CN215342581U

CN215342581U - Multi-color temperature COB light source

Info

Publication number: CN215342581U
Application number: CN202121028345.XU
Authority: CN
Inventors: 董国浩; 陈智波; 谢观逢; 夏雪松
Original assignee: Guangzhou Ledteen Optoelectronics Co ltd
Current assignee: Silicon Energy Photoelectric Semiconductor Guangzhou Co ltd
Priority date: 2021-05-13
Filing date: 2021-05-13
Publication date: 2021-12-28
Anticipated expiration: 2031-05-13

Abstract

The utility model provides a multi-color-temperature COB light source, wherein a chip is connected with a circuit in a substrate through a die bonding adhesive layer, a dam is in a closed annular shape to surround the chip, a fluorescent glue layer is filled in the dam to cover the chip, a plurality of layers of fluorescent glue are sequentially arranged from inside to outside, the innermost layer of fluorescent glue wraps the chip and the die bonding adhesive layer which are arranged on the layer, and the outer layer of fluorescent glue wraps the chip, the die bonding adhesive layer and all inner layer of fluorescent glue which are arranged on the layer. The utility model adopts the chip-level dispensing process, can fully and uniformly arrange the dispensing with different color temperatures aiming at the dispensing of a single chip, and thus the emitted light is uniform; the color coordinate value can be tested after glue dispensing is finished, adjustment can be made immediately, batch material waste cannot be caused, any required color coordinate value can be flexibly debugged, and defective products can be reduced; the process is suitable for flip chips, normal chips and vertical chips.

Description

Multi-color temperature COB light source

Technical Field

The utility model relates to the technical field of COB (chip on board) packaging, in particular to a multi-color temperature COB light source.

Background

In current two colour temperature COB or polychrome temperature COB field, through using CSP chip and blue light chip together, make up out the changes in temperature colour temperature on a COB light source, reach regulation and control colour temperature purpose. However, the value of the color coordinate of the CSP chip cannot be known in the process of debugging the color coordinate of the CSP chip, and the color coordinate of the CSP chip can be known only by mounting the CSP chip on a substrate after the debugging is completed, which causes a certain amount of waste of materials; in addition, the conventional double-color-temperature or multi-color-temperature COB is covered by a fluorescent glue strip according to a connecting circuit of a chip, and then the fluorescent glue is used for filling the whole COB light-emitting surface for the second time.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model aims to provide a multi-color-temperature COB light source, which adopts a chip-level dispensing process, can fully and uniformly arrange dispensing with different color temperatures aiming at the dispensing of a single chip, and thus, the emitted light is uniform; the color coordinate value can be tested after glue dispensing is finished, adjustment can be made immediately, batch material waste cannot be caused, and any required color coordinate value can be flexibly debugged; the process is suitable for flip chips, normal chips and vertical chips.

The utility model provides a multi-color-temperature COB light source which comprises a substrate, a dam, a plurality of layers of fluorescent glue, a plurality of chips and a plurality of die bonding adhesive layers, wherein electrodes of the chips are connected with a circuit in the substrate through the die bonding adhesive layers, the dam surrounds the chips in a closed ring shape, the fluorescent glue layers are filled in the dam to cover the chips, the plurality of layers of fluorescent glue are sequentially arranged from inside to outside, the innermost layer of fluorescent glue wraps the chips and the die bonding adhesive layers arranged on the layer, and the outer layer of fluorescent glue wraps the chips, the die bonding adhesive layers and all the inner layer of fluorescent glue arranged on the current layer.

Furthermore, the chips wrapped by the fluorescent glue are sequentially distributed in the dam from inside to outside.

Further, the chips wrapped by the innermost layer of fluorescent glue are circularly distributed in the dam; according to the sequence from inside to outside, the chips wrapped by the outer layer of fluorescent glue are distributed on the outer sides of the chips wrapped by the inner layer of fluorescent glue.

Further, the box dam is circular.

Further, the substrate is a flip-chip COB substrate, a front-loading COB substrate, or a vertical COB substrate.

Further, the chip is a flip chip, a face-up chip or a vertical chip.

Furthermore, at least one chip is arranged in each layer of fluorescent glue.

Furthermore, the number of the layers of the fluorescent glue is at least two.

Compared with the prior art, the utility model has the beneficial effects that:

the utility model provides a multi-color temperature COB light source, which adopts a chip-level dispensing process, can fully and uniformly arrange dispensing of different color temperatures aiming at the dispensing of a single chip, and thus, the emitted light is uniform, uniform dispensing is realized, and the uniformity and quality of the light are improved; the color coordinate value can be tested after glue dispensing is finished, adjustment can be made immediately, batch material waste cannot be caused, any required color coordinate value can be flexibly debugged, and defective products can be reduced; the process is suitable for flip chips, normal chips and vertical chips.

The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood and to implement them in accordance with the contents of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings. The detailed description of the present invention is given in detail by the following examples and the accompanying drawings.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the utility model and together with the description serve to explain the utility model without limiting the utility model. In the drawings:

fig. 1 is a cross-sectional view of a multi-color temperature COB light source of the present invention.

In the figure: 1. a box dam; 2. a second layer of fluorescent glue; 3. a first layer of fluorescent glue; 4. a first chip; 5. a second chip; 6. a substrate; 7. and (5) solidifying the bonding layer.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and the detailed description, and it should be noted that any combination of the embodiments or technical features described below can be used to form a new embodiment without conflict.

The utility model provides a polychrome temperature COB light source, as shown in figure 1, including base plate 6, box dam 1, a plurality of layers of fluorescent glue, a plurality of chips, a plurality of solid brilliant bond line 7, the electrode of chip is through the circuit connection among solid brilliant bond line 7 and the base plate 6, thereby make the chip circular ring form surround the chip, the fluorescent glue film is filled in box dam 1 in order to cover the chip, box dam 1 is arranged in blocking the fluorescent glue outflow when not baking, a plurality of layers of fluorescent glue sets gradually from inside to outside, the fluorescent glue parcel of inlayer sets up at the chip of this layer and solid brilliant bond line 7, outer fluorescent glue parcel sets up the chip on this layer, solid brilliant bond line 7 and the all inlayer fluorescent glue of present layer. At least one chip is arranged in each layer of fluorescent glue. The number of the layers of the fluorescent glue is at least two. By adopting a chip-level dispensing process, aiming at the dispensing of a single chip, the dispensing with different color temperatures can be fully and uniformly distributed, so that the emitted light is uniform; the color coordinate value can be tested after glue dispensing is finished, adjustment can be made immediately, batch material waste cannot be caused, and any required color coordinate value can be flexibly debugged.

As shown in fig. 1, the first layer of fluorescent glue 3 is an innermost layer of fluorescent glue, wraps the first chip 4 and the die bond bonding layer 7 corresponding to the first chip 4, and is used for exciting the fluorescent powder in the first layer of fluorescent glue 3 and the second layer of fluorescent glue 2 by the light emitted by the first chip 4, so as to obtain a first color temperature; the second layer of fluorescent glue 2 wraps the second chip 5, the die bond adhesive layer 7 corresponding to the second chip 5, the first layer of fluorescent glue 3, the first chip 4 and the die bond adhesive layer 7 corresponding to the first chip 4, and the second layer of fluorescent glue is used for emitting light through the second chip 5 to excite the fluorescent powder in the second layer of fluorescent glue 2, so that a second color temperature is obtained. Only two layers of fluorescent glue are shown in fig. 1, and it should be understood that more COB light sources with color temperature can be made according to the same principle according to actual requirements.

In one embodiment, the chips wrapped by the fluorescent glue are sequentially distributed in the box dam 1 from inside to outside. As shown in fig. 1, the chips wrapped by the innermost layer of fluorescent glue (i.e. the first chips 4 in fig. 1) are distributed in the dam 1 in a circular shape; the chips (i.e. the second chips 5 in fig. 1) wrapped by the outer layer of the fluorescent glue are distributed on the outer sides of the chips (i.e. the first chips 4 in fig. 1) wrapped by the inner layer of the fluorescent glue in the order from inside to outside. The box dam 1 is circular.

In one embodiment, substrate 6 is a flip-chip COB substrate, a front-mounted COB substrate, or a vertical COB substrate. The chip is a flip chip, a face-up chip or a vertical chip. The process is suitable for flip chips, normal chips and vertical chips.

In the above embodiment, a multi-color temperature COB light source is provided, and correspondingly, the present application further provides a manufacturing method of the multi-color temperature COB light source. Since the embodiment of the method is used for manufacturing the multi-color-temperature COB light source, the description is simple, and relevant points can be found in the partial description of the embodiment of the device. The method embodiments described below are merely illustrative.

A manufacturing method of a multi-color temperature COB light source comprises the following steps:

fixing the chip on the substrate 6 by using a die bonding adhesive, and enclosing the chip by using an enclosure dam adhesive;

carrying out single chip dispensing on a chip which is pre-placed under the first layer of fluorescent glue 3 through the first layer of fluorescent glue 3, testing whether the color coordinate is a target value of the color coordinate after the single chip in the current layer is covered by the first layer of fluorescent glue 3, and debugging to the target value of the color coordinate by debugging the proportion of fluorescent powder or adjusting the using amount of the fluorescent glue if the color coordinate is not the target value of the color coordinate;

dispensing chips pre-placed under the outer-layer fluorescent glue and all inner-layer fluorescent glue of the current layer through the outer-layer fluorescent glue, testing whether the color coordinate is a target value of the color coordinate after the outer-layer fluorescent glue covers the chips in the current layer and all the inner-layer fluorescent glue of the current layer, and debugging to the target value of the color coordinate by debugging the proportion of the fluorescent powder or adjusting the using amount of the fluorescent glue if the color coordinate is not the target value of the color coordinate; and circularly executing the step until the glue dispensing of the fluorescent glue on the outermost layer and the target value of the color coordinate debugging are finished.

As shown in fig. 1, the first chip 4 and the second chip 5 are fixed on the substrate 6 by die bond adhesive, and then the first chip 4 and the second chip 5 are enclosed by dam adhesive. And carrying out chip-level dispensing: firstly, a first layer of fluorescent glue 3 is dispensed, single chip dispensing is carried out on a first chip 4, the first layer of fluorescent glue 3 covers the single first chip 4, testing can be carried out after the single first chip is covered, the color coordinate is not a required color coordinate target value, and the color coordinate target value is debugged by methods of debugging the proportion of fluorescent powder or adjusting the using amount of the first layer of fluorescent glue 3 and the like; after the first layer of silica gel is spotted, a first color temperature is obtained; then, a second layer of fluorescent glue 2 is dispensed, the second layer of fluorescent glue 2 covers the first layer of fluorescent glue 3 and the second chip 5, and the second chip 5 excites fluorescent powder in the second layer of fluorescent glue 2 through light emission, so that a second color temperature is obtained. A plurality of color temperature regulation can be realized on one COB light source.

According to the utility model, the chip-level dispensing multi-color-temperature COB process is used, so that the color coordinate value can be controlled at will, the color coordinate value can be known in the manufacturing process, the color coordinate value can be adjusted at any time, defective products can be reduced, and the waste of materials is reduced; the chip-level dispensing multi-color-temperature COB process can uniformly dispense glue and improve the uniformity quality of light.

The foregoing is merely a preferred embodiment of the utility model and is not intended to limit the utility model in any manner; those skilled in the art can readily practice the utility model as shown and described in the drawings and detailed description herein; however, those skilled in the art should appreciate that they can readily use the disclosed conception and specific embodiments as a basis for designing or modifying other structures for carrying out the same purposes of the present invention without departing from the scope of the utility model as defined by the appended claims; meanwhile, any changes, modifications, and evolutions of the equivalent changes of the above embodiments according to the actual techniques of the present invention are still within the protection scope of the technical solution of the present invention.

Claims

1. The utility model provides a polychrome temperature COB light source which characterized in that: including base plate, box dam, a plurality of layers of fluorescent glue, a plurality of chip, a plurality of solid brilliant bond line, the electrode of chip passes through gu the brilliant bond line with circuit connection in the base plate, the box dam becomes closed cyclic annular and surrounds the chip, the fluorescent glue film fill in enclose in the dam with the cover the chip, a plurality of layers the fluorescent glue sets gradually from inside to outside, and the fluorescent glue parcel of inlayer sets up at the chip of this layer and solid brilliant bond line, and outer fluorescent glue parcel sets up at the chip of this layer, solid brilliant bond line and the all inlayer fluorescent glue of current layer.

2. The multi-color temperature COB light source of claim 1, wherein: and the chips wrapped by the fluorescent glue are sequentially distributed in the dam from inside to outside.

3. A multi-color temperature COB light source of claim 2, wherein: the chips wrapped by the innermost layer of fluorescent glue are circularly distributed in the dam; according to the sequence from inside to outside, the chips wrapped by the outer layer of fluorescent glue are distributed on the outer sides of the chips wrapped by the inner layer of fluorescent glue.

4. The multi-color temperature COB light source of claim 1, wherein: the box dam is circular.

5. The multi-color temperature COB light source of claim 1, wherein: the base plate is flip-chip COB base plate, just adorns COB base plate or perpendicular COB base plate.

6. The multi-color temperature COB light source of claim 5, wherein: the chip is a flip chip, a normal chip or a vertical chip.

7. The multi-color temperature COB light source of claim 1, wherein: at least one chip is arranged in each layer of fluorescent glue.

8. The multi-color temperature COB light source of claim 1, wherein: the number of layers of the fluorescent glue is at least two.