN 210351971U
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Abstract
The utility model discloses a fin of ultra-thin mainframe box, including piece base, wave mode lamellar body, compressive structures, spacer and locating hole, the turning position department on piece base surface all is equipped with the locating hole, and the surface of piece base is equipped with equidistant wave mode lamellar body to piece base surface between the adjacent wave mode lamellar body is equipped with equidistant spacer, and the inside of wave mode lamellar body is equipped with compressive structures, be equipped with two sets of equidistant second louvres on the outer wall of piece base one side, the one end of second louvre extends to the center and presss from both sides the inside in chamber and is linked together with the outer wall of copper substrate, and is equipped with two sets of equidistant first louvres on the outer wall of second louvre one side is kept away from to the piece base, and the one end of first louvre extends to the center and presss from both sides the inside in chamber and is linked together with the outer wall of copper. The utility model discloses the phenomenon that wearing and tearing appear in the wave mode lamellar body when not only having reduced the fin use has improved the radiating effect when the fin uses, has prolonged the life of fin moreover.
Description
Technical Field
The utility model relates to a heat conduction material technical field specifically is a fin of ultra-thin mainframe box.
Background
With the rapid development of high technology, electronic products become intelligent and complex, the volume of electronic components tends to be miniaturized, and the density of electronic components in a unit area is higher and higher, and the direct influence caused by the situation is that the heat generated by the electronic products is larger and larger in the operation process, and in order to lead out the heat generated by the electronic products, the heat is required to be radiated, so that corresponding radiating fins are required.
At present, the radiating fins on the market are various, but the functionality is single, certain problems still exist, the requirements of people can not be met gradually, and the specific problems are as follows:
(1) the traditional radiating fins are difficult to limit and fix the corrugated sheet body, so that the corrugated sheet body is easy to rub with each other and is easy to wear;
(2) the traditional radiating fins are inconvenient to uniformly coat heat-conducting silicone grease, so that the heat-conducting silicone grease is difficult to uniformly contact with a host chip, and the radiating effect is greatly reduced;
(3) the traditional wave-shaped sheet body of the radiating fin has low toughness and strength, so that the radiating fin is easy to break and has short service life.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a fin of ultra-thin mainframe box to it is difficult to carry out spacing fixed, be not convenient for evenly paint heat conduction silicone grease and the lower problem of wave mode lamellar body toughness intensity to solve to provide the fin among the above-mentioned background art to the wave mode lamellar body.
In order to achieve the above object, the utility model provides a following technical scheme: the heat sink of the ultrathin mainframe box comprises a base, wave-shaped sheet bodies, compression-resistant structures, spacing seats and positioning holes, wherein the positioning holes are formed in the corner positions of the surface of the base, the wave-shaped sheet bodies are arranged on the surface of the base at equal intervals, the spacing seats are arranged on the surface of the base between every two adjacent wave-shaped sheet bodies at equal intervals, and the compression-resistant structures are arranged inside the wave-shaped sheet bodies.
Preferably, a central clamping cavity is arranged at the central position inside the sheet base, a copper substrate is arranged at the central position inside the central clamping cavity, and aluminum auxiliary sheets are arranged inside the sheet base on two sides of the central clamping cavity.
Preferably, the outer wall of one side of the base is provided with two groups of second heat dissipation holes at equal intervals, one end of each second heat dissipation hole extends to the inside of the central clamping cavity and is communicated with the outer wall of the copper base, the outer wall of one side of the base, far away from the second heat dissipation holes, is provided with two groups of first heat dissipation holes at equal intervals, and one end of each first heat dissipation hole extends to the inside of the central clamping cavity and is communicated with the outer wall of the copper base.
Preferably, the outer wall of one side of the wave-shaped sheet body, which is far away from the sheet base, is provided with a central linkage groove, the outer walls of the sheet bases at the two ends of the central linkage groove are provided with transverse attaching strips, the outer walls of the sheet bases at the two sides of the central linkage groove are provided with longitudinal attaching strips, the outer walls of one sides of the longitudinal attaching strips and the transverse attaching strips are provided with flow guide grooves, and one end of each flow guide groove extends to the inside of the central linkage groove.
Preferably, the compression-resistant structure is sequentially provided with an adhesive, a micro-wire mesh body, metal ion clamping pieces and compression-resistant corrugated wire bodies from inside to outside, the adhesive is arranged at the central position inside the wave-shaped sheet body, the micro-wire mesh bodies are adhered inside the wave-shaped sheet bodies on two sides of the adhesive, the metal ion clamping pieces are arranged inside the wave-shaped sheet body on one side, away from the adhesive, of the micro-wire mesh bodies, and the compression-resistant corrugated wire bodies are arranged at the central positions inside the metal ion clamping pieces.
Preferably, a central vertical piece is arranged at the center of the surface of the spacing seat, a plane where two ends of the central vertical piece are located is coplanar with a plane where two ends of the wave-shaped piece body are located, spherical spacing blocks are arranged on two outer side walls of the central vertical piece, and one end of each spherical spacing block is fixedly connected with the outer wall of the wave-shaped piece body.
Compared with the prior art, the beneficial effects of the utility model are that: the heat radiating fin of the ultrathin mainframe box not only reduces the phenomenon that the wave-shaped fin body is abraded when the heat radiating fin is used, improves the heat radiating effect when the heat radiating fin is used, but also prolongs the service life of the heat radiating fin;
(1) the spherical spacing blocks, the central vertical pieces and the spacing seats are arranged, the bottom parts of the adjacent wave-shaped sheet bodies are spaced and limited through the spacing seats, and then the spherical spacing blocks are arranged above the spacing seats through the central vertical pieces to space and limit the top parts of the adjacent wave-shaped sheet bodies, so that the function of limiting and fixing the radiating fins is realized, the adjacent wave-shaped sheet bodies are prevented from being contacted, and the phenomenon that the wave-shaped sheet bodies are abraded when the radiating fins are used is reduced;
(2) by arranging the transverse attaching strips, the flow guide grooves, the central linkage grooves and the longitudinal attaching strips, the heat-conducting silicone grease can be uniformly coated on four sides of the substrate through the transverse attaching strips and the longitudinal attaching strips, and then the heat-conducting silicone grease is coated on the central position of the substrate through the central linkage grooves, and meanwhile, the central linkage grooves and the transverse attaching strips can be communicated with the heat-conducting silicone grease in the flow guide grooves through the flow guide grooves, so that the heat-conducting silicone grease can be uniformly contacted with a host chip, and the heat dissipation effect of the heat dissipation fin during use is improved;
(3) the adhesive, the micro-wire mesh body, the metal ion clamping pieces and the compression-resistant corrugated wire bodies are arranged, the micro-wire mesh body is adhered to the inside of the wave-shaped sheet body through the adhesive, so that the toughness strength of the wave-shaped sheet body is improved, and the toughness strength of the wave-shaped sheet body is enhanced through the good compression resistance of the metal ion clamping pieces and the compression-resistant corrugated wire bodies, so that the toughness strength of the wave-shaped sheet body is further improved, the phenomenon of fracture of the wave-shaped sheet body is avoided, and the service life of the radiating fin is prolonged.
Drawings
FIG. 1 is a schematic front view of the present invention;
fig. 2 is a schematic rear view of the present invention;
FIG. 3 is a schematic diagram of a side view cross-sectional structure of a substrate according to the present invention;
fig. 4 is the sectional view of the anti-compression structure of the present invention.
In the figure: 1. a substrate; 2. a wave-shaped sheet body; 3. a spherical spacer block; 4. a central vertical sheet; 5. a compression resistant structure; 501. a binder; 502. a microfilament mesh body; 503. a metal ion clip; 504. a compression-resistant corrugated wire body; 6. a spacer seat; 7. positioning holes; 8. transverse laminating strips; 9. a diversion trench; 10. a central linking groove; 11. longitudinal attaching strips; 12. a copper substrate; 13. a central nip cavity; 14. aluminum auxiliary sheets; 15. a first heat dissipation hole; 16. a second heat dissipation hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides an embodiment: a heat sink of ultra-thin mainframe box comprises a base 1, a wave-shaped sheet body 2, a pressure-resistant structure 5, a spacing seat 6 and a positioning hole 7, wherein the positioning hole 7 is arranged at the corner position of the surface of the base 1, the wave-shaped sheet body 2 with equal spacing is arranged on the surface of the base 1, a central clamping cavity 13 is arranged at the central position inside the base 1, a copper substrate 12 is arranged at the central position inside the central clamping cavity 13, aluminum auxiliary sheets 14 are arranged inside the base 1 at two sides of the central clamping cavity 13, two groups of second heat dissipation holes 16 with equal spacing are arranged on the outer wall at one side of the base 1, one end of each second heat dissipation hole 16 extends into the central clamping cavity 13 and is communicated with the outer wall of the copper substrate 12, two groups of first heat dissipation holes 15 with equal spacing are arranged on the outer wall of the base 1 far away from one side of the second heat dissipation holes 16, one end of each first heat dissipation hole 15 extends into the inner part of the central clamping cavity 13 and, so as to facilitate the transfer of thermal energy;
the outer wall of one side of the sheet base 1, which is far away from the wave-shaped sheet body 2, is provided with a central linkage groove 10, the outer walls of the sheet bases 1 at the two ends of the central linkage groove 10 are provided with transverse attaching strips 8, the outer walls of the sheet bases 1 at the two sides of the central linkage groove 10 are provided with longitudinal attaching strips 11, the outer walls of one sides of the longitudinal attaching strips 11 and the transverse attaching strips 8 are provided with flow guide grooves 9, and one end of each flow guide groove 9 extends into the central linkage groove 10 so as to be convenient for uniformly coating heat-conducting silicone grease;
the surface of the base 1 between the adjacent wave-shaped sheet bodies 2 is provided with equally-spaced spacing seats 6, the center position of the surface of each spacing seat 6 is provided with a central vertical sheet 4, the planes of two ends of each central vertical sheet 4 are coplanar with the planes of two ends of each wave-shaped sheet body 2, two outer side walls of each central vertical sheet 4 are provided with spherical spacing blocks 3, and one end of each spherical spacing block 3 is fixedly connected with the outer wall of each wave-shaped sheet body 2 so as to be convenient for spacing, limiting and fixing the adjacent wave-shaped sheet bodies 2;
the anti-compression structure 5 is arranged in the wave-shaped sheet body 2, the anti-compression structure 5 is sequentially provided with an adhesive 501, a micro-wire mesh body 502, a metal ion clamping piece 503 and an anti-compression corrugated wire body 504 from inside to outside, the adhesive 501 is arranged at the central position in the wave-shaped sheet body 2, the micro-wire mesh bodies 502 are adhered in the wave-shaped sheet bodies 2 at two sides of the adhesive 501, the metal ion clamping piece 503 is arranged in the wave-shaped sheet body 2 at one side of the micro-wire mesh body 502 far away from the adhesive 501, and the anti-compression corrugated wire body 504 is arranged at the central position in the metal ion clamping;
the microwire net body 502 is adhered to the inside of the wave-shaped sheet body 2 through the adhesive 501, so that the toughness strength of the wave-shaped sheet body 2 is improved, and the toughness strength of the wave-shaped sheet body 2 is enhanced through the good compression resistance of the metal ion clamping pieces 503 and the compression-resistant corrugated wire bodies 504, so that the toughness strength of the wave-shaped sheet body 2 is further improved, and the fracture phenomenon is avoided.
The working principle is as follows: when the radiating fin is used, firstly, the bottom of the adjacent wave-shaped sheet bodies 2 are spaced and limited through the spacer 6, then the spherical spacer blocks 3 are arranged above the spacer 6 through the central vertical sheet 4, the top of the adjacent wave-shaped sheet bodies 2 are spaced and limited so as to avoid the contact of the adjacent wave-shaped sheet bodies 2 and reduce the abrasion phenomenon of the wave-shaped sheet bodies 2, then, the heat-conducting silicone grease can be uniformly coated on the four sides of the sheet base 1 through the transverse laminating strips 8 and the longitudinal laminating strips 11, the heat-conducting silicone grease is coated on the central position of the sheet base 1 through the central linkage groove 10, meanwhile, the central linkage groove 10 and the transverse laminating strips 8 can be communicated with the heat-conducting silicone grease in the guide groove 9 through the guide groove 9 so as to ensure that the heat-conducting silicone grease is uniformly contacted with a host chip, the radiating effect of the radiating fin is improved, and the micro-wire mesh body 502 is bonded to the inside of the wave, the toughness strength of the wave-shaped sheet body 2 is improved, the toughness strength of the wave-shaped sheet body 2 is further improved through the good compression resistance of the metal ion clamping sheet 503 and the good compression resistance of the compression resistance corrugated wire body 504, the toughness strength of the wave-shaped sheet body 2 is further improved, the phenomenon that the wave-shaped sheet body is broken is avoided, the service life of the radiating fin is prolonged, finally, the heat energy is transferred through the good heat conducting performance of the copper substrate 12 and the good heat conducting performance of the aluminum auxiliary sheet 14, meanwhile, the heat introduction and the heat conduction are further assisted through the first radiating holes 15 and the second radiating holes 16, and therefore the use of the radiating fin.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. The utility model provides a fin of ultra-thin mainframe box, includes film base (1), wave type lamellar body (2), compressive structure (5), interval seat (6) and locating hole (7), its characterized in that: the corner positions of the surface of the sheet base (1) are provided with positioning holes (7), the surface of the sheet base (1) is provided with wave-shaped sheet bodies (2) at equal intervals, the surface of the sheet base (1) between the adjacent wave-shaped sheet bodies (2) is provided with spacing seats (6) at equal intervals, and the wave-shaped sheet bodies (2) are internally provided with compression-resistant structures (5).
2. A heat sink for ultra-thin mainframe box as claimed in claim 1, wherein: the piece base is characterized in that a central clamping cavity (13) is arranged at the central position inside the piece base (1), a copper base piece (12) is arranged at the central position inside the central clamping cavity (13), and aluminum auxiliary pieces (14) are arranged inside the piece base (1) on two sides of the central clamping cavity (13).
3. A heat sink for ultra-thin mainframe box as claimed in claim 2, wherein: the heat dissipation device is characterized in that two sets of second heat dissipation holes (16) which are arranged at equal intervals are formed in the outer wall of one side of the base (1), one ends of the second heat dissipation holes (16) extend to the inside of the central clamping cavity (13) and are communicated with the outer wall of the copper base (12), two sets of first heat dissipation holes (15) which are arranged at equal intervals are formed in the outer wall of one side, away from the second heat dissipation holes (16), of the base (1), and one ends of the first heat dissipation holes (15) extend to the inside of the central clamping cavity (13) and are communicated with the outer wall of the copper base (12).
4. A heat sink for ultra-thin mainframe box as claimed in claim 1, wherein: the wave-shaped sheet body is characterized in that a central linkage groove (10) is formed in the outer wall, far away from one side of the wave-shaped sheet body (2), of the sheet base (1), transverse laminating strips (8) are arranged on the outer walls of the sheet base (1) at two ends of the central linkage groove (10), longitudinal laminating strips (11) are arranged on the outer walls of the sheet base (1) at two sides of the central linkage groove (10), guide grooves (9) are formed in the outer walls of one sides of the longitudinal laminating strips (11) and the transverse laminating strips (8), and one end of each guide groove (9) extends to the inside of the central linkage groove (10).
5. A heat sink for ultra-thin mainframe box as claimed in claim 1, wherein: the pressure-resistant structure (5) is sequentially provided with an adhesive (501), a micro-wire mesh body (502), metal ion clamping pieces (503) and pressure-resistant corrugated wire bodies (504) from inside to outside, the adhesive (501) is arranged at the central position inside the wave-shaped sheet body (2), the micro-wire mesh body (502) is adhered inside the wave-shaped sheet body (2) on two sides of the adhesive (501), the metal ion clamping pieces (503) are arranged inside the wave-shaped sheet body (2) on one side, far away from the adhesive (501), of the micro-wire mesh body (502), and the pressure-resistant corrugated wire bodies (504) are arranged at the central position inside the metal ion clamping pieces (503).
6. A heat sink for ultra-thin mainframe box as claimed in claim 1, wherein: the center position department on spacer (6) surface is equipped with central upright piece (4), and the plane that the center found piece (4) both ends place and the plane coplane that wave mode lamellar body (2) both ends place to all be equipped with spherical spacer block (3) on the two lateral walls of central upright piece (4), the one end of spherical spacer block (3) and the outer wall fixed connection of wave mode lamellar body (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920954874.9U CN210351971U (en) | 2019-06-24 | 2019-06-24 | Cooling fin of ultrathin mainframe box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920954874.9U CN210351971U (en) | 2019-06-24 | 2019-06-24 | Cooling fin of ultrathin mainframe box |
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| Publication Number | Publication Date |
|---|---|
| CN210351971U true CN210351971U (en) | 2020-04-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920954874.9U Active CN210351971U (en) | 2019-06-24 | 2019-06-24 | Cooling fin of ultrathin mainframe box |
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| Country | Link |
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| CN (1) | CN210351971U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110149788A (en) * | 2019-06-24 | 2019-08-20 | 东莞市派实达电子科技有限公司 | A kind of cooling fin of ultra-thin mainframe box |
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2019
- 2019-06-24 CN CN201920954874.9U patent/CN210351971U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110149788A (en) * | 2019-06-24 | 2019-08-20 | 东莞市派实达电子科技有限公司 | A kind of cooling fin of ultra-thin mainframe box |
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