CN214206189U - High heat dissipation backshell and vehicle-mounted display - Google Patents
High heat dissipation backshell and vehicle-mounted display Download PDFInfo
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- CN214206189U CN214206189U CN202022246325.1U CN202022246325U CN214206189U CN 214206189 U CN214206189 U CN 214206189U CN 202022246325 U CN202022246325 U CN 202022246325U CN 214206189 U CN214206189 U CN 214206189U
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Abstract
The utility model discloses a high heat dissipation backshell, include: the heat dissipation device comprises an installation part, a heat dissipation function part connected with the installation part and a heat conduction guide post; the heat dissipation function part is provided with a power amplifier heat dissipation area and a wide groove heat dissipation area; the power amplifier radiating area is provided with a plurality of radiating fins, a power amplifier installing groove and heat conducting fins, the power amplifier installing groove is formed in the back face of each radiating fin, and the heat conducting fins are connected with the side faces of the power amplifier installing groove and the radiating fins respectively; the wide-groove heat dissipation area is provided with a plurality of heat dissipation convex strips and heat dissipation holes; the heat transfer guide pillar is connected with the back of the heat dissipation convex strip; the mounting portion is provided with a plurality of interface holes. The utility model discloses a heat conduction fin can be with the heat for radiating fin from the side conduction of power amplifier mounting groove, has increased the power amplifier mounting groove and has conducted the heat for radiating fin's way, can effectively strengthen power amplifier's radiating effect, extension power amplifier's life.
Description
Technical Field
The utility model relates to an automotive electronics technical field especially relates to a high heat dissipation backshell and vehicle-mounted display.
Background
The heat dissipation of the existing vehicle-mounted display is all born by the rear shell, but the heat dissipation structure cannot meet the heat dissipation of a device with large heat productivity. For promoting the radiating effect, the utility model discloses a high heat dissipation plastic backshell and vehicle-mounted display's of grant publication No. CN210805026U, patent name provide a strengthen the radiating technical scheme to operational amplifier, but this technical scheme has only strengthened operational amplifier's heat dissipation, moreover, the power amplifier mounting groove that is used for placing operational amplifier only has a face and casing contact, can not be fast fully conduct the heat that operational amplifier produced for the casing, the efficiency of heat transfer is slower. Further, the technical solution cannot sufficiently transfer heat and dissipate heat of other main heat generating devices such as chips in the vehicle-mounted display, and cannot sufficiently meet the requirement of sufficient heat dissipation of the vehicle-mounted display.
Accordingly, the prior art is deficient and needs improvement.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is: the utility model provides a high heat dissipation backshell and vehicle-mounted display, strengthen the heat dissipation to operational amplifier, strengthen the chip heat conduction and the heat dissipation in the vehicle-mounted display, satisfy the heat conduction and the heat dissipation demand of chip.
The technical scheme of the utility model as follows: provided is a high heat dissipation rear case, including: the heat dissipation device comprises an installation part, a heat dissipation function part connected with the installation part and a heat conduction guide post; the heat dissipation function part is provided with a power amplifier heat dissipation area and a wide groove heat dissipation area; the power amplifier radiating area is provided with a plurality of radiating fins, a power amplifier installing groove and heat conducting fins, the power amplifier installing groove is formed in the back face of each radiating fin, and the heat conducting fins are connected with the side faces of the power amplifier installing groove and the radiating fins respectively; the wide-groove heat dissipation area is provided with a plurality of heat dissipation convex strips and heat dissipation holes; the heat transfer guide pillar is connected with the back of the heat dissipation convex strip; the mounting portion is provided with a plurality of interface holes. The heat conduction guide pillar can contact with the chip through the insulating heat conduction glue, so that heat generated by the chip can be quickly conducted to the heat conduction guide pillar, then conducted to the heat dissipation convex strip, the heat dissipation convex strip can quickly dissipate heat of the heat, the heat conduction guide pillar is compared with a back shell, the heat dissipation effect of the heat conduction guide pillar on the chip is greatly improved, and the chip can stably operate. The heat-conducting fins can conduct heat to the heat-radiating fins from the side faces of the power amplifier mounting grooves, and the way that the power amplifier mounting grooves conduct the heat to the heat-radiating fins is increased, so that the heat-radiating effect of the power amplifier can be effectively enhanced, and the service life of the power amplifier is prolonged.
Further, the heat dissipation function portion further includes: the fan installing area strengthens the ventilation district, the fan installing area is provided with fan mounting hole and fan ventilation hole, it is provided with a plurality of side ventilation holes to strengthen the ventilation district. The fan mounting area is used for mounting a fan to enhance heat dissipation. The side vent hole can make wind pass in and out from the side, and the wind can better take away heat generated by the main board.
Further, strengthen the ventilation district and still be provided with a plurality of back ventilation holes.
Further, high heat dissipation backshell still includes: the mainboard erection column, the bottom and the side of mainboard erection column all with the installation department is connected, and the side and the installation department of mainboard erection column are connected, can strengthen the intensity of mainboard erection column, avoid the mainboard erection column to be broken easily.
Furthermore, the main board mounting column is provided with a main board mounting hole; the installation department is provided with the screen mounting hole, the plane at mainboard mounting hole place is between the plane at heat dissipation function portion and screen mounting hole place. The mainboard can be installed on the mainboard erection column earlier, then installs the display screen on the screen mounting hole, accomplishes the equipment to on-vehicle display.
Furthermore, the surface of the heat dissipation convex strip is a curved surface. The curved surface has a larger surface area than the plane, so that the heat dissipation area can be increased, and the heat dissipation effect is enhanced.
Furthermore, the heat dissipation convex strip is a hollow body, the weight of the high-heat-transfer heat dissipation rear shell can be reduced through the hollow body, and the material cost is saved.
Preferably, the high heat dissipation backshell adopts the metal material, preferred copper product, aluminum product and steel.
Further, the utility model also provides an on-vehicle display, include: the high heat dissipation rear shell comprises a main board arranged in the high heat dissipation rear shell, an interface, a chip and a power amplifier which are arranged on the main board, and a display screen connected with the high heat dissipation rear shell; the interface is arranged at the interface hole, the heat transfer guide post is connected with the chip through insulating heat-conducting glue, and the power amplifier is inserted into the power amplifier mounting groove.
According to the above technical scheme, the utility model provides a high heat dissipation backshell and vehicle-mounted display, heat conduction guide pillar can be through insulating heat conduction glue and chip contact for heat conduction guide pillar can be given in the quick conduction of the heat that the chip produced, then the conduction is given heat dissipation sand grip, and the heat dissipation sand grip just can be dispelled the heat with the heat fast, compares the chip and only gives the backshell through the air conduction, and the heat conduction guide pillar can be very big has promoted the radiating effect to the chip, makes the operation that the chip can be stable. The heat-conducting fins can conduct heat to the heat-radiating fins from the side faces of the power amplifier mounting grooves, and the way that the power amplifier mounting grooves conduct the heat to the heat-radiating fins is increased, so that the heat-radiating effect of the power amplifier can be effectively enhanced, and the service life of the power amplifier is prolonged.
Drawings
Fig. 1 is a schematic structural view of a high heat dissipation rear housing of the present invention;
fig. 2 is a schematic structural view of another view angle of the high heat dissipation rear housing of the present invention;
FIG. 3 is a schematic structural diagram of the vehicular display of the present invention;
fig. 4 is an exploded view of the vehicle-mounted display of the present invention.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
Referring to fig. 1 to 4, the present invention provides a high heat dissipation rear housing 60, including: a mounting part 10, a heat dissipation function part connected to the mounting part 10, and a heat transfer guide pillar 20; the heat dissipation function part is provided with a power amplifier heat dissipation area and a wide groove heat dissipation area; the power amplifier radiating area is provided with a plurality of radiating fins 81, a power amplifier mounting groove 82 and heat conducting fins 83, the power amplifier mounting groove 82 is arranged on the back of the radiating fins 81, and the heat conducting fins 83 are respectively connected with the side surfaces of the power amplifier mounting groove 82 and the radiating fins 81; the wide-groove heat dissipation area is provided with a plurality of heat dissipation convex strips 31 and heat dissipation holes 32; the heat transfer guide pillar 20 is connected with the back of the heat dissipation convex strip 31; the mounting portion 10 is provided with a plurality of interface holes 11. Heat conduction guide pillar 20 can contact with chip 91 through insulating heat conduction glue 90 for heat that chip 91 produced can be quick conduct give heat conduction guide pillar 20, then conduct for heat dissipation sand grip 31, heat dissipation sand grip 31 just can go out the heat dissipation fast, compares chip 91 and only conducts for the backshell through the air, and heat conduction guide pillar 20 can very big promotion to the radiating effect of chip 91, makes the operation that chip 91 can be stable. The heat-conducting fins 83 can conduct heat to the heat-radiating fins 81 from the side surfaces of the power amplifier mounting grooves 82, so that the way of conducting heat to the heat-radiating fins 81 by the power amplifier mounting grooves 82 is increased, the heat-radiating effect of the power amplifier 70 can be effectively enhanced, and the service life of the power amplifier 70 is prolonged.
In this embodiment, the heat dissipation function portion further includes: the ventilation district is strengthened to the fan installing zone, the fan installing zone is provided with fan mounting hole 51 and fan ventilation hole 52, it is provided with a plurality of side ventilation holes 53 to strengthen the ventilation district. The fan mounting area is used for mounting a fan to enhance heat dissipation. The side vent holes 53 allow wind to enter and exit from the side, so that the wind can better take away heat generated by the main board 92.
In this embodiment, the enhanced ventilation zone is also provided with a plurality of back vents 54.
In this embodiment, the high heat dissipation rear housing 60 further includes: mainboard erection column 40, the bottom and the side of mainboard erection column 40 all with installation department 10 is connected, and mainboard erection column 40's side is connected with installation department 10, can strengthen mainboard erection column 40's intensity, avoids mainboard erection column 40 to be broken easily.
In this embodiment, the main board mounting post 40 is provided with a main board mounting hole 41; the mounting portion 10 is provided with a screen mounting hole 12, and a plane where the main board mounting hole 41 is located is between the heat dissipation function portion and the plane where the screen mounting hole 12 is located. The main board 92 can be mounted on the main board mounting post 40, and then the display screen 94 is mounted on the screen mounting hole 12, thereby completing the assembly of the vehicle-mounted display.
In this embodiment, the surface of the heat dissipation rib 31 is a curved surface. The curved surface has a larger surface area than the plane, so that the heat dissipation area can be increased, and the heat dissipation effect is enhanced.
In the embodiment, the heat dissipation ribs 31 are hollow bodies, which can reduce the weight of the high heat transfer and dissipation rear housing 60 and save material cost.
In this embodiment, the rear case 60 with high heat dissipation is made of aluminum.
The utility model also provides a vehicle-mounted display, include: the high heat dissipation rear housing 60, a main board 92 installed in the high heat dissipation rear housing 60, an interface 93, a chip 91, a power amplifier 70 installed on the main board 92, and a display screen 94 connected to the high heat dissipation rear housing 60; the interface 93 is disposed at the interface hole 11, the heat conductive pillar 20 is connected to the chip 91 through an insulating heat conductive adhesive 90, and the power amplifier 70 is inserted into the power amplifier mounting groove 82.
To sum up, the utility model provides a high heat dissipation backshell and vehicle-mounted display, heat conduction guide pillar can be through insulating heat conduction glue and chip contact for heat conduction guide pillar that the heat that the chip produced can be quick is given in the conduction, then the conduction is given heat dissipation sand grip, and the heat dissipation sand grip just can be fast dispelled the heat with the heat, compares the chip and only gives the backshell through the air conduction, and heat conduction guide pillar can be very big has promoted the radiating effect to the chip, makes the operation that the chip can be stable. The heat-conducting fins can conduct heat to the heat-radiating fins from the side faces of the power amplifier mounting grooves, and the way that the power amplifier mounting grooves conduct the heat to the heat-radiating fins is increased, so that the heat-radiating effect of the power amplifier can be effectively enhanced, and the service life of the power amplifier is prolonged.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (7)
1. A high heat dissipation backshell, its characterized in that includes: the heat dissipation device comprises an installation part, a heat dissipation function part connected with the installation part and a heat conduction guide post; the heat dissipation function part is provided with a power amplifier heat dissipation area, a wide groove heat dissipation area, a fan installation area and a reinforced ventilation area; the power amplifier radiating area is provided with a plurality of radiating fins, a power amplifier installing groove and heat conducting fins, the power amplifier installing groove is formed in the back face of each radiating fin, and the heat conducting fins are connected with the side faces of the power amplifier installing groove and the radiating fins respectively; the wide-groove heat dissipation area is provided with a plurality of heat dissipation convex strips and heat dissipation holes; the heat transfer guide pillar is connected with the back of the heat dissipation convex strip; the mounting part is provided with a plurality of interface holes; the fan mounting area is provided with a fan mounting hole and a fan ventilation hole, and the reinforced ventilation area is provided with a plurality of side ventilation holes.
2. A high heat dissipation rear cover as recited in claim 1, wherein said enhanced ventilation zone is further provided with a plurality of rear ventilation holes.
3. The high heat dissipation rear housing of claim 1, further comprising: the mainboard erection column, the bottom and the side of mainboard erection column all with the installation department is connected.
4. The high heat dissipation rear shell as claimed in claim 3, wherein the main board mounting posts are provided with main board mounting holes; the installation department is provided with the screen mounting hole, the plane at mainboard mounting hole place is between the plane at heat dissipation function portion and screen mounting hole place.
5. The high heat dissipation rear cover according to claim 1, wherein the surface of the heat dissipation ribs is curved.
6. The high heat dissipation rear housing of claim 1, wherein the heat dissipation ribs are hollow bodies.
7. An in-vehicle display, comprising: the high heat dissipation rear shell of any one of claims 1-6, a motherboard mounted within the high heat dissipation rear shell, an interface, a chip, a power amplifier mounted on the motherboard, a display screen connected to the high heat dissipation rear shell; the interface is arranged at the interface hole, the heat transfer guide post is connected with the chip through insulating heat-conducting glue, and the power amplifier is inserted into the power amplifier mounting groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022246325.1U CN214206189U (en) | 2020-10-10 | 2020-10-10 | High heat dissipation backshell and vehicle-mounted display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022246325.1U CN214206189U (en) | 2020-10-10 | 2020-10-10 | High heat dissipation backshell and vehicle-mounted display |
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| Publication Number | Publication Date |
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| CN214206189U true CN214206189U (en) | 2021-09-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202022246325.1U Active CN214206189U (en) | 2020-10-10 | 2020-10-10 | High heat dissipation backshell and vehicle-mounted display |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114158239A (en) * | 2021-12-17 | 2022-03-08 | 先锋高科技(上海)有限公司 | Vehicle-mounted power amplifier with heat radiation structure |
-
2020
- 2020-10-10 CN CN202022246325.1U patent/CN214206189U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114158239A (en) * | 2021-12-17 | 2022-03-08 | 先锋高科技(上海)有限公司 | Vehicle-mounted power amplifier with heat radiation structure |
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